Abstract: A matrix converter for converting a polyphase alternating current into a desired alternating output current includes at least two stages; a plurality of controllable bidirectional switches, converts m phases of the polyphase alternating current into alternating output current with n (n<m) phases of a load; and a controllable bidirectional switch controlling each phase of the polyphase alternating current in at least one stage of the converter.

Abstract: A method includes controlling the cyclo-converter 7 in coordination with controlling a coupled HF inverter 3. The controlling of the cyclo-converter 7 provides at least a first freewheeling FW period in the cyclo-converter for each cycle of the HF inverter 3. The controlling of the HF inverter provides a freewheeling period in the HF inverter 3 each time the first freewheeling period is provided in the cyclo-converter.

Abstract: A control apparatus for an AC-AC direct converter. The control apparatus includes a calculator providing a phase command ?* of an output voltage of the converter, a calculator providing a q-axis current iq by using output currents iu and iw and the phase command ?*, a detector detecting a pulsation component contained in the q-axis current iq, a calculator providing a phase correction magnitude ?cmp so as to decrease the pulsation component, and an adder/subtractor correcting the phase command ?* by using the correction magnitude ?cmp. This apparatus can decrease the output voltage distortion and low frequency torque pulsation and can suppress the increase of an output current without weakening a magnetic flux, even when the converter is operated in an overmodulation region.

Abstract: A design structure for content addressable memory including a first array of memory cells, and a second array of memory cells. A search logic circuit is configured to prevent a discharge of the second array of memory cells when a search of the first array of memory cells finds certain data.

Abstract: The present invention discloses a three-dimensional memory module (3D-MM), which excels contemporary micro-drive (CMD) in both physical size and storage capacity. Three-dimensional memory (3D-M)-based 3D-MM ((3D)2-MM) further excels CMD in manufacturing cost. Mask-programmable (3D)2-MM is the only semiconductor storage that can store a mobile movie library.

Abstract: A semiconductor memory device that can achieve high-speed operation or that is highly integrated and simultaneously can achieve high-speed operation is provided. Transistors are disposed on both sides of diffusion layer regions to which capacitor for storing information is connected and other diffusion layer region of each transistor is connected to the same bit line. When access to a memory cell is made, two transistors are activated and the information is read. When writing operation to the memory cell is carried out, two transistors are used and electric charges are written to the capacitor.

Abstract: The present invention, generally speaking, provides for a non volatile memory cell requiring no extra process steps. In one embodiment, the non volatile memory cell is a lateral polysilicon programmable read only memory cell, in particular a lateral poly fuse memory cell. Technique are provided to achieve a high yielding, voltage, temperature, and process insensitive lateral poly fuse memory. In one embodiment, a fusible link memory circuit includes a fusible link memory element and a programming circuit. The programming circuit includes a replica of the fusible link memory element and a programming current source for producing a known current density in the fusible link memory element in spite of variations including at least process variations.

Abstract: A semiconductor storage device comprises of a memory cell connected to a plate line and a bit line, a potential shift circuit which is connected to a bit line, temporarily changes in output voltage corresponding to the voltage change of the bit line when a voltage is applied to the plate line, and then outputs a voltage before the application of the voltage to the plate line, a charge transfer circuit for transferring charge stored on the potential shift circuit corresponding to the temporary output voltage change of the potential shift circuit, and a charge accumulation circuit for generating a read voltage from a memory cell after accumulating the transferred charge.

Abstract: A ferroelectric memory device includes: a first p-channel type MISFET connected between a first bit line and a first node; a second p-channel type MISFET connected between a second bit line and a second node; a first negative potential generation circuit connected to the first node; and a second negative potential generation circuit connected to the second node, wherein a gate terminal of the first p-channel type MISFET and the second node are connected to each other, and a gate terminal of the second p-channel type MISFET and the first node are connected to each other.

Abstract: A memory cell includes a ferroelectric capacitor for holding a charge and a transistor connected in parallel with the ferroelectric capacitor. A plurality of the ferroelectric memory cells are connected in series to form a memory cell block. A selection transistor connects,to one end of the block. A bit line connects to the selection transistor. A plate line connects to the other end of the block. A control circuit changes potentials of the word line and the bit line. With the potential of the plate line being held constant, the potential of the word line is changed, thereby erasing information or writing information to the ferroelectric memory cells.

Abstract: In a phase change random access memory (PRAM) device, data is programmed in selected memory cells using a plurality of program loops. In each program loop, division program operations for cell groups including the selected memory cells are performed in consecutive timeslots.

Abstract: A nonvolatile memory device comprises a first voltage generation unit, a second voltage generation unit, a first circuit block, and a discharge unit. The first voltage generation unit generates a first voltage with a first magnitude. The second voltage generation unit generates a second voltage with a second magnitude greater than the first magnitude. The first circuit block selectively receives the first voltage or the second voltage through an input node. The discharge unit discharges the input node between a time point where the input node has been charged with the second voltage and a time point where the input node receives the first voltage.

Abstract: A non-volatile memory cell fabricated with a conventional CMOS process, including a flip-flop circuit having an NMOS transistor that shares a floating gate with a write PMOS capacitor and an erase PMOS capacitor. An erase function is implemented by inducing Fowler-Nordheim tunneling through the erase PMOS capacitor, thereby providing a positive charge on the floating gate. A write function is implemented by inducing Fowler-Nordheim tunneling through the NMOS transistor, thereby providing a negative charge on the floating gate. The write PMOS capacitor provides bias voltages during the erase and write operations. Prior to a read operation, the flip-flop circuit is reset. If the floating gate stores a positive charge, the NMOS transistor turns on, thereby switching the state of the flip-flop circuit. If the floating gate stores a negative charge, the NMOS transistor turns off, thereby leaving the flip-flop circuit in the reset state.

Abstract: A circuit and method efficiently powers a static storage element during a low voltage mode of operation. The static storage element is powered at a first voltage level in an active mode of the static storage element. The static storage element is powered in a low power mode using alternating first and second phases. Powering the static storage element during the first phases in the low power mode includes powering the static storage element at or below a second voltage level, wherein powering the static storage element during the second phases in the low power mode includes powering the static storage element at a higher voltage level than the second voltage level. In another form two modes of low power operation are used where a first mode uses a less power efficient operation than the second mode, but both are more power efficient than a normal power mode.

Abstract: The present invention describes circuitry and a method of providing a low power WRITE mode of operation for an integrated circuit comprising an SRAM memory to provide a reduced IDDQ relative to the IDDQ of a full active mode. In one aspect, the circuitry includes an SRAM memory array, mode control circuitry coupled to the array and configured to alter a supply voltage level to the SRAM array based on a mode of operation. The circuitry also includes control inputs coupled to the mode control circuitry for selecting one of the low power write mode, the full active mode, and optionally a retention mode of operation. The mode control circuitry is configured to receive the control inputs to select one of the three modes of operation, and to alter one or more supply voltage levels to the array, for example, the Vss supply voltage using a Vss supply circuit and the Vdd supply voltage using a Vdd supply circuit, based on the selected mode of operation.

Abstract: Memory employing a plurality of five-transistor memory bit cells in a memory matrix and a power supply control circuit that is configured to provide a simultaneous full clear to all of the memory bit cells is described herein.

Abstract: A PCRAM cell has a high resistivity bottom electrode cap to provide partial heating near the interface between the cell and the bottom electrode, preventing separation of the amorphous GST region from the bottom electrode, and reducing the programming current requirements.

Abstract: A medium for use in data storage, thermal energy storage and other applications, the medium comprising a functional layer made of different materials. One embodiment provides a data storage medium. The data storage medium comprises a substrate and a data storage layer supported by the substrate. The data storage layer comprises a plurality of regions each capable of representing a digital value. The data storage layer is at least partly made of a first material and a second material different from the first material. The data storage layer comprises a pattern of discrete portions made of the second material lying in a plane defined by the data storage layer. The pattern is configured such that each region representing a digital value contains a portion made of the first material and at least one of the discrete portions made of the second material. Other embodiments provide a thermal energy storage medium and a sensing medium.

Abstract: A method of operating a phase change random access memory (PRAM) device comprises performing a program operation to store data in selected PRAM cells of the device, wherein the program operation comprises a plurality of sequential program loops. The method further comprises suspending the program operation in the middle of the program operation, and after suspending the program operation, resuming the program operation in response to a resume command.

Abstract: Provided is a phase change random access (PRAM) memory. The PRAM may include a memory cell array having a plurality of phase change memory cells, and a data read circuit including a compensation unit and a sense amplifier, the compensation unit configured to provide a sensing node with a compensation current to compensate for a decrease in a level of the sensing node caused by a current flowing through one of the plurality of phase change memory cells, and the sense amplifier configured to compare a level of the sensing node with a reference level and output a result of the comparison.

Abstract: Semiconductor devices including a memory cell are provided. In one embodiment, the memory cell includes a first conductive material within a pore of a dielectric layer. The first conductive material may include a first surface having a first dimension that is less than the photolithographic limit. Further, in this embodiment, the memory cell includes a structure changing material in contact with the first surface of the first conductive material along a substantial portion of the first dimension. Additional devices and systems including a memory cell, and methods for manufacturing such a memory cell, are also provided.

Abstract: A semiconductor integrated circuit device, such as a memory device or radiation detector, is disclosed, in which data storage cells are formed on a substrate. Each of the data storage cells includes a field effect transistor having a source, drain, and gate, and a body arranged between the source and drain for storing electrical charge generated in the body. The magnitude of the net electrical charge in the body can be adjusted by input signals applied to the transistor, and the adjustment of the net electrical charge by the input signals can be at least partially cancelled by applying electrical voltage signals between-the gate and the drain and between the source and the drain.

Abstract: Embodiments relate to a method for measuring a threshold voltage of a flash device including inputting a voltage and a pulse width. The dependence of threshold voltage on the applied voltages and the pulse width may be determined by using a threshold voltage measuring equation, and equations regarding a plurality of device variables included within the threshold voltage measuring equation.

Abstract: A carrier storage node such as a floating gate is formed on a moving electrode with a control gate to form a suspended gate non-volatile memory, reducing floating gate to floating gate coupling and leakage current, and increasing data retention.

Abstract: A fuse sensing circuit includes a sense controller and a fuse state sensor. The sense controller includes a reference fuse and a reference sensor coupled to the reference fuse. The reference sensor generates a sample clock with a certain threshold transition characteristic in response to the assertion of a sense input by detecting a programming state of the reference fuse. The fuse state sensor includes a sample fuse, a fuse sensor coupled to the sample fuse, and a flip-flop. The sample fuse is configured to generate a data signal indicative of a programming state of the sample fuse when an enable input is asserted and the sense input is asserted. The flip-flop is configured to sample the data signal using the threshold transition characteristic on an assertion edge of the sample clock. The fuse sensing circuit may be included in an image sensor or an imaging system.

Abstract: A nonvolatile semiconductor memory according to the present invention includes a memory cell transistor which is disposed in a first region and which has a gate electrode of a stacked structure, and a dummy cell which is disposed in a second region neighboring the first region and which has a gate electrode having the same structure as that of the gate electrode of the memory cell transistor. The memory cell transistor and dummy cell are connected to the same word line. The memory cell transistor has a diffusion layer serving as the source/drain region thereof, while the dummy cell does not have the diffusion layer serving as the source/drain region thereof.

Abstract: A method monitors an erase threshold voltage distribution in a NAND flash memory device. The method programs a main cell by applying a first program voltage to the main cell, and then measures a threshold voltage of the main cell. The method programs a peripheral cell using a second program voltage and a third program voltage, and then measures a threshold voltage of the peripheral cell. The method measures a threshold voltage of the main cell changed by the measured threshold voltage of the peripheral cell, and then may predict an initial erase threshold voltage distribution of a page of the peripheral cell by using an interference correlation between the measured threshold voltages of the main cell and the peripheral cell.

Abstract: A non-volatile memory device includes a plurality of power control circuits interfaced via a single Y multiplexer with an array of memory cells. The multiple power control circuits provide multiple pre-charge paths configured to pre-charge the drain node of a target memory cell in the array, as well as the drain and/or source nodes of unselected memory cells in the array. The multiple pre-charge paths decrease the current through the array cells and also decrease the pre-charge and set up times for the array.

Abstract: A method for preventing generation of program disturbance incurred by hot electrons in a NAND flash memory device. A channel boosting disturb-prevention voltage lower than a program-prohibit voltage applied to other word lines is applied to edge word lines coupled to memory cells that are nearest to select transistors. As a result, an electric field between the memory cells coupled to the edge word lines and the select transistors is weakened, and the energy of the hot electrons is reduced.

Abstract: A method for preventing generation of program disturbance incurred by hot electrons in a NAND flash memory device. A channel boosting disturb-prevention voltage lower than a program-prohibit voltage applied to other word lines is applied to edge word lines coupled to memory cells that are nearest to select transistors. As a result, an electric field between the memory cells coupled to the edge word lines and the select transistors is weakened, and the energy of the hot electrons is reduced.

Abstract: An object of the present invention is to provide a semiconductor memory device capable of preventing a defect caused by falling of a word line and deterioration in patterning precision due to disturbance of the pitch of word lines at an end of a memory block. Plural dummy word lines are disposed at an end of a memory block, a word driver is mounted for the dummy word line to control the threshold voltage of a dummy memory cell formed below the dummy word line. Also at the time of operating a memory area for storing data from the outside, a bias is applied to the dummy word line. The invention can prevent a defect caused by falling of a word line and deterioration in patterning precision due to disturbance of the pitches of word lines at an end of a memory block, and realize high yield and reliably operation.

Abstract: A non-volatile memory device programs memory cells in each row in a manner that minimizes the coupling of spurious signals. A control logic unit programs the cells in a row using a set of bit state assignments chosen by evaluating data that are to be written to the cells in the row. The control logic unit performs this evaluation by determining the number of cells in the row that will be programmed to each of a plurality of bit states corresponding to the write data. The control logic unit then selects a set of bit state assignments that will cause the programming level assigned to each bit state to be inversely proportional to the number of memory cells in the row that are programmed with the bit state. The selected set of bit states is then used to program the memory cells in the row.

Abstract: A non-volatile semiconductor memory device includes plurality of word lines and a plurality of bit lines comprising even numbered bit lines and odd numbered bit lines and a memory cell array including a plurality of memory cells having two or more storage states, one of the plurality of memory cells being connected to a corresponding word line of the plurality of word lines, the number of storage states between adjacent memory cells is different in a word line direction and a bit line direction.

Abstract: In response to a read command received by a system interface unit for accessing a plurality of blocks of data stored in said non-volatile semiconductor memory, a controller carries out selective read operations of blocks of data to two memories from the non-volatile semiconductor memory. The controller also carries out parallel operations of data transferring a first block of data, which has already been subjected to error detection and error correction operations by an error correction unit, from one of the two memories to a host system via said system interface unit and of data transferring of a second block of data to be subjected to the error detection and error correction operation, from said non-volatile semiconductor memory to the other of the two memories.

Abstract: A memory device and a method of operating a memory device is disclosed. In one embodiment of the invention, the memory device includes a plurality of multi-level memory cells each having a number m of levels not matching 2n with n being a non-zero integer, and a circuit or device for combining the levels of at least two of the memory cells for write and read operations into a set of combined states and for transforming at least a subset of 2n combinations of the set of combined states into n two-level data bits.

Abstract: A method, apparatus and system are described which provide a memory device having an array of cells which may be selectively designated for either error correction code use or redundancy cell use.

Abstract: A method for operating a memory system including a flash memory device having a plurality of memory blocks comprises determining whether a read error generated during a read operation of the flash memory device is caused by read disturbance and replacing a memory block which includes the read error, with a spare memory block if the read error is caused by read disturbance.

Abstract: This memory device comprises a word-line control circuit applying a read voltage and a soft-value read voltage as a word line voltage to a word line to generate soft-values. The soft-value read voltage is between an upper limit and a lower limit of each of plural threshold voltage distributions. A likelihood calculation circuit calculates a likelihood value of data stored in a memory cell based on the soft-value. An error correction circuit executes data error correction for the data read from the memory cell based on the likelihood value. A refresh control circuit controls a timing of a refresh operation for the memory cell based on the soft-value or the likelihood value.

Abstract: High voltage generator circuits and methods for operating non-volatile semiconductor memory devices are provided for use with non-volatile memory such as FLASH memory devices, to selectively generate different types of control voltages for various operating modes of non-volatile memory devices.

Abstract: A semiconductor device includes a unit high-breakdown-voltage transistor includes first to fourth high-breakdown-voltage transistors. The first high-breakdown-voltage transistor is connected to a first write line at the other end of the current path thereof, and includes a first gate which is disposed in a first direction. The second high-breakdown-voltage transistor is connected to a second write line at the other end of the current path thereof, and includes a second gate which is disposed in a second direction crossing the first direction. The third high-breakdown-voltage transistor is connected to a third write line at the other end of the current path thereof, and includes a third gate which is disposed in the first direction. The fourth high-breakdown-voltage transistor is connected to a fourth write line at the other end of the current path thereof, and includes a fourth gate which is disposed in the second direction.

Abstract: A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory operations in memory planes. The memory operations are sequentially initiated and the memory operation for at least one of the memory planes is initiated during the memory operation for another memory plane. In one embodiment, each of a plurality of programming circuits is associated with a respective memory plane and is operable to program data to the respective memory plane in response to programming signals and when it is enabled. Control logic coupled to the plurality of programming circuits generates programming signals in response to the memory receiving program commands and further generates programming enable signals to individually enable each of the programming circuits to respond to the programming signals and stagger programming of data to each of the memory planes.

Abstract: One embodiment of the present invention includes applying a first value to a bit line, boosting word lines associated with the bit line and a common selection line to create a first condition based on the first value, and cutting off a boundary non-volatile storage element associated with the common selection line to maintain the first condition for a particular non-volatile storage element associated with the bit line and common selection line. A second value is applied to the bit line and at least a subset of the word lines are boosted to create a second condition for a different non-volatile storage element associated with the bit line and common selection line. The second condition is based on the second value. The first condition and the second condition overlap in time. Both non-volatile storage elements are programmed concurrently, based on their associated conditions.

Abstract: Non-volatile storage elements are programmed in a manner that reduces program disturb, particularly at the edges storage elements strings, by using modified pass voltages. In particular, during the programming of a selected storage element, an isolation voltage is applied to a storage element proximate to the selected storage element thereby electrically dividing the channel associated with the storage elements into two isolated areas. Additional isolated areas are formed remotely from the selected storage element by applying the isolation voltage to other remote storage elements. The isolated channel regions associated with the storage elements are then boosted with different pass voltages in order to alleviate the effects of program disturb. Thus, a standard pass voltage is applied to storage elements immediately adjacent to the selected storage element, and a lower pass voltage is applied to storage elements remote from the selected storage element.

Abstract: Embodiments of the present invention provide a flash memory device with a unified oscillation circuit, and a method of operating the device. The unified oscillation circuit produces alternative internal clock signals for corresponding alternative operating modes of the flash memory device. At least a portion of the unified oscillation circuit is used to generate all of the alternative internal clock signals. Compared to conventional memory devices and methods that use multiple oscillators, embodiments of the invention improve circuit density and reduce the incidence of timing glitches caused by switching between multiple oscillators.

Abstract: A flash memory device is disclosed and includes a memory cell array comprising memory cells arranged in rows and columns, a page buffer circuit having a single latch structure and configured to read data from a selected page in the memory cell array, and a controller controlling the page buffer circuit to detect memory cells having an improper voltage distribution causes by charge leakage within the selected page.

Abstract: In one aspect, a program method is provided for a flash memory device including a plurality of memory cells each being programmed in one of a plurality of data states. The program method of this aspect includes programming selected memory cells in a first data state, verifying a result of the programming, successively programming selected memory cells in at least two or more data states corresponding to threshold voltages which are lower than a threshold voltage corresponding to the first data state, and verifying results of the successive programming.

Abstract: Disclosed herein is a nonvolatile semiconductor memory device including: a first selection transistor configured to be connected to a bit line; a second selection transistor configured to be connected to a common source line; a memory cell configured to be connected in series between the first and second selection transistors; and writing means for carrying out writing for a selected memory cell. In the nonvolatile semiconductor memory device, the writing means applies a potential yielding a writing-blocked state via a bit line to a memory cell for which writing is not to be carried out, of a memory cell selected for writing, and the writing means carries out writing for a writing-target memory cell in a state in which a bit line has a bit line potential state dependent upon a threshold value state of the writing-target memory cell.

Abstract: Errors can occur when reading the threshold voltage of a programmed non-volatile storage element due to at least two mechanisms: (1) capacitive coupling between neighboring floating gates and (2) changing conductivity of the channel area after programming (referred to as back pattern effect). To account for coupling between neighboring floating gates, the read process for a particular memory cell will provide compensation to an adjacent memory cell in order to reduce the coupling effect that the adjacent memory cell has on the particular memory cell. To account for the back pattern effect, a first voltage is used during a verify operation for unselected word lines that have been subjected to a programming operation and a second voltage is used for unselected word lines that have not been subjected to a programming operation. The combination of these two techniques provides for more accurate storage and retrieval of data.

Abstract: Errors can occur when reading the threshold voltage of a programmed non-volatile storage element due to at least two mechanisms: (1) capacitive coupling between neighboring floating gates and (2) changing conductivity of the channel area after programming (referred to as back pattern effect). To account for coupling between neighboring floating gates, the read process for a particular memory cell will provide compensation to an adjacent memory cell in order to reduce the coupling effect that the adjacent memory cell has on the particular memory cell. To account for the back pattern effect, a first voltage is used during a verify operation for unselected word lines that have been subjected to a programming operation and a second voltage is used for unselected word lines that have not been subjected to a programming operation. The combination of these two techniques provides for more accurate storage and retrieval of data.

Abstract: One embodiment of the present invention includes applying a first value to a bit line, boosting word lines associated with the bit line and a common selection line to create a first condition based on the first value, and cutting off a boundary non-volatile storage element associated with the common selection line to maintain the first condition for a particular non-volatile storage element associated with the bit line and common selection line. A second value is applied to the bit line and at least a subset of the word lines are boosted to create a second condition for a different non-volatile storage element associated with the bit line and common selection line. The second condition is based on the second value. The first condition and the second condition overlap in time. Both non-volatile storage elements are programmed concurrently, based on their associated conditions.