Abstract: One embodiment of the present invention includes applying a first value to a bit line, boosting word lines associated with the bit line and a common selection line to create a first condition based on the first value, and cutting off a boundary non-volatile storage element associated with the common selection line to maintain the first condition for a particular non-volatile storage element associated with the bit line and common selection line. A second value is applied to the bit line and at least a subset of the word lines are boosted to create a second condition for a different non-volatile storage element associated with the bit line and common selection line. The second condition is based on the second value. The first condition and the second condition overlap in time. Both non-volatile storage elements are programmed concurrently, based on their associated conditions.

Abstract: A NAND flash memory device, and more particularly, to NAND flash memory device and method of manufacturing operating the same as described. A dielectric film and a conduction layer are formed between cell gates so that between-cell gates are buried. Therefore, an interference effect between floating gates, which becomes profound with the level of integration increasing, and program threshold voltage distributions between cells can be improved.

Abstract: The present disclosure includes various method, device, and system embodiments for reducing non-volatile memory cell read failures. One such method embodiment includes performing a first read operation, using an initial read potential, to determine a state of a selected memory cell in a string of non-volatile memory cells. This method includes determining whether the state of the selected memory cell is an incorrect state by performing a first check using a data checking technique, and if the incorrect state is determined, performing a number of subsequent read operations using read potentials stepped to a higher and a lower read potential to a particular count of read operations.

Abstract: A method for programming a flash memory device is provided, where the flash memory device includes a plurality of memory cells, and where a threshold voltage of each of the memory cells is programmable in any one of plural corresponding data states.

Abstract: A method is for programming a flash memory device which includes a plurality of memory cells storing multi-bit data representing one of a plurality of states. The method includes programming the multi-bit data into selected memory cells of the plurality of memory cells, the programming including a first verify-reading operation performed by a first verifying voltage, determining whether to execute a reprogramming operation for each of the selected memory cells, and reprogramming the selected memory cells in accordance with the determination. The reprogramming of the selected memory cells includes a second verify-reading operation performed by a second verifying voltage, the second verifying voltage being higher than the first verifying voltage.

Abstract: Read failure is reduced by increasing the drain current through a serial string of memory cells during the read operation. In one embodiment, this is accomplished by using a higher read pass voltage for unselected word lines when the selected word line is within a predetermined distance of the drain side of the memory block array. If the selected word line is closer to the source side, a lower read pass voltage is used. In another embodiment, the cells on the word lines closer to the drain side of the memory block array are erased to a lower threshold voltage than the memory cells on the remaining word lines.

Abstract: A non-volatile memory having a gate structure, a pair of storage units and two assist gates is provided. The gate structure is disposed on the substrate. The storage units are disposed on the sidewalls of the gate structure. The assist gates are disposed on the respective sides of the gate structure and adjacent to the storage units. Each assist gate is shared between two adjacent memory cells. The gate structure, the storage units and the assist gates are electrically isolated from one another.

Abstract: Electronic circuitry is described having a first transistor having a first gate dielectric located between an electrically floating gate and a semiconductor substrate. The first injection current flows through the first gate dielectric to establish a first amount of electrical charge on the gate electrode. The electronic circuitry also includes a second transistor having a second gate dielectric located between the gate electrode and the semiconductor substrate. A band-to-band tunneling current flows between valence and conduction bands of the second transistor to create a second injection current that flows through the second gate dielectric to establish the first amount of electrical charge on the gate electrode. Non volatile memory cell circuits having the above described circuitry are also described.

Abstract: Provided is a nonvolatile memory with less element deterioration and good data retaining properties. In a nonvolatile memory formed by the manufacturing steps of a complementary type MISFET without adding thereto another additional step, erasing of data is carried out by applying 9V to an n type well, 9V to a p type semiconductor region, and ?9V to another p type semiconductor region and setting the source and drain of data writing and erasing MISFETs and data reading MISFETs at open potential to emit electrons from a gate electrode to a p well by FN tunneling. At this time, by applying a negative voltage to the p well having a capacitive element formed thereover and applying a positive voltage to the p well having the MISFETs formed thereover, a potential difference necessary for data erasing operation can be secured at a voltage low enough not to cause gate breakage.

Abstract: A method for prioritized erasure of a non-volatile storage device, the method including the steps of: providing at least one flash unit of the storage device, wherein each flash unit has a plurality of blocks; writing data into the plurality of blocks; assigning an erasure-priority to each block, wherein the erasure-priority correlates with an erasure-priority of the data; and erasing the data in each block according to the erasure-priority of each block upon receiving an emergency-erase command. Preferably, the step of writing data into the plurality of blocks is performed in an arbitrary order in a first flash unit, and the step of writing into subsequent flash units is performed in correlation with the order in the first flash unit. Preferably, the step of erasing includes aborting erasure, before completing the erasure, for at least some of the plurality of blocks.

Abstract: A method capable of improving endurance of memory includes detecting whether a record cell is the last non-programmed record cell of a set of record cells that includes the record cell. The method includes erasing the corresponding set of multi-time programmable memory blocks and erasing the set of record cells, if the record cell is the last non-programmed record cell of the set of record cells that includes the record cell. The method further includes programming the record cell corresponding to a first non-programmed record cell in the set of record cells if the non-programmed record cell is not the last non-programmed record cell of the set of record cells.

Abstract: A memory subsystem is provided including an interface circuit adapted for communication with a system and a majority of address or control signals of a first number of memory circuits. The interface circuit includes emulation logic for emulating at least one memory circuit of a second number.

Abstract: An improved cross-coupled CMOS high-voltage latch that is used for storing data bits to be written to memory cells of a non-volatile memory is provided with a switching circuit that, during writing of data bits into the memory cells of the latch, provides a high series impedance between one leg of the latch and ground to limit leakage current. A large number of latches are connected in parallel and their accumulated leakage currents are limited by the switching circuit to prevent overload of a high-voltage generator, such as a charge pump circuit, for the high-voltage latch, so that data can be properly written in the memory cells of the non-volatile memory.

Abstract: A first input buffer receives sequentially inputted first data. A first data selector selectively transfers the first data from the first input buffer in accordance with a data input mode. A first data alignment circuit aligns and outputs the data from the first data selector. A second input buffer receives sequentially inputted second data in accordance with the data input mode. A second data selector selectively transfers the data of the first input buffer or of the second input buffer, in accordance with the data input mode. A first data alignment circuit aligns and outputs the data from the second data selector.

Abstract: A data output apparatus converts input data into data that changes less than the input data, and outputs the converted data to a memory.

Abstract: According to an example embodiment, a semiconductor memory device may include a memory core, input circuit, and/or an output circuit. The input circuit may be configured to generate second data from first data using latch circuits operating in response to input control signals enabled during different periods. The input circuit may be further configured to provide the second data to the memory core. The second data may have 2N times the number of bits of the first data, where N is a positive integer. The output circuit may be configured to generate fourth data from third data using latch circuits operating in response to output control signals enabled during different periods. The output circuit may be further configured to provide the fourth data to data output pins. The fourth data may have ½N times the number of bits of the third data. A method of inputting/outputting data is also provided.

Abstract: A latency signal generator and method thereof are provided. The example latency signal generator may include a sampling clock signal generator adjusting a plurality of initial sampling clock signals based on a received clock signal to generate a plurality of adjusted sampling clock signals, a latch enable signal supply unit adjusting a plurality of initial latch enable signals based on a given one of the plurality of initial sampling clock signals to generate a plurality of adjusted latch enable signals and a latch unit including a plurality of latency latches, each of the plurality of latency latches selectively latching a given internal read command based on one of the plurality of adjusted sampling clock signals and one of the plurality of adjusted latch enable signals.

Abstract: An improved cross-coupled CMOS high-voltage latch that is used for storing data bits to be written to memory cells of a non-volatile memory is provided with a switching circuit that, during writing of data bits into the memory cells of the latch, provides a high series impedance between one leg of the latch and ground to limit leakage current. A large number of latches are connected in parallel and their accumulated leakage currents are limited by the switching circuit to prevent overload of a high-voltage generator, such as a charge pump circuit, for the high-voltage latch, so that data can be properly written in the memory cells of the non-volatile memory.

Abstract: A word driver supplies a high level voltage to a word line when a memory cell is accessed and supplies low level voltage which is a negative voltage to the word line when the memory cell isn't accessed. A precharge circuit lowers a precharge voltage-supplying capacity to a bit line at least during a standby period when the memory cell is not accessed. A substrate voltage of an nMOS transistor with source or drain connected to the bit line is set to the low level voltage or lower of the word line. Therefore, when the word line and the bit line fails short and the voltage of the bit line changes to the low level voltage of the word line during the standby period, a substrate current can be prevented from flowing between the source of the nMOS transistor and a substrate or the drain and the substrate.

Abstract: An improved architecture and method for operating a PCRAM integrated circuit is disclosed which seeks to minimize degradation in the resistance of the phase change material in the cells. When an attempt is made during a write command to write a data state to a bit which already has that data state, such matching data states are identified and writing to those bits is precluded during the write command. In one embodiment, both the incoming data to be written to a bit and the data currently present at that bit address are latched. These latched data are then compared (e.g., with an XOR gate) to determine which bits have a matching data state. The results of this comparison are used as an enable signal to the write (column) driver in the PCRAM memory array, with the effect that only data bits having different data state are written, while data bits having a matching data state are not needlessly re-written.

Abstract: In a nonvolatile memory device, a program operation is performed on a plurality of nonvolatile memory cells by programming data having a first logic state in a first group among a plurality of selected memory cells selected from the plurality of nonvolatile memory cells during a first program interval of the program operation, and thereafter, programming data having a second logic state different from the first logic state in a second group among the selected memory cells during a second program interval of the program operation after the first program interval.

Abstract: A device for reading out memory information storable in a memory has an integrator and a comparator. The memory provides, in a hold phase, a leakage current, and in a readout phase, a readout current. The readout current is dependent on the stored memory information. The integrator is adapted to integrate a quantity derived from the leakage current during the hold phase, and to provide a leakage voltage corresponding to an integrated leakage current. The integrator is further adapted to integrate a quantity derived from the readout current during the readout phase, and to provide a readout voltage corresponding to an integrated readout current. The comparator may compare the leakage voltage to the readout voltage and provide, in dependence on the comparison, a readout value corresponding to the memory information.

Abstract: Plural data lines read normal data stored in a first area in the memory cell array when the data lines are connected to a selected bit line. Plural parity data lines read parity data from a second area in the memory cell array different from the first area, the parity data being used for an error correction of the normal data stored in the memory cell. A first determination circuit compares the normal data read from the data lines and their expectation value, respectively, and determines whether the data and the expectation value coincide, respectively. A second determination circuit compares the parity data read from the parity data lines and their expectation value, respectively, and determines whether the data and the expectation value coincide, respectively. The second determination circuit includes a selection circuit that selectively outputs a determination result on a part of the parity data lines.

Abstract: A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory operations in memory planes. The memory operations are sequentially initiated and the memory operation for at least one of the memory planes is initiated during the memory operation for another memory plane. In one embodiment, each of a plurality of programming circuits is associated with a respective memory plane and is operable to program data to the respective memory plane in response to programming signals and when it is enabled. Control logic coupled to the plurality of programming circuits generates programming signals in response to the memory receiving program commands and further generates programming enable signals to individually enable each of the programming circuits to respond to the programming signals and stagger programming of data to each of the memory planes.

Abstract: A controller circuit is coupled to a memory device over a data/IO bus and a control bus. The controller circuit generates a read enable signal that is transmitted to the memory device to instruct the memory device to drive data onto the data/IO bus. The read enable signal is fed back to the controller circuit that then uses the fed back signal to read the data from the data/IO bus.

Abstract: A semiconductor memory device includes an aligning signal generator, a data aligning unit, a data transmitting controller and a data transmitter. The aligning signal generator receives a data strobe signal to output aligning signals. The data aligning unit aligns a plurality of data pieces input in succession in response to the aligning signals. The data transmitting controller generates a data transmitting signal synchronized with the transition of the aligning signal. The data transmitter transmits an aligned data output from the data aligning unit to a data storage area in response to the data transmitting signal. A method for driving the semiconductor memory device includes aligning data pieces input in succession as parallel data in response to a data strobe signal, generating a data transmitting signal corresponding to transition of the data strobe signal and transmitting the parallel data to a data storage area in response to the data transmitting signal.

Abstract: A memory control circuit includes: a phase detection module for detecting a phase difference between a data strobe signal and a clock signal; a control module, coupled to the phase detection module, for generating a set of control signals according to the phase difference, where the set of control signals correspond to the phase difference; a latch module for latching write data carried by a data signal according to rising/falling edges of the data strobe signal; an odd/even data separator, coupled to the latch module, for performing odd/even data separation on the write data to generate a data separation signal carrying odd/even data corresponding to the write data; and an adjustable delay line module, coupled to the odd/even data separator and the control module, for adjusting the odd/even data's delay according to the control signals, where the delay amount of the odd/even data corresponds to the control signals.

Abstract: It is provided a semiconductor device with the ability to carry out data output operation using a reference clock of which the duty cycle is substantially 50%. The semiconductor device includes a clock buffer for receiving the external clock to generate an internal clock; a delay locked loop circuit for receiving the internal clock to generate a delay locked clock, a controlling unit for generating a control signal, a data output unit for output of data synchronized with a reference clock, and a clock transfer circuit for receiving the delay locked clock to output the reference clock in response to the control signal wherein the clock transfer circuit corrects the duty cycle of the delay locked clock based on a duty cycle information of the reference clock.

Abstract: A cell core unit and its peripheral circuit are driven by a relatively low voltage power supply. A constant voltage that does not depend on the power supply voltage is provided as a boosted voltage (VBOOST) to be supplied to a control signal for a word line of the cell core unit. A sense amplifier amplifies a higher voltage level of a bit line to the power supply voltage. Then, a circuit for generating a signal for defining the transition timing and/or the pulse width of a control signal from the peripheral circuit to the cell core unit performs signal delay using a delay circuit having a characteristic in which a delay time thereof decreases with reduction of the provided power supply voltage.

Abstract: The present invention detects a sense amplifier having an unbalanced characteristic. In a test method for a semiconductor memory device for detecting a sense amplifier having an unbalanced characteristic, an intermediate potential having different H and L levels from normal operation is restored in a first memory cell of a first bit line connected to a test target sense amplifier, charge quantity when the capacitance of the capacitor is small is virtually stored in the first memory cell, then the data of the first memory cell is read, and a malfunction of the sense amplifier is checked based on the presence of an error of read data.

Abstract: A semiconductor memory device includes a delay time selecting portion for outputting, as a final read/write command, an internal read/write command that corresponds to an external read/write command and is synchronized with an external clock rising edge at a tRCD time without any delay when an address is applied before an address setup time based on the external clock rising edge of a previously set tRCD time, a decoder for decoding an address applied from an external portion with the read/write command to output a decoded address, and a selecting portion for receiving the decoded address to select a memory cell of a memory cell array in response to the final read/write command.

Abstract: A redundancy program circuit and methods thereof. The redundancy program circuit may include a master fuse circuit with a master fuse outputting an operation enable signal to indicate a master fuse operating status, at least one control fuse circuit including at least one control fuse, the at least one control fuse circuit outputting an operating status signal for the at least one control fuse and a multiplexing unit configured to multiplex decoding address signal bits based on at least one of the operating status signal and the operation enable signal.

Abstract: A flash memory device, a system including a flash memory device, a method for operating a flash memory cell, and an apparatus for operating a flash memory cell include applying a first bit line voltage to a bit line coupled to the cell, applying a first test voltage to a word line coupled to the cell, storing a first threshold voltage value for the cell, applying a second test voltage to the word line, storing a second threshold voltage value for the cell, and determining a programming pulse voltage for the cell from the first and second stored threshold voltage values.

Abstract: A semiconductor memory device checks a RAS timing to recognize and set an operation timing of the semiconductor memory device. The semiconductor memory device includes an input buffer, a RAS timing controller and a bank controller. The input buffer transmits a RAS timing test signal. The RAS timing controller generates a RAS timing signal. The bank controller controls a refresh operation timing in response to an output of the input buffer in a test mode and the RAS timing signal in a normal mode.

Abstract: A DRAM bit line precharge voltage generator comprises a first amplifier having a first current source and comparing a first voltage with a precharge voltage to control a first PMOS transistor, a second amplifier having a second current source and comparing a second voltage with the precharge voltage to control a second PMOS transistor, a third amplifier having a third current source and comparing a third voltage with the precharge voltage to control a first NMOS transistor, and a fourth amplifier having a fourth current source and comparing the first voltage with the precharge voltage to control a second NMOS transistor. The precharge voltage feedbacks from an output node connected between the second PMOS transistor and the first NMOS transistor.

Abstract: A semiconductor memory device is able to control a timing of an auto-precharge operation. The semiconductor memory device includes a timing controller and an auto-precharge controller. The timing controller generates timing control signals to be used for controlling a timing of an auto-precharge operation based on control signals inputted from an external device or through a mode register set. The auto-precharge controller controls the auto-precharge operation in response to the timing control signals.

Abstract: A sense amplifier includes a reference signal providing unit and an internal sense amplification unit. The reference signal providing unit provides a reference bit line signal in response to a reference control signal. The internal sense amplification unit receives the reference bit line signal and data signals that correspond to the data. The received signals are provided through bit lines connected to the memory cell array. The internal sense amplification unit senses the received reference bit line signal and the data signals and amplifies the sensed signals. The sense amplifier senses data stored in memory cells connected to dummy bit lines of the outmost memory cell array of a semiconductor memory device such that the memory cells that are not used can be used. Accordingly, the design area and cost of the semiconductor memory device can be reduced.

Abstract: Provided is a memory device that can detect a mismatch in a bit line sense amp, wherein the memory device includes a sense amp drive unit for selectively supplying a pull-up drive voltage or a pull-down drive voltage to a bit line sense amp in response to a sensing test signal provided from outside.

Abstract: A memory circuit comprises a plurality of parallel bit-lines connected to a plurality of memory cells, a plurality of sense amplifiers connected to the bit-lines and a plurality of switches each of which being connected to a respective pair of bit-lines out of the plurality of bit-lines for switchably short-circuiting the respective pair of bit-lines. The bit-lines of the respective pair of bit-lines are connected to two different sense amplifiers, and the bit-lines of the respective pair of bit-lines are adjacent to a further bit-line disposed between the bit-lines of the respective pair of bit-lines.

Abstract: Methods and systems are provided for storing data holographically. Multiple distinct data packets are received. The data packets are stored on a temporary data storage. Data that includes the data packets are written holographically during a single write session to a photopolymer storage medium by optically interfering an optical data beam with an optical reference beam. The data are written physically to a data region on the photopolymer storage medium. A bleaching area of the photopolymer storage medium is exposed to a bleaching illumination to optically fix the bleaching area and prevent data from subsequently being written to the bleaching area. The bleaching area includes the data region.

Abstract: Methods and apparatus to provide refresh when an out of range address is received are disclosed. An example method of providing a refresh signal to a memory cell includes receiving a memory address on address lines ranging from a most significant bit address line to a least significant bit address line. A memory driver logic device is coupled to the memory cell. An out of range logic decoder is coupled to provide a fixed logic input to a first input of the memory driver logic device. Address logic is provided to cause the memory driver logic device to enable the memory cell if the memory address is a local out of range address.

Abstract: The present invention suppresses the refresh failure of a DRAM due to the dispersion of a threshold of a MOSFET. The DRAM has a first unit for recording a set value of a back bias potential to be applied to a back gate of a cell transistor and a second unit for generating a back bias potential based on the set value of the back bias potential recorded in the first unit and supplying the generated back bias potential to the back gate, wherein when a threshold of a MOSFET which has a structure identical to the cell transistor and which has been fabricated in the same process as the cell transistor is greater than a target value which the cell transistor should have, a value shallower than the back bias potential for the target value is recorded in the second unit.

Abstract: A device is disclosed for refreshing memory contents of first and second memory cells, wherein the memory contents of the first memory cells are refreshed in a first period of time and the memory contents of the second memory cells are refreshed in a second period of time, having a pre-charge circuit for bit lines for the first memory cells and the second memory cells, and having a controller which may be coupled to the pre-charge circuit to control the pre-charge circuit such that a pre-charge voltage may be applied to the bit lines of the first memory cells during the first period of time and not during the second period of time and that the pre-charge voltage may be applied to the bit lines of the second memory cells during the second period of time and not during the first period of time.

Abstract: A dynamic random access memory (DRAM) having DRAM cells coupled to wordlines and bitlines. In a self-refresh mode, the cells coupled with the even numbered rows retain main data previously stored therein and the assistant data, which is logically opposite to the main data, is overwritten into the cells coupled with the wordlines of the odd numbered rows. When the DRAM enters the self-refresh mode, a starting refresh address for the self-refresh mode is detected. If the detected starting refresh address does not match with a predetermined correct address set for the self-refresh operation mode, a dummy refresh cycle will be established in an entry-burst self-refresh period. During the dummy refresh cycle, a dummy refresh command is added to increment an internal row address counter that provides row addresses for self-refreshing the cells of the selected wordlines within the cell array.

Abstract: A method, apparatus, and system to enable a partial refresh scheme for DRAM which includes specifying at least a refresh start value, or a refresh start value and a refresh end value, to reduce the number of rows that must be refreshed during a refresh cycle, thus reducing the amount of power consumed during refresh.

Abstract: A power gating circuit of a memory device includes a power gating unit and a control unit. The power gating unit includes first, second, and third power gating transistors connected in parallel between a power supply voltage and an internal power supply voltage bus of the memory device. The three power gating transistors are sequentially turned ON. The second and third power gating transistors turn ON sequentially in response to the increasing voltage level of the bus. The timing points when the second and third power gating transistors are sequentially turned ON is based upon detecting the gradually increasing the voltage level of the internal power supply voltage. The size of the first power gating transistor may be smaller than the size of the second power gating transistor, and the size of the second power gating transistor may be smaller than the size of the third power gating transistor.

Abstract: A circuit and method efficiently powers a static storage element during a low voltage mode of operation. The static storage element is powered at a first voltage level in an active mode of the static storage element. The static storage element is powered in a low power mode using alternating first and second phases. Powering the static storage element during the first phases in the low power mode includes powering the static storage element at or below a second voltage level, wherein powering the static storage element during the second phases in the low power mode includes powering the static storage element at a higher voltage level than the second voltage level. In another form two modes of low power operation are used where a first mode uses a less power efficient operation than the second mode, but both are more power efficient than a normal power mode.

Abstract: A semiconductor memory device 100 is proposed including an internal address generation circuit 3, a first internal address control signal generation part 4, a second internal address control signal generation part 11, and an internal address control signal selection circuit 10 having an OR gate transistor 12. The internal address generation circuit 3 generates an internal address signal based on input address data. The first internal address control signal generation part 4 generates a first internal address control signal and having a function which fixes the first internal address control signal at a predetermined level with the elapse of a fixed period of time. The second internal address control signal generation part 11 generates a second internal address control signal corresponding to an input of a predetermined command. The OR gate transistor 12 transmits either the first internal address control signal or the second internal address control signal to the internal address generation circuit 3.

Abstract: Memory with at least two memory banks each having memory cells, a control circuit, and at least one bank mode register, wherein the bank mode register stores information about an operation mode of a memory bank, wherein the control circuit operates at least one of the memory banks according to the information of the mode register.

Abstract: A domino SRAM global bit select circuit provides an interface between dual global read and write bit line pairs to a “local bit select” circuit.