Abstract: A fan frame includes a main body (10) and conducting wires (40) secured on the main body. The main body has a securing tab (30) extending from an outer surface thereof. The securing tab has a free end. A groove (32) for the wires to extend through is defined between the securing tab and the outer surface of the main body. At least a block (35) extends from the outer surface of the main body. A space (80) for receiving the wires therein is defined between the block, the securing tab and the outer surface of the main body. A guiding surface (352) is formed on the block from a bottom end towards a top end of the block for guiding the wires to move into the space.

Abstract: A heat sink is provided that makes air velocity between cooling fins uniform in order to improve heat dissipation performance, thereby realizing a reduction in weight and achieving high cost performance. Distal ends of fins disposed substantially in front of a cooling fan are located on the uppermost stream side in the flowing direction of cooling air, and distal ends of fins on both sides in the width direction of the heat sink are located on the lowermost stream side. Each of the fins is preferably provided with a slope so that the height of the fin gradually increases from the distal end thereof in a direction from the upstream side to the downstream side in the flowing direction of cooling air.

Abstract: A system and method are disclosed for enclosing electronic equipment in a noiseproofed and ventilated enclosure. This includes supplying air to an enclosure and removing air from the enclosure through acoustic chambers attached to the enclosure. The acoustic chambers can be constructed of materials or be treated with materials that have noise-absorbing or noise-abating properties. In addition, the acoustic chamber for exhausting air from the enclosure can contain baffles that help to prevent noise that has entered the acoustic chamber from leaving the chamber. And, the system and method can use a cable egress port that allows cables and wiring to pass through the egress port while blocking the transmission of noise through the egress port.

Abstract: A computer enclosure includes an airflow guide (10), a chassis (20) for mounting the airflow guide therein, a fan 30 mounted in the airflow guide, and a side panel (27) for covering the chassis. The chassis includes a rear panel (25) and a motherboard (21) mounted therein, a heat sink (23) is mounted on the motherboard, a plurality of openings (253) for dissipating heat and a fixing slot (251) are defined in the rear panel. The fan aligns with an area of the openings of the rear panel. The airflow guide encases the heat sink therein and includes a catch (1371) engaging in the fixing slot of the chassis. The side panel covers the chassis and abuts against the airflow guide for preventing the catch disengaging from the fixing slot.

Abstract: A substrate mounted with an electronic element thereon, comprises a base, an insulator, a fluid passage, and a pressurizer. The base is made of a metal. The insulator is made of a ceramic material and provided on one face of the base. The insulator has a heat-generating electronic element mounted on its side facing contrary to the one face. The fluid passage is formed within the base to have liquid flow therethrough, and radiates heat which has been transmitted from the electronic element via the insulator to the base. The pressurizer applies pressure to the liquid within the fluid passage. The pressurizer includes a pressurizing chamber and an actuator unit. The pressurizing chamber is formed within the fluid passage. The actuator unit changes a volume of the pressurizing chamber by displacing a portion of the insulator corresponding to the pressurizing chamber with respect to a direction perpendicular to the one face.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

Abstract: An electrical enclosure that includes a sidewall, a back and a top, defining an interior. The top of the enclosure is adapted to open and provide access to the interior. The enclosure includes a backplane mounted to the interior of the enclosure. The backplane has at least one cutout where the cutout is positioned on the backplane to align with an obstacle positioned on the enclosure sidewall and extending into the enclosure interior.

Abstract: A heat dissipating device for cooling a heat-generating electronic device, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (14), and heat pipes (16) thermally connecting the heat spreader and the fins. The fins include at least one fastening fin (146). The fastening fin includes a pair of mounting tabs (1462). The mounting tabs of the fastening fin are oriented towards the fan for mounting the fan on the heat sink assembly. The fastening fin functions not only for dissipating heat into a surrounding environment but also for connecting the fan to the heat sink assembly.

Abstract: In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract: Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together.

Abstract: An electronic unit, in particular a control device for a motor vehicle, has a printed circuit board, populated with electronic components, and a housing enclosing the printed circuit board. The printed circuit board has at least one first section, arranged at a distance from the housing and equipped with electronic components on both sides thereof, and at least one second section which is connected to the housing by way of a heat-conducting adhesive layer.

Abstract: Methods and devices for cooling printed circuit boards having at least one heat source are disclosed and described. Such a device may include a dielectric layer disposed onto a surface of a substrate. The dielectric layer may include a plurality of carbonaceous particles disposed in a dielectric material. In one aspect, the carbonaceous particles may be diamond particles. Furthermore, a circuit including a heat source may be disposed onto a surface of the dielectric layer opposite to the substrate such that the circuit is thermally coupled to the dielectric layer. Additionally, the dielectric layer may be configured to accelerate heat generated by the heat source away from the heat source.

Abstract: A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.

Abstract: In accordance with the present disclosure, a drawer slide rack equipment mount that allows an equipment chassis to be operational when the chassis is slid in the rack and when the chassis is slid outward from the rack such that components in the chassis can be tested while the components are operating as part of the rack system. The drawer slide can include a first rigid member and a second rigid member to slidably engage the first rigid member. Also a set of contacts holders can hold contacts proximate to the first rigid member and in a parallel configuration with the first rigid member such that when conductors on an equipment chassis (and a second rigid member) move with the second rigid member along the first rigid member the set of contacts mounted in relation to the first rigid member can engage the conductors on the equipment chassis in more than one location.

Abstract: A removable cartridge containing circuit components to be used with a distributed DC power harvesting system. Various components of the circuits, such as capacitors or transistors, may be included in removable cartridges that may be plugged into the overall circuit.

Abstract: An exemplary flexible printed circuit board includes a flexible base film, a number of signal traces formed on the flexible base film, and at least a grounding metal layer formed on the flexible base film. The grounding metal layer defines a number of openings therein thereby forming a mesh-like pattern. The flexible printed circuit board can disperse and reduce stress caused by bending, thereby preventing wires from becoming broken/cracked and enhancing flexibility.

Abstract: A press stripe device for a computer interface card comprises a casing body; at least one press stripe locating above the casing body; the press stripe having a plurality of guide channels; each of two sides of the guide channel having a plurality of slots; at least one press unit formed of a bracket and a suspending arm which is pivotally installed to the bracket; the bracket having a block corresponding to the guide channel and at least one downward extending rotary shaft; the suspending arm having an ear corresponding to the slot of the press stripe and sliding grooves at two sides thereof; and wherein the press unit is engaged to the press stripe by the block being locked to a lower side of the press stripe so that the bracket is moveable to drive the suspending arm of the bracket.

Abstract: A chassis has positioning plates which are perpendicular to each other formed by cutting and bending a plate material, attachment convex portions which are formed by press work of the plate material, and which are projected out in bending direction of the positioning plates, and L-shaped attachments. Aboard has a pair of slits into which a pair of the positioning plates inserted, and attachment holes. The board is positioned in two directions by a pair of the positioning plates, thereby the board can be positioned with a high degree of accuracy.

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

Abstract: A printed circuit board having only one circuit element, said circuit element having one or more leads and each lead being in electrical communication to one end of a trace on the printed circuit board, wherein said trace has a second end terminating at a pad, wherein said pad is in electrical communication with a receptacle capable of receiving and retaining a wire.

Abstract: The present invention provides a circuit board in which generation of a white-blushed mark which is partially produced at a blank portion having no wiring pattern at a rim of an opening portion is suppressed when forming the opening portion by punching, and a manufacturing method thereof in the circuit board in which a portion where a wiring pattern is dense and the blank portion having no wiring pattern are present at a rim of a central part of the circuit board. There is provided a circuit board having an opening portion formed at the center of the circuit board by punching, the circuit board having a structure where a dummy electrode pattern connected with a rim of the opening portion is provided besides a wiring pattern which is connected with the opening portion at the rim of the opening portion and used for wire bonding. It is preferable to provide the dummy electrode pattern having a size satisfying S/d?0.

Abstract: A connecting terminal has an electrically-conductive ring surrounding a columnar space. Electrically-conductive elastic pieces extend from the electrically-conductive ring in the direction of the central axis of the columnar space. Electrically-conductive blades stand from the outer surfaces of the electrically-conductive elastic pieces. A lead terminal is received in the columnar space. The tip ends of the electrically-conductive elastic pieces are urged against the lead terminal. The lead terminal is prevented from withdrawing out of the through hole. Electric connection is established between the lead terminal and the elastic pieces. The blade or blades of the connecting terminal or terminals stick into the wall surface of the through hole. The connecting terminal is thus firmly held in the through hole. Electric connection is established between the blade or blades and the through hole. Electric connection is thus established between the lead terminal and the through hole.

Abstract: A flush mounted assembly for housing an electronic or electro-mechanical module which detects abnormal conditions and responds to the detection of such abnormal conditions. The assembly includes a base mounted in an opening in a structural member such as a wall, partition or ceiling. The base includes a peripheral wall defining a shallow cavity with an outer open face and an inner wall. A laterally outwardly projecting flange extends from the peripheral side wall of the base for flush engagement with the structural member. The shallow cavity of the base is dimensioned to receive the electronic or electro-mechanical module. A closure plate is provided for the open outer face of the base. The closure face has a periphery dimensioned to close the open outer face of the shallow cavity in the base leaving only a narrow gap between the closure plate periphery and the base periphery wall to allow ambient air to enter the shallow cavity of the base and interact with the module.

Abstract: An electromagnetic interference (“EMI”) shield that can help control the emission of electromagnetic radiation from an optoelectronic module in which the EMI shield is positioned. In one example embodiment, an EMI shield includes a base and plurality of flanges extending from a perimeter of the base. The base defines an optical subassembly (“OSA”) opening and a plurality of complementary structures. The OSA opening is configured to receive an OSA. Each complementary structure is configured to engage a complementary structure of an OSA connector block.

Abstract: A nano-scale compliant mechanism includes a coupler and a plurality of nanotubes disposed for nano-scale motion relative to a grounded component. The nanotubes are fastened at one end to the coupler and at the other end to ground, to guide motion of the coupler relative to the ground. Particular embodiments include a plurality of parallel carbon nanotubes. An exemplary embodiment exhibits first and second regions of mechanical behavior; a first region governed by bulk elastic deformation of the nanotubes and a second region governed by compliant, hinge-like bending of the buckled nanotubes.

Abstract: A surgical headlamp containing dual lamp housings, each containing multiple LED light sources is featured. Both lamp housings may be adjusted so that light beams emitted by each LED be selectively converged through a focusing lens at a spot a predetermined distance in front of the lamp housings. Each lamp housing typically contains in addition to the LED's, one or more focusing lenses to gather and direct the light generated by the LED's forward to an illuminated work area. Batteries, preferably rechargeable, are mounted either on the headband supporting the headlamp on a users head or external to the headband, are used to power the LED's. A cooling system for the LED's is included, which utilizes a heat sync associated with the printed circuit board for the LED's, combined with a liquid cooling solution which is pumped in chamber surrounding the base of the heat sync of the LED light system.

Abstract: The invention comprises a flexible tubing which is adapted to carry a plurality of electrical conductor lines and have at least one passage for passing fluids through and wherein there is a mounting connector that connects the electrical lines to the desired use of it and also a connection to allow the fluids used in the flexible tubing to be connected to the area of use. The connection is made through a friction-force fit and that achieves both the electrical connection and the fluid connection.

Abstract: An enclosure assembly allows a hinge bracket to realize establishment of the opened attitude or the closed attitude of a second enclosure relative to a first enclosure. The second enclosure rotates relative to the hinge bracket around the second rotation axis. The second enclosure in this manner changes its attitude relative to the first enclosure. The hinge bracket stays where it is. The hinge bracket does not rotate. The position of the light sources is thus kept unchanged. The position of the light is maintained regardless of a change in the attitude of the second enclosure around the second rotation axis. The enclosure for an electronic apparatus is thus allowed to enjoy an enhanced appearance. This leads to an enhanced appearance of the electronic apparatus.

Abstract: An apparatus comprised of: a generally tubular and closed writing utensil sheath formed by a first thin sidewall and adapted to receive a writing utensil; a generally tubular and closed lighting device sheath, formed by a second sidewall, positioned adjacent to the writing utensil sheath, and adapted to receive a lighting device; and a connecting portion connecting the writing utensil sheath to the lighting device sheath such that the lighting device illuminates a writing surface when the writing utensil is in use. The sheaths can further include teeth to keep the writing utensil and lighting device in place. The sheaths can be parallel to one another or somewhat non-parallel to more specifically direct the light at the writing surface when in use. In one embodiment, both of the sidewalls of the sheaths are less than or equal to approximately one eighth of an inch thick. In one embodiment, the connecting portion includes two flat surfaces that are substantially parallel to one another.

Abstract: A cooking utensil is disclosed having a handle, a cooking implement extending from the handle, at least one electric light attached to the handle for illuminating at least a portion of the cooking implement, and power means for providing electric power to the light. In addition, the cooking utensil has either or both an attitude-sensitive switch connecting the light and the power means for turning the light on and off in response to the attitude of the utensil, and an ambient light-sensitive switch connecting the light and the power means for turning the light on and off in response to the level of the ambient light.

Abstract: A lighting apparatus usable for providing light or illumination is provided. The lighting apparatus is formed of components or modules that are easily interchanged to allow uniform parts, simple assembly, and selection of desired features for a particular lighting device.

Abstract: The invention relates to a lighting unit, comprising a first light element formed as a conventional light source, a second light element formed as a plurality of LEDs and a lamp cap. According to the invention the second light element is formed as a separate LED module with a fitting and a second lamp cap whereby the first and the second light elements are removably attached via the fitting and the second lamp cap, the fitting and second lamp cap providing electrical and mechanical connection between both light elements. The invented lighting unit is cost-effective and has better mixing possibilities of the light produced by both light elements.

Abstract: A luminous body is described, in particular in the form of a planar lighting device for general lighting or for back-lighting of displays, which luminous body comprises a plurality of light sources (2), for example LED elements, arranged in a housing (10), in particular an optical waveguide plate (1). The optical waveguide plate (1) forms a first optical medium (1) with a first optical scattering power, into which the light of the light sources (2) is coupled. Furthermore, at least one second optical medium (5) with a second optical scattering power is provided, such that the light propagating in the second optical medium (5) is at least substantially coupled in from the first optical medium (1), and the scattering power of at least one of the media is chosen for the purpose of influencing the flow of light in the housing (10) such that a given brightness distribution of the light on the light emission surface (4) is achieved.

Abstract: A kind of luminous input is disclosed. The luminous input includes an input element, a light guide, and a plurality of LEDs. The light guide defines a hole for receiving the input element, and includes a reflection part and a light transmission part around the hole. The reflection part includes a first reflection surface and a second reflection surface opposite each other. The second reflection surface is tilted at an angle relative to the first reflection surface. Light emitted by the LEDs is sequently reflected by the first and second reflection surface, then passes through the light transmission part. The luminous input is low in height and is efficient in using the light.

Abstract: A light emitting element is mounted on the surface of a board. The light emitting element emits light. The light passes through a translucent optical member. The light enters the translucent optical member through a incident surface. The lines of protrusions make the incident surface jagged. The jagged surface resulting from the protrusions enables diffusion of the light entering through the incident surface. The light spreads along the surface of the board. Simultaneously, the emitted light is partly reflected on the incident surface. The reflected light is reflected on a reflecting surface placed behind the light emitting element. The reflected light then enters the translucent optical member. The translucent optical member is thus allowed to illuminate over a wide range with a sufficient brightness. An impressive illumination can be realized.

Abstract: Apparatuses for backlighting and manufacturing processes thereof are disclosed. There is provided a backlight module. The backlight module comprises a double-sided circuit board with thermal conducting material as one of the core layers; a plurality of light source components mounted on the first surface of the circuit board; and, a plurality of electronic components mounted on the second surface of the circuit board. The thermal conducting core layer discharges heat generated by the light source components. The circuit board has at least one window on the surface layer at the second surface to expose the thermal conducting core layer for thermal dissipation. As such, the component heights on the illuminating side of the circuit board are unified, and the reflector can be made as a smooth planar sheet to provide a more uniform backlight illumination compared to a single-side circuit board design. Further, such an arrangement reduces the complexity in manufacturing the reflector and hence the cost thereof.

Abstract: An LED lighting array is disclosed wherein a plurality of light emitting devices disposed in at least first and second columns are mounted on a planar mounting surface to form an emission plane. The emission axes of all the LEDs in a first column are parallel with each other and lie in a first plane. The emission axes of the LEDs in an adjacent, second column are also parallel, but a second plane containing the emission axes of the second column is disposed at a predetermined, non-zero angle with respect to the first plane. The non-zero angle is a function of the LED beam width and the distance to a lighting target. This configuration of the LEDs provides an optimum balance at a predetermined target distance between the size of the area illuminated and the brightness of the illumination of the target. In one aspect of the invention the LED lighting array includes at least first, second and third columns of LEDs.

Abstract: A lamp cover includes a main plate portion which faces a right side surface of a lamp casing and an upper side-plate portion and a lower side-plate portion which overlap an upper side surface and a lower side surface of the lamp casing arranged adjacent to the right side surface of the lamp casing. A projection which is formed on a front-surface member is brought into contact with an outer side of a front periphery of the main plate portion. The upper side-plate portion and a rear portion of the upper side surface of the lamp casing which the upper side-plate portion overlaps are fastened to each other by screws. Further, the upper side-plate portion and a front portion of the upper side surface of the lamp casing which the upper side plate portion overlaps are fastened together by screws by way of an insulation plate.

Abstract: A heat dissipating design for lamp is disclosed. The heat dissipating design of the present invention comprises a main body, which includes a cover. The cover seals up the top portion of the heat dissipating unit, and hence a sealed space is formed. A plurality of light generating units, a light generating units plate, an AC/DC adopter unit and one or more heat conducting pieces are disposed in the sealed space. When heat is generated by the light generating units and the AC/DC adopter unit, heat is transferred to the light generating units plate and the heat conducting pieces and then to the heat dissipating unit and the heat dissipating pieces. Heat is then dissipated into the ambient air. In this way, heat may be dissipated quickly and efficiently.

Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

Abstract: A holder in which a light emitting diode is set in an opening is fixed on a heat sink so that power feeding units of the light emitting diode are pushed toward the heat sink by metal wiring bodies. Therefore, the light emitting diode and the heat sink can be brought into close contact with each other and heat dissipation performance of the heat sink can be improved.

Abstract: An image generating apparatus includes an light guide member so arranged as to surround the light-emitting device, wherein a circumferential light-emitting surface of the light guide member is so arranged as to be inclined with respect to a surface on which the light-emitting device is set and a circumferential light guide portion of the light guide member is formed such that a vertical thickness is substantially uniform with respect to the surface on which the light-emitting device is set.

Abstract: A light source having a rigid substrate, a first LED, and a flexible reflector housing is disclosed. The rigid substrate has a first surface having a plurality of electrical traces formed thereon, the first LED die being disposed on the first surface and connected to two of the electrical traces. The rigid substrate also includes a plurality of external electrical connections for accessing the electrical traces. The reflector housing includes a layer of flexible material having at least one cavity extending through the layer of flexible material. The layer of flexible material is bonded to the first surface such that the cavity overlies the first LED die. The cavity has walls that reflect light generated in the first LED die. The first die can be encapsulated in a layer of silicone encapsulant. The reflector can likewise be constructed from silicone.

Abstract: An exemplary light emitting diode (30) includes a light output unit (31), an optical lens (33), and a reflective sheet (35). The optical lens is mounted on the light output unit. The optical lens includes a light input surface (331), a generally funnel-shaped top surface (333) and a light output surface (335). The funnel-shaped top surface is distal from the light input surface. The light output surface generally between the light input surface and the top surface is an annular bulging surface. It is relatively easy to configure an injection mold for making the optical lens.

Abstract: A light guiding plate is made of a transparent thermoplastic resin and has a first main surface, a second main surface opposed to said first main surface, a first side wall, a second side wall, a third side wall opposed to said first side wall and a fourth side wall opposed to said second side wall, the surface portion of the first main surface is provided with convex portions and/or concave portions, the light guiding plate has a longitudinal-direction length, which is a length from the first side wall to the third side wall, of 40 mm or more but 130 mm or less, at least 80% region of the light guiding plate has a thickness of 0.1 mm or more but 0.55 mm or less.

Abstract: A decorative lighting apparatus and method include a plurality of mini-light surrounds, each surround formed from silicone. Each surround has a conical cavity configured to stretch when receiving a mini-light to removably retain the surround on the mini-light. Each surround has an outer three dimensional shape different than the mini-light.

Abstract: A vehicular illumination device includes a light distribution control unit, a determination unit and a control unit. The light distribution control unit performs an alteration control of a vehicular illumination unit so as to alter a light distribution with respect to an illumination object detected by a detection unit. When the illumination object ceases to be detected, the determination unit determines whether or not there is a need to maintain the alteration control in a current state. When it is determined that there is a need to maintain the alteration control in the current state, the control unit controls the light distribution control unit so as to maintain the alteration control in the current state.

Abstract: A lighted exterior rearview mirror system for a vehicle comprises an exterior rearview mirror assembly adapted for mounting to a side of a vehicle. The exterior mirror assembly includes a reflective element having a heater and a breakaway joint assembly having stationary member and a pivoting member that comprises a bracket supporting an electrically-operable actuator for positioning the reflective element about at least one axis. The exterior mirror assembly comprises a ground illumination or a signal light. The breakaway joint assembly includes a wire-way through which a wire cable passes carrying vehicle control signals and electrical power.