Abstract: A memory read circuit includes k sense amplifiers provided for respective k bit lines and reading out data from their corresponding bit lines, where k is a natural number, a shift register that includes k flip-flops connected in cascade and arranged to hold outputs from corresponding sense amplifiers, and to output the outputs from the k sense amplifiers as serial data, and expected value setting section arranged to store in the k flip-flops expected value data on the outputs from the corresponding sense amplifiers, and a determination section arranged to determine whether the expected value data stored in the flip-flops matches the outputs from the corresponding sense amplifiers.

Abstract: A trial programming process is performed for a first set of one or more non-volatile storage elements to test usage of the non-volatile storage system. Based on this trial programming, a programming signal is calibrated by adjusting its initial magnitude. The calibrated programming signal is then used to program a second set of non-volatile storage elements (which may or may not include the first set).

Abstract: A trial programming process is performed for a first set of one or more non-volatile storage elements to test usage of the non-volatile storage system. Based on this trial programming, a programming signal is calibrated by adjusting its initial magnitude. The calibrated programming signal is then used to program a second set of non-volatile storage elements (which may or may not include the first set).

Abstract: A system and method for determining a SONOS VT window using a current sensing scheme is disclosed. The present invention creates a first current path and a second current path through the volatile and non-volatile sections of an nvSRAM memory cell. The erase threshold voltage of the first edge of the window is determined when current is detected in the first path. The program voltage of the second edge of the window is determined when current is detected in the second path. Accordingly, the voltage used to power a plurality of SONOS transistors may be set using the values of the first and second threshold edges to determine the VT window.

Abstract: A read reference determining the logical value for results read from memory is adjusted during unstable power conditions.

Abstract: When reading data from a non-volatile storage element that is part of a group of connected non-volatile storage elements, resistance information is measured for the group. One or more read parameters are set based on the measured resistance information. The read process is then performed using the one or more parameters.

Abstract: Shifts in the apparent charge stored on a floating gate (or other charge storing element) of a non-volatile memory cell can occur because of the coupling of an electric field based on the charge stored in adjacent floating gates (or other adjacent charge storing elements). The problem occurs most pronouncedly between sets of adjacent memory cells that have been programmed at different times. To account for this coupling, the read process for a particular memory cell will provide compensation to an adjacent memory cell in order to reduce the coupling effect that the adjacent memory cell has on the particular memory cell. When reading the adjacent cell to determine the appropriate compensation, margined read voltages can be used.

Abstract: Shifts in the apparent charge stored on a floating gate (or other charge storing element) of a non-volatile memory cell can occur because of the coupling of an electric field based on the charge stored in adjacent floating gates (or other adjacent charge storing elements). The problem occurs most pronouncedly between sets of adjacent memory cells that have been programmed at different times. To account for this coupling, the read process for a particular memory cell will provide compensation to an adjacent memory cell in order to reduce the coupling effect that the adjacent memory cell has on the particular memory cell. When reading the adjacent cell to determine the appropriate compensation, margined read voltages can be used.

Abstract: In a method of operation, a flash memory cell is programmed, a word-line voltage is coupled to the flash memory cell, and a state of the flash memory cell is sensed at intervals to generate data to indicate a state of the flash memory cell. In a method of operation, a latch in a cache memory of a NAND flash memory is switched off, and the latch is initialized while the latch is switched off. A read voltage is coupled to a gate of a selected flash memory cell in the NAND flash memory where the selected flash memory cell is coupled to a bit-line, and the bit-line is coupled to an input of the latch while a voltage on the bit-line is changing.

Abstract: A non-volatile memory device includes an even bit line and an odd bit line, a first register, a second register, a first precharge unit, a second precharge unit and a bit line select unit. The even bit line and the odd bit line are connected to a memory cell array. The first register is connected to the even bit line and configured to store specific data. The second register is connected to the odd bit line and configured to store specific data. The first precharge unit precharges an even sense node, formed at a node of the even bit line and the first register, with a high level or supplies supplementary current to the even sense node. The second precharge unit precharges an odd sense node, formed at a node of the odd bit line and the second register, with a high level or supplies supplementary current to the odd sense node. The bit line select unit connects the even bit line and the even sense node and connects the odd bit line and the odd sense node.

Abstract: A simple method and device for accurately measuring flash memory cell current. The sensing scheme comprises an integrator, an analog to digital converter, and a digital to analog converter. The method comprises the acts of applying an input current and a feedback output current to a summer, integrating the resulting summer output over time, passing the integrated output to a clocked comparator, outputting a comparator output which controls a feedback circuit that keeps the integrator's voltage at the same level as a reference voltage, and outputting a digital average current to a counter. Delta sigma modulation (averaging) is employed to cancel out noise that would otherwise affect the cell current measurement.

Abstract: Data verification in a memory device using a portion of a data retention margin is provided. A bit count is read from the region to determine whether errors will result in the memory. A read in one or more retention margin portions is performed after the normal program verify sequence and if the number of bits in these regions is more than a pre-set the memory will fail verify status. A method of verifying data in a memory device includes the steps of: defining an retention margin between adjacent data thresholds; programming the memory device with data; determining whether bits are present in the data retention margin; and if the number of bits in the retention margin exceeds a threshold, generating an error.

Abstract: A memory system, comprising an array of storage elements divided into logical blocks and pages within said logical blocks and a managing circuit is provided. The managing circuit is in communication with said array of storage elements and performs programming and reading operations. The programming operations include programming a plurality of multi-state storage data. The reading operations include defining an retention margin between adjacent data thresholds, determining whether bits are present in a portion of the data retention margin, and if the number of bits in the portion of retention margin exceeds a threshold, generating an error.

Abstract: Unselected groups of non-volatile storage elements are boosted during programming to reduce or eliminate program disturb for targeted, but unselected memory cells connected to a selected word line. Prior to applying a program voltage to the selected word line and boosting the unselected groups, the unselected groups are pre-charged to further reduce or eliminate program disturb by providing a larger boosted potential for the unselected groups. During pre-charging, one or more pre-charge enable signals are provided at different voltages for particular non-volatile storage elements.

Abstract: A non-volatile storage system in which body bias can be applied to optimize performance. Body bias can be set in an adaptive manner to reduce an error count of an error correcting and/or detecting code when reading data from non-volatile storage elements. Also, a body bias level can be increased as a number of programming cycles increases. Also, body bias levels can be set and applied separately for a chip, plane, block and/or page. A body bias can be applied to a first set of NAND strings for which operations are being performed by controlling a first voltage provided to a source side of the first set of NAND strings and a second voltage provided to a p-well. A source side of a second set of NAND strings for which operations are not being performed is floated or receives a fixed voltage.

Abstract: A method of driving a non-volatile memory device includes programming a plurality of memory cells based on a first data copied from a program data buffer to a verification data buffer, verifying the memory cells by overwriting a result of the verification of the programmed memory cells to a verification data buffer, and re-verifying the memory cells by repeating the programming and verifying operations at least once with respect to the memory cells that were successfully verified, based on the verification result written to the verification data buffer.

Abstract: A method for erasing data of a NAND flash memory device including memory cell blocks may include using a first erase voltage applied to memory cells of a block to be erased. A first verification may be performed to verify erased states of the memory cells using a first verify voltage different than a second verify voltage. Memory cells that have not passed the first verification process are classified as a first group and a verification is performed on memory cells that have passed the first verification using the second verify voltage. Memory cells that have passed the second verification are classified as a second group and memory cells that have not passed the second verification are classified as a third group. Then data of the memory cells of the three groups are erased using first, second and third step voltages and first, second and third erase voltages, respectively.

Abstract: A system of Flash EEprom memory chips with controlling circuits serves as non-volatile memory such as that provided by magnetic disk drives. Improvements include selective multiple sector erase, in which any combinations of Flash sectors may be erased together. Selective sectors among the selected combination may also be de-selected during the erase operation. Another improvement is the ability to remap and replace defective cells with substitute cells. The remapping is performed automatically as soon as a defective cell is detected. When the number of defects in a Flash sector becomes large, the whole sector is remapped. Yet another improvement is the use of a write cache to reduce the number of writes to the Flash EEprom memory, thereby minimizing the stress to the device from undergoing too many write/erase cycling.

Abstract: Non-volatile memory read operations compensate for floating gate coupling when the apparent threshold voltage of a memory cell may have shifted. A memory cell of interest can be read using a reference value based on a level of charge read from a neighboring memory cell. Misreading the neighboring cell may have greater effects in particular programming methodologies, and more specifically, when reading the neighboring cell for particular states or charge levels in those methodologies. In one embodiment, memory cells are programmed to create a wider margin between particular states where misreading a neighboring cell is more detrimental. Further, memory cells are read in one embodiment by compensating for floating gate coupling based on the state of a neighboring cell when reading at certain reference levels but not when reading at other reference levels, such as those where a wider margin has been created.

Abstract: A set of non-volatile storage elements is divided into subsets for erasing in order to avoid over-erasing faster erasing storage elements. The entire set of elements is erased until a first subset of the set of elements is verified as erased. The first subset can include the faster erasing cells. Verifying the first subset includes excluding a second subset from verification. After the first subset is verified as erased, they are inhibited from erasing while the second subset is further erased. The set of elements is verified as erased when the second subset is verified as erased. Verifying that the set of elements is erased can include excluding the first subset from verification or verifying both the first and second subsets together. Different step sizes are used, depending on which subset is being erased and verified in order to more efficiently and accurately erase the set of elements.

Abstract: We describe a NAND flash memory device including a memory cell array formed on a substrate including a plurality of cell strings each including a string selecting transistor, a ground selecting transistor, and plural memory cells serially coupled between the string selecting transistor and the ground selecting transistor. A high voltage generator is configured to supply a bulk voltage to the substrate and an erase control circuit is configured to stepwise increase the bulk voltage during a first period of an erase operation and to maintain the bulk voltage substantially constant during a second period of the erase operation.

Abstract: Various embodiments include a circuit to receive data information, a memory array including memory cells coupled to a bit line, and control circuitry to charge the bit line while the data information is received at the circuit. The control circuitry may program the data information into a selected memory cell of the memory cells after the data information is received at the circuit. Other embodiments including additional methods, apparatus, and systems are disclosed.

Abstract: Method for controlling voltage in a non-volatile memory system is provided. The method includes selecting a first input value for a voltage generator system operating in one of a plurality of modes, the first input value controlling a temperature dependent component of a voltage applied to a memory cell; and selecting a second input value for the voltage generator system operating in one of the plurality of modes, the second input value controlling a temperature independent component of the voltage applied to the memory cell. The temperature dependent component of the voltage applied to the memory cell and the temperature independent component of the voltage applied to the memory cell are controlled independently in response to the first input value and the second input value.

Abstract: Controlling a bitline bias voltage by sensing the bitline bias voltage, modifying a bitline bias control signal in accordance with the sensed bitline bias voltage, and controlling the bitline bias voltage in accordance with the modified bitline bias control signal. The modifying the bitline bias control signal is carried out by enabling a pull up circuit and disabling a pull down circuit in response to a first control signal and disabling the pull up circuit and enabling the pull down circuit in response to a second control signal.

Abstract: Unselected groups of non-volatile storage elements are boosted during programming to reduce or eliminate program disturb for targeted, but unselected memory cells connected to a selected word line. Prior to applying a program voltage to the selected word line and boosting the unselected groups, the unselected groups are pre-charged to further reduce or eliminate program disturb by providing a larger boosted potential for the unselected groups. During pre-charging, one or more pre-charge enable signals are provided at higher voltages for certain memory cells that may have undergone partial programming.

Abstract: Unselected groups of non-volatile storage elements are boosted during programming to reduce or eliminate program disturb for targeted, but unselected memory cells connected to a selected word line. Prior to applying a program voltage to the selected word line and boosting the unselected groups, the unselected groups are pre-charged to further reduce or eliminate program disturb by providing a larger boosted potential for the unselected groups. During pre-charging, one or more pre-charge enable signals are provided at higher voltages for certain memory cells that may have undergone partial programming.

Abstract: Unselected groups of non-volatile storage elements are boosted during programming to reduce or eliminate program disturb for targeted, but unselected memory cells connected to a selected word line. Prior to applying a program voltage to the selected word line and boosting the unselected groups, the unselected groups are pre-charged to further reduce or eliminate program disturb by providing a larger boosted potential for the unselected groups. During pre-charging, one or more pre-charge enable signals are provided at different voltages for particular non-volatile storage elements.

Abstract: A flash memory device, such as a NAND flash, is described having an array of floating gate transistor memory cells with strings of memory cells connected to respective bitlines. Structures and methods for selectively pre-charging bitlines are described.

Abstract: A non-volatile memory device comprises an even bit line and an odd bit line contacting to a memory cell array. A register unit includes a first register and a second register for temporarily storing data. A detecting node detects a voltage level of the specific bit line or the specific register which is connected to the bit lines and the registers. A selecting unit of the bit line includes a first power input terminal and a second power input terminal. The first power input terminal applies a first power of a specific voltage level to the even bit line in response to an even discharge signal. The second power input terminal applies a second power of a specific voltage level to the odd bit line in response to an odd discharge signal.

Abstract: A non-volatile storage system in which a body bias is applied to compensate for performance variations which are based on the position of a selected word line which is associated with non-volatile storage elements undergoing program, read or verify operations. In one approach, the body bias increases when the selected word line is closer to a drain side of a NAND string than a source side. In another approach, the body bias varies when the selected word line is an end word line. In another approach, first or second body bias levels can be used when the selected word line is in a first or second group of word lines, respectively. The body bias reduces variations in threshold voltage levels and threshold voltage distributions which are based on the selected word line position. Gate-induced drain leakage (GIDL) is also reduced.

Abstract: A P-channel non-volatile memory is described. The P-channel non-volatile memory includes a substrate, a first memory cell, and second memory cell. An N-well is disposed over the substrate, and the first cell and the second cell are disposed over the N-well. The first memory cell includes a first gate, a first charge storage structure, a first doped region and a second doped region. The first doped region and the second doped region are disposed in the substrate on the respective sides of the first gate. The second cell includes a second gate, a second charge storage structure, a third doped region, and the second doped region. The third doped region and the second doped region are disposed in the substrate on the respective sides of the second gate. The second cell and the first cell share the second doped region.

Abstract: Various embodiments include erasing at least one memory cell of a string of memory cells of a memory device while a control gate of at least one of a first memory cell and a second memory cell of the string of memory cells has a first voltage and while a control gate of each memory cell of a plurality of intermediate memory cells between the first memory cell and the second memory cell has a second voltage. Some embodiments include erase verifying only the first memory cell and second memory cell in a first erase verify operation, and erase verifying the plurality of intermediate memory cells in a second erase verify operation. Other embodiments including additional apparatus, systems, and methods are disclosed.

Abstract: A multi-use eFuse macro is presented. A device includes multiplexers and selection logic that allow eFuse latches to store auxiliary data in addition to programming electronic fuses. The multiplexers and selection logic are coupled to the inputs and outputs of the eFuse latches, and are controlled by a processing unit or an external tester. When a tester wishes to program or update an eFuse element (electronic fuses), the multiplexers and selection logic are configured for “eFuse” mode, which allows an eFuse controller to provide program data and control data to the eFuse latches which, in turn, program the eFuse element. When the device requires additional storage, the multiplexers and selection logic are configured for “auxiliary data” mode, which allows a processing unit to store and retrieve data in the eFuse latches.

Abstract: The present invention provides a semiconductor device and a method of controlling the semiconductor device, the semiconductor device comprising: a memory cell array; a terminal that inputs or outputs storage data stored in the memory cell array, and inputs address data indicating an address in the memory cell array at which the storage data is input or output, the terminal comprising: a first terminal that inputs a first part of the address data; and a second terminal that inputs a second part of the address data, wherein the second part of the address data is comprised of the entire remaining portion of the address data not comprising the first part of the address data; a first internal address line and a second internal address line to which the address data is supplied; and a switch that couples the first part of the address data to one of the first internal address line or the second internal address line in accordance with predetermined switch information, while coupling the second part of the address da

Abstract: The present invention relates to a semiconductor device including a MLC capable of storing plural bits of data, wherein some of the MLC are set and operated as a buffer section in response to a control signal.

Abstract: Provided in one example embodiment, a method of programming n bits of data to a semiconductor memory device may include outputting a first bit of data written in a memory cell from a first latch, storing the first bit of the data to a third latch, storing a second bit of the data to the first latch, outputting the second bit of the data from the first latch, storing the second bit of the data to the second latch, and writing the second bit of the data stored in the second latch to the memory cell with reference to a data storage state of the first bit of the data stored in the third latch.

Abstract: The invention relates to a device, and also to a corresponding method of implementation, for SRAM memory information storage, powered by a voltage VDD and comprising: an array of base cells organised in base columns, and at least one mirror column of mirror cells, liable to simulate the behaviour of the cells in a base column, The invention is characterised in that the device further comprises: Emulation means, in a mirror column, of the most restricting cell in a base column, Means for varying the mirror power supply voltage (VDDMMOCK) for the mirror column, and Means for copying the mirror power supply voltage in the emulated base column.

Abstract: A voltage pumping device for generating a high voltage that is a boosted voltage is disclosed. The voltage pumping device includes an oscillator for generating a first pulse signal or second pulse signal in response to a control signal, and a high voltage pump for pumping a high voltage of a constant level in response to the first pulse signal or second pulse signal.

Abstract: A voltage generating circuit of a semiconductor memory apparatus is provided including a voltage generator that generates a core voltage in response to a voltage generating signal, a voltage drop part that drops a level of the core voltage to a predetermined target level when the level of the core voltage is increased by an overdrive operation, and a voltage generation controller that disables the voltage generating signal when the overdrive operation is performed so as to stop the driving of the voltage generator.

Abstract: There are provided a bias voltage generator, a semiconductor memory device having the bias voltage generator, and a method for generating the bias voltage. The bias voltage generator which generates the bias voltage to control a sensing current supplied to a memory cell for sensing data is characterized in that the bias voltage is output in response to an input voltage being applied, so that a slope of the bias voltage to the input voltage is different in at least two sections divided corresponding to a level of the input voltage.

Abstract: A semiconductor memory device according to the present invention comprising: n memory banks, where n is an integer more than 1; a first internal voltage generation circuit allocated to corresponding m memory banks, where m is an integer equal to or smaller than the n; and a second internal voltage generation circuit allocated to corresponding p memory banks, where p is an integer equal to or smaller than the n, wherein the first internal voltage generation circuit supplies an internal voltage when one of corresponding banks is in an active state, and the second internal voltage generation circuit supplies the internal voltage in a period in which one of corresponding banks is in the active state and in which a predetermined operation is performed.

Abstract: A solid state memory system comprises a first memory chip that includes a plurality of storage elements, and a controller. Each of the plurality of storage elements have a measurable parameter that varies between a lower limit and an upper limit. The controller receives write data, converts the write data to N target values, and transmits the N target values to the first memory chip. The first memory chip adjusts corresponding measurable parameters of N storage elements of the plurality of storage elements to the N target values, where N is an integer greater than zero.

Abstract: A word line driving circuit and a semiconductor device using the same are disclosed. The word line driving circuit includes a second pad separated from a first pad, the first pad being applied with a first ground voltage, the second pad being applied with a second ground voltage, and a word line driver supplied with the second ground voltage, the word line driver driving word lines.

Abstract: A RFID device having a nonvolatile ferroelectric memory regulates bit line capacitance to optimize a bit line sensing margin and minimize power consumption. The RFID device having an analog block adapted and configured to transmit and receive a radio frequency signal to/from an external communication apparatus, a digital block adapted and configured to receive a power voltage and the radio frequency signal from the analog block, transmit a response signal to the analog block and output a memory control signal, and a memory adapted and configured to store data and regulate bit line capacitance.

Abstract: An integrated circuit communicates with memory devices. Data from the memory devices arrives at the integrated circuit with varying propagation delays. The integrated circuit detects the arrival of data from the memory devices, and stores the data in FIFOs. A FIFO drain signal is generated responsive to the detection of the data arrival.

Abstract: The present invention relates to a semiconductor memory device with a fixed burst length, including a column control circuit, the semiconductor memory device including: a command decoder decoding external commands to be output as an internal command with fixed burst length information; a column controlling unit giving a bank address to the internal command to be output as a column control signal; and a bank controlling a read and write operation corresponding to the fixed burst length in accordance with on the column control signal.

Abstract: A semiconductor memory device includes a bit line sense amplifier, a sense amplifier enable signal generator, a power line driver, and a driver controller. The bit line sense amplifier senses and amplifies data carried on a bit line. The sense amplifier enable signal generator generates a sense amplifier enable signal in response to an active command signal and a precharge command signal. Activation points of times of the sense amplifier enable signal corresponding to the active command signal are multiplexed depending on input/output bandwidth option information. The power line driver drives a pull-up power line and a pull-down power line of the bit line sense amplifier. The driver controller controls the power line driver in response to the sense amplifier enable signal.

Abstract: A memory device includes a delay circuit and a delay selection unit. The delay circuit delays a pulse signal to generate a delayed pulse signal. The pulse signal is used to generate a write enable signal and a read enable signal. The delay selection unit selects one of the delayed pulse signal output from the delay circuit in a test mode and the pulse signal in a normal mode.

Abstract: According to one aspect, an on-die termination (ODT) circuit is controlled during transition from a first power mode to a second power mode of a memory device. The transition from an asynchronous ODT circuit path to a synchronous ODT circuit path is delayed to compensate for an operational latency of a delay locked loop (DLL) circuit.

Abstract: A semiconductor memory device with a mirror function enables two memory devices such as two DRAMs to share the same address and control signals. A pair of semiconductor memory devices are mounted on both sides of a substrate to be symmetrical to each other. A mirror function transfers a first transmission signal and a second transmission signal input on respective pads to any one of a mirror “on” path and a mirror “off” path. The mirror function can vary or reduce path delay differences between the mirror function “on” path and the mirror function “off” path by means of the delay and the mixture of phases in the semiconductor memory device, and reduce skew occurred in the operation of the mirror function.