Abstract: A layered capacitor includes a capacitor body that is divided into two first capacitor sections and a second capacitor section. The first capacitor sections are disposed at ends in a layer-stacking direction such that the second capacitor section is interposed between the first capacitor sections in the layer-stacking direction. The resonant frequency of the first capacitor sections is greater than that of the second capacitor section. The total number of third internal electrodes and fourth internal electrodes provided per dielectric layer included in the second capacitor section is less than the total number of first via conductors and second via conductors per dielectric layer included in the first capacitor sections. The ESR per dielectric layer included in the second capacitor section is greater than that per dielectric layer included in the first capacitor sections.

Abstract: A capacitor is provided. The capacitor includes opposing electrodes fabricated from a non-woven carbon nanotube sheet bonded to opposing noble metal foils. The capacitor also includes a non-porous casing within which the opposing electrodes are placed. The capacitor further includes electrically conductive contacts extending from the noble metal foils through an opening in the casing. The capacitor can be a portable capacitor. A method of manufacturing the capacitor is also provided.

Abstract: The invention relates to a coil type solid electrolytic capacitor containing solid organic polymer with high electrical conductivity as electrolyte and its manufacturing method. In the invention, such processes as oxidation, carbonization, immersing, chemical oxypolymerization, and so on are fully disclosed. The solid electrolytic capacitor of the invention has a pretty low equivalent series resistance (ESR), good impedance frequency properties, so can be used at a frequency above 1 MHz. And it has a high anti-ripple current capacity, wide applicable range of temperature, good temperature properties, large capacity, long life, and reliable performance, therefore can be widely applied in the fields of modern communication, computer, and high performance civilian and military electronic products.

Abstract: An information handling system (IHS) chassis includes a first subassembly including a first panel attached to a first plurality of beams. A second similarly constructed subassembly is positioned parallel to the first subassembly. First and second end panels are attached to the first and second subassemblies so that the first and second subassemblies are maintained parallel. A plurality of side beams including a first side panel are interconnected between the first and second subassemblies so that all the panels and beams define a cavity having an open side. An access panel is movably attached to the open side. All of the panels used in the chassis construction are exterior panels.

Abstract: An electrical transformer station comprising a modular foundation which is assembled from a plurality of cuboid modules fixed to each other and forming a solid and static foundation. The cuboid modules may be provided with T-formed grooves in the sides of the cuboid modules. Adjacent cuboid modules may be linked together by inserting corresponding H-formed plugs into the T-formed grooves of two adjacent cuboid modules.

Abstract: An exemplary housing (100) for portable electronic device includes a main structure (10) and a static electricity eliminating structure (18). The main structure includes a top cover (12), a bottom cover (16) and a frame (14). The top cover faces the bottom cover. The frame is located between the top cover and bottom cover. The static electricity eliminating structure is in contact with the frame, which includes a main body (182) and a tin-cobalt alloy layer (184) formed on a surface of the main body.

Abstract: The present utility model relates to a starter comprising a body (12) and a pair of insert terminals (13) disposed at one end of the body (12), wherein at least one recess is formed at another end of the body (12). The starter according to the present utility model may be mounted or replaced simply and conveniently without any special tool. Furthermore, the starter according to the present utility model has a simple structure and may be manufactured simply without modifying substantially the apparatus and the process for manufacturing the conventional starter.

Abstract: The present invention relates to a support frame for a display and a support structure for a display having the support frame. A support frame for a display of the present invention comprises a seating portion 42 seated on a bottom surface of a case 36; a connection portion 45 extending perpendicularly from the seating portion 42 and having an insertion hole 47 into which an antenna 60 is inserted; and a fastening portion 48 extending perpendicularly from the connection portion 45 and supported by one side of the case 36. According to the present invention so configured, it is possible to increase the strength of the support frame and thus protect a liquid crystal display panel more effectively by means of the reinforcing rib 50 and the escape portion 49 provided in the support frame, and also to improve a radio wave reception rate of the antenna 60.

Abstract: A housing protective cover that is attachable to and detachable from an electronic apparatus having a housing formed in a plate shape and a display screen provided on a front surface of the housing and multiple connectors provided on a side surface of the housing. The housing protective cover includes a part surrounding a circumference of the side surface of the housing and covering a part of the multiple connectors provided on the side surface and an opening for exposing a part of the connectors.

Abstract: Dual display devices are provided. A dual display device includes a first display, a second display, a support, a rotary mechanism, and a translation mechanism. The rotary mechanism is pivotally connected to the support and coupled with the first and second displays, wherein the first and second displays are synchronously rotated with respect to the support via the rotary mechanism. The translation mechanism is movably connected to the support and coupled with the rotary mechanism, wherein the first and second displays are symmetrically moved with respect to the support via the translation mechanism.

Abstract: A plasma display module in which a chassis can be readily and quickly separated from a plasma display panel, and methods of attaching and detaching the plasma display panel to and from the chassis are disclosed. In one embodiment, the plasma display module includes a chassis that is disposed on an opposite side of the plasma display panel where an image is displayed and supports the plasma display panel, plates coupled to a surface of the chassis facing the plasma display panel, and a double-sided tape, wherein a surface of the double-sided tape is attached to a surface of the plasma display panel facing the chassis and the other surface of the double-sided tape is attached to each of the plates.

Abstract: An apparatus, system, and method are disclosed for a scalable, composite, reconfigurable backplane. The backplane is made up of one or more blade aggregation modules which provide switching for attached devices. The blade aggregation module connects to transition cards that then connect with blade modules. The blade aggregation module provides connectivity to the connected modules, which may connect to a second blade aggregation module through the transition cards. The transition cards may additionally connect with unit aggregation modules to connect rows of blade modules together. Transition cards can also provide outside connectivity. The backplane, made up of blade aggregation modules, transition cards, and unit aggregation modules, is highly scalable and versatile, and also provides an unblocked airflow path to facilitate cooling the blades.

Abstract: A computer case includes a chassis comprising a first wall and a second wall detachably attached to the first wall, a cover detachably attached to the first wall, and means for coupling the cover to the first wall. The coupling means is driven by the second wall to fix the cover to the first wall and prevent the cover from being detached from the first wall before the second wall disengaged from the first wall.

Abstract: A high-density memory module is made up of two memory boards, each with memory elements affixed to each of two sides, the two memory boards disposed on either side of a central rigid substrate, each memory board having a flexible wiring array, electrically and mechanically affixed at one end to one of the memory board and at the other end to the other of the memory boards, the flexible wiring array wrapped at its midpoint around a bottom of the central rigid substrate, so that two linear arrays of comb tabs affixed to the flexible wiring array are disposed in proximity to the bottom of the central rigid substrate, so that the central rigid substrate may be inserted into a mating electrical connector, making an electrical connection with both memory boards.

Abstract: The invention provides an electronic device that is environment-friendly and capable of achieving satisfactory noise prevention effect at low cost, and a housing implementing such electronic device. The housing has an electronic circuit disposed therein, and includes a component exposure section in which part of a conductive component disposed in the housing is exposed outward, a plate section made of a conductive material having a predetermined thickness, and spreading at a distance from the component exposure section, and a bridge section with the overall thickness thereof larger than the thickness of the plate section, extending along the component exposure section and electrically connecting the plate section and the conductive component.

Abstract: A heat exchange system for blade server systems is disclosed, wherein said blade server system contains a plurality of server blades arranged in a blade center, wherein the heat exchange system comprises first heat sinks associated to each of said plurality of server blades, and whereby the first heat sinks are adapted to collect heat emitted from heat emitting devices on said associated server blade; means for transferring heat from the heat emitting devices to the first heat sinks; and a liquid cooled second heat sink associated to said blade center, whereby said first heat sinks are connected to said second heat sink by thermal coupling.

Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.

Abstract: Provided is an axial fan apparatus including a housing and an axial-flow impeller. The axial-flow impeller is capable of rotating inside the housing and includes a plurality of axial-flow wings each having a negative pressure generation surface for generating a negative pressure, and an auxiliary vane standing on the negative pressure generation surface at an end portion of each of the plurality of axial-flow wings.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.

Abstract: A modular cooling system (10) for a vehicle is provided. The modular cooling system (10) includes a frame (12) adapted to be mounted to a portion of a vehicle. A heat-generating component (16) and a plurality of cooling components (18, 22, 24, 26) are received on the frame (12). At least one of the cooling components (18, 22, 24, 26) is placed into communication with the heat-generating component (16).

Abstract: Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

Abstract: A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit.

Abstract: A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.

Abstract: The power inverter includes: a case made of a metal; a first power module provided in the case and including a DC terminal and an AC terminal; a second power module provided in the case and including a DC terminal and an AC terminal; and a cooling formation body for decreasing heat generated from the first and second power modules. The first and second power modules are disposed in a manner such that the DC terminals face each other.

Abstract: Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.

Abstract: A heat spreader for transferring heat from a heat source to a heat sink using a phase change coolant, includes an array of cells, each cell having at least one microporous wick for supporting flows of the coolant in the liquid phase, via capillary action, within the spreader from proximate the heat sink to proximate the source and at least one macroporous wick for supporting flows of the coolant, in the liquid and vapor phase, within the spreader from proximate the source to proximate the heat sink.

Abstract: In one embodiment, an apparatus comprises a semiconductor device a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an alloy having a low indium content.

Abstract: System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.

Abstract: To provide an electronic device which can prevent that a heat sink constituting a source of the unnecessary radiation of electromagnetic waves with a simple structure. The electronic device which contains the heat sink in the case is constituted. A heat sink includes: a fin assembly having a wave-guide structure provided with mesh-like openings as a whole and with a plurality of arranged fins and wall portions extending from each of the openings; a heat receiving plate for receiving heat from an electronic device which is a cooled object; and heat pipes. Since each of the openings of the fin assembly has the wave-guide structure, heat generated by the electronic device is dissipated to an exterior through the openings of the fin assembly and an opening section of a case. Leakage of electromagnetic waves to the exterior is prevented by operation of the wave-guide structure.

Abstract: A three-dimensional multichip module includes a first integrated circuit chip having at least one first high-temperature functional area and one first low-temperature functional area, and at least one second integrated circuit chip having a second high-temperature functional area and a second low-temperature functional area. The second high-temperature functional area is arranged opposite the first low-temperature functional area. As an alternative, at least one low-temperature chip having only one low-temperature functional area can also be arranged between the first and second chips.

Abstract: A solid-state hard disk drive, taking solid-state memory as storage media, is assembled by magnetic disk array configuration, mainly including a device body and a plurality of solid-state memories, wherein the left and right of the device body respectively have a plurality of inserting grooves for accommodating and arranging the solid-state memories, the bottom part of each inserting groove separately having a connecting seat for connecting the solid-state memory, wherein the bottom part of the device body is arranged a connecting interface, furthermore, a control unit being arranged at the interior of the device body and being electrically connected to each connecting seat and connecting interface respectively, and thus an integral memory with capacity accumulation is integrated by the connecting seat that controls each solid-state memory, finally a single hard disk drive being simulated.

Abstract: A sliding type of a portable terminal is provided. The terminal includes a first housing, a second housing adapted to slide on the first housing, and a sliding module for coupling the second housing to the first housing so as to slide. The sliding module includes a guide member mounted on a surface of the first housing, at least one guide hole extending in a longitudinal direction of the guide member, and a slide member extending through the guide member via the guide hole to be mounted on the second housing, the slide member moving along the guide hole and supporting a sliding movement of the second housing. The portable terminal limits the play of the housings in other directions than the sliding direction. This guarantees a smooth sliding movement and improves the structural stability of the terminal.

Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

Abstract: A semiconductor integrated circuit includes a first clock pin controller that receives a mirror function signal and a test mode signal to generate a first input buffer control signal in response to the mirror function signal in a normal mode. A second clock pin controller receives the mirror function signal and the test mode signal to generate a second input buffer control signal, which is an inverted signal of the first input buffer control signal, in response to the mirror function signal in the normal mode. An input buffer unit generates output signals of first and second pins in response to the first input buffer control signal and the second input buffer control signal, respectively.

Abstract: An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

Abstract: A motherboard may be adapted to selectively implement one of two different memory technologies. For example, the motherboard may be able to subsequently implement a subsequently developed memory technology. In some embodiments, the motherboard is capable of detecting whether a memory module is in a slot dedicated to a first or a second memory technology and, based on the presence of a memory module in an appropriate slot, the motherboard may be adapted to operate with the particular, selected memory technology.

Abstract: An electronic component has a pair of electrically-conductive terminals. Electrically-conductive pads are opposed to each other on the surface of a substrate at the inner edges defined along parallel first reference lines. Solder is placed on the electrically-conductive pads for bonding the electrically-conductive terminals to the electrically-conductive pads, respectively. The electrically-conductive pad includes protruding sections formed continuous with a main section having the side edges along parallel second reference lines intersecting with the first reference lines. The protruding sections protrude outside the second reference lines along corresponding one of the first reference line. The surface tensions of the melted solder on the main section and the protruding sections are balanced with each other. The electronic component is thus prevented from standing up. The electronic component is prevented from suffering from tombstone phenomenon.

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board, which includes a first insulation layer, a first via that penetrates the first insulation layer, and a first pad formed on one surface of the first insulation layer, where a whole of or a portion of the first pad is buried in the first via, has a portion of or the whole of the pad buried in the via, so that the contact area between the pad and the via may be increased, and the printed circuit board can be given greater reliability.

Abstract: A printed circuit board (PCB) assembly having a plurality of circuit layers including outer layers and intervening layers with through-vias and micro-vias used to translate a portion of the signal connections of the grid, thereby creating a set of diagonal routing channels between the vias on internal layers of the board and a BGA package mounted on the printed circuit board.

Abstract: An electronic system with integrated circuit device and passive component is disclosed. One embodiment provides a printed circuit board, a method for fabricating an electronic system, and an electronic system, including at least one integrated circuit device and at least one passive component, wherein the passive component is arranged at least partially underneath the integrated circuit device.

Abstract: In an igniter module housing (F) of an automotive headlamp assembly, an improved EMI shielding includes a thin coating (12) on the housing. This arrangement eliminates the need for separate EMI shielding components. The coating is electrically conductive, typically a metal such as aluminum, and may be sputtered, painted, or dipped onto the plastic substrate at a thickness of approximately 3 microns or less. The total weight of the aluminum coating is on the order of 1 milligram.

Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

Abstract: A display panel and a light source device used therein are provided. The display panel includes a light-guide thin-film circuit substrate, a light source and a polarizing layer. The light-guide thin-film circuit substrate has a light entrance end and a light exit top surface, and the light source is disposed corresponding to the light entrance end. The polarizing layer is disposed on the light-guide thin-film circuit substrate and parallels the light exit top surface of the light-guide thin-film circuit substrate. The light produced by the light source enters the circuit substrate through the light entrance end, guided and transmitted through the circuit substrate, and then leaves the circuit substrate through the light exit top surface and enters the polarizing layer. The light after passing through the polarizing layer is turned into a polarized light having flat light source effect as a backlight source for the system.

Abstract: Disclosed are a waveguide member and a keypad assembly including the same. The waveguide member includes a waveguide for guiding light propagated inside, and at least one recess formed in a direction perpendicular to a direction of guidance of light coupled to the inside of the waveguide so that light guided by the waveguide is reflected to the waveguide. The keypad assembly includes a keypad having at least one key button and an elastic sheet fixing the key button, a waveguide member positioned beneath the keypad, the waveguide member having a waveguide for guiding light coupled to an inside and at least one recess for reflecting light guided by the waveguide to the waveguide, and a switch pad positioned beneath the waveguide member so as to establish an electric contact when the key button is pressed.

Abstract: A light-emitting device and an electronic device using the same are provided. The light-emitting device includes a light-guiding plate, a circuit board, at lease one light source unit and a reflective layer. The circuit board is disposed under the light-guiding plate. The reflective layer is disposed above the light-guiding plate. The light-guiding plate has at lease one hole. The light source unit is disposed on the circuit board and within the hole. The reflective layer is disposed above the hole. The light-emitting device is disposed on one side of a part, such as a keypad, of the electronic device for providing light to the keypad.

Abstract: A luminous body is described, in particular in the form of a planar illumination device for general lighting or for backlighting of displays, wherein the luminous body comprises a plurality of light sources arranged in a housing (1) such as, for example, LED elements (3, 5). The luminous body is remarkable in that the light of the light sources is radiated at least substantially in a direction parallel to a light emission surface (6) of the housing (1), while the inner walls of the housing (1) reflect the light at least partly. Not only does this render it possible to achieve a very homogeneous light distribution on the light emission surface (6) also in the case of a small constructional height of the luminous body, but the fact that no optical waveguide plate is required in the housing (1) also provides advantages in the form of a simple manufacture and low cost.

Abstract: A speaker assembly (20) for use with a light bulb socket is provided. The speaker assembly generally includes a housing (22) including an electrical contact (26) for use with a light bulb socket for supplying electrical power to the housing. The speaker assembly further includes a receiver, an amplifier, and a speaker (24) being disposed within and electrically connected to the housing, wherein the receiver receives an audio signal and delivers it to the amplifier, and wherein the amplifier amplifies the signal for delivery to the speaker.

Abstract: The invention relates to a jukebox or vending machine provided with a lighting system. In order to provide an improved lighting system for generating lighting effects, the lighting system comprises a screen, the screen having a colored design, a circuit board with at least a first lighting device and a second lighting device, wherein the first lighting device is configured to radiate a first light cone and the second lighting device is configured to radiate a second light cone and wherein the first light cone and the second light cone intersect on the screen, and a controller for modifying the first light cone independently of the second light cone.

Abstract: Provided are solid state backlight devices and methods for forming the same. A solid state backlight unit according to some embodiments of the invention includes a housing having a major surface and multiple LEDs on a first surface of the major surface. The solid state backlight unit also includes a specular reflector proximate to the first surface of the major surface and oriented substantially perpendicular to the first surface of the major surface.