Abstract: The invention relates to an electric insulation material including modified nanoparticles, a porous substrate and polymer matrix, wherein the modified nanoparticles include a nanoparticle and a diblock copolymer covalently attached to the nanoparticle, the diblock copolymer including a first block polymer of molecular weight greater than 1000 and a glass transition temperature below room temperature attached to the nanoparticle and a second block polymer of molecular weight greater than 1000 covalently linked to the first block polymer, wherein the second block polymer and the matrix both possess the same chemical functionality. Other electrical insulation materials and methods of making such electrical insulation materials are also disclosed.

Abstract: A cable having a current leakage detection function includes three current-carrying core wires. Each current-carrying core wire is wrapped by an insulating layer, so that the current-carrying core wires are electrically insulated from one another. The insulating layer of at least one of the current-carrying core wires is wrapped by a metal wire net. Current guiding wires in contact with the metal wire net or a single-sided conductive film laminated outside the metal wire net is utilized to achieve the effect of timely and effectively conducting a leakage current to a leakage current detection device, so as to improve the reliability of leakage current detection.

Abstract: The present invention relates to a crosslinkable polymer composition, comprising (i) an unsaturated polyolefin having a total amount of carbon-carbon double bonds/1000 carbon atoms of more than 0.37, and (ii) at least one ether and/or ester group containing additive selected from the group consisting of polyethylene glycol, a glycerol ester compound, polypropylene glycol, an amido group containing fatty acid ester, ethoxylated and/or propoxylated pentaerythritol, an alpha-tocopherol ester, an ethoxylated and/or propoxylated fatty acid, and derivatives thereof.

Abstract: An apparatus and method for forming a single strand wire with improved flexibility and a stranded cable from a single strand wire. In one embodiment, the flexible single strand wire has a solid, single strand wire body and at least one helical groove formed on an outer circumferential surface of the wire body. The stranded cable includes a plurality of strands. In one embodiment, one of the strands has a planar surface that extends along a longitudinal axis of the cable body.

Abstract: An arm structure includes a first arm pivotally supported on a body, and a second arm pivotally supported on the first arm at an axis portion formed s on a distal end side of the first arm. A wire harness fixing portion for fixing a wire harness is provided at a distal end side of the second arm. A guide portion having a curved face for guiding the wire harness is provided at an end portion at an end side of the second arm, the end side being opposite to the distal end side. A width of the guide portion is larger than a width of a portion of the second arm corresponding to the axis portion, in a width direction perpendicular to a longitudinal direction of the second arm.

Abstract: A power connection device, in particular for power connections of safety containers, is provided. To improve the operational safety, the power connection device includes two cascaded current feedthroughs, whereby the electrical connections between the conductors of the feedthrough are arranged in conduits of reduced volume so that the interstices between the conductors are at least partially filled.

Abstract: To provide a grommet of which a vehicle body latch recess is not deformed, thereby maintaining a good sealing function, even if a wire harness that passes the grommet is bent sharply. The grommet includes: an inner tube for passing electrical cables in the wire harness in a close contact manner; an annular coupling section protruding from an outer peripheral surface of the inner tube; and an outer tube contiguous with an outer peripheral surface of the annular coupling section and disposed coaxially with the inner tube. The outer tube is adapted to couple the annular coupling section to a larger thickness portion of the outer tube and to couple a reducing diameter slant wall section to the larger thickness portion. The outer tube is provided on an outer peripheral surface at a boundary area between the larger thickness portion and the slant wall section with a vehicle body latch recess in an annular manner. The annular coupling section is formed into a smaller thickness.

Abstract: One embodiment of the invention provides a multi-layered ceramic package. The ceramic package includes a signal layer having a plurality of signal lines and a mesh reference layer parallel to the signal layer. The mesh reference layer includes a plurality of intersecting reference lines of varying reference-line width in the plane of the mesh layer. The mesh reference lines may be widened in locations of probable signal cross-talk. Other embodiments of the invention include software for optimizing a ceramic package design by selectively widening mesh lines in regions of probable cross-talk, and systems for designing and manufacturing such a ceramic package.

Abstract: A pixel array including first signal lines, second signal lines, switch devices, and pixel units coupling to the first signal lines and the second signal lines through the switch devices is provided. The first signal lines and the second signal lines are formed on different films. Each of the pixel units includes a common electrode line. In each of the pixel units of an ith row, the common electrode line has at least one first line segment and at least one second segment coupled to each other and formed on different films, and a distance between an (i?1)th first signal line and the first line segment is not equal to that between the (i?1)th first signal line and the second line segment. The first signal lines are either scan lines or data lines of the pixel array, and the second signal lines are the other kind.

Abstract: A wired-circuit-board-assembly sheet includes a plurality of wired circuit boards arranged in parallel in one direction, which are regularly omitted at given intervals, and a plurality of units defined by margin portions where the wired circuit boards are omitted.

Abstract: Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

Abstract: There is provided a circuit board. The circuit board according to an aspect of the invention may include: an insulating base body; a plurality of circuit patterns including a first conductive pattern and a second conductive pattern facing the first conductive pattern at a predetermined interval therebetween; a printed resistor connecting the first conductive pattern and the second conductive pattern; and a heat radiation pattern provided on the insulating base body and overlapping at least partially overlapping the printed resistor. According to an aspect of the invention, a circuit board facilitating a design of a heating structure by forming a printed resistor on a circuit board and forming a heat radiation structure overlapping or connected to the printed resistor, and a method of manufacturing the same can be provided.

Abstract: A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.

Abstract: A display array substrate according to an aspect of the invention may include: a substrate wafer having cutting grooves curved inward; and a transparent electrode coated over one surface of the substrate wafer, wherein shock, occurring when cutting the substrate wafer, is prevented from being transmitted to the transparent electrode by cutting the substrate wafer along the cutting grooves having a different height from the transparent electrode.

Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

Abstract: A printed circuit board (PCB) and a fabrication method thereof are disclosed. The PCB includes: a dual-layered circuit pattern formed with a desired pattern on at least one of upper and lower surfaces of an insulation base member (i.e., an insulation substrate) and having metal layers each having a different thermal expansion coefficient; and an insulating layer formed on the insulation base member to cover the circuit pattern. Because the PCB includes an anti-warping unit, a processing rate and productivity can be improved.

Abstract: A printed circuit board according to an aspect of the invention may include: a board portion having an electrode portion provided on a surface thereof; a solder resist layer provided on the surface of the board portion and having an opening therein to expose the electrode portion to the outside; and a bump layer having the same diameter as the opening and providing an electrical connection with an external chip component.

Abstract: Disclosed is a method of manufacturing a pattern electrode which excels in electroconductivity, transparency and etching property and a pattern electrode, the method comprising a step of applying a metal particle containing solution onto a substrate to form a conductive layer, a step of pattern printing a metal particle removing solution on a portion of the conductive layer, which is to be removed, and a step of washing the resulting printed material, whereby the portion of the conductive layer on which the metal particle removing solution has been printed is removed to form a non-conductive portion.

Abstract: Manufacturing method and circuit module, which comprises an insulator layer (1) and, inside the insulator layer (1), at least one component (6), which comprises contact areas (7), the material of which contains a first metal. On the surface of the insulator layer (1) are conductors (22), which comprise at least a first layer (12) and a second layer (32), in such a way that at least the second layer (32) contains a second metal. The circuit module comprises contact elements between the contact areas (7) and the conductors (22) for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area (7), an intermediate layer (2), which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer (2) and the contact area (7) is less that the surface area (APAD) of the contact area (7).

Abstract: There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit.

Abstract: An interposer includes: an insulation plate where a via is formed, the insulation plate including a resin or a ceramic; a first upper redistribution layer electrically connected to the via along a circuit pattern designed on the top surface of the insulation plate; a first upper protection layer laminated to expose a portion of the first upper redistribution layer and protecting the first upper redistribution layer; a second upper redistribution layer electrically connected to the first upper redistribution layer and laminated along a designed circuit pattern designed; a second upper protection layer laminated to expose a portion of the second upper redistribution layer and protecting the second upper redistribution layer; and an under bump metallization (UBM) formed at the exposed portion of the second upper redistribution layer.

Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.

Abstract: A method of manufacturing a mounting structure includes: an insulating resin arranging step of forming, on a circuit board, two kinds of insulating resin including first insulating resin cured at first curing temperature and second insulating resin cured at second curing temperature higher than the first curing temperature; a mounting step of aligning the bumps formed on an electronic component such that the bumps are opposed to counter electrodes of the circuit board; and a full-scale pressing step of performing, after the mounting step, full-scale pressing to join the electronic component and the circuit board. The insulating resin is heated to reach the first curing temperature before the full-scale pressing, and the insulating resin is heated to reach the second temperature during the full-scale pressing after the curing of the first insulating resin.

Abstract: An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine.

Abstract: An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.

Abstract: A wiring board includes a substrate having a surface made of an insulating resin. An adhesion layer is formed on the substrate. A wiring layer is formed on the adhesion layer. The adhesion layer is formed by a nitrided NiCu alloy containing nitrogen therein. A nitrogen content of the nitrided NiCu alloy is within a range from 1 atoms % to 5 atoms %.

Abstract: A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.

Abstract: A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the first side to engage with the electrically insulative sheet.

Abstract: A low temperature ceramics substrate, a low temperature ceramics assembling system, and a method thereof in which a fixing member is formed on the bottom of an LTCC substrate, an insertion hole is formed at a coupled portion on a fixing member of the LTCC substrate coupled onto the heat sink, the fixing member is inserted into the insertion hole when the LTCC substrate and the heat sink are coupled to each other to firmly achieve alignment and fixation by the fixing member and a ceramic laminate assembling system includes a ceramic laminate substrate including an electronic component mounted on the bottom thereof and a fixing member is formed at one side thereof; and a heat sink including a sensor holder onto which the electronic component is held and an insertion groove is provided at a portion corresponding to the fixing member.

Abstract: An electronic component includes a component body including a mounting surface facing a circuit substrate, and a plurality of first external electrodes arranged on the mounting surface so as to extend between a first side and a second side of the mounting surface substantially parallel with each other and so as to be within a first region having a width that is substantially equal to half a length of the first side in a direction in which the first side extends. A circuit substrate includes a substrate body, a plurality of second external electrodes, arranged on a main surface of the substrate body, respectively connected to the plurality of the first external electrodes, and support units arranged to protrude from the main surface of the substrate body and such that the electronic component overlaps the support units outside the first region.

Abstract: A wiring board with built-in capacitors includes a core substrate, and a high dielectric sheet including a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer made of a sintered ceramic body and sandwiched between the lower electrode layer and the upper electrode layer, the lower electrode layer and/or the upper electrode layer being partitioned into multiple electrodes such that the high dielectric sheet has multiple capacitors. The lower electrode layer and/or the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel.

Abstract: Disclosed is a package substrate, which includes an insulating layer including a circuit layer having a via for connecting layers and an insulating member formed in the insulating layer so as to separate the insulating layer, thus preventing the package substrate from warping and reducing land co-planarity of the substrate. A method of fabricating the package substrate is also provided, including (a) forming a first circuit layer on a carrier, (b) forming an insulating layer on the carrier having the first circuit layer, (c) forming an insulating member in the insulating layer so as to separate the insulating layer, (d) forming a second circuit layer including a via on the insulating layer and the insulating member, and (e) removing the carrier.

Abstract: A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 ?m or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board.

Abstract: Alien crosstalk suppression cores are used to decrease alien crosstalk in communications channels. Electrical communication cables may be provided with alien crosstalk suppression cores. The alien crosstalk suppression cores, which may be ferrite suppression cores, are placed separately on some or all of the twisted pairs within a communication cable. The alien crosstalk suppression cores reduce ANEXT and AFEXT in high-frequency communications when communication cables are installed near one another. Alien crosstalk suppression cores may also be incorporated into other communication channel components, such as on a PCB within a communication jack.

Abstract: Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.

Abstract: A junction box for electrically connecting insulated conductors of a first cable to corresponding insulated conductors of a second cable, including a terminal housing; a plurality of electrically conductive contacts extending through the terminal housing, each contact of said contacts including first and second insulation displacement contacts (IDCs) opening into respective first and second sides of the terminal housing; and first and second lid members operatively coupled to the terminal housing so that relative movement between the terminal housing and the lid members urges insulated conductors interposed therebetween into corresponding IDCs for electric connection to the contacts, wherein said relative movement electrically connects the insulated conductors of the first cable on the first side of said sides of the terminal housing to corresponding insulated conductors of the second cable on the second side of said sides of the terminal housing via the IDCs of common contacts.

Abstract: A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the electrical sub-system being molded into a pre-mold by a first molding process, the pre-mold comprising an encapsulation layer molded around the common ground and an at least one structural member secured to the encapsulation layer and at least one of the plurality of circuit paths, the structural member providing rigidity to the pre-mold; and a plurality of locating features extending from at least one of the encapsulation layer and the structural member.

Abstract: According to one embodiment, a flexible printed wiring board includes a component mounting portion to which a component is mounted and to which a reinforcing sheet is bonded. The component mounting portion includes an inner layer comprising a wiring pattern, and an outermost film layer disposed to cover the wiring pattern. The outermost film layer, to which the reinforcing sheet is bonded, is formed with a groove such that, when the reinforcing sheet is bonded, the groove extends in a region between the outermost film layer and the reinforcing sheet and communicates with an outside of the region.

Abstract: Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.

Abstract: A junction box, comprising a multi-layer circuit board, wherein the circuit board (6) comprises: a plurality of dielectric layers, each having conducting track on a side and arranged one on top of another to form the multi-layered circuit board; power circuitry (4) mounted on the circuit board; signal processing circuitry (5) mounted on the circuit board; and a power input for inputting electrical power into the circuitry on the circuit board, wherein the electrical power is transferred through conducting track (12) arranged to be on an inner dielectric layer, the conducting track on the inner dielectric layer being thicker than the conducting track arranged on the outer dielectric layers, and wherein the power circuitry is arranged on one region of the circuit board and the signal processing circuitry is arranged on another region of the circuit board, the two regions being thermally isolated by a thermal dam (9).

Abstract: An improved structure for a wire outlet cover, arranged at a sidewall of a carton receiving a network wire, includes a body and a collar. The body has a hollow cylindrical shape and includes an inlet end and an outlet end, wherein the body is, at the outlet end, provided with plural stop blocks, and wherein the body is, near the outlet end, provided with a stop flange. The collar has a hollow annular shape and is, at its internal edge, provided with plural axially-extended edges. The collar is assembled to the rear body, with the plural axially-extended edges stopped by the plural stop blocks, such that the collar and the stop flange are spaced apart for a predetermined distance for receiving the sidewall of the carton. Therefore, the network wire will not be twisted when entering into the wire outlet cover nor be twisted around the inlet end.

Abstract: A wire harness includes a cable and a clamp. The cable has an end portion at which a connection terminal is provided. The connection terminal is electrically connected to a connecting portion. The clamp is attached with the cable so as to be movable with respect to the cable in a direction in which the cable extends. The clamp is fixed to a fixing portion disposed adjacent to the connecting portion in a state that the connection terminal is electrically connected to the connecting portion.

Abstract: This is directed to a cable for use with an electric device in which the conductive medium used to conduct electrical signals is a flex instead of distinct wires. The flex can include any suitable number of conductive traces connecting connectors integrated in or coupled to the ends of the flex. Using a flex can allow a user to roll the cable more easily, and reduce tangling of the cable. In addition, the flex may be more resistant to bending in particular desired directions.

Abstract: A shock reduction tool includes an upper interconnect module configured to electrically and mechanically orient and connect to an upper module and a lower interconnect module configured to electrically and mechanically orient and connect to a lower module. A shock absorber section is disposed between the upper interconnect module and the lower interconnect module. A wire management section is disposed between the upper interconnect module and the lower interconnect module. A plurality of wires electrically connect the upper interconnect module and the lower interconnect module and pass through the shock absorber section and the wire management section.

Abstract: Method of drilling a well, including one method comprising determining a first value indicative of a relative position of a geological bed boundary with respect to a drilling assembly, determining a second value indicative of an optical property of a formation fluid proximate the drilling assembly, and controlling a well trajectory based on the first and second value.

Abstract: A drilling tool assembly may include a housing, a piston disposed in the housing, and a clutch assembly coupled to the housing and the piston. The clutch assembly may be configured to facilitate rotation of the piston relative to the housing. A cutting assembly may be coupled to the piston in a manner that it is rotatable relative to the piston. A method of forming a wellbore may include positioning a drilling tool in the wellbore, the drilling tool comprising a housing, a piston, a clutch assembly, and a drill head. The method may further include reciprocating the piston axially within the housing, rotating the piston relative to the housing the clutch assembly, rotating the drill head relative to the housing and the piston, and forming the wellbore.

Abstract: This invention relates to the construction of well such as oil and gas wells using techniques based on drilling small lateral wells from a main well. The problem of narrow pressure window is solved by the use of constructions techniques that are based on the use of lateral boreholes, i.e. secondary boreholes that are drilled a main borehole, wherein a method of constructing a well comprises drilling a main borehole extending from the surface through one or more underground formations, drilling a plurality of lateral boreholes extending from the main borehole into surrounding formations, wherein the lateral boreholes are substantially shorter and of smaller diameter than the main borehole; and wherein each lateral borehole is separated from its neighbouring lateral boreholes by a relatively short distance. Drilling of the lateral boreholes can be for to extend 5-60 metres from the main borehole with a diameter in the range 3.

Abstract: A drilling assembly comprises a bent housing terminating in a drill bit (18), and a top section coupled to the bent section. The top section is suspended upon coiled tubing (10). The drilling assembly includes an orienter means (2-6) capable of rotating the bent housing with respect to the top section, wherein the orienter means includes an electric motor (34) situated in the bent section. The bent housing includes sensor means (30) for monitoring downhole physical variables, the sensor means being situated in the bent section. The orienter means may be an electro-mechanical motor.

Abstract: A method of casing drilling a portion of an offshore well includes running a casing string with a drill bit assembly attached to it into a previously drilled portion of the well. Before the drill bit assembly reaches bottom, the operator attaches drill pipe to the casing string and lowers the casing string on the drill pipe. When the drill bit is at bottom, an upper end of the casing string should be below the blowout preventer. The operator then performs casing drilling by rotating the drill pipe. When at a desired depth for the casing string, the operator pulls the drill pipe from the well and lifts the casing string up until its upper end is at the rig floor. The operator then runs the casing string back into the well but using casing in this instance. The operator then cements the casing string.

Abstract: A rock drilling bit having PDC radial bearings has journal and cone bearing surfaces with increased contact area to increase load support. The radius of curvature of the bearing pin journal and cone bearing surfaces are matched or conformed on the bearing pressure side. The conformal journal surfaces may be formed on the main journal bearing, the pilot pin radial bearing, or both surfaces. In addition, diamond inlays may be located on the bearing surfaces of the cone, the bearing pin, or both components.