Abstract: An object of the present invention is to provide an electrode sintered body wherein shrinkage is prohibited and conductivity is good. An electrode sintered body including intermetallic compound comprising nickel and aluminum is provided. And then an internal electrode paste, which can inhibit shrinkage of an internal electrode layer, is manufactured by raising sintering temperature of conducting particle materials constituting internal electrode sheet to be internal electrode layers after firing. Further, a high-function multilayer electronic device using electrode paste for internal electrodes is manufactured.

Abstract: [Object] To provide a capacitor in which generation of warpage of a laminate can be prevented. [Solution] A capacitor 1 includes a laminate 2 in which a plurality of dielectric layers 6 are laminated, an inner electrode 3 disposed between the dielectric layers 6 of the laminate 2, an outer electrode 4 that is disposed on an end face of the laminate 2 so as to be connected to the inner electrode 3 and that has an extending portion 4A extending to a first main surface 2A of the laminate 2, and an underlying layer 5 including a base 5a disposed between the extending portion 4A and the first main surface 2A and metal particles 5b that are contained in the base 5a and that are joined to the outer electrode 4. With this structure, it is possible to provide a capacitor 1 in which warpage is not easily generated in the laminate 2 during sintering.

Abstract: A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.

Abstract: A terminal plate for an ultracapacitor package is formed from a single sheet of conductive material and comprising a plurality of bent tabs extending in a direction substantially orthogonal to a first main surface of the terminal plate. The terminal plate is configured to provide direct metallurgical contact between external terminals of the ultracapacitor package and the respective terminals of an electrode set that is incorporated into the package.

Abstract: Provided are a solid electrolytic capacitor including an anode, a dielectric layer provided on a surface of the anode, a coupling agent layer provided on the dielectric layer, a conductive polymer layer provided on the coupling agent layer, and a cathode layer provided on the conductive polymer layer, wherein the coupling agent layer contains a first coupling agent having a phosphonic acid group and a second coupling agent which is a silane coupling agent, and a method for manufacturing the solid electrolytic capacitor.

Abstract: A solid electrolytic capacitor including an anode, a dielectric layer formed on the anode, a polyvinyl alcohol film formed on the dielectric layer, and a conductive polymer layer formed on the polyvinyl alcohol film, wherein the polyvinyl alcohol film has a cross-linked structure.

Abstract: Disclosed is an electrochemical capacitor which comprises an element, an electrolyte, and an outer case that houses the element and the electrolyte. The element comprises: a negative electrode that is obtained by forming a negative electrode layer on the surface of a collector, the negative electrode layer containing a carbon material in which lithium ions are absorbed; a positive electrode that is obtained by forming a positive electrode layer on the surface of a collector, the positive electrode layer absorbing ions; and a separator that is interposed between the negative electrode and the positive electrode. The electrolyte contains lithium ions. A coating film that contains lithium carbonate is formed on the surface of the carbon material that is contained in the negative electrode layer.

Abstract: A power system including an uninterruptible power system (UPS) and a maintenance bypass panel (MBP) The UPS has an input to receive input power and an output to provide output power. The MBP has an input to receive the output power provided by the UPS and an output to provide the input power to the input of the UPS. A busbar is configured to couple one of the input of the UPS to the output of the MBP and the output of the UPS to the input of the MBP. The busbar has a first region to couple to one of the input and the output of the UPS, a second region to couple to one of the input and the output of the MBP, and a measurement region. A cover shields the busbar from inadvertent contact and includes a small diameter aperture to permit access to the measurement region of the busbar.

Abstract: An enclosure for an electrical system is provided. The enclosure includes at least three panels, a support structure, and a top. The support structure supports the at least three panels. The at least three panels are not removable when the top is not opened passed a predetermined. The at least three panels are removable when the top is opened passed the predetermined position.

Abstract: An interior assembly for a three phase load center. The interior assembly includes a base pan having at least one first module that includes a first receptacle portion and a first base portion. The base pan also includes at least one second module having a second receptacle portion and a second base portion. Each receptacle portion includes a receptacle wall having a receptacle edge portion. Each base portion includes a base wall having a base edge portion wherein upon insertion of the second base portion into the first receptacle portion the receptacle and base edge portions engage to attach the first module to the second module and form a modular base pan. The base pan further includes a bus bar located on a back side of the first and second modules and a plurality of insulators for insulating the bus bar.

Abstract: A mobile power system comprises a plurality of energy sources, wherein at least one energy source is a solar powered generating device and at least one energy source is a wind powered generating device; a plurality of electronic and telecommunications components configured to receive the power generated by the plurality of energy sources and/or convert the power generated to direct current power; a plurality of batteries configured to store the direct current power; and at least one transportable housing configured to hold the plurality of energy sources, the plurality of electronic and telecommunications, and the plurality of batteries during transport of the housing, and wherein the housing is configured to remotely operate the at least one solar powered energy device and the at least one wind powered generating device when the mobile power system is in operation.

Abstract: According to one aspect, a portable electronic device including a first portion having a first surface, a second portion having a second surface, and a slide portion slidably coupled to the first and second portions. The first portion, second portion and slide portion are adapted so that the first portion can slide along a first direction between a closed position wherein the first portion at least partially covers the second surface, and an extended position wherein the second surface is at least partially exposed, and when the first portion is in the extended position, the first portion and slide portion can slide relative to the second portion along a second direction into an open position in which the first surface and the second surface are aligned.

Abstract: An electronic device includes a case and a power supply arranged in the case. The power supply includes a first power port to connect to a power line for supplying power to the electronic device. The electronic device further includes an extension cord to connect to the first power port through a plug; the extension cord includes a second power port to connect to the power line. When the plug is connected with the first power port, the power line is connected to the second power port to supply power to the electronic device through the second power port, the extension cord, the first power port, and the power supply; when the plug is disconnected from the first power port, the power line is connected to the first power port to supply power to the electronic device through the first power port and the power supply.

Abstract: According to one embodiment, an electronic device includes: a first housing; a second housing; and a connector. The first housing includes a first face and a first periphery portion provided along a periphery of the first face. The second housing includes a second face and a second periphery portion provided along a periphery of the second face and positioned near the first periphery portion. The connector includes a first portion connected to the first housing and a second portion connected to the second housing. The connector rotatably connects the first housing and the second housing with each other. The connector permits a change in a distance between the first portion and the second portion to prevent a change in a distance between the first periphery portion and the second periphery portion when the first housing and the second housing are rotated with respect to each other.

Abstract: According to one embodiment, an electronic device includes a first housing, a second housing, a connection portion, and a resistance mechanism. The first housing includes a first edge and a first display screen. The second housing includes a second edge extending along the first edge and a second display screen capable of facing the first display screen. The connection portion includes a contact portion that is in contact with a plane when one of the housings is placed on the plane and the other is raised. The connection portion is connected to the first edge to be rotatable about a first rotation axis and the second edge to be rotatable about a second rotation axis parallel to the first rotation axis. The resistance mechanism applies different resistance to the rotation of the first housing and the connection portion and to the rotation of the second housing and the connection portion.

Abstract: According to one embodiment, an electronic device includes a first housing, a connection portion, and a second housing. The first housing includes a first edge, a first display screen, a first wall located opposite the first display screen, and a first flared portion extending from the periphery of the first wall. The connection portion is connected to the first edge to be rotatable about a first rotation axis. The second housing includes a second edge connected to the connection portion to be rotatable about a second rotation axis parallel to the first rotation axis and extending along the first edge, a second display screen capable of facing the first display screen, a second wall located opposite the second display screen, and a second flared portion extending from the periphery of the second wall.

Abstract: According to one embodiment, an electronic apparatus includes a main body, a cover, and a storage portion. The main body includes a display unit. The cover includes a first surface at which the main body is supported, and a second surface on which the main body is placed. The storage portion is provided between the first and second surfaces. The cover includes a first use mode in which the display unit is covered, and a second use mode in which the display unit is exposed, and the first and second surfaces are rotatable with respect to each other in the second use mode.

Abstract: The present invention provides a resin chassis base that can correspond to for various components and components with various sizes by providing a plurality of sets of mounting holes thereon. The present invention provides a resin chassis base that fixes an electric substrate, and is mounted to a component provided in an electric apparatus, the resin chassis base having formed thereon the plurality of sets of mounting holes in order to be screwed to various components and/or components with various sizes. The resin chassis base is screwed by use of any one of the plurality of sets of the mounting holes formed on the resin chassis base.

Abstract: To provide a portable electronic device that can determine to which processing portion a signal received by a loop antenna is suited and can preferably perform different types of noncontact communication. A portable electronic device according to the present invention includes: an antenna (33) including a first loop portion (31) and a second loop portion (32), a signal processing portion that processes a signal received at the antenna (33); a signal detection portion (36); and in a state in which a single loop antenna formed by the first loop portion (31) and the second loop portion (32) is connected with the signal detection portion (36), a control portion (38) that delivers a signal received at the single loop antenna to the signal processing portion, and delivers a signal received at the first loop portion to the signal processing portion.

Abstract: A display device includes a display panel including a front substrate and a back substrate, a back cover disposed in the rear of the display panel, and a transparent cover including a portion disposed in the front of the front substrate of the display panel. The transparent cover contains a resin material having transmission capable of transmitting light. The transparent cover is separated from a front surface of the front substrate by a predetermined distance, and an air layer is formed between the transparent cover and the front surface of the front substrate.

Abstract: Provided is a display apparatus. A stand type of the display apparatus may be converted into a tilt type or a flip type as necessary.

Abstract: A system to mate electronic assemblies may include a computer backplane, and a first electronic interconnect carried by the computer backplane configured to operationally mate with a first electronic assembly. The system may also include a second electronic interconnect carried by the computer backplane that is physically separate from the first electronic interconnect, the second electronic interconnect configured to operationally mate with a second electronic assembly where the first electronic assembly and the second electronic assembly mate with the computer backplane at substantially a same time.

Abstract: An electronic device having a concealed keyboard includes a first housing, a second housing rotatably coupled to the first housing, and a concealment cover coupled to a rear of the first housing. The first housing has a coupling edge and two sides that are substantially perpendicular to the coupling edge of the first housing. The second housing has a coupling edge and two sides that are substantially perpendicular to the coupling edge of the second housing. A receiving portion is formed on a rear surface of the first housing and is configured to receive the second housing. When the second housing is in the receiving portion, each respective side of the first housing and the second housing are co-terminal with one another. The concealment cover is exteriorly positioned with respect to the second housing when the second housing is in the receiving portion.

Abstract: An electronic device can include a conductive feature and an ultraviolet (“UV”) blocking layer overlying the conductive feature. The electronic device can also include an insulating layer overlying the UV blocking layer. The electronic device can further include a conductive structure extending into an opening within the insulating layer, wherein the conductive structure is electrically connected to the conductive feature. In one aspect, the UV blocking layer lies within 90 nm of the conductive structure. The insulating layer can be at least 4 times thicker than the UV blocking layer. In another aspect, a method can be used in forming the electronic device. In still a further aspect, a system can include the electronic device, a processor, and a display, wherein the processor is electrically coupled to the electronic device and the display.

Abstract: Computer workstation includes a mounting bracket for attachment to a wall, and a cabinet connected to the mounting bracket. A track, attached to the cabinet, is engaged with the mounting bracket to vertically guide the cabinet. A non-contacting sensor detects a computer operator. An input device tray is rotatably connected to the cabinet, and has i) an operating position that holds computer input device(s) in an input position and ii) a stowed position substantially preventing access. First electromagnet selectively retains the tray in the stowed position. Second electromagnet selectively retains the tray in the operating position. An electronic lock control panel accepts authentication input from the operator. An electronic lock control module, in a lockable compartment of the cabinet, is connected to the lock control panel and the sensor. The lock control module separately controls electric current flow through the electromagnets in response to authentication by the lock control module.

Abstract: A shelf positioned behind a computer monitor, where the shelf is connected to either the stand supporting the monitor or the computer monitor back surface. The shelf has a flat portion which is essentially horizontal for holding various items. The shelf may further comprise a lip or a rail. The shelf may be removably connected to the stand or monitor, or may be an integral part of either.

Abstract: A circuit board assembly includes a first circuit board having an electrical connection circuit on a surface thereof. A second circuit board is on the surface of the first circuit board. A first memory socket is mounted on the second circuit board. The first memory socket is only electrically connected to the electrical connection circuit through the second circuit board. A second memory socket is mounted on the second circuit board. The second memory socket that is only electrically connected to the electrical connection circuit through the second circuit board.

Abstract: A disk drive assembly includes a disk drive, a drive bracket, and a securing member. The disk drive includes a sidewall with a securing hole. The drive bracket receives the disk drive therein. The drive bracket includes a first side panel. The first side panel includes a side panel body substantially parallel to the sidewall and a securing tab extending from the side panel body. A through hole is defined in the side panel body. A securing slot is defined in the securing tab. The securing member includes a member panel, a pivoting portion, and a securing portion. The pivoting portion is pivotably mounted to the first side panel. The member panel includes a positioning tab passing through the through hole to be inserted in the securing hole. The securing portion engages with the securing slot to prevent the securing member from moving away from the first side panel.

Abstract: A removable hard disk drive (HDD) bay has a casing, a door assembly and an extracting assembly. The door assembly has a pivoting member, a cover slidably mounted on the pivoting member, a retainer slidably mounted in the cover and selectively hooking the casing, and a driving member driving the retainer. The extracting assembly pivotally connects the door assembly to the casing. When the door assembly is opened relative to the casing, the extracting assembly extracts the HDD (AA) with a simple mechanism and the door assembly does not occupy any room in the casing. The casing does not have to reserve a room for the door assembly and a volume of the removable HDD bay is efficiently minimized.

Abstract: A keyboard adjusting heat dissipation efficiency of a heat dissipation unit disposed in a host device and including a switching unit, a control unit, and a communication port is disclosed. The switching unit is switched to different states. The control unit generates a control signal according to the state of the switching unit. The communication port transmits the control signal to the host device. The host device adjusts the heat dissipation efficiency of the heat dissipation unit according to the control signal.

Abstract: In order to adequately but not excessively or unnecessarily cool heat generating electrical components and decrease the noise produced by fans used to cool the heat generating electrical components in an electrical hardware system, an environmental controller controls the speeds of the fans using at least two temperature sensors. In one example, a first temperature sensor measures a hotspot component temperature and generates a hotspot component temperature value, and a second temperature sensor measures an air inlet temperature and generates an air inlet temperature value. The environmental controller controls the speeds of the fans based on the difference between the measured hotspot component temperature value and a target hotspot component temperature value calculated based on the measured air inlet temperature value and a predefined function.

Abstract: An electronic device includes a bottom plate, a circuit board, a fan, and an airflow guide member. The circuit board is fixed to the bottom plate. The fan is arranged at the front of the circuit board. The airflow guide member is arranged between the fan and the circuit board. The airflow guide member includes an airflow guide wall for guiding most of airflow upwards to the top of the circuit board. A number of slots is defined in the airflow guide wall, for allowing only a minimum portion of the airflow to flow underneath the circuit board.

Abstract: A chassis with horizontal plugged frames includes an air inlet, a board area, a first air chamber, a second air chamber, and an air outlet. The air inlet is set in the board area and is linked to the first air chamber; the air outlet is set on a wall of the second air chamber where the second air chamber contacts external air; and the first air chamber is located on one side of the board area, and the second air chamber is located on the other side of the board area.

Abstract: There is provided an electronic device that includes a heatsink, a first dual IGBT coupled to the heatsink and configured to provide electrical power to a field exciter, a second dual IGBT coupled to the heatsink and configured to provide electrical power to a battery, a third dual IGBT coupled to the heatsink and common to the field exciter and the battery. The electronic device also includes a temperature sensor disposed in the heatsink, a cooling unit comprising a plenum and a variable source of air flow, and a controller. The controller is configured to receive a temperature reading from the temperature sensor and, based on the temperature reading, determine a desired level of cooling for at least one of the dual IGBTs, wherein an air flow rate provided by the cooling unit is determined based on the desired level of cooling.

Abstract: In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost.

Abstract: A spring fixture includes a base, first and second holding parts extending in opposite lateral directions from the base, and a height registration part extending downwardly from the base relative to the lateral directions. The heat sink member has a height adjustment hole at a location corresponding to the height registration part. The height registration part is inserted through the height adjustment hole so that electronic components are fixed to a heat sink member by the first and second holding parts. A distance between the base and the heat sink member can be changed by varying a size of the height adjustment hole to accommodate varying heights of the electronic components. Therefore, the spring fixture can be used for various types of the electronic components with different heights without changing the designs and manufacturing methods for the spring fixture.

Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

Abstract: A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.

Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Abstract: A terminal board is electrically connected to a module terminal of a semiconductor module. The semiconductor module and a cooling unit are laminated on the terminal board. A spring member is disposed on the semiconductor module and the cooling unit. A spring support tool is disposed on the spring member in order to apply, to the spring member, an urging force for pressing the semiconductor module and the cooling unit against the terminal board.

Abstract: A reliable power module is realized, in which a good performance of radiating heat of the power semiconductor element is secured and it is hard for the heat of a power semiconductor element to be conducted to a driving element. A power module includes a power semiconductor element mounted on a lead frame, and a driving element mounted on the lead frame, and a heat radiating plate radiating heat which is generated by the power semiconductor element, and a resin holding the power semiconductor element, the driving element, and the heat radiating plate, wherein the heat radiating plate has a portion disposed at a side opposite to a surface of the lead frame where the power semiconductor element is mounted, a portion disposed between the power semiconductor element and the driving element, and a portion disposed below the power semiconductor element, as the portions being in a body.

Abstract: A heat dissipating system adapted to dissipate heat generated from an electrical package mounted onto a socket connector, comprises a clip defining a downward lower pressing portion; and a heat dissipating device disposed under the clip, being adapted to in contact with a surface of the electrical package and embedded with a number of springs evenly disposed on an upper surface thereof adapted to be pressed by the pressing portion.

Abstract: Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

Abstract: An electronic module (100) for mating with a complementary connector, comprises: a housing, a printed circuit board (3) disposed in the housing, a slider member (6) movably received in the channel, a cover member (9) confining the slider member to the housing, a gasket (5) mounted to the housing and having a pair of engaging portions (54), and an ejector (7) located above on the slider member. The slider member has a body portion (611) and a pair of arm portions (612) extending forwardly from the body portion. The ejector is located above the pair of arm portions, and has a pair of cantilever portions pivotable outward, in response to a sliding movement of the slider member, against the pair of engaging portions.

Abstract: A method of manufacturing a component built-in module includes a step of preparing a sheet metal; a step of providing a conductive thick-film pad over one main surface of the sheet metal by applying and curing a conductive paste; a step of providing a joining material over the conductive thick-film pad; a step of mounting a chip component onto the conductive thick-film pad with the joining material interposed therebetween; a step of providing a resin layer over the one main surface so as to cover the chip component; and a step of forming a surface electrode by patterning the sheet metal.

Abstract: A docking station includes an enclosure, two hook assemblies, a transmission assembly, a button and a pusher assembly. The enclosure defines a receiving room, two first through holes and a second through hole. The hook assemblies pass through the first through holes to secure an electronic device. The transmission assembly engages with the hook assemblies to drive the hook assemblies move forward and backward in the first through holes to be coupled to and uncoupled from the electronic device. The button extends into the receiving room from outside of the enclosure and used to drive the transmission assembly move. The pusher assembly passes through the second through hole to push the electronic device away from the enclosure. When the hook assemblies are detached from the electronic device, the pusher assembly push the electronic device detach from the enclosure.

Abstract: Disclosed herein is a mobile terminal including a terminal body comprising a circuit board formed to process radio signals, a first and a second member configured to form an external appearance of the terminal and disposed to cover a lateral surface of the circuit board, a power feed connecting portion to allow the first member and the circuit board to be power feed connected, and a ground connecting portion to allow the first member and the circuit board to be ground connected. Accordingly, an electrical element and an antenna are disposed adjacent to each other, allowing the effective use of a space within the terminal.

Abstract: Provided is a display device including: a display panel; a frame which holds the display panel; and a cushion which is softer than the frame, wherein the frame includes: a first portion which overlaps the display panel; a second portion which extends from the first portion more outwardly than an outer edge of the display panel; and a projecting portion which is formed on the second portion in a raised manner and faces a side surface of the outer edge of the display panel, and the cushion has a hole, is mounted on the projecting portion by fitting the projecting portion in the hole, and faces the side surface of the outer edge of the display panel in an opposed manner.

Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture integrally forms a resilient beam portion adjacent an edge thereof carrying a grounding pad.

Abstract: An information handling system can include a base, a printed circuit board including a capacitive switch, and a cover. The printed circuit board can be attached to the base, and the cover can lie adjacent to the printed circuit board. The capacitive switch can be configured to change state when an object is close to the cover. The cover can be configured such that it can be detached from the remainder of the information handling system while the printed circuit board remains attached to the base. The configuration of the printed circuit board and cover can be particularly useful when maintaining a keyboard or a touch pad or when replacing the cover.