Abstract: There is provided a system and method for planning a well path. An exemplary method comprises defining a proxy constraint volume as a three-dimensional (3D) cellular volume where each cell has at least one value derived from data from a 3D earth model. An initial well path is defined within user defined drilling parameter constraints. The exemplary method comprises defining acceptable constraint parameters to be applied to values derived from an intersection of the initial well path and the proxy constraint volume. If the intersection of the initial well path and the proxy constraint volume is not within the acceptable constraint parameters, the initial well path may be iteratively adjusted to create successive well paths until at least one of the successive well paths is within the acceptable constraint parameters for the values derived from the intersection of the well path and proxy constraint volume.

Abstract: A bidirectional downhole fluid flow control system is operable to control the inflow of formation fluids and the outflow of injection fluids. The system includes at least one injection flow control component and at least one production flow control component in parallel with the at least one injection flow control component. The at least one injection flow control component and the at least one production flow control component each have direction dependent flow resistance, such that injection fluid flow experiences a greater flow resistance through the at least one production flow control component than through the at least one injection flow control component and such that production fluid flow experiences a greater flow resistance through the at least one injection flow control component than through the at least one production flow control component.

Abstract: A method of delivering a desired relatively high optical power to a well tool in a subterranean well can include coupling to an optical waveguide an optical source which combines multiple optical frequency ranges, respective centers of the frequency ranges being separated by at least a peak shift frequency in a Raman gain spectrum for a corresponding pump wavelength generated by the optical source, and transmitting the desired optical power to the well tool via the optical waveguide positioned in the well. Another method of delivering optical power to a well tool in a subterranean well can include coupling to an optical waveguide an optical source, the optical source comprising a sufficient number of lasing elements to transmit the optical power, with the optical power being greater than a critical power for stimulated Brillouin scattering in the waveguide.

Abstract: A downhole valve for insertion in a production tubing string permits recirculation of fluid pumped into the casing annulus. The valve includes a cylindrical housing defining an opening, an internal mandrel disposed within the housing, defining a central bore and defining an opening, a valve between the housing and the mandrel, wherein said valve opens to allow fluid communication from the mandrel central bore to the annulus space in response to a pressure differential between the mandrel central bore and the annular space, and biasing means for biasing the valve in a closed position.

Abstract: A seal assembly including a first tubular having a sealing surface and a seal element run with the first tubular and displaced from the surface. The seal element initially has a radial dimension that forms a radially innermost or outermost sealing dimension of the first tubular for enabling the first tubular to be sealed with a second tubular radially disposed with the first tubular. A mechanism is included that is triggerable for reconfiguring the radial dimension of the seal element. The sealing surface of the first tubular operative forms the radially innermost or outermost sealing dimension of the first tubular when the radial dimension of the seal element has been reconfigured for enabling the sealing surface of the first tubular to receive a second seal element. A method of sealing tubulars is also disclosed.

Abstract: A seal assembly between a wellhead housing having a bore and a casing hanger, has an inner seal leg for sealing against a hanger and an outer seal leg for sealing against the housing. A bellows style portion is formed on a nose ring carried by the seal assembly to increase lockdown capacity. The bellows style portion has an inner surface that faces an outer profile of the hanger, and an outer surface that faces the bore of the housing. Inner and outer lock rings are disposed on the bellows style portion. When the bellows style portion is axially collapsed, it radially expands into the bore of the housing and the outer profile of the hanger, and urges the inner and outer lock rings into engagement with the outer profile of the hanger and the bore of the housing.

Abstract: Embodiments of the disclosure relate to directing a flow from a borehole termination structure. Embodiments include a device for containing fluid flow from a borehole. The device includes an engagement body and a sealing member located within a cavity of the engagement body. The cavity is configured to receive a portion of a borehole termination structure extending from the borehole and to direct fluid from the borehole into a fluid conduit. The sealing member has a changeable shape configured to surround the borehole termination structure and to form a seal between an outer surface of the borehole termination structure and an inner surface of the body of the containment assembly based on the borehole termination structure being positioned within the cavity.

Abstract: A device for injecting a fluid into a mechanical system that may undergo heating, comprising at least one body containing a thermally triggered charge generating combustion gas, ignition of the charge being able to be triggered under the action of an ignition command and/or under the effect of a heat contribution, from a heating area of the body toward the charge, a reservoir containing the fluid, means for fastening the device to the mechanical system, the fastening means adapted to put the reservoir in fluid communication with the mechanical system, and means for delivering pressurized fluid outside the reservoir through the action, directly or through intermediate means, of the combustion gases. Within the device, the fastening means comprise at least one injection sleeve provided with an outer thread coated with an anti-loosening adhesive film. The invention also relates to a mechanical system equipped with at least one such device.

Abstract: A system for extinguishing and/or inerting, including an extinguishing-agent tank, a conveyor device for an extinguishing agent, a pipeline, and nozzles. A synthetic liquid extinguishing agent (12) is stored at low pressure of up to 3 bar relative to 21° C. in the extinguishing-agent tank (1) and at least one incidence sensor detects fire signals and reports them to a fire detection panel and/or control panel (9) which activates the conveyor device (4) that conveys the synthetic liquid extinguishing agent by means of a pipeline (5) to nozzles (6), and the liquid extinguishing agents transitions into the gas phase after leaving the nozzles (6). The system represents a more cost-effective system that requires less technical efforts in comparison to previous systems having synthetic liquid extinguishing agents.

Abstract: A plural-layer protective coating placeable adjacent the outside surface of a liquid fuel container.

Abstract: A seeding implement is provided that includes a depth adjustment mechanism configured to facilitate rapid reconfiguration of a ground engaging tool for varying penetration depths. In an exemplary embodiment, the seeding implement includes a ground engaging tool and a packer arm pivotally coupled to a packer support structure. The seeding implement also includes a packer wheel rotatably coupled to the packer arm, and configured to rotate across a soil surface to limit a penetration depth of the ground engaging tool into the soil. The seeding implement further includes a depth adjustment assembly including a slot within the packer support structure, a corresponding slot within the packer arm, and a fastener disposed through the slots. In this configuration, the penetration depth of the ground engaging tool is varied by adjusting a position of the fastener within the slots.

Abstract: A seeding implement is provided that includes a depth adjustment mechanism configured to facilitate rapid reconfiguration of a ground engaging tool for varying penetration depths. In an exemplary embodiment, the seeding implement includes a ground engaging tool and a packer arm pivotally coupled to a packer support structure. The seeding implement also includes a packer wheel rotatably coupled to the packer arm, and configured to rotate across a soil surface to limit a penetration depth of the ground engaging tool into the soil. The seeding implement further includes a depth adjustment assembly including a slot within the packer support structure, a corresponding slot within the packer arm, and a fastener disposed through the slots. In this configuration, the penetration depth of the ground engaging tool is varied by adjusting a position of the fastener within the slots.

Abstract: An improved method is provided for operating a power tool. The method includes: monitoring rotational motion of the power tool about an axis using a rotational motion sensor disposed in the power tool; determining a direction of the rotational motion about the axis; and driving the output member in a direction defined by the detected rotational motion of the tool, where the output member is driven by a motor residing in the power tool. Thus, the output member is drive clockwise when the rotational motion of the tool is clockwise about the axis and the output member is drive counter-clockwise when the rotational motion of the tool is counter-clockwise about the axis.

Abstract: A power tool has a housing, an output member coupled to the housing, and a motor, rotational motion sensor, timer, and control circuit in the housing. The timer is initiated, and the rotational motion sensor monitors rotational motion of the housing about an axis. The control circuit determines the direction of the rotational motion of the housing, whether the direction is different from a previous direction of rotational motion of the housing, and whether a value for the timer exceeds a predetermined threshold. If the direction is different from the previous direction and the timer value is less than the predetermined threshold, the control circuit initiates a protective action for the power tool. The control circuit also drives the motor to cause the output member to rotate in a direction that corresponds to the detected rotational motion of the housing.

Abstract: A hand-guided apparatus may include an operating lever, a switch, and an intermediate lever. The operating lever may actuate a function of the hand-guided apparatus, be constructed in an elongated manner and be pivotably attached to a housing of the apparatus. The switch actuates the function and is arranged in the housing. The intermediate lever mechanically actuates the switch. The operating lever includes a safety element enabled to be pretensioned and shifted along a longitudinal axis of the operating lever. The operating lever and the intermediate lever are enabled to be mechanically coupled by shifting the safety element into a pretensioned state to enable actuation of the switch by pivoting of the operating lever. The operating lever and the intermediate lever are enabled to be mechanically decoupled by shifting the safety element into a relaxed state to prevent actuation of the switch by pivoting of the operating lever.

Abstract: The post driver machine includes a housing, inside of which is a weight which can be lifted by a chain being rotated around a generally elliptical path by a powered sprocket. A catch mechanism is affixed to the chain, and can engage with a weight catch attached to the weight. However, when there is not a post positioned within the post driver, the weight rests at a position too low the weight catch to engage with the catch mechanism. Upon properly inserting a post into the post driver, the post presses upwardly on the weight until the weight catch engages with the catch mechanism to lift the weight.

Abstract: The post driver with limited movement floating post anvil does not rely heavily upon the skill of the operator to efficiently drive posts. The post anvil is allowed to move up and down in relation to the driver, but its movement is limited by both lower and upper fixed barriers. Since the movement is limited, the operator can position the driver upon the post allowing the full weight of the driver framework/carrier machine to rest upon the post. The post would push the floating post anvil upward only to the point at which the upper fixed barrier prevents further upward movement of the floating post anvil. Thus, once the floating post anvil abuts the upper fixed barrier, substantially the entire weight of the post driver is resting on the post.

Abstract: A wire harness includes a high-voltage wire and a pipe member for receiving the high-voltage wire. The pipe member is provided, at a plurality of points thereon, with crushed portions formed by crushing a pipe outer surface inward. The crushed portions are formed as portions to which clamps are to be attached. The crushed portions are formed and positioned in correspondence with positions of L-shaped brackets. The crushed portions are formed as portions for generating protrusions on a pipe inner surface, and the protrusions serve as a contact supporting point for the high-voltage wire.

Abstract: A wire harness which can absorb a position shift or a dimensional tolerance related to mounting or the like sufficiently is provided. A wire harness (21) includes a harness body (22), a motor side connector (23) provided at one end of the harness body (22), and an inverter side connector (24) provided at the other end of the harness body (22). The harness body (22) includes high voltage conduction paths (25), and an electromagnetic shielding member (26) which collectively covers the high voltage conduction paths (25). The high voltage conduction path (25) includes a conductor body (27), connecting parts (28, 29) and a mold part (30). The conductor body (27) is provided with a tolerance absorbing part (31).

Abstract: The present invention provides a waterproof structure for a conductive path which waterproofs a conductive path without imposing an unnecessary load on a conductor, and can sufficiently obtain a creepage distance. A plurality of grooves 9 is formed on the outer circumferential surface 8 of an insulator 7. The grooves 9 are formed to be hollow by heat or cutting. The grooves 9 are formed within a predetermined range L on the outer circumferential surface 8 of the insulator 7. This predetermined range L is set as a range in which an overmold part 5 is provided. The overmold part 5 is a seal member made of an elastomer, and is disposed and formed within the predetermined range L of an electric wire 2. Also, the overmold part 5 is formed to fill all of the three grooves 9.

Abstract: A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.

Abstract: The present disclosure relates to a graphene electrical wire and a method for manufacturing thereof. In particular, the graphene electrical wire includes a metal core having a shape of fiber, and a graphene layer synthesized on the outer surface of the metal core. Also, the method includes the steps of providing a metal core having a shape of fiber, and synthesizing a graphene layer on the outer surface of the metal core.

Abstract: The present invention introduces a method and a structure for effectively generating spin currents in a metallic electric conductor. When, for example, a conductor manufactured from copper is evenly coated with a thin carbon layer, the internal direction of the magnetic axis, i.e. the spin, of the electrons acting as charge carriers can be polarized in such a way that the spins of the set of electrons align in the area of the interface between carbon and copper. This results in intensive generation of the spin current in the coated conductor. The generation of the spin current enables reduction of losses, shortening of delays relating to signal transfer and improvement of the general immunity to interferences.

Abstract: A grommet includes a body having a first wall and a second wall. A passageway extends from the first wall to the second wall, and a service port extends from a first end adjacent to the first wall to a second end adjacent to the second wall. A first cap is integral with the first wall and covers the first end of the service port. Similarly, a second cap is integral with the second wall and covers the second end of the service port.

Abstract: Disclosed are a technology capable of improving printing properties and a structure of a touch window manufactured by the same. The touch window according to the present invention comprises: a sensing electrode pattern layer formed on a transparent window and including sensing electrodes which are patterned; and wiring parts connected to the sensing electrodes, wherein the touch window further comprises dummy circuit patterns spaced apart from the wiring parts.

Abstract: A manufacturing method of a circuit board structure includes steps of: providing a circuit board which comprising a metal substrate, a metal layer and a dielectric layer disposed between the metal substrate and the metal layer; forming grooves on the circuit board to expose the metal substrate, the dielectric layer and the metal layer; performing a procedure for connecting metal in the grooves so that the metal substrate and the metal layer being in contact with each other. A structure of circuit board comprises a metal substrate, a dielectric layer and a metal layer. The dielectric layer is formed on the metal substrate, and the metal layer is formed on the dielectric layer; wherein the metal substrate and the metal layer can be in contact with each other at an appropriate position by performing a metal connecting procedure.

Abstract: A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing. One exemplary embodiment of the method for making printed circuit boards includes coating a non-metallized substrate with a palladium based material including a ferric based solution combined with palladium.

Abstract: Electronic devices can be prepared by forming a patterned thin film on a suitable receiver substrate. A cyanoacrylate polymer is used as a deposition inhibitor material and applied first as a deposition inhibitor material. The deposition inhibitor material can be patterned to provide selected areas on the receiver substrate where the deposition inhibitor is absent. An inorganic thin film is then deposited on the receiver substrate using a chemical vapor deposition technique only in those areas where the deposition inhibitor material is absent. The cyanoacrylate polymer deposition inhibitor material can be applied by thermal transfer from a donor element to a receiver substrate before a patterned thin film is formed.

Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

Abstract: Provided is a Cu alloy interconnection film for touch-panel sensors, which excels in oxidation resistance and adhesion properties, and is low in electrical resistance. The interconnection film contains at least one alloy element selected from a group consisting of Ni, Zn, and Mn by 0.1 to 40 atom % in total, and the remainder contains Cu and inevitable impurities. Alternatively, the interconnection film is made of a Cu alloy containing at least one element selected from the group consisting of Ni, Zn, and Mn. In this case, if the Cu alloy contains one element, Ni is contained by 0.1 to 6 atom %, or Zn is contained by 0.1 to 6 atom %, or Mn is contained by 0.1 to 1.9 atom %. On the other hand, if two or more alloy elements are contained, the alloy elements are contained by 0.1 to 6 atom % in total (wherein, Mn is contained by [((6?x)×2)/6] atom % or less if Mn is contained; here, x is a total adding amount of Ni and Zn).

Abstract: A wafer (or a circuit board), which is used to perform three-dimensional mounting, has protrusion 20 which is provided in low melting point metal 15 for electrically connecting mutually joined wafers 61 and 62, and which defines an interval between mutually joined wafers 61 and 62 without being deformed at the time when low melting point metal 15 is melted. A joining structure of wafers 61 and 62 is manufactured by using wafers 61 and 62, at least one of which has protrusion 20. In the manufactured joining structure of wafers 61 and 62, wafers 61 and 62 are electrically connected to each other by low melting point metal 15, and protrusion 20, which defines the interval between wafers 61 and 62 without being deformed at the time when low melting point metal 15 is melted, is provided in low melting point metal 15.

Abstract: A secondary alloyed 1N copper wire for bonding in microelectronics contains one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.09 wt % and about 9.9 wt %.

Abstract: A conductive bonding material includes: copper particles coated with either gallium or gallium alloy; and either tin particles or tin alloy particles. An electronic component includes: a wiring board having electrode pads; a component mounted on the wiring board and having a plurality of electrodes; a sealing resin covering the component; and a plurality of terminals coupled to a wiring line in the wiring board to an external substrate, wherein the plurality of electrodes being coupled to the electrode pads through a conductive bonding material containing copper particles coated with either gallium or gallium alloy particles and either tin particles or tin alloy particles.

Abstract: An electrical communication system includes a printed circuit board (PCB) having first and second ground plates and a plurality of signal vias and a plurality of ground vias extending between and through the first and second ground plates. Each of the plurality of signal vias are electrically connected to a respective conductive trace on a surface of the PCB. Cables connect to the PCB at a right angle, with a connector attached to an opposite side of the PCB. Each cable has two signal wires and a ground wire extending therefrom. The two signal wires define a differential pair. The signal wires are symmetrical with respect to the ground wire. Each of the signal wires electrically connects to a respective one of the plurality of signal vias. The ground wire connects to one of the plurality of ground vias. The cables are offset with respect to one another on the first and second ground plates and within the PCB.

Abstract: A structural body includes a first conductor having a first opening; a second conductor, having a second opening, which is opposite to at least a portion of the first conductor; a conductor via, passing through the first opening and the second opening, which is insulated from the first conductor and the second conductor; a first interconnect, provided in the inside of the first opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end and which is opposite to the second conductor; and a second interconnect, provided in the inside of the second opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end, and which is opposite to the first conductor.

Abstract: An electro-static discharge (ESD) protection structure includes a first insulation layer (having a first surface, a second surface opposite to the first surface, and a through hole), a patterned conductive layer (located on the first surface), an electro-static releasing layer (located on the second surface), and a solder mask layer. At least one portion of the patterned conductive layer surrounds the through hole. The electro-static releasing layer is electrically insulated from the patterned conductive layer. At least one portion of the electro-static releasing layer is around the through hole. The solder mask layer covers the first insulation layer and a portion of the patterned conductive layer and exposes a portion of the patterned conductive layer surrounding the through hole. A multi-layered circuit board including a second insulation layer, a power supply layer, a third insulation layer and the ESD protection structure is also provided.

Abstract: A structure and method is disclosed for a routing structure for connecting the transparent conductive oxide (TCO) electrodes of a touch-sensor panel to a touch controller while providing the requisite cross-over routing. Routing is confined to the border area of a single glass panel where there is no need for transparency. By applying the TCO electrodes to the glass surface, first, and then applying the non-conducting artwork layer above them, there is no need to extend the TCO electrodes above the glass surface and, thereby, subject these thin and brittle electrodes to mechanical stress. Instead, vias are positioned in the artwork then filled with conductive plugs. These provide the connectivity between the TCO electrodes and metal traces above them.

Abstract: Disclosed herein is a via hole plating method including a first plating step of performing a pattern plating on a via hole of a printed circuit board; and a second plating step of performing a pattern fill plating on the pattern plating, whereby a deviation in plating thickness at a high current density region may be decreased simultaneously with improving a via filling efficiency, thereby making it possible to significantly improve the quality of the printed circuit board.

Abstract: A wire fixing member (10) to be fixed to an unillustrated case housing a device by fixing a shield shell (40) to the case includes a housing (20) to be held in the shield shell (40), wires (W) pulled out through the housing (20), a housing projection (28) located at a part of the housing (20) where the wires W are pulled out and formed to project along the wires (W), and an adhesive tape (T) for integrally fixing the wires (W) and the housing projection (28) by covering both the wires (W) and the housing projection (28) and adhering to the wires (W) and the housing projection (28).

Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.

Abstract: A wire fixing structure and a liquid crystal display device using the same, wherein the wire fixing structure comprises a base and a clamping portion extended from the base, a wire fixing ring is formed by an enclosure of the clamping portion and the base for a wire to be inserted into. Thereby, the wire can be fixed in the liquid crystal display device conveniently and securely by the present technology.

Abstract: An electronic device and a joint are provided. The electronic device includes a casing, an electronic element and the joint. The casing has a cable hole. The electronic element is disposed inside the casing. The joint includes a body, a waterproof and breathable film and a fastener. The body is fixed to the cable hole and has a breathable channel. The waterproof and breathable film is disposed at the breathable channel. The fastener is used for fastening a power cable to the body. The power cable passes through the fastener and the body and electrically connects the electronic element. The joint, a power cable and the casing form a waterproof and breathable chamber.

Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.

Abstract: Electrical enclosure assemblies, electrical service enclosures, and methods of assembling an electrical enclosure assembly are presented herein. An electrical enclosure assembly for housing electrical components of an electrical distribution system is disclosed. The enclosure assembly includes a plurality of sidewalls interconnected to define therebetween a mounting space within which are mounted the electrical components, and define at one end thereof an open endface. An endwall guide extends from one or more of the sidewalls into the mounting space. The endwall guide includes a plurality of elongated slots, a plurality of projections, or both. The enclosure assembly also includes an endwall configured to at least partially close off the open endface. The endwall includes a plurality of elongated slots, a plurality of projections, or both. Each of the projections is configured to fit into and secure with a respective elongated slot to thereby removably mount the endwall to the sidewalls.

Abstract: A composite sleeve for a conductor including a conductor having an outer surface, a first sleeve positioned about the outer surface of the conductor, and a second sleeve positioned about the first sleeve. One of the first and second sleeves is formed from a compressed amide synthetic fiber. The first and second sleeves cooperate to provide protection for the conductor from external elements.

Abstract: A wire connector assembly configured to inhibit leakage of fluids between two distinct environments and a method of constructing same is presented. The assembly includes insulated wire cables having ends that are spaced apart and joined by a wire splice element within a connector body, thereby interrupting a fluid leak path through the strands of the wire cables. The connector body may be over-molded the wire splice elements and a portion of connector body may be disposed intermediate to the ends of the wire cables, providing an additional physical barrier to the fluid leak path. The wire splice element may include wire crimp wings that are crimped to the ends of the wire cable. The wire splice elements may also include insulation crimp wings that may be crimped to the insulation to prevent insulation on the wire cables from pulling back and exposing wire strands.

Abstract: An adhesive composition for bonding a first circuit member including a first circuit electrode formed on a first circuit substrate and a second circuit member including a second circuit electrode formed on a second circuit substrate, the first circuit electrode and the second circuit electrode being electrically connected, wherein at least one substrate among the first circuit substrate and the second circuit substrate includes a thermoplastic resin having a glass transition temperature of not more than 200° C. The adhesive composition contains core-shell type silicon particles having a core layer and a shell layer provided for coating the core layer.

Abstract: An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %.

Abstract: A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min.

Abstract: An apparatus and method for controlling power delivered to a pulsed power system which includes a command charge switch for controlling when power produced by a primary power system is fed into a cable. The command charge switch also controls the power delivered to the pulsed power system in a bottom hole assembly.