Abstract: A tubular tower (11), of a wind energy plant (10) with a current conduction means system (25, 35) for transmitting electrical power from a generator on the tower (11), to a power module at the base of the tower. The current conduction means system (25, 35) has three electrical conductors (27.1, 27.2, 27.3; 37.1, 37.2, 37.3; 45.1, 45.2, 45.3) arranged next to one another. A housing (26, 36, 46) is connected to the inner tower wall at predetermined distances using connecting devices which have electrical cross-sections conducting with the tower wall. The distances between the connecting devices in the longitudinal extent of the tower (11) and the cross-sections of the connecting devices between the housing (26, 36, 46) and the tower wall are dimensioned such that during a fault, the voltage drop between the tower wall and the housing (26, 36, 46) does not exceed a predetermined touch voltage.

Abstract: Circuits integrated or integrable with a photovoltaic panel to provide built-in functionality to the photovoltaic panel including safety features such as arc detection and elimination, ground fault detection and elimination, reverse current protection, monitoring of the performance of the photovoltaic panel, transmission of the monitored parameters and theft prevention of the photovoltaic panel. The circuits may avoid power conversion, for instance DC/DC power conversion, may avoid performing maximum power tracking to include a minimum number of components and thereby increase overall reliability.

Abstract: A switchgear includes a switching device, which is driven by a propellant chemical charge or fast acting switch. The switchgear includes a current or fault current detection unit, and an optical sensor unit for light arc or fault light arc detection, without the need of having an auxiliary voltage applied. In order to reduce the closing time of an earthing switch, the electrical circuit of an inductive current detection unit is electrically connected in series with a light sensing switching path, and a current signal directly ignites the propellant chemical charge or fast acting switch by using a limited electronic device.

Abstract: A method is provided for forming a current carrying structure with improved electrostatic discharge protection. The current carrying structure includes a conductive material layer and a voltage switchable dielectric layer adapted to switch between insulative and conductive at a predetermined voltage between the ground plane and the conductive material. An aperture is formed through the voltage switchable dielectric layer, and conductive material is deposited in the aperture to form a conductive pathway between the voltage switchable dielectric layer and another layer. A spark gap is created between the conductive material of the aperture and a ground portion using a laser to remove a portion of the conductive material layer from an area surrounding the aperture without substantially modifying physical properties of the underlying switchable dielectric layer.

Abstract: An interface circuit configurable in input and output modes comprises a current source; an input/output node; a diode to prevent current from flowing from the input/output node to the current source; a first switch to short-circuit the diode when closed; and a second switch to form a ground path from the input/output node when closed. In input mode, the first switch is closed and the state of a connected sensor circuit may be measured. In the output mode, the first switch is open, and the second switch may be closed to activate an output circuit. In the output mode, power dissipation may be monitored, and the diode may protect the current source and measurement node from current flowing through the output circuit. In the input mode, closing the first switch may prevent the diode from introducing measurement errors due to non-linear attenuation of perturbative AC signals.

Abstract: The object of the invention is a thermal overload protection device (22) for protecting an electric component (10), in particular an electronic component, wherein the overload protection device (22) has a short-circuit unit (24) for short-circuiting connections (12, 14) of the component (10), and an actuating member (26) actuating the short-circuit unit (24) in a temperature sensitive manner. According to the invention it is provided that the short-circuit unit (24) is attached to a circuit path support (16) in at least one area (28), and is supported in at least another area (30) on the component (10) disposed on the circuit path support (16) via the actuating unit (26), and/or at least one of the circuit paths (18, 20) contacting one of the connections (12, 14) to be short-circuited. The invention further relates to a respective arrangement (36) having a circuit path support (16), at least one component (10) disposed thereupon, and at least one assigned overload protection device (22).

Abstract: A surge absorber is provided with a glass tube (2); a pair of sealing electrodes (3) which block openings at both ends of said glass tube (2) to seal discharge gas therein; and a plate-shaped insulator (4) having the pair of the sealing electrodes (3) arranged at both ends thereof, said insulator housed inside the glass tube (2). At least one of the two end portions (4a) of the plate-shaped insulator (4) has the same width as the inner diameter of the end portion of the glass tube (2), and at least the width of the intermediate portion (4b) of the plate-shaped insulator (4) is set narrower than the inner diameter of the end portion of the glass tube (2).

Abstract: Multiple wound film capacitors include a hollow core formed by a first non-conducting tubular section, and a first capacitor winding wrapped around the first non-conducting tubular section. Also included are a second non-conducting tubular section wrapped around the first capacitor winding, and a second capacitor winding wrapped around the second non-conducting tubular section. The multiple wound film capacitors may also include a third non-conducting tubular section wrapped around the second capacitor winding, and a third capacitor winding wrapped around the third non-conducting tubular section. In addition, ends of the first and second non-conducting tubular sections extend beyond ends of the first and second capacitor windings.

Abstract: A rotary capacitor which changes electrostatic capacity by changing a mutually opposite area of a pair of electrodes which opposes each other, includes a rotary shaft which can rotate around a central axis, wherein the pair of electrodes includes a first electrode plate which protrudes from a circumferential surface of the rotary shaft, and a second electrode plate which may be separated in a direction along the central axis with respect to the first electrode plate and may be disposed so as to oppose the first electrode plate, and a notch which penetrates in a plate thickness direction may be formed on an edge portion of the first electrode plate.

Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer 22. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (Dc) of ceramic grains in a cover area is smaller than an average diameter (Da) of ceramic grains in the active area, and when a thickness of the cover area is expressed by Tc, 9 um?Tc?25 um and Tc/Dc?55 are satisfied. A multilayer ceramic capacitor having excellent moisture-resistance properties may be obtained.

Abstract: Described in this patent application are devices for energy storage and methods of making and using such devices. In various embodiments, blocking layers are provided between dielectric material and the electrodes of an energy storage device. The block layers are characterized by higher dielectric constant than the dielectric material. There are other embodiments as well.

Abstract: A dielectric ceramic enabling low-temperature firing and exhibiting good dielectric characteristics, and a stack ceramic electronic component using the same are provided. The dielectric ceramic containing (Ba1-x-yCaxSry)m(Ti1-zZrz)O3 (1.005?m?1.2, 0?x+y?0.2, and 0?z?0.2) as a major component and an amount of Bi relative to 100 parts by mol of the major component which is 1.0 part by mol or more and 40 parts by mol or less.

Abstract: Provided is a laminated ceramic capacitor having excellent lifetime characteristics in a high-temperature loading test. It includes a laminated body including a plurality of stacked dielectric layers including crystal grain and crystal grain boundaries, and a plurality of internal electrodes and external electrodes. The laminated body contains, as its main constituent, a perovskite-type compound containing Ba and Ti and optionally Ca, and further contains a rare-earth element R, and Mn, Mg, V, and Si With respect to 100 parts by mol the Ti, the total parts by mol content (100×m) of Ba and Ca is 0.950?m<1.000, the contents in terms of parts by mol is 0.3?R?2.5, 0.05?Mn?0.5, 0.5?Mg?2.0, 0.05?V?0.25, 0.5?Si?3.0, and further, the molar ratio x of Ca/(Ba+Ca) is 0?x?0.01, and the existence of the rare-earth element R in a position of 4 nm inner from a surface of the crystal grain is 20% or more.

Abstract: A capacitor array includes a plurality of comb capacitors sharing a common comb electrode. At least one of the comb capacitors has a comb electrode as a single base part. Each of the other ones of the comb capacitors has an electrode formed by coupling a plurality of base parts. In the other ones of the comb capacitors, a space between a wire coupling the base parts and an end of each of comb teeth of the common electrode, which is interposed between the base parts, is larger than a space between a base of each of the base parts of the plurality of comb capacitors and an end of each of the comb teeth of the common electrode, which is interposed between comb teeth of the base part.

Abstract: Activated carbons having improved volumetric capacitance and double layer capacitors including these activated carbons are described herein.

Abstract: Disclosed herein are an activated carbon for a lithium ion capacitor, including mesopores with a pore size of 2˜50 nm in a content of 20˜30% based on all pores therein, an electrode including the activated carbon as an active material, and a lithium ion capacitor using the electrode. Accordingly, there can be provided an activated carbon having appropriate mesopores for allowing an increase in capacitance by free adsorption and desorption of the lithium ions, and a lithium ion capacitor storage device having a long lifespan and high input and output characteristics and further having reliability on high-rate charging and discharging cycles by including the activated carbon as an active material.

Abstract: A supercapacitor module includes: two main substrates each including an insulator plate, at least one electrical conductive unit formed on a surface of the insulator plate facing toward the other one of the two main substrates, and a circuit unit electrically connecting the electrical conductive unit to an external power; a separator film unit including a liquid-permeable insulating film disposed between the two main substrates; and an electrolyte filled between the two main substrates and cooperating with the liquid-permeable insulating film and the electrical conductive units of the two main substrates to form at least one supercapacitor between the two main substrates.

Abstract: A dielectric material is provided. The dielectric material includes at least one layer of a substantially continuous phase material. The material is selected from the group consisting of an organic, organometallic, or combination thereof in which the substantially continuous phase material has delocalized electrons.

Abstract: Disclosed herein are an electrode, a method for fabricating the same, and an electrochemical capacitor including the same, the electrode including an electrode current collector; a plurality of first active material layers made of a complex of graphene and carbon nanotubes (CNT) above the electrode current collector; and a plurality of second active material layers made of carbon nanofibers (CNF), each of the second active material layers being interposed between the first active material layers. According to the present invention, an electrochemical device having high capacitance and output can be provided by using materials such as graphene, carbon nanotubes (CNT), and carbon nanofibers (CNF), which have excellent specific surface area and electric conductivity, as an electrode active material, and thereby to fabricate an electrode having a multilayer structure.

Abstract: An electrical junction box for distributing electric power in a vehicle includes: a metal core substrate 1 provided with a core metal assembly having two core metal plates arranged with a gap, and an insulating layer embedded in the gap and covering surfaces of the metal core plates to integrate the metal core plates; and electronic components. Electric power from a battery is inputted into the core metal plate, and electric power from an alternator is inputted into the core metal plate. The electronic components are provided with a plurality of attaching portions soldered or screwed to the metal core substrate. At least one of the attaching portions is attached to the core metal plate, and at least one of the attaching portions is attached to the core metal plate.

Abstract: In accordance with the present disclosure, a scalable and modular rack-level power infrastructure is described. The power infrastructure may include a power distribution unit (PDU), which receives alternating current (AC) power from an external power source. The PDU may be coupled to a busbar and output DC power to the busbar. The busbar may be coupled to a server within a rack-server system and provide DC power to the server. Additionally, the infrastructure may include a battery back-up unit (BBU) element coupled to the busbar. The BBU element may charge from and discharge to the busbar.

Abstract: A switchboard for coupling with a structure surface includes a panel box comprising a back wall and at least one sidewall extending from the back wall. The sidewall comprising a front. The switchboard further includes a door panel coupled to the front of the side and a positioning member located in the sidewall. The positioning member comprising a fixed end coupled to the sidewall and a moveable end configured to be positioned to contact the structure surface when the front of the panel box is at a pre-determined distance from the structure surface.

Abstract: A flat panel display installation and method employ a wall bracket assembly for installing a flat panel display on, and at a spacing away from, a support wall. A background member is connected to the wall bracket assembly and is located behind the flat panel display in the spacing. The background member extends past an outer periphery of the flat panel display to be visible as an ornamental backdrop against which the flat panel display is viewable.

Abstract: The subject matter disclosed herein relates to a charging docking station to wirelessly stream video from a smartphone and/or tablet computer to a remote receiver.

Abstract: A fixing structure for an interface card connector is provided and includes a bottom housing, a board body, an interface card connector, a fixing plate, a torsion spring, and a spring. The bottom housing has an opening and a stop wall. The interface card connector is rotatably located on the board body by a fixing axis and includes a slot. The fixing plate includes a main body, a second spring fixing portion, an interface card connector fixing portion, and a protruding portion. When the board body is moved out the opening and the protruding portion contacts the stop wall, the fixing plate is stopped, and the interface card connector is separated from the interface card connector fixing portion. As a result, the interface card connector is rotated on the board body by the torsion spring, such that the slot is directed upwardly on the board body.

Abstract: A battery structure includes an input device, a housing, an electronic component, a first battery cell, a second battery cell, a case and a protection circuit. The input device includes a flat input surface. The housing is configured to support the input device and to accommodate components therein. The electronic component and the first and second battery cells are in the housing. The second battery cell overlaps at least partially with the electronic component in a thickness direction of the housing, and is thinner than the first battery cell. The case includes a frame configured to enclose the first and second battery cells and a joist inside the frame in a lattice pattern between the first and second battery cells. The protection circuit is configured to be electrically connected to the first and second battery cells at a position apart from the second battery cell.

Abstract: An electronic device of the present invention has a battery storage structure with a battery pack inserted into a battery storage section provided in a device case, a battery electrode provided on a side surface of the battery pack that comes in contact with a connection electrode provided within the battery storage section and the battery storage section is openably/closably covered by a battery cover. This electronic device includes a locking member which engageably locks the battery pack into the battery storage section by sliding the battery pack into place, and a guide pressing section provided on the battery cover which presses the battery pack towards the connection electrode once inserted between inner surface parts positioned on opposite sides of the connection electrode of the battery storage section and the battery pack opposing side with the battery cover covering the battery storage section where the battery pack is stored.

Abstract: An electronic device of the present invention is provided with a cover which is rotatably attached to a device case in an openable/closable manner and conceals a storage section provided in the device case; an operating member which is rotatably attached to the device case and exposed outside of the device case; and a lock member which locks the cover in a state where the cover conceals the storage section, and lifts the cover upward in an opening direction when the lock on the cover is released by a rotation operation of the operating member.

Abstract: A DC receptacle has, in a housing, a pair of connection sockets with which a pair of connection terminals of a plug used in a DC electrical equipment is adapted to be detachably electrically connected. The DC receptacle includes a circuit opening/closing unit configured to open or close a power line; and a connection verification unit for verifying the connection of the plug to the receptacle. The circuit opening/closing unit opens or closes the power line depending on the connection state between the plug and the receptacle detected by the connection verification unit.

Abstract: A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.

Abstract: An information processing apparatus 10 connected to a peripheral device through a cable includes a main body unit 20 having a connector on a bottom portion 20a of the main body unit 20, a base unit 40 that is set on the main body unit 20 in a tiltable manner, a tilting unit 60 that turns the main body unit about a vicinity of the bottom portion of the main body unit with respect to the base unit when tilting is performed, and a cable holder 80 that defines a position of the cable in a vicinity of the connector and suppresses movement of the cable accompanying the tilting operation between the defined position and the connector, wherein the cable holder is attached to the tilting unit.

Abstract: A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein.

Abstract: A latching assembly comprises a bracket, and a hook. The hook comprises: a top; a base having a first portion proximate to a first end and a second portion proximate to a second end. The second portion is inclined or sloped towards the top. A front surface extends from the first end to the second end. The front surface is substantially parallel to the surface of the second part at the first end, forming a first portion of the base for engaging the bracket. The front surface is further inclined or sloped toward the surface of the second part at the second end. When the bracket and the hook are engaged and the first part and the second part are separated by force, the bracket slides on the second portion of the base and the inclined or sloped front surface at the second end, thereby disengaging the bracket from the hook.

Abstract: According to one embodiment, an electronic apparatus includes a main body, a display module, a pair of arm portions configured to couple a first axis and a second axis and including an elbow portion at a predetermined point, each of the arm portions being rotatable about the first axis between a first position in which the second axis is positioned in the vicinity of a first end portion and a second position in which the second axis is positioned in the vicinity of a second end portion, and a component provided in the vicinity of a first side surface of the main body in a position bypassed by the elbow portion when the arm portion is in the second position.

Abstract: A portable computer system is provided having a first unit with touch-sensitive LCD display screen and a detachable second unit having a keyboard. The first unit includes a support structure movable between a stowed position and a deployed position, which can support the first unit in an inclined position on a planar surface. The support structure can help support the first unit when mounted on the second unit, standing alone, or both.

Abstract: A hinge is provided that permits a user to use a computer system either as a laptop computer or a tablet computer. The hinge may comprise a hinge block and an inhibitor stopper. The hinge block may have a first hinge member and a second hinge member. The inhibitor stopper may be disposed between the first hinge member and the second hinge member. The inhibitor stopper may have a first wing and a second wing. The inhibitor stopper may be attached to the hinge block. The first and second wings may be rotatable around an axis.

Abstract: A docking station and an electronic apparatus using the same are provided. The electronic apparatus includes a portable computer and a docking station. The docking station includes a body, a base and a connecter, and the portable computer is detachably connected to the docking station. The base is movably connected to the body. The connecter disposed on the base is movable with the base relative to the body. The body is electrically connected to the portable computer via the connecter, and thus the portable computer can move relative to the docking station.

Abstract: A mobile data memory which is designed such that it can be used in an intrinsically safe manner in explosion-prone areas includes a memory device which has a first interface and a second interface for data exchange, wherein the second interface is designed in an intrinsically safe manner and for data exchange with a device, in particular with a sensor, and the first interface is designed for data exchange with data processing equipment, in particular for data evaluation.

Abstract: An exemplary embodiment of the present invention includes an add-on module. The add-on module is in contact with a base cooling plate that is connected to a thermal energy transport element and at least one thermal energy generating device when the cooling capacity of the base cooling plate is exceeded by the rating of the thermal energy generating device.

Abstract: Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.

Abstract: Systems and methods are provided for controlling output energy levels in wireless communications devices, such as wireless USB modems, while optimizing performance of the wireless communications devices. Controlling output energy levels includes controlling specific absorption rate (SAR) levels and heat levels generated by one or more radiating elements in a wireless communications device. Controlling output energy levels is achieved by integrating one or more radiating elements in a movable device, such a fan and/or by incorporating a moving reflector element, such as a fan, proximate to one or more radiating elements. Integrating the one or more radiating elements in, e.g., a fan, or by using a fan near the one or more radiating elements, the radiation pattern resulting from the output energy may be spatially averaged and/or dithered, reducing SAR levels and allowing for excessive output heat energy to be vented and/or one or more radiating elements to be cooled.

Abstract: The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.

Abstract: The invention relates to a monitoring device for sliding closures, casting tube changers or the like on a foundry ladle or a similar metallurgical vessel, wherein the device has an electronics system (4) for detecting the parameters of the monitored device that are functionally important during casting. In order to ensure trouble-free functioning of the electronics system (4), according to the invention said system is housed in a unit (3) fastened to the foundry ladle. Said unit has thermal insulation (8) and is provided with an air cooling system (10) which is operated with purified cooling air and can be electrically driven both by an energy source (15) supplied by the waste heat of the foundry ladle and by an external energy source (16).

Abstract: A display apparatus including a glass plate detachably mounted to facilitate after-sales service (A/S) for repair or replacement of the glass plate and reduce A/S time is provided. The display apparatus includes a display which displays an image; a glass detachably mounted on the front surface of the display; and a pivotable holder provided at the glass to detachably mount the glass to the display.

Abstract: Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.

Abstract: A capability for controlling heat transfer using airflow-induced fluttering of a cantilevered elastic plate is presented. A mounting structure is configured to be coupled to a surface of an element having a heat generating component coupled thereto. An elastic place is coupled to the mounting structure so as to arrange the elastic plate in a cantilevered position with respect to the surface of the element and at a position above the surface of the element when the mounting structure is coupled to the surface of the element. The elastic plate is configured to flutter, in response to air flow incident on the elastic plate, in a manner tending to disrupt the boundary layer region. The elastic plate may be arranged at a position that is selected based on a determined location of the boundary layer region.

Abstract: In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.

Abstract: A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion.

Abstract: An apparatus for a single chip package using Land Grid Array (LGA) coupling is provided. The apparatus includes a multi-layer substrate, at least one integrated circuit chip, and a Printed Circuit Board (PCB). The a multi-layer substrate has at least one substrate layer, has at least one first chip region and at least one second chip region in a lowermost substrate layer, configures a transmission line transition of a vertical structure for transmitting a signal from at least one integrated circuit chip coupled in the first chip region in a coaxial shape or in a form of a Co-Planar Waveguide guide (CPW), and has an LGP coupling pad for connecting with a Printed Circuit Board (PCB) in the lowermost layer. The at least one integrated circuit chip is coupled in the first chip region and the second chip region. The PCB is connected with the multi-layer substrate using the LGA coupling via the LGA coupling pad.