Abstract: A metallized film composed of a dielectric film, a metal thin film layer and a dielectric layer, the metal thin film layer being formed on at least one surface of the dielectric film, the dielectric layer being formed on the metal thin film layer, and the dielectric layer being composed of acrylic acid ester resin as a main component being composed of dimethylol tricyclodecane diacrylate and monoacrylate containing a heterocycle

Abstract: There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2?D99/D50?3 and 2?D50/D1?3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented.

Abstract: A first paste film containing a metal powder and non-vitreous inorganic oxide is formed on a glass ceramic green sheet, and a second paste film containing a metal powder is formed on the first paste film to cover at least the edge portion of the first paste film. Then the glass ceramic green sheet and the first and second paste films are fired. As a result, a surface electrode is obtained, and then a plating layer is formed on the surface electrode. The second paste film contains less non-vitreous inorganic oxide than the first paste film and the abundance ratio of the non-vitreous inorganic oxide in the surface electrode is lower in a region bordering the plating layer than in a region bordering the glass ceramic layer at least in an edge portion of the surface electrode.

Abstract: Aspects of the invention are directed to a method for forming a graphene composite structure. Initially, an encapsulating film is formed on a substrate. The encapsulating film comprises graphene. Subsequently, a plurality of particles are deposited on the encapsulating film, and then a temporary layer is deposited on the plurality of active particles and the encapsulating film. The substrate is then removed. Lastly, the temporary layer is also removed so as to cause the plurality of particles to form a cluster that is at least partially encapsulated by the encapsulating film.

Abstract: Disclosed is a polymerization solution for electrolytic polymerization having a small environmental load, having excellent economic efficiency and capable of producing a conductive polymer exhibiting excellent heat resistance. The polymerization solution has: a solvent consisting of 100 to 80% by mass of water and 0 to 20% by mass of an organic solvent; at least one monomer selected from the group consisting of 3,4-disubstituted thiophenes; and at least one organic non-sulfonate supporting electrolyte having an anion with the molecular weight of 200 or more. A conductive polymer film densely filled with polymer particles is obtained by performing electrolytic polymerization using the polymerization solution. A polymer electrode provided with the conductive polymer film exerts excellent heat resistance and the electrochemical activity of the polymer electrode will hardly deteriorate even when being subjected to high temperatures.

Abstract: A capacitor for use in relatively high voltage environments is provided. During formation, anodization may be carried out in a manner so that the dielectric layer possesses a relatively thick portion that overlies an external surface of the anode and a relatively thin portion that overlies an interior surface of the anode. In addition to employing a dielectric layer with a differential thickness, the solid electrolyte is also formed from the combination of pre-polymerized conductive polymer particles and a hydroxy-functional nonionic polymer.

Abstract: A capacitor whose electrical properties can be stable under a variety of different conditions is provided. The solid electrolyte of the capacitor is formed from a combination of an in situ polymerized conductive polymer and a hydroxy-functional nonionic polymer. One benefit of such an in situ polymerized conductive polymer is that it does not require the use of polymeric counterions (e.g., polystyrenesulfonic anion) to compensate for charge, as with conventional particle dispersions, which tend to result in ionic polarization and instable electrical properties, particularly at the low temperatures noted above. Further, it is believed that hydroxy-functional nonionic polymers can improve the degree of contact between the polymer and the surface of the internal dielectric, which unexpectedly increases the capacitance performance and reduces ESR.

Abstract: A solid electrolytic capacitor that comprises a sintered porous anode, a dielectric layer that overlies the anode body, and a solid electrolyte overlying the dielectric layer is provided. The anode is formed from a finely divided powder (e.g., nodular or angular) having a relatively high specific charge. Despite the use of such high specific charge powders, high voltages can be achieved through a combination of features relating to the formation of the anode and solid electrolyte. For example, relatively high press densities and sintering temperatures may be employed to achieve “sinter necks” between adjacent agglomerated particles that are relatively large in size, which render the dielectric layer in the vicinity of the neck less susceptible to failure at high forming voltages.

Abstract: This is to provide an electroconductive polymer material which has excellent adhesion to a base and excellent water resistance. Also, this is to provide a solid electrolytic capacitor which has excellent water resistance by using the same. An electroconductive polymer solution according to the present invention contains an electroconductive polymer, at least one water-soluble multivalent alcohol, and at least one oxoacid having two or more hydroxy groups. Since a resin obtained by carrying out a polycondensation reaction of the water-soluble multivalent alcohol and the oxoacid has a cross-linked structure, an electroconductive polymer having lower water-absorbing property and more excellent water resistance in comparison with a resin having a linear structure can be obtained.

Abstract: An electric conductive polymer aqueous suspension is prepared by dispersing an electric conductive polymer powder whose surface is doped with a polyacid in which the number of anion groups is 50% or more and 99% or less with respect to the number of repeating units of the polyacid. By using the electric conductive polymer aqueous suspension, an organic material excellent in adhesiveness to a substrate and humidity resistance, and high in conductivity, as well as a solid electrolytic capacitor low in ESR and excellent in reliability in a high humidity atmosphere, and a method for producing the same can be provided.

Abstract: A service control center is provided on a machine at a position accessible to a service technician or an operator. The service control center includes a service control panel. Further, the service control panel includes a first rotary switch adapted to selectively operate a transmission locking system and a second rotary switch adapted to selectively operate an engine starter system. A first flange having a first opening configured to retain the first rotary switch in a locked position and a second flange having a second opening configured to retain the second rotary switch in a locked position.

Abstract: A cooling system for a subterranean power line may include a cooling tube configured to house a fluid. Heat generated by the subterranean power line may be radiated and/or conducted to the cooling tube and absorbed by the fluid within the cooling tube. As the fluid heats up, it may change phase from a liquid to a gas. The hot gas may rise to a heat-exchanging condenser configured to dissipate the heat and condense the fluid back into a liquid. The cool, condensed liquid my return from the heat-exchanging condenser to the cooling tube. Risers, gas transport tubes, pressure regulation systems, fluid storage tanks, and other components described herein may increase the efficiency of the cooling system and/or otherwise improve the viability of the cooling system for subterranean power lines.

Abstract: A keyboard comprises a plurality of physically-discrete keycap rows, wherein each of these rows is hingeably coupled to at least one adjacent row. These physically-discrete keycap rows can be stored in a manner somewhat akin to a rolled-up state (such that, for example, at least two of the physically-discrete keycap rows are disposed substantially back-to-back when in a collapsed and stored state). Such a keyboard can be disposed, at least in part, within a sliding tray that moves these rows between a collapsed state and a deployed state.

Abstract: A keyboard comprises a plurality of keycap-bearing physically-discrete segments that are hingeably coupled to one another. When in a non-deployed configuration, the keycap-bearing physically-discrete segments are disposed on a back side of a corresponding housing such that the keys face outwardly away from that back side of the housing. When in a deployed configuration, the keycap-bearing physically-discrete segments are disposed substantially planar with respect to that same housing and face outwardly away from a front side of the apparatus.

Abstract: Systems and methods for packaging a Control Assembly (“CA”) on an Electronic Device (“ED”). The methods involve: mounting a first component (112, 812, 908) of CA on a Top Surface (“TS”) (104, 804, 904) of ED (100, 800, 900) such that a Central AXis (“CAX”) (136, 836, 934) thereof is at an acute angle (170, 870, 962) relative to a plane (152, 852, 952) perpendicular to a horizontal center axis (150, 850, 950) of ED; mounting a second component (106, 806, 906) of CA on TS such that CAX (132, 832, 932) thereof is at a first Obtuse Angle (“OA”) (164, 860, 960) relative to the plane; and mounting a third component (108, 808, 912) of CA on TS such that CAX (134, 834, 936) thereof is at a second OA (166, 862, 970) relative to the plane. The second or third component may have a trapezoidal shape.

Abstract: A test platform includes a supporting member, an annular first slide rail below the supporting member, and an annular conductive second slide rail below the first slide rail. The second slide rail is electrically connected to a power source. An uninterrupted power supply (UPS) is mounted on a bottom of the supporting member. A power socket is mounted on the supporting member and electrically connected to the UPS. A number of first wheels are mounted on the bottom of the supporting member. Each first wheel rests on and can roll along the first slide rail. A number of conductive second wheels are mounted on a bottom of the UPS. Each second wheel rests on and can roll along the second slide rail.

Abstract: An electronic device enclosure includes a top panel and a handling device. The top panel defines a mounting opening. The handling device includes a handling member, a cover member, and an elastic member. The handling member is mounted to the top panel. The handling member defines a receiving opening corresponding to the mounting opening. The cover member is pivotally mounted to the handling member and is received in the receiving opening. The elastic member elastically resists an inner side of the cover member. The cover member is received in the receiving opening in a first position. The elastic member elastically resists an inner side of the cover member in the first position. The cover member is configured to rotate inward to move from the first position to a second position. The elastic member is deformed when the cover member is in the second position.

Abstract: A collapsible electronic equipment includes a first part, a shaft, a second part, a retaining element, and a blocking element. The first part pivots on the second part via the shaft. The retaining element is disposed on the shaft, and the blocking element is movably disposed on the second part. When the blocking element is abutted against the retaining element, a relative position between the first part and the second part is maintained.

Abstract: A display device includes a display panel comprising a pixel region; a protective film on the display panel; and a top chassis on the display panel and defining a first open surface which exposes the pixel region and a second open surface which protrudes from an end of the first open surface.

Abstract: Provided is an in-vehicle electronic apparatus including a main body that includes a panel attaching/detaching part, and a panel that is attached to and detached from the panel attaching/detaching part. The panel attaching/detaching part is provided with a lock mechanism and a holding lever, the lock mechanism being arranged to lock the panel to the main body, the holding lever being rotatable and being arranged to hold the panel when the holding lever is rotated to a holding position. The panel is moved in a predetermined direction with respect to the main body such that locking of the panel to the main body by the lock mechanism is released. When the panel is moved in the predetermined direction such that the locking is released, the holding lever is rotated to the holding position due to inertia such that the panel is held by the holding lever.

Abstract: A device for acquiring and processing sensor measured values and/or for controlling actuators has a base housing, sensors and/or actuators attached to the base housing, a cover that can be connected to the base housing to cover the sensors and/or actuators, and a circuit board with control electronics. To mount the circuit board easily and effect secure contact of the sensors therewith, the circuit board is securely connected to the inner side of the cover using press-fit connectors, the circuit board has electrically active first contact faces on its side remote from the cover, the sensors and/or actuators have electrically active second contact faces on their sides facing the cover, and the second contact faces of the sensors and/or actuators are connected to the first contact faces via electrically conductive contact springs.

Abstract: A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state of the hollow portion being evacuated via a through-hole that brings the inside and the outside of the hollow portion into communication, the package main body portion is sealed with a sealing member, the getter material and the electronic device are connected to a first conductor pad and a second conductor pad, the first conductor pad is connected with a third conductor pad via a thermally conductive material, and the second conductor pad is electrically connected with a fourth conductor pad on a wiring substrate.

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

Abstract: Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.

Abstract: An electronic device apparatus includes an enclosure and a pressing assembly pivotally mounted in the enclosure. A circuit board is mounted in the enclosure. A bottom edge of an expansion card is mounted on the circuit board. The pressing assembly includes a flexible and elastic pressing member. The pressing member includes a pressing portion and a pair of securing feet mounted on opposite edges of the pressing portion. A distance of the pair of securing feet is larger than a with of a top edge of the expansion card. The top edge of the expansion card is located between the pair of securing feet and is pressed by the pressing portion.

Abstract: Systems and methods for protecting a flight recorder are provided. In certain embodiments, a crash survivable memory unit, comprises a memory device that records flight data; a flexible insulation layer that inhibits thermal energy from conducting from an external side of the flexible insulation layer to an internal side of the flexible insulation layer, wherein the internal side faces the memory device; a microlattice layer abutting the internal side and enclosing the memory device, the microlattice layer configured to distribute thermal energy that passes through the flexible insulation layer substantially throughout the microlattice layer; and a heat absorbing material that impregnates the microlattice layer, the heat absorbing material configured to absorb the thermal energy in the microlattice layer; and an impact resistant layer encircling the flexible insulation layer, wherein the impact resistant layer absorbs shocks that result from other objects contacting the impact resistant layer.

Abstract: A removable hard disk drive holder made of a plastic unit enveloping a metallic unit comprises a bracket, a plate and a handle. The bracket has a front panel and two side plates. The two side plates extend toward the same direction perpendicularly from the opposite edge of the front panel. The front panel has a front panel pivot portion arranged over one edge thereof The plate slidably engages with the front panel and has a latch fastening portion. The handle has a handle pivot portion and the handle fastening portion conforming to the latch fastening portion. The handle pivot portion is arranged over one edge of the handle and pivotally connected to the front panel pivot portion. The removable hard disk drive is structurally firm, light and thin and minimizing associated members.

Abstract: A heat dissipation apparatus includes a motherboard has a first heat source and a second heat source thereon, a heat transmission module and a cooling fan. One terminal of the heat transmission module contacts the first heat source. The heat transmission module transmits heat from the first heat source to another terminal of the heat transmission module. The cooling fan has a first air inlet opening, a first air outlet opening and a second air outlet opening. The first air outlet opening faces the another terminal of the heat transmission module. The second air outlet opening faces the second heat source. The cooling fan rotates and generates airflow that flows from the first air outlet opening to the another terminal of the heat transmission module. The cooling fan rotates and generates airflow that flows from the second air outlet opening to the second heat source.

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract: A host for a portable computer is disclosed. A main board is disposed in a casing. A socket mechanism is rotatably disposed in the casing, is electrically connected to the main board, and detachably connects to an electronic device. The electronic device protrudes to the exterior of the casing when the socket mechanism rotates to a first position. The electronic device is received in the casing when the socket mechanism rotates to a second position.

Abstract: A cooling device for electronic components includes a substantially prismatic body made of a thermally conductive material, which has a pair of substantially planar main outer surfaces and encloses therein at least one circuit for the flow of a cooling fluid. Both main outer surfaces are designed to allow removable attachment of an electronic component to be cooled. A control apparatus incorporating the device.

Abstract: The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots between protrusions extending from a base of the heat sink. However, in other embodiments, the plurality of fins may have connector ends having female sides and opposite male sides, wherein the plurality of fins may be attached to each other via the interlocking female and male sides, thereby forming at least part of the base of the heat sink, and fortified with reinforcing members.

Abstract: Voltage regulator, in particular for an alternator, comprising a connector designed to perform the function of a communication interface between the alternator and a control unit of an engine to which the alternator is connected; a capacitor designed to be connected to the alternator, for performing the function of an anti-noise filter at radio frequencies; a processing module designed to be connected to the alternator, for managing operation thereof; a heat sink designed to dissipate the heat of the regulator; the regulator wherein it comprises a casing which is designed to be connected to the alternator and defines a main cavity designed to house the connector and a secondary cavity which is adjacent to the main cavity and designed to house the capacitor; the casing is able to be fixed to the alternator by means of four mechanical connection elements, two of said connection elements being connected to the capacitor, a third one being connected and screwed to a brush holder of the alternator and a fourth one

Abstract: An improved field emission system and method is provided that involves field emission structures having irregular polarity patterns defined in accordance with one-dimensional codes, where an irregular polarity pattern is at least one of an asymmetrical polarity pattern or an uneven polarity pattern. Such one-dimensional codes define at least one peak force and a plurality of off peak spatial forces corresponding to a plurality of alignments of said first and second field emission structures per code modulo, where a peak force is a spatial force produced when all aligned field emission sources produce an attractive force or all aligned field emission sources produce a repellant force and an off peak spatial force is a spatial force resulting from cancellation of at least one attractive force by at least one repellant force.

Abstract: A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.

Abstract: The present invention relates that a part of the outer bottom is combined with an intermediate heat conductor (102) the flow guide holes (300) are not totally shielded after combined, the interior of the heat dissipater (100) is installed with the heat conductive rib structure (310) for being combined with the inner periphery of the heat dissipater (100), the intermediate heat conductor is installed with the electric luminous body (200) and formed as the heat source, so the heat can be conducted to the surface of the heat conductive rib structure (310) and the heat dissipater (101), and with the fluid effect of hot ascent/cold descent, the airflow is enabled to upwardly flow from one side of the electric luminous body (200) through the flow guide holes (300) then flow out from the other side thereof.

Abstract: A storage device includes: a first semiconductor device mounted on a substrate; a housing accommodating the substrate, with the substrate fixed on a first fixing unit that is coupled to a first surface of the housing; and a first thermal conductive plate disposed between the first semiconductor device and the housing, with the first thermal conductive plate thermally connected to the housing, wherein the first thermal conductive plate has a thermal conductivity that is higher than that of the substrate. Thus, the storage device may dissipate heat generated by the semiconductor device rapidly to the outside or away from the storage device.

Abstract: An optical module includes: an optical receiving module 101 provided with a plurality of leads 105 for transmitting an electrical signal at 15 Gbit/s or more; a printed circuit board 103 provided with a pad 106 that is connected with the plurality of leads 105 by solder; and a metal thin plate 102 that is provided between the printed circuit board 103 and the optical receiving module 101 when the optical receiving module 101 is mounted on the printed circuit board 103. The thickness of the metal thin plate 102 is defined in such a manner that a distance between the plurality of leads 105 and the pad 106 is in the range of 50 to 500 ?m after the optical receiving module. 101 is mounted on the printed circuit board 103.

Abstract: For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.

Abstract: Aspects of the disclosure provide a circuit that includes a printed circuit board (PCB) substrate formed with an opening portion that is dimensioned to accommodate an integrated circuit (IC) package. When the IC package is disposed in the opening portion and is electrically coupled to the PCB substrate for PCB assembling, a thickness of the assembled PCB is less than a thickness sum of the IC package and the PCB substrate.

Abstract: A modular power device is used for mounting on a main plate. The modular power system includes a first substrate, a driving module and a converting module. The first substrate having a first axial direction and a second axial direction substantially perpendicular to the first axial direction is inserted into the main plate, such that the second axial direction is substantially perpendicular to the main plate. The driving module is located on one side of the first substrate and electrically connected thereon. The converting module is located on the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction.

Abstract: A modular converter cabinet system of a converter having phase modules with upper and lower converter valves, wherein each converter valve has at least two converter cells and a branch inductor connected in series, includes a first valve cabinet, a second valve cabinet, and an inductor cabinet. The first and second valve cabinets each have several vertically spaced valve levels and several honeycomb cells arranged next to one another. The inductor cabinet has several vertically spaced phase levels. Two valve levels of at least one of the first and second valve cabinets are electrically connected to a respective phase level of the inductor cabinet that is arranged next to the at least one valve cabinet. A converter cabinet system which can be individually adapted to different converter output voltages in a simple manner is thus obtained.

Abstract: The present invention relates to a conducting substrate and a touch screen comprising the same, and the conducting substrate according to the present invention comprises a board, an electric conducting pattern provided on at least one surface of the board, and a darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern, wherein a reflective diffraction intensity of a reflective diffraction image obtained by radiating light emitted from a point light source on one surface from which the darkening layer is visible is reduced by 60% or more as compared to the conducting substrate having the same constitution except that the electric conducting pattern is formed of Al and does not comprise the darkening layer.

Abstract: A portable electronic device includes an electronic module and an electronic module fixing structure. The electronic module fixing structure includes a main body, a sliding component, a rod and an elastic component connected between the main body and the sliding component. The main body has a track with a positioning portion. The sliding component is slidably disposed on the main body. The rod is rotatably connected with the sliding component. An end of the rod is adapted to move along the track. When the end is located at the positioning portion, the end and the positioning portion are interfered with each other to position the sliding component. When the electronic module pushes the sliding component, the rod is rotated to drive the end to move away from the positioning portion, and the sliding component pushes the electronic module away from the main body through elastic force of the elastic component.

Abstract: An electronic module includes a housing, a back and a front, wherein the back is configured with a retainer for latchment in a support system and a movable cover connected to the housing is disposed at the front, a receptacle is disposed in a top region of the front of the housing, the receptacle is configured to receive a first hinge piece of a hinge, with a latching mechanism, connecting the housing and the cover, the cover is configured at a first end as a second hinge piece of the hinge, a first opening is disposed perpendicular to a longitudinal axis of the cover at the first end in an enclosure of the cover into which an axial casing is inserted, and the first hinge piece has a second opening into which a partial region of the axial casing is inserted to form an axis of rotation of the hinge.

Abstract: A compact transition structure includes a printed circuit board, wherein there is a rectangular region on one side of the printed circuit board and the rectangular region has a pair of long edges and a pair of short edges; a transition probe on the one side of the printed circuit board, wherein the transition probe extends into the rectangular region through a long edge of the rectangular region and has a terminal near a center of the rectangular region; and a coupler probe on the one side the printed circuit board, wherein the coupler probe extends into the rectangular region through a short edge of the rectangular region and has a terminal before the center of the rectangular region such that the coupler probe is electrically insulated from the transition probe.

Abstract: A touch-sensing substrate including a substrate, a patterned conductive layer and a patterned insulating layer is provided. The substrate has a plurality of first striped regions and a plurality of second striped regions. The first striped regions are intersected with the second striped regions to define a plurality of sensing-pad disposition regions. The patterned conductive layer includes a plurality of sensing pads disposed in the sensing-pad disposition regions. The patterned insulating layer is disposed on the first striped regions and the second striped regions. The patterned insulating layer and the patterned conductive layer are spliced to form a patterned light-shielding layer. The patterned light-shielding layer has a plurality of enclosed notches arranged in array, wherein parts of the enclosed notches are surrounded by the patterned conductive layer, and other parts of the enclosed notches are surrounded by the patterned conductive layer and the patterned insulating layer.

Abstract: A flexible printed circuit board and a display apparatus including the same, which can prevent damage due to static electricity is disclosed. The flexible printed circuit board includes a signal line region and a ground region protruding from the signal line region, wherein the external periphery of the signal line region is a conductive pattern unformed region where a conductive pattern is not formed. Additionally, at least a portion of the external periphery of the ground region is a conductive pattern formed region where a conductive pattern is formed.

Abstract: A component includes a substrate having at least one flexible substrate area which has at least one area reinforced by forming a material composite. The material composite includes at least a portion of the flexible substrate area. The component also includes a first microstructured or nanostructured element and a connecting mechanism configured to attach the first microstructured or nanostructured element to the flexible substrate area. A damping mass is configured to cover at least the first microstructured or nanostructured element and a portion of the substrate protruding over the material composite. The component is configured to provide a secure receptacle for the electronic element and to offer good vibration decoupling of the electronic element from vibrations of the component.

Abstract: Intersection structures are provided to reduce a strain in a conformable electronic system that includes multi-level arrangements of stretchable interconnect structures. Bypass regions are formed in areas of the stretchable interconnect structures that may ordinarily cross or pass each other. The bypass regions of the stretchable interconnects are disposed relative to each other such that the intersection structure encompasses at least a portion of the bypass regions of each stretchable interconnect structure. The intersection structure has elastic properties that relieve a mechanical strain on the bypass regions during stretching at least one of the stretchable interconnect structures.