Abstract: There is provided a protector to be assembled and fixed to a given position of a fixation object. The protector includes an accommodating space and an opening consecutive to the accommodating space which an electric wire or a bundle of electric wires is adapted to be passed through and accommodated in. The accommodating space includes an excessive part accommodating space which accommodates an excessive part of the electric wire or the bundle of electric wires.

Abstract: A variable length encapsulation housing configuration for an encapsulated electrical energy transmission device has a first encapsulation housing with a sliding surface and a second encapsulation housing supported in a sliding manner on the sliding surface of the first encapsulation housing. The first encapsulation housing has a supporting body on which a coating is applied to form the sliding surface.

Abstract: A communication cable including a cable jacket having a jacket end and a shielding layer having an electrically conductive exterior surface. The exterior surface extends along a length of the communication cable and interfaces with the cable jacket. The exterior surface has an exposed section that extends beyond the jacket end to a shielding end of the shielding layer. The communication cable also includes at least one insulated conductor that extends along the length of the communication cable and that is surrounded by the shielding layer and the cable jacket. The communication cable also includes an adhesive layer that surrounds the exposed section of the exterior surface. The adhesive layer is electrically conductive and is in intimate contact with the exterior surface.

Abstract: An adhesive-backed duct has a main body having a conduit portion with a cavity formed longitudinally therethrough and a flange portion having an adhesive backing layer to mount the duct to a mounting surface. A septum is disposed within the cavity portion and defines at least two bore potions.

Abstract: Herein described is a cable from transmitting electricity, which is particularly useful for subsea applications. A method of manufacturing the cable and a method of transmitting electricity with the cable is also described.

Abstract: Cable structures can be formed for cables and other components that include non-cable components such as jacks and headphones. The cable structure includes an inner wrap that is formed from a metallic doped fabric that can be spiral wound around a conductive bundle such that it essentially completely encapsulates the conductive bundle. The inner surface of fabric, which is on contact with the conductive bundle, is treated such that it acts as an insulator. The exterior surface of the fabric is essentially conductive. A metal braid can then be applied over the exterior surface of the fabric, such that the metal braid and fabric are electrically coupled together to enhance EMI shielding in the cable.

Abstract: This is directed to a cable for use with an electronic device. The cable can be substantially flat, such that all of the conductive wires of the cable are substantially in the same plane. A spacer can be placed between the wires to ensure that wires conducting signals remain a minimum distance apart to avoid signal degradation. The spacer can also control the bending of the cables to favor bending in a preferred direction while reducing or limiting bending in a less preferred direction.

Abstract: A transparent electric conductor includes titanium oxide doped with aluminum and at least one other dopant: either in the form Ti1-a-bAlaXbOy, where X is a dopant or a mixture of dopants selected from the group consisting of Nb, Ta, W, Mo, V, Cr, Fe, Zr, Co, Sn, Mn, Er, Ni, Cu, Zn and Sc, a is in the range 0.01 to 0.50, and b is in the range 0.01 to 0.15; or in the form Ti1-aAlaFcOy-c, where a is in the range 0.01 to 0.50, and c is in the range 0.01 to 0.10. With the above composition, the electrical conductivity and the light transmittance are suitable for use of the transparent electric conductor in various applications, in particular as a transparent electrode of an electronic device.

Abstract: A paneling apparatus for a ceiling or a wall of a room is provided, which may include: two electrically conductive conduction layers, arranged to overlap. First layers between which at least one insulation layer, which electrically insulates the conduction layers from one another, is arranged with, at least one contact-making device which, in a subregion, is accommodated in the layers and which has a first contact region. One of the conduction layers makes electrical contact, and has a second region, with which the other conduction layer makes electrical contact and is electrically insulated from the first region. The conduction layers may make electrical contact with at least one lighting element, holding the lighting element on the layers. The device is arranged on the layers and can move relative thereto.

Abstract: A removable protective terminal shield is a snap-off or breakaway cap that is molded into the plastic enclosure of a lighting control device that covers the neutral wire input hole and, if desired, the head of the terminal screw used to tighten the terminal to the wire after it is inserted into the hole. The terminal input or connection is securely protected until it is determined that an alternative wiring option is available and then the terminal shield is easily removable.

Abstract: A modular insulator for an electrical conductor is provided. The modular insulator includes a first end member configured to couple to a support rail of an electrical power distribution system and a second end member configured to couple to the support rail. The modular insulator further includes at least one intermediate member comprising a groove and configured to releasably couple to at least one of the first and second end members such that the intermediate member is positioned between the first and second end members. The groove is configured to receive a portion of the electrical conductor.

Abstract: A device connects a wire harness to a structure. A fixation portion of the device is secured to the structure. A spacing portion is connected to the fixation portion and to a connector portion. A retaining clip on the connector portion deforms when a wire harness connector component moves axially toward the fixation portion. The clip opposes an abutment edge against the component into engagement position when the component is past the clip to prevent it from moving back onto the clip. An abutment surface contacts another portion of the component in engagement position to prevent further axial movement of the component toward the fixation portion. The component is held captive between the edge and the abutment surface. Also provided are a cable support for connecting the wire harness to the device, a method for connecting and disconnecting the wire harness to a structure with the device, and an aircraft.

Abstract: A printed circuit board is designed to meet the following requirements. A front-back copper foil residual rate difference a?b falls within a range of ?10% to 10%, where the insulative board is divided into a plurality of divisions, in which front and back surface copper foil residual rates of each division are a % and b %, respectively. A difference (a?b)?(c?d) between front-back copper foil residual rate differences of adjacent divisions falls within a range of ?10% to 10%, where the front and back surface copper foil residual rates of a division adjacent to the each division are c % and d %, respectively. There are not three or more consecutive divisions for which the difference between the front-back copper foil residual rate differences goes beyond a range of ?5% to 5%.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Abstract: An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes two wire clips and two fasteners engaging with the wire clips, respectively. The wire clip includes two opposite engaging arms, and an engaging section interconnecting the two engaging arms. Each engaging arm includes a connecting section extending outwardly from the engaging section, and a hook bent outwardly from a free end of the connecting section. The hooks of each wire clip are hooked in the heat sink, each fastener extends through the engaging section of the corresponding wire clip, the engaging section of the wire clip is resiliently pressed by the fastener, and the heat sink is pressed downwardly by the connecting section of the wire clip.

Abstract: An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes a wire clip and two fasteners engaging with the wire clip. The wire clip includes a main body and two engaging arms extending outwardly from two ends of the main body respectively. Each engaging arm includes a first section extending outwardly from the main body, a second section opposite to the first section, an engaging portion interconnecting the first section with the second section, and a hook bent outwardly from a free end of the second section. The main body and the hook of each engaging arm are hooked on the heat sink, and each fastener extends through the corresponding engaging portion. The engaging portions are resiliently pressed by the fasteners, and the heat sink is pressed downwardly by the main body of the wire clip.

Abstract: Disclosed herein is a printed circuit board, including: an insulating layer; a circuit layer formed on one surface of the insulating layer; and a via electrode penetrating through the insulating layer and being connected with the circuit layer, wherein the circuit layer is formed in a structure where different kinds of metal layers having different thermal conductivities are laminated.

Abstract: A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor includes a ceramic substrate having a main portion and an outrigger. A resistor element is between an input contact and an output contact on a top surface of the main portion. A ground plane attachment area is on a top surface of the outrigger. The ground plane attachment area is mounted to a ground plane of a circuit board to provide a heat pathway for dissipating heat generated by the resistor element.

Abstract: A printed wiring board (PWB) can be fabricated with enhanced thermal characteristics that can enable the use of higher performance electronic components and/or a smaller packaging configuration. A substrate layer of the PWB includes a matrix material and optional reinforcing fibers embedded in the matrix material. The matrix material and/or the reinforcing fibers may include thermally-conductive particles such as nanodiamonds that increase the thermal conductivity of the substrate layer. Holes may be formed through the substrate layer for receiving and/or electrically connecting electronic components. The thermally-conductive particles are sized sufficiently small to allow the formation of the holes through the substrate layer using conventional equipment and processes such as drilling. The PWB may also include a protective coating that comprises thermally-conductive particles.

Abstract: Disclosed herein are prepreg, a copper clad laminate (CCL), and a printed circuit board. When a reinforcing member formed of organic fiber including a liquid crystal polymer resin or a super engineering resin and a base resin having the same component as the reinforcing member are used, a coefficient of thermal expansion (CTE) and rigidity may be adjusted. In addition, during an operation of a semiconductor chip mounted on the printed circuit board, the semiconductor chip and the printed circuit board expand and contract due to heat by as much as similar degrees, and thus, the reliability of a solder joint may be enhanced. Moreover, fiber protrusion failure may be prevented compared with a case a via hole is processed by using a CO2 laser drill, thereby minimizing substrate failures.

Abstract: An anchor group anchors organic dielectric compounds used in the production of organically based capacitors. The capacitors referred to are those that can be produced in a parallel process on a prepeg or other common printed circuit board substrate without additional metallisation on copper. The pre-fabricated capacitor layer can then be built into the printed circuit board, thereby gaining on space and cost for the surface of the printed circuit board.

Abstract: Disclosed herein is a touch panel including: an electrode pattern configured of a combination of rectangular patterns of which first and second internal angles facing each other are the same as each other and remaining third and fourth internal angles facing each other except for the first and second internal angles are different from each other.

Abstract: A printed circuit board includes a base, a number of conductive pads, a dielectric layer, an activated metal layer, a first metal seed layer, a second metal seed layer, and a plurality of metal bumps. The conductive pads are formed on the base. The dielectric layer is formed on a surface of the conductive pads and portions of the base are exposed from the c conductive pads. The dielectric layer includes blind vias corresponding to the conductive pads, and a laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the dielectric layer. The second metal seed layer is formed on the activated metal layer and the conductive pads. Each metal bump is formed on the second metal seed layer, and each metal bump protrudes from the dielectric layer.

Abstract: A conductive circuit is formed by printing a conductive ink composition to form a pattern and heat curing the pattern, the ink composition comprising an addition type silicone rubber precursor, a curing catalyst, conductive particles having a density of up to 2.75 g/cm3, and a thixotropic agent, typically carbon black and being solvent-free. The ink composition has such thixotropy that the circuit may be formed by screen printing at a high speed and in high throughputs and yields.

Abstract: A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and the conductive pattern and having an opening portion exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening portion of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern and the portion of the interlayer insulation layer exposed through the opening portion of the solder-resist layer, and a bump structure formed in the opening portion of the solder-resist layer such that the bump structure is formed on the metal layer in the opening portion of the solder-resist layer.

Abstract: A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and conductive pattern and having opening exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern exposed through the opening of the solder-resist layer, and a bump formed in the opening of the solder-resist layer such that the bump is on the metal layer in the opening of the solder-resist layer. The opening of the solder-resist layer has space formed with side surface of the bump, inner wall of the solder-resist layer and the portion of the interlayer insulation layer in the opening of the solder-resist layer.

Abstract: A light emitting system is provided. An exemplary embodiment of a light emitting system comprising at least a light emitting module comprises a substrate, and light emitting rows supported by the substrate, wherein each light emitting row has unpackaged light emitting chips, surrounded by a reflective structure, and a transparent lens is disposed above the light emitting rows for mixing lights emitted from the light emitting rows to form a light source. An exemplary embodiment of a light emitting module of the invention can improve light emitting efficiency effectively with achieving better heat dissipation efficiency.

Abstract: A method includes providing an electronic assembly, where the electronic assembly has at least one electrical connection that includes at least a surface that is substantially pure tin metal and the pure tin metal has tin whiskers formed thereon and the pure tin metal has a thickness. The method includes exposing the tin metal to at least one mitigating agent selected to interact with the tin metal to oxidize the tin whiskers and mechanically removing substantially all the oxidized tin whiskers from the electronic assembly. The electronic assembly is exposed to the mitigating agent under appropriate conditions to oxidize the tin whiskers.

Abstract: A printed circuit board includes a first insulating layer, a second insulating layer on the first insulating layer, and at least one via formed through the first and second insulating layers in a layered structure. The via includes a first via layer formed through the first insulating layer, a second via layer formed on the first via layer while passing through the second insulating layer, and an adhesive layer between the first and second via layers. The first via layer has a section different from a section of the second via layer. The adhesive property between the copper layer and the insulating layer is improved. The vias used to connect interlayer circuits to each other are formed between a plurality of insulating layers through an etching process instead of a laser process or a polishing process, thereby improving the process ability and reducing the manufacturing cost.

Abstract: The invention relates to a layered body, in particular one with two sheets of electric functional layers, as well as a use of this layered body for example in a touch screen with improved resolution. By changing the grid structure at the intersection areas a moiré effect can be avoided by superimposition of the patterns.

Abstract: A connecting apparatus for connecting a first electronic device and a second electronic device together comprises a first port, a second port electronically connected to the first port, and a printed circuit board (PCB). The PCB comprises a first grounded region, a second grounded region, and a first electronic element. The first electronic element is electronically connected between the first grounded region and the second grounded region. When the first electronic device is electronically connected to the second electronic device together via the connecting apparatus, the first port is electronically connected to the first electronic device, and the second port is electronically connected to the second electronic device. The first grounded region, the first electronic element, and the second grounded region form a first return current path for allowing high frequency signals to pass through. A printed circuit board thereof is also provided.

Abstract: Devices and methods are disclosed for reducing vibration and noise from capacitor devices. The device includes a circuit board, and first and second capacitor structures. The second capacitor structure has substantially the same properties as the first and is coupled to the opposite face of a supporting structure substantially opposite of the first capacitor structure. The first and second capacitor structures can receive substantially the same excitation signals, can be electrically connected in parallel or in series. The first and second capacitor structures can be discrete capacitors, capacitor layers, stacks or arrays of multiple capacitor devices, or other capacitor structures. Stacks of multiple capacitor devices can be arranged symmetrically about the supporting structure. Arrays of multiple capacitor devices can be arranged with offsetting capacitors on the opposite face of the supporting structure substantially opposite one another.

Abstract: In a package substrate, adjacent bumps in a first array of bumps being an outermost array arranged along a first side of the package substrate are arranged being shifted in a first axial direction that is a normal direction of the first side and in a second axial direction that intersects perpendicularly with the first axial direction in a plan view. Adjacent bumps in a second array of bumps arranged in the inside of the first array of bumps are arranged being shifted in the first axial direction and in the second axial direction in a plan view.

Abstract: A cable includes a jacket surrounding a cable core. The cable core includes four twisted pairs. An S-shaped separator separates two of the twisted pairs from the other two twisted pairs. The S-Shaped separator may be formed with two layers or three layers, wherein at least one layer is conductive. In alternative embodiments, one or both ends of the S-shaped separator make electrical contact to mid-portions of the separator to create one or two shielding cambers within the cable.

Abstract: An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents.

Abstract: A server cabinet includes a rack and a power distribution unit (PDU). The rack includes a top plate, a bottom plate, and a side plate connected between sides of the top plate and the bottom plate. A through hole is defined in the top plate, near a front end of the top plate. An opening is defined in the bottom plate, near a front end of the bottom plate. The PDU is fastened on an inner side of the side plate, near a front side of the rack. A power cable of the PDU is extendable out of the rack through the through hole or the opening.

Abstract: A slit opening 8 is formed on a lower principal surface 6a of a hard disk case 6, in the vicinity of the inner side of an angle part formed by a lower left lateral wall 6e and an opposing lower lateral wall 6c. A hard disk drive 7 is placed in the hard disk case 6. When the hard disk drive 7 is subjected to vibration caused by disturbance on the hard disk case 6, elastic deformation of an angle part 8a of the slit opening 8 occurs using an axis 8b as a center to reduce vibration of the hard disk drive 7. Thus, it is possible to reduce the thickness of the hard disk case 6. With such a configuration, a hard disk case that is for housing an electronic component and that can have a small thickness can be provided.

Abstract: Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.

Abstract: There is provided an electrical device's casing capable of reducing vibration generated by the electrical device while the device is operating. A converter case (10) encasing a reactor which generates vibration while operating includes: a plate-shaped base (12) having a front surface and a rear surface, the reactor being to be mounted on the front surface; a reactor case (30) erected from the front surface of the base (12) and surrounding an outer periphery of the reactor; a reinforcing portion (40) provided outside the reactor case (30) and configured to increase stiffness of the base (12); and a rib (50) coupling the reactor case (30) and the reinforcing portion (40) to each other.

Abstract: There is provided an attachment structure of an electrical equipment accommodation box in which an electrical equipment accommodation box accommodating therein an electrical component is attached to a wall surface of a vehicle body-side by a bracket. The bracket has a receptacle shape in which a bottom part is formed at a side facing the wall surface. The bottom part of the bracket is provided with a connection part for connecting the bracket and the wall surface each other.

Abstract: A mounting structure of an inlet box (20) of a car which includes an outer panel (2) of the car having a hole (2j), an inlet box inserted in the hole (2j), a flange (21f) provided around the opening (22) of the inlet box (20) and an engaging claw (220) provided on the outer peripheral surface of the inlet box (20). The flange (21f) is set around the hole (2j) from the outside onto the edge (2f). The flange (21f) is screwed to the edge (2f) of the hole (2j) of the outer panel (2) from the inside. The engaging claw engages the hole (2j) of the edge (2f) of the outer panel (2) from the inside when the flange (21f) is set on the edge (2f) of the hole (2j). The engaging claw is capable of disengaging from the edge (2f) of the hole (2j) by a disengagement operation occurring inside the outer panel (2).

Abstract: A flat-conductor connection element for an antenna structure is described. The flat-conductor connection element, is arranged in or on a pane and has: a flat conductor with a base layer, a conductor track, a first dielectric layer, a shield, and a second dielectric layer and a metal frame.

Abstract: A fastening device, e.g., for an electrical cable in a vehicle, has a sleeve which is lockable in a holder and which encloses the line. The sleeve has at least two sleeve subareas which are at least partially separable from one another in such a way that in a preinstalled state the line is inserted into an inner area of the sleeve, and the sleeve subareas are connectable to one another in such a way that in an installed state the line is completely annularly enclosed by the sleeve subareas. Due to the multipart configuration of the sleeve, it is easily mounted on a line. A resistant material such as a thermoplastic elastomer, which is processable with the aid of injection molding, is used for the sleeve.

Abstract: A protector includes a bottom plate part on which a plurality of electric wires is placed on the same plane, a pair of side parts that is provided to erect from the bottom plate part so that the electric wires is interposed between the pair of the side parts, a distance between the pair of the side parts corresponding to crank-shaped curved parts of the electric wires being larger than a distance between the pair of the side parts corresponding to front and rear linear parts of the crank-shaped curved parts of the electric wires, and a protector fixing part that is provided on the bottom plate part so that the protector fixing part is positioned between the crank-shaped curved parts provided next to each other.

Abstract: A connector includes a terminal including a connecting portion that is connected to a plate portion formed at an end of another terminal by a fitting, and an elastic member having a lower rigidity than the plate portion and the connecting portion. The connecting portion includes a bottom portion to be in contact with the plate portion and first and second side portions provided upright from both end sides of the bottom portion in a width direction orthogonal to the fitting direction so as to interpose a contact portion with the plate portion therebetween. When the terminal is fitted to the other terminal, the elastic member is interposed between the plate portion and the first and second side portions and elastically deforms and contacts with both side surfaces of the plate portion in the width direction and with the first and second side portions in the elastically deformed state.

Abstract: A covering material for electric wire, and an insulated electric wire and a wiring harness including the same, wherein the wire including the covering material has a reduced diameter, is inserted into a connector. The covering material containing a polyvinyl chloride comprises, with respect to 100 parts by mass of the polyvinyl chloride, 10 to 20 parts by mass of a plasticizer, 1 to 6 parts by mass of a chlorinated polyethylene, and 1 to 6 parts by mass of an MBS resin, and a total amount of the chlorinated polyethylene and the MBS resin is 2 to 7 parts by mass. The wire has an external diameter of smaller than 1.1 mm, and comprises a conductor 1 and an insulator 2 that covers the conductor 1. The insulator 2 is made of the covering material, and has a thickness of 0.25 mm or smaller.

Abstract: A contact element for contacting a contact point formed on a body includes: an element section on the contact point side for a force-locking connection to the contact point, an element section on the connection side for connection to an electrical connection conductor, and an intermediate section which connects the two element sections to one another for compensating for thermal expansions. At least the element sections on the contact point side and on the connection side are made of different integrally bonded materials having material properties which are adapted to the functionality of the corresponding element section.

Abstract: A wiring element fastening device is provided to fasten a wiring element to a wiring element connector. The wiring element connector includes an engaging part that is electrically engageable with a terminal of the wiring element. The wiring element fastening device includes: a hook-thread component having a base part engaged with the wiring element connector and a screwing part integrated with the base part; and a fastening element for fastening a wiring member of the wiring element and screwed with the screwing part. With the above-described structure, the terminal of the wiring element will not be in poor contact with or separated from the engaging part of the wiring element connector, even if one end of the wiring element is pulled by an external force or a corresponding end of the wiring element connector is pulled.

Abstract: An umbilical cable assembly is created by a process which, in an embodiment, fits an abandonment cap onto an end of an electrically conductive cable as well as a polyethylene disc into which a set of connection pins have been pre-molded. The abandonment cap is injection molded onto the end of the electrically conductive cable where a cylindrical volume of polyethylene is concurrently injection molded to the polyethylene disc. In certain embodiments some of the connection pins are connected to the umbilical's conductive power core. The abandonment cap, fitted to an umbilical exposed end, comprises an injection molded, substantially cylindrical volume of polyethylene disposed over the cable sheath; the disc in which a set of connection pins have been pre-molded; the concurrently injection molded, substantially cylindrical volume of polyethylene disposed over the disc; and a protective cover disposed at least partially over the disc proximate an exposed end of the umbilical's conductive power core.

Abstract: A surface mount connector includes a pair of electrical contacts spaced from each other a predetermined distance. Each contact includes a substantially flat base portion having upper and lower surfaces, the lower surface being suitable for soldering to a pad or land on a printed circuit board (PCB). Each contact is provided with an integrally-formed conductor-engaging portion extending from a base portion in a direction substantially normal to the base portion. Electrically non-conductive tape is secured to the upper surfaces of the spaced base portions for maintaining the contacts spaced at a set or predetermined distance from each other. The contacts each including member for physically and electrically engaging another insulated conductor so that the connector can physically and electrically engage and secure two separate insulated or clad conductors while maintaining them electrically isolated.