Abstract: A polishing composition of the present invention is used for polishing an object containing a phase-change alloy and is characterized by containing an ionic additive. Examples of the ionic additive include a cationic surfactant, an anionic surfactant, an amphoteric surfactant, and a cationic water-soluble polymer.

Abstract: According to one embodiment, a pattern formation method includes forming a first mask layer including a first and a second concave pattern on a first surface of a substrate. The method can include providing a protection film in the first concave pattern. The method can include providing a self-assembling material in the second concave pattern. The method can include forming a first and a second phase in the second concave pattern by phase-separating the self-assembling material. The method can include removing the protection film together with the first phase to form a second mask layer having the first concave pattern and a third concave pattern. The third concave pattern is provided in the second concave pattern, and has an opening width narrower than an opening width of the second concave pattern. The method can include processing the substrate using the second mask layer as a mask.

Abstract: A method of manufacturing a layer pattern of a semiconductor device, the method including forming an anti-reflective coating (ARC) layer on an etching object layer such that the ARC layer includes a polymer having an imide group; forming a photoresist pattern on the ARC layer; wet etching portions of the ARC layer exposed by the photoresist pattern to form an ARC layer pattern; and etching the etching object layer using the photoresist pattern as an etch mask to form the layer pattern.

Abstract: A method for producing patterns includes inclined flanks from a face of a substrate. A protective mask is formed covering at least two masked areas of the face of the substrate and defining at least one intermediate space. An inclined flank is plasma etched from each masked area, wherein the etching forms continuous passivation layer on the inclined flanks producing autolimitation of the etching when the inclined flanks join each other. The etching is carried out in a chamber and includes the introduction into the chamber of a gas additional to the plasma. The additional gas includes molecules of a chemical species participating in the formation of the passivation layer, the quantity of gas in the chamber being controlled so that the chamber contains a quantity of molecules of the species sufficient to form the passivation layer continuously.

Abstract: A semiconductor process includes the following steps. A wafer on a pedestal is provided. The pedestal is lifted to approach a heating source and an etching process is performed on the wafer. An annealing process is performed on the wafer by the heating source. In another way, a wafer on a pedestal, and a heating source on a same side of the wafer as the pedestal are provided. An etching process is performed on the wafer by setting the temperature difference between the heating source and the pedestal larger than 180° C.

Abstract: A dry etching agent according to the present invention contains (A) a fluorinated propyne represented by the chemical formula: CF3C?CX where X is H, F, Cl, Br, I, CH3, CFH2 or CF2H; and either of: (B) at least one kind of gas selected from the group consisting of O2, O3, CO, CO2, COCl2 and COF2; (C) at least one kind of gas selected from the group consisting of F2, NF3, Cl2, Br2, I2 and YFn where Y is Cl, Br or I; and n is an integer of 1 to 5; and (D) at least one kind of gas selected from the group consisting of CF4, CHF3, C2F6, C2F5H, C2F4H2, C3F8, C3F4H2, C3ClF3H and C4F8. This dry etching agent has a small environmental load and a wide process window and can be applied for high-aspect-ratio processing without special operations such as substrate excitation.

Abstract: The present disclosure relates to a method and apparatus for performing a dry plasma procedure, while mitigating internal contamination of a semiconductor substrate. In some embodiments, the apparatus includes a semiconductor processing tool having a dry process stage with one or more dry process elements that perform a dry plasma procedure on a semiconductor substrate received from an input port. A wafer transport system transports the semiconductor substrates from the dry process stage to a wet cleaning stage located downstream of the dry process stage. The wet cleaning stage has one or more wet cleaning elements that perform a wet cleaning procedure to remove contaminants from a surface of the semiconductor substrates before the semiconductor substrate is provided to an output port. The wet cleaning procedure prior removes internal contaminants of the dry process procedure from the semiconductor substrate and thereby improves wafer manufacturing quality.

Abstract: A method for sharpening a nanotip involving a laser-enhanced chemical etching is provided. The method includes immersing a nanotip in an etchant solution. The nanotip includes a base and an apex, the apex having a diameter smaller than a diameter of the base. The method also includes irradiating the nanotip with laser fluence to establish a temperature gradient in the nanotip along a direction from the apex to the base of the nanotip such that the apex and base are etched at different rates.

Abstract: Described are methods and apparatuses for the stabilization of precursors, which can be used for the deposition of manganese-containing films. Certain methods and apparatus relate to lined ampoules and/or 2-electron donor ligands.

Abstract: A method is provided in which a substrate including various materials of different fracture toughness (KIc) can be spalled in a controlled manner. In particular, a surface step region is formed within a surface portion of the substrate prior to formation of a stressor layer. The presence of the surface step region within the surface portion of the substrate controls the depth and ease at which crack initiation occurs within the substrate.

Abstract: A semiconductor device manufacturing method includes forming a first high-k insulating film on a processing target object; performing a crystallization heat-treatment process on the first high-k insulating film at a temperature equal to or higher than about 650° C. for a time less than about 60 seconds; and forming, on the first high-k insulating film, a second high-k insulating film containing a metal element having an ionic radius smaller than that of a metal element of the first high-k insulating film and having a relative permittivity higher than that of the first high-k insulating film.

Abstract: A method of manufacturing a semiconductor device is disclosed. The method includes forming a film containing a predetermined element and carbon on a substrate by performing a cycle a predetermined number of times. The cycle includes supplying a first process gas containing the predetermined element and a halogen element to the substrate; supplying a second process gas containing carbon and nitrogen to the substrate; supplying a third process gas containing carbon to the substrate; and supplying a fourth process gas to the substrate, the fourth process gas being different from each of the first to the third process gases.

Abstract: A substrate processing apparatus includes: a process chamber for processing a substrate; a substrate mounting member including a mounting surface on which a plurality of substrates are concentrically mounted with facing a ceiling of the process chamber; a rotation instrument for rotating the substrate mounting member in a direction parallel to the mounting surface; a gas supply unit and a gas exhaust unit which are disposed in the process chamber above the substrate mounting member upstream and downstream in the substrate mounting member rotating direction, respectively; and a controller for controlling the gas supply unit, the gas exhaust unit, and the rotation instrument to process the substrates, when the substrate passes through a predetermined region formed in the process chamber by the gas supply unit and the gas exhaust unit, by supplying a reactant gas from the gas supply unit and exhausting the reactant gas from the gas exhaust unit.

Abstract: An ALD method includes providing a substrate in an ALD reactor, performing a pre-ALD treatment to the substrate in the ALD reactor, and performing one or more ALD cycles to form a dielectric layer on the substrate in the ALD reactor. The pre-ALD treatment includes providing a hydroxylating agent to the substrate in a first duration, and providing a precursor to the substrate in a second duration. Each of the ALD cycles includes providing the hydroxylating agent to the substrate in a third duration, and providing the precursor to the substrate in a fourth duration. The first duration is longer than the third duration.

Abstract: Method of deposition on a substrate of a dielectric film by introducing into a reaction chamber a vapor of a precursor selected from the group consisting of Zr(MeCp)(NMe2)3, Zr(EtCp)(NMe2)3, ZrCp(NMe2)3, Zr(MeCp)(NEtMe)3, Zr(EtCp)(NEtMe)3, ZrCp(NEtMe)3, Zr(MeCp)(NEt2)3, Zr(EtCp)(NEt2)3, ZrCp(NEt2)3, Zr(iPr2Cp)(NMe2)3, Zr(tBu2Cp)(NMe2)3, Hf(MeCp)(NMe2)3, Hf(EtCp)(NMe2)3, HfCp(NMe2)3, Hf(MeCp)(NEtMe)3, Hf(EtCp)(NEtMe)3, HfCp(NEtMe)3, Hf(MeCp)(NEt2)3, Hf(EtCp)(NEt2)3, HfCp(NEt2)3, Hf(iPr2Cp)(NMe2)3, Hf(tBu2Cp)(NMe2)3, and mixtures thereof; and depositing the dielectric film on the substrate.

Abstract: A deposition for producing a porous organosilica glass film comprising: introducing into a vacuum chamber gaseous reagents including one precursor of an organosilane or an organosiloxane, and a porogen distinct from the precursor, wherein the porogen is aromatic in nature; applying energy to the gaseous reagents in the chamber to induce reaction of the gaseous reagents to deposit a film, containing the porogen; and removing substantially all of the organic material by UV radiation to provide the porous film with pores and a dielectric constant less than 2.6.

Abstract: Disclosed is a method of forming a nitride film on an object to be processed (“processed object”). The method includes: exposing the processed object to dichlorosilane which is a The method includes a step (step (a)) of exposing the processed object to dichlorosilane which is a precursor gas and a step (step (b)) of exposing the processed object to plasma of a processing gas which includes an ammonia gas and a hydrogen gas after step (a). Alternatively, step (a) and step (b) may be alternately repeated and a step of removing dichlorosilane (step (c)) may be further provided between step (a) and step (b).

Abstract: A method of manufacturing a semiconductor device according to the present invention includes the steps of (b) forming, on a back face of a dummy substrate and back faces of a plurality of semiconductor substrates, inorganic films having such thicknesses as to be resistant to a temperature of a thermal oxidizing treatment or a heat treatment and to sufficiently decrease an amount of oxidation or reducing gaseous species to reach the back faces of the dummy substrate and the plurality of semiconductor substrates, (c) disposing the dummy substrate and the plurality of semiconductor substrates in a lamination with surfaces turned in the same direction at an interval from each other, and (d) carrying out a thermal oxidizing treatment or post annealing over the surfaces of the semiconductor substrates in an oxidation gas atmosphere or a reducing gas atmosphere after the steps (b) and (c).

Abstract: A electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB. The electrical interconnect includes a multi-layered substrate with a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The center openings include at least one cross-section greater than the first and second cross-sections. A plurality of spring probe contact members are located in the center openings. The contact members include first contact tips extending through the first opening and above the first surface, second contact tips extending through the second openings and above the second surface, and center portions located in the center openings. The center portions include a shape adapted to bias the first and second contact tips toward the IC device and PCB, respectively.

Abstract: A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.

Abstract: A connector fitting structure is composed of a power-feed connector and a power-receiving connector. The power-feed connector includes: a case; a connector main body having a power-line terminal; a lever for moving the connector main body forward and backward; and a lock arm for locking both cases with each other by engaging with a case of the power-receiving connector. In the connector fitting structure, while both cases are locked with each other and the connector main body is positioned in a front position, the connector main body is fitted with a connector main body of the power-receiving connector. Further, while both cases are locked with each other and the connector main body is positioned in a rear position, the power-line terminal is in contact with a power-line terminal of the power-receiving connector.

Abstract: A slider (19) to be slid by rotating a lever (20) is mounted in a first lever-side connector (L1). The slider (19) is held at an initial position where cam followers (17) provided on the first lever-side connector (L1) can be received into cam grooves (29). When the slider (19) is at the initial position, a part of the slider (19) projects out from the connector. Lever plates (20A) of the lever (20) are so configured that protecting edge portions (38) formed on parts of side edges of the lever plates (20A) are located substantially at the same position as or behind a projecting end part of the slider (19) when the slider (19) is at the initial position. Further, the protecting edge portions (38) are located closer in distance to rotary shafts (34) than an operating portion (20B).

Abstract: A connector (L1) has a one-piece rubber plug (39) with wire insertion holes (45) to collectively seal wires (W) drawn out from the rear end surface of an inner housing (22) by inserting the wires into the corresponding wire insertion holes (45). The connector (L1) has wall surfaces (23, 41) for sandwiching the one-piece rubber plug (39) from front and rear in an inserting direction of the wires (W). Positioning pins (48) project substantially parallel with axial directions of the wire insertion holes (45) from the wall surface (41) on the side of the inner housing (22) toward the one-piece rubber plug (39) and to be inserted and press-fit into positioning holes 51 arranged near the wire insertion holes (45). Narrowed portions (51A) having a small hole diameter are formed at axial intermediate positions of the positioning holes (51).

Abstract: A connector with a force multiplying mechanism includes first and second fixed connectors (F1, F2) which are arranged side by side and each of which includes cam followers (17, 18), and first and second lever connectors (L1, L2) which are individually connectable to the respective fixed connectors (F1, F2) and each of which includes a rotatably provided lever (20, 70) and is connectable to the corresponding one of the fixed connectors (F1, F2) by a force multiplying action produced by rotating the lever (20, 70) while the cam followers (17, 18) and the lever (20, 70) are engaged directly or indirectly via a slider (19). The first and second fixed connectors (F1, F2) are so arranged that surfaces where the cam followers (17, 18) are formed are perpendicular to each other.

Abstract: A lever (70) is rotatably mounted on a second lever-side connector (L2) connectable to a mating connector to extend between facing side surfaces. The lever (70) is rotatable substantially along a connecting direction between a connection surface of the second lever-side connector (L2) and a wire drawing surface (H). A correcting portion (71A) of a wire cover (71) mounted to cover the wire drawing surface is formed to rise at a position displaced toward a central part from a base portion (71 B), and collects and accommodates wires (W) in the correcting portion (71A).

Abstract: A connector assembly having a first connector portion, a second connector portion, and connector position assurance structure. An anti-deflection tab and an anti-deflection protrusion are employed in the connector assembly to control movement of the connector position assurance structure relative to the remainder of the connector assembly.

Abstract: A connector is provided that includes a female terminal with sacrificial portion. The terminal is configured to minimize arcing between a mating male terminal and an intended contact portion of the female terminal. The female terminal is configured such that arcs between the male terminal and the female terminal occur such that the sacrificial portion of the female terminal experiences any arcing while the intended contact portion remains suitable for reliably engaging the male terminal.

Abstract: A technique is provided for connecting a power cable to a submersible component. A connector system is used to form the connection and comprises a plurality of individual connectors for connecting power carrying conductors to the submersible component. Each of the individual connectors is separately connectable to the submersible component which enables improved sealing with respect to the submersible component. In multi-phase power applications, individual connectors can be used for each phase.

Abstract: Latching mechanisms for pluggable electronic devices when received within a host cage of a host device. In one example embodiment, the host cage is configured to be connected to a host printed circuit board and configured to at least partially surround a host connector. The host cage includes a pair of inwardly biased leaf springs that extend toward the host connector and thereby engage with the latching mechanism of the pluggable electronic module in order to secure the pluggable electronic module within the host cage.

Abstract: [Problem] To provide an electrical connector that suppresses cross-talk. [Resolution Means] An electrical connector includes a main body 14 and a cover 16, with the main body 14 and the cover 16 demarcating a space housing a cable 3; the main body 14 includes an upper housing 20, a lower housing 22, a wiring substrate 28 arranged between the upper housing 20 and the lower housing 22, and a shield member 30 arranged interposing the upper housing 20 and the lower housing 22; and the wiring substrate 28 includes a contact 24 for electrically connecting to the cable 3, a connection terminal 26 for electrically connecting to a mating connector, and connecting conductor wiring L for electrically connecting the contact 24 and the connection terminal 26.

Abstract: A securing device includes a first closing unit and a second closing unit. The first closing unit with two upward guide portions and a resilient pressing portion. A protrusion extends from the top of the resilient pressing portion. A fixing portion is connected to the second end of the first closing unit is formed by a wire bending downward from the second end of the first closing unit so as to be mounted to the transmission cable. The second closing unit is a box-like unit. An opening is defined through in the second closing unit so as to accommodate the first closing unit therein. A plurality of engaging holes are defined through the top of the second closing unit and the protrusion of the first closing unit is engaged with one of the engaging holes.

Abstract: A connector apparatus is provided which includes a connector and a mechanical connect-assist mechanism associated, at least in part, with the connector. The connector is configured to operatively plug into a socket structure, and the mechanical connect-assist mechanism includes a cam shaft rotatably coupled to the connector and a connect-assist element projecting from the rotatable cam shaft. The connect-assist element is configured to engage at least one element-receiving opening associated with the socket structure with insertion of the connector within the socket structure. Rotating of the rotatable cam shaft moves the connect-assist element within the at least one element-receiving opening to facilitate secure seating and retention of the connector within the socket structure.

Abstract: A child-resistant plug includes a plug body, at least one prong, and at least one tab extending from the plug body. In one embodiment, a tab is positioned adjacent each of the upper and lower portions of the plug body and each tab is attached to the plug body by a hinging member. The hinging member allows the tabs to rotate between a folded and an unfolded position. When a tab is in its unfolded position, the tab is sized and positioned such that an aperture in the tab aligns with a pre-existing aperture in an electrical outlet cover plate. A fastening member may be used to attach the tab to the cover plate, preventing a child from unplugging a device or accessing the electrical socket. When the tab is attached to the cover plate, and a person pulls the plug or cord with a pre-determined amount of force, the hinging member will break, and the plug will release from the electrical socket.

Abstract: A rocket launcher connector assembly that comprises a first connector component coupled to a launch tube and a second connector component is coupled to a rocket. The second connector component includes an interface side configured to engage the mating interface of the first connector component. Spring members of the second component have rounded portions for engaging contact pads of the first component. A housing of the assembly has a connector holding portion for holding the first and second components. The connector holding portion defines an alignment channel that supports the first component and the alignment member is slidably received in the alignment channel in an insert direction. A tolerance member is engaged with both the alignment member and the connector holding portion of the housing, wherein as the alignment member slides in the alignment channel, the tolerance member biases the alignment member in a direction opposite the insert direction.

Abstract: The invention achieves prevention of sink mark and drainage within a hood part. A housing (10) made of synthetic resin has a hood part (17) extending forward from a terminal holding part (11), and a guide wall part (19) having a guide recessed part (15) formed in a back end part of an inner surface. The housing (10) is formed with a longitudinal mold drawing pathway (20) which includes a mold drawing recessed part (21) having a form which recesses a region in front of a region corresponding to the guide recessed part (15) of the outer surface of the guide wall part (19), and a mold drawing port (22) having a form that communicates with the mold drawing recessed part (21) and passes through a back surface wall (18).

Abstract: An electrical connector includes a housing having a receptacle that is configured to receive an electrical wire therein. An electrical contact is held by the housing. The electrical contact includes a contact beam that includes a wire interface that is configured to engage the electrical wire. The contact beam is movable between a closed position and an open position. The wire interface is configured to engage the electrical wire when the contact beam is in the closed position. The wire interface is configured to be disengaged from the electrical wire when the contact beam is in the open position. The electrical connector includes a push-button actuator having a resiliently deflectable spring that is configured to slidably engage the contact beam to thereby move the contact beam from the closed position to the open position.

Abstract: A method and apparatus is disclosed herein for providing a connection between a connector and a flex cable. In one embodiment, the connector scheme comprises: a flex ribbon having first and second sides, the first side being opposite the second site, where the flex ribbon has one or more traces on the first side and a ground plane on at least a portion of the second side; and a connector into which the flex ribbon is inserted to make an electrical connection thereto, where the connector has a metal shell in electrical contact with the ground plane while having contacts in electrical contact with the one or more traces.

Abstract: A bracket is disclosed for managing the entry of one or more wires into an opening of an electronic equipment chassis. The bracket includes mounting holes configured to accept fasteners for engaging the bracket to the chassis. The bracket also includes a wire support portion having openings for receiving ends of a cable tie to secure one or more wires to the bracket. A faceplate portion of the bracket is positionable to overlie the portion of the chassis opening that is not occupied by the wire(s) to prevent access to the interior of the chassis. A plurality of brackets can be provided for electronic equipment chassis that have multiple openings. Other embodiments are disclosed and claimed.

Abstract: A terminal block includes at least one connecting terminal housing that extends in a longitudinal direction and is row-capable in a transverse direction. The transverse direction is transverse to the longitudinal direction. The connecting terminal housing includes a first flange and a second flange. The first flange is disposed in a first area at a first end of the connecting terminal housing and extends in a first direction. The second flange is disposed in a second area at a second end of the connecting terminal housing and extends in a second direction that is different than the first direction.

Abstract: A coaxial cable connector for connecting to a coaxial cable, the connector including a body having a longitudinal axis, a front end, an opposed rear end, and an interior. The connector also includes an inner post extending through the body and a coupling nut carried on the inner post. A pawl is carried in the interior of the body for engaging with a cable applied to the interior and preventing removal of the cable after being so applied to the interior. The pawl moves out of and into interference with the cable in response to the application of the cable into the interior of the the retraction of the cable off the inner post, respectively.

Abstract: To improve airtightness while reducing a usage amount of a resin for a sealing operation. A terminal block 20 of an electronic device 100 includes a resinous portion 21, a terminal member 23, and a connection member 25. Then, since a first area A1 and a second area A2 are divided by a partition wall 273 in the terminal block 20, it is possible to individually charge a charging resin 29A for blocking a through-hole A22 and a charging resin 29B for blocking a boundary portion between the terminal member 23 and the resinous portion 21. Thus, since the charging amounts of the charging resins 29A and 29B may be respectively adjusted, it is possible to appropriately charge the charging resin for improving the airtightness and to reduce the usage amount of the charging resin for a sealing operation.

Abstract: An electrical connector includes an insulating body having multiple signal receiving slots and at least one grounding receiving slot, multiple signal terminals and at least one grounding terminal respectively received in the signal receiving slots and the grounding receiving slot, a first conducting layer disposed in the grounding receiving slot for shielding the signal terminals, and a solder located in the grounding receiving slot and contacts the first conducting layer and the grounding terminal. The electrical connector may further includes an upper conducting layer and a lower conducting layer, respectively disposed on an upper surface and a lower surface of the insulating body, and multiple through holes surrounding each signal receiving slot. Each through hole has an internally disposed second conducting layer. The upper conducting layer, the lower conducting layer, the first conducting layer and the second conducting layer are conducted.

Abstract: An electrical connector system includes mating pin and socket connectors each designed for increased contact density to improve performance of high-speed data transfer. The connectors include features for retaining a plurality of pin or socket contacts in a ganged, co-aligned configuration and for shielding groups of contacts from one another to reduce interference and crosstalk. The connectors further include features for providing strain relief to the internal wires and/or cables. The electrical connectors further include an electrically conductive grounding contact to latch various internal components of the electrical connector together for improved mechanical connection and shielding properties.

Abstract: A connector assembly includes contact modules each having a wafer, a first ground frame extending along a first side of the wafer and a second ground frame extending along a second side of the wafer. The wafer has a dielectric body holding a plurality of signal contacts. The first ground frame has beams extending from a front of the first ground frame. The second ground frame has shields at least partially surrounding corresponding mating portions of the signal contacts. Each first ground frame is mechanically and electrically connected to an adjacent second ground frame of an adjacent contact module. Each second ground frame is mechanically and electrically connected to an adjacent first ground frame of an adjacent contact module.

Abstract: An integrated radio frequency connector installed in a main board includes a built-in radio frequency part, a connecting element and conductive wire. The connecting element is installed and electrically coupled to the built-in radio frequency part, and the connecting element has a conductive terminal protruded from the built-in radio frequency part, and an end of the conductive wire is electrically coupled to the conductive terminal, and the other end of the conductive wire is electrically coupled to the main board to achieve a modular design, so as to facilitate the assembling procedure.

Abstract: The present invention related to a signal transmission apparatus of connector that includes a substrate on which multiple signal transmitters are disposed. Each of the signal transmitters is made of at least a capacitor or an inductor and disposed on the substrate by surface mount technology (SMT). The substrate further includes multiple winding coils that are electrically connected to the corresponding signal transmitters individually. The substrate, signal transmitters and winding coils are disposed within a RJ connector. The manufacture of the present invention only requires to dispose the signal transmitters on the substrate by SMT and electrically connect the winding coils to the corresponding signal transmitters so as to achieve the enhancement of the electrical characteristics (RL or IL), stable product quality and increase of production through-put as well as further improve the character of common mode rejection mode (CMRR).

Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, or processor mounted on a circuit board to a backplane. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.

Abstract: A connector includes a module and a housing that accommodates the module. The module includes multiple contacts each including a first contact part to contact a board, a second contact part to contact a connection object, and a body extending at angle from the first contact part to the second contact part; and a molded part insert-molded with the contacts arranged as inserts. The molded part covers a portion of the body part through a surface of the first contact part of each of the contacts facing toward the board. In each contact, a width of the portion of the body covered with the molded part is smaller than a width of a spring portion of the body. The spring portion is exposed from the molded part and supports the second contact part in such a manner as to allow its displacement.

Abstract: A connector to be mounted on a board and connect a connection object to the board includes a housing into which the connection object is inserted through an insertion slot and multiple contacts each of which comes into contact with the connection object and the board. Each of the contacts includes a movable contact that comes into contact with a first surface of the connection object, a fixed contact that comes into contact with the board and includes fixing portions for fixing the fixed contact to the housing, and a connecting part that connects the movable contact and the fixed contact. Each of the fixing portions branches and projects from a signal transmission line provided between the connection object and the board. The movable contact is rotatable relative to the fixed contact.

Abstract: A connecting structure includes a flat circuit body, a slider that is attached to a vicinity of a distal end portion of the flat circuit body, and a connector which includes a slider containing portion and a terminal arrangement portion. When the slider is connected to the slider containing portion, conductors of the flat circuit body are electrically connected to the connection terminals of the terminal arrangement portion. The slider has a narrow width end portion whose width at the distal end is smaller than width of the flat circuit body so that side edges of the distal end of the flat circuit body are projected from the narrow width end portion. The slider containing portion has a positioning face which contacts with one of the side edges of the distal end of the flat circuit body.