Abstract: A memory cell system/method incorporating reduced transistor counts and/or improved design-for-manufacturability (DFM) is disclosed. The system/method incorporates cross-coupled feedthru (3410)/feedback (3420) amplifiers to implement memory cell state memory, wherein the feedback amplifier incorporates a multi-state output drive capability (3423) allowing the memory cell to be read/written using only one access device (3430) connected to the output (3412) of the feedthru (3410) amplifier. The multi-state output drive capability (3423) modulates the feedback amplifier (3420) drive strength to enable reading/writing of the feedthru amplifier (3410) state with greatly reduced memory cell input fan-in requirements. The invention anticipates replacement of traditional DP/8T/6T/4T memory cell structures with corresponding 6T/6T/5T/3T memory cell configurations, resulting in a 16%-25% transistor reduction depending on memory array application context.

Abstract: Providing for improved write processes of a semiconductor memory are disclosed herein. By way of example, a programmable write assist can be provided that includes partially discharging a supply voltage applied to a memory cell. Partially discharging the supply voltage can improve write speeds to the memory cell, as well as improve reliability of the write process. A write assist circuit can cause the discharging in response to a resistance-modulated signal. Moreover, the resistance-modulated signal can be configured to control an amount or speed of the discharging of the supply voltage. Further, modulation control can be provided to mitigate discharging of the supply voltage beyond a target level, to reduce data loss in a target data cell or an adjacent data cell.

Abstract: Roughly described, the cell layout in an SRAM array is re-arranged such that the gate electrodes for transistors for which flexibility to use one channel length is desired, are formed along a different track from those for transistors for which flexibility to use a different channel length is desired. Not only does such a re-arrangement permit optimization of device ratios, but also in certain implementations can also reduce, rather than increase, cell area. Specific example layouts are described. The invention also involves layout files, macrocells, lithographic masks and integrated circuit devices incorporating these principles, as well as fabrication methods.

Abstract: Systems and methods are provided for fabricating a static random access memory (SRAM) cell in a multi-layer semiconductor device structure. The SRAM cell includes two pull-up transistors, two pull-down transistors, a plurality of operation-assistance transistors, and two pass-gate transistors. The first pull-up transistor and the second pull-up transistor are formed in a first device layer of the multi-layer semiconductor device structure. The first pull-down transistor and the second pull-down transistor are formed in a second device layer of the multi-layer semiconductor device structure. The plurality of operation-assistance transistors are formed in the first device layer and configured to provide local supply voltages to the first pull-up transistor and the second pull-up transistor respectively. The first pass-gate transistor and the second pass-gate transistor are formed in the second device layer and configured to provide access to the data bit.

Abstract: The present disclosure provides an integrated circuit formed in a semiconductor substrate. The integrated circuit includes a first static random access memory (SRAM) cell having a first cell size; and a second SRAM cell having a second cell size greater than the first cell size. The first SRAM cell includes first n-type field effect transistors (nFETs) each having a first gate stack. The second SRAM cell includes second nFETs each having a second gate stack different from the first gate stack.

Abstract: A semiconductor memory includes an array of volatile memory cells, wherein one of the volatile memory cells has transistors connected in a first memory cell circuit, and at least one non-volatile memory cell having transistors connected in a second memory cell circuit, wherein the transistors in the first memory cell circuit are at least one more than the transistors in the second memory cell circuit.

Abstract: A circuit includes a Static Random Access Memory (SRAM) array. An SRAM cell is in the SRAM array and includes a p-well region, a first and a second n-well region on opposite sides of the p-well region, and a first and a second pass-gate FinFET. The first pass-gate FinFET and the second pass-gate FinFET are p-type FinFETs. A CVss line is over the p-well region, wherein the CVss line is parallel to an interface between the p-well region and the first n-well region. A bit-line and a bit-line bar are on opposite sides of the CVss line. A CVdd line crosses over the SRAM cell. A CVss control circuit is connected to the CVss line. The CVss control circuit is configured to provide a first CVss voltage and a second CVss voltage to the CVss line, with the first and the second CVss voltage being different from each other.

Abstract: A magnetoresistive memory has first and second magnetic tunnel junction (MTJ) elements operated differentially, each with a pinned magnetic layer and a free magnetic layer that can have field alignments that are parallel or anti-parallel, producing differential high and low resistance states representing a bit cell value. Writing a high resistance state to an element requires an opposite write current polarity through the pinned and free layers, and differential operation requires that the two MTJ elements be written to different resistance states. One aspect is to arrange or connect the layers in normal and reverse order relative to a current bias source, thereby achieving opposite write current polarities relative to the layers using the same current polarity relative to the current bias source. The differentially operated MTJ elements can supplement or replace single MTJ elements in a nonvolatile memory bit cell array.

Abstract: According to one embodiment, a magnetoresistive element includes a first magnetic layer, a second magnetic layer, a non-magnetic layer formed between the first magnetic layer and the second magnetic layer, a charge storage layer having a first surface and a second surface different from the first surface, the first surface facing the second magnetic layer, a first insulating layer formed between the second magnetic layer and the first surface of the charge storage layer, and a second insulating layer formed on the second surface of the charge storage layer.

Abstract: A semiconductor device of this invention has an array of non-volatile memory cells, may operate immediately after power activation to write data on and read out the data without reading from an external portion. Further, this invention is free from the lithographic process of the phase-change layer on the manufacturing process.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device including the steps of applying a first non-negative voltage potential to a first region via a bit line and applying a second non-negative voltage potential to a second region via a source line. The method may also include applying a third voltage potential to a word line, wherein the word line may be spaced apart from and capacitively to a body region that may be electrically floating and disposed between the first region and the second region. The method may further include applying a fourth positive voltage potential to a third region via a carrier injection line, wherein the third region may be disposed below at least one of the first region, the body region, and the second region.

Abstract: The present invention relates to a nonvolatile memory device and to a method for manufacturing same. According to the present invention, the blocking insulation layer of a nonvolatile memory device having a typical SONOS structure is replaced with a threshold voltage switching material, which changes to a low resistance state only while a voltage greater than a threshold voltage is applied while maintaining a high resistance state under normal conditions and returning to the high resistance state when the applied voltage is removed. The present invention performs a program operation by injecting charges from a gate electrode layer into a charge trap layer through an insulation layer formed of the threshold voltage switching material after applying a voltage pulse greater than the threshold voltage to the gate electrode layer.

Abstract: A nonvolatile semiconductor memory device is provided which includes: a P-type memory cell transistor having a source, a drain, a gate, and a charge storage layer; and a control circuit which, in a case where the P-type memory cell transistor has its threshold greater than or equal to a first value (Vr) and less than or equal to a second value (Vrd), carries out a program operation of injecting electrons into the charge storage layer.

Abstract: A system and method for reading memory cells in a multi-level cell memory device. A set of thresholds may be received for reading a current page of the memory cells. The set of threshold may include hard decision thresholds for hard decoding, soft decision thresholds for soft decoding, erase thresholds for erase decoding and/or other combinations of thresholds. The set of thresholds may be divided into a plurality of groups of thresholds. The current page may be simultaneously read using multiple thresholds, where each of the multiple thresholds is divided into a different group of thresholds.

Abstract: Methods, devices, modules, and systems for programming memory cells can include storing charges corresponding to a data state that represents an integer number of bits in a set of memory cells. Programming memory cells can include storing a charge in a cell of the set, where the charge corresponds to a programmed state, where the programmed state represents a fractional number of bits, and where the programmed state denotes a digit of the data state as expressed by a number in base N, where N is equal to 2B, rounded up to an integer, and where B is equal to the fractional number of bits represented by the programmed state.

Abstract: A method for data storage includes accepting data for storage in a memory that includes multiple analog memory cells and supports a set of built-in programming commands. Each of the programming commands programs a respective page, selected from a group of N pages, in a subset of the memory cells. The subset of the memory cells is programmed to store M pages of the data, M>N, by performing a sequence of the programming commands drawn only from the set.

Abstract: Multiple bits of data are programmed together to each cell of a segment of a word line while other segments of the same word line are unprogrammed. Subsequently, additional segments are similarly programmed. Data is read from a partially programmed word line (with a mix of programmed and unprogrammed segments) using a single reading scheme.

Abstract: A data storage device includes a non-volatile memory device which includes a memory cell array; and a memory controller which includes a buffer memory. The operating method of the data storage device includes storing data in the buffer memory, and determining whether the data stored in the buffer memory is data accompanying a buffer program operation of the memory cell array. When the data stored in the buffer memory is data accompanying the buffer program operation, the method further includes determining whether a main program operation on the memory cell array is required, and when a main program operation on the memory cell array is required, determining a program pattern of the main program operation on the memory cell array. The method further includes issuing a set of commands for the main program operation on the memory cell array to the multi-bit memory device based on the program pattern.

Abstract: A system and method for storing data uses multiple flash memory dies. Each flash memory die includes multiple flash memory cells. A charge pump is adapted to supply charge at a predetermined voltage to each flash memory die of the flash memory dies, and an interface is adapted to receive instructions for controlling the charge pump.

Abstract: Several preferred embodiments of 1S1F 16T NVSRAM, 1S1F 20T NVSRAM, 1S2F 22T NVSRAM, 1S2F 14T NVSRAM cells are proposed, regardless of 1-poly, 2-poly, PMOS or NOS flash cell structures. Two separate sourcelines for the paired flash Strings are also proposed for easy adding ability for the NVSRAM circuit to detect the marginally erased Vt0 and marginally programmed Vt1 of the paired flash cell. By increasing an resistance added to common SRAM power line, the pull-down current through flash Strings to grounding source line can be made much larger than the pull-up current to improve SFwrite program operation. Simple method by increasing flash cell channel length to effectively enhance coupling area is applied to secure SRAM-to-Flash store operation under self-boost-program-inhibit scheme. 1S2F architecture also provide flexibility for alternate erasing and programming during both a recall and store operation.

Abstract: A method for managing a non-volatile memory may include a first phase of writing data to a first bank of a memory plane of the non-volatile memory, and then a second phase of writing the same data to a second bank of the same memory plane of the non-volatile memory in the case of success of the first writing phase.

Abstract: A semiconductor memory device includes a memory array including memory blocks stacked in a plurality of layers on a substrate, first vertical lines suitable for coupling bit lines, and second vertical lines suitable for coupling word lines of the memory blocks vertically stacked, wherein the memory blocks include selection lines vertically stacked and separated from each other, and the bit lines are coupled to the memory blocks and arranged in a plurality of layers.

Abstract: In a 3D stacked non-volatile memory device, multiple smaller drain-end selected gate (SGD) transistors replace one larger SGD transistor. The SGD transistors have different work functions in their control gates so that, during a programming operation, a discontinuous channel potential is created in an inhibited NAND string. The SGD transistor closest to the bit line has a higher work function so that the channel potential under it is lower, and the next SGD transistor has a lower work function so that the channel potential under it is higher. The different work functions can be provided by using different control gate materials for the SGD transistors. One option uses p+ polysilicon and n+ polysilicon to provide higher and lower work functions, respectively. Metal or metal silicide can also be used. A single SGD transistor with different control gate materials could also be used.

Abstract: Apparatuses are described that include stacked arrays of memory cell strings and their methods of operation. Apparatuses include architectures that reduce the use of several common components, allowing greater device density and smaller device size for a given semiconductor area.

Abstract: The present invention provides a nonvolatile memory cell string and a memory array using the same. According to the present invention, a wall type semiconductor separated into twin fins and a memory cell string formed with memory cells having a gated diode structure along each fin are enabled to increase the degree of integration and basically prevent the interferences between adjacent cells. And a first semiconductor layer and a depletion region of a PN junction wrapped up by a gate electrode are enabled to remove GSL and CSL by GIDL memory operation and significantly increase the degree of integration for applying to a neuromorphic technology.

Abstract: Nonvolatile memory devices, operating methods thereof, and memory systems including the same. A nonvolatile memory device may include a memory cell array and a word line driver. The memory cell array may include a plurality of memory cells. The word line driver may be configured to apply word line voltages to a plurality of word lines connected to the plurality of memory cells, respectively. Magnitudes of the word line voltages may be determined according to locations of the plurality of word lines.

Abstract: A gate voltage generator which supplies first gate voltage at erase verify time to a first selected word line to which a first memory cell included in N memory cells is connected, which supplies the first gate voltage at the erase verify time to a second selected word line to which a first reference cell included in M reference cells is connected, which supplies second gate voltage at the erase verify time to a first non-selected word line connected to a memory cell array, and which supplies third gate voltage at the erase verify time to a second non-selected word line connected to a reference cell array is included. An electric current which flows through a reference cell connected to the second non-selected word line is stronger than an electric current which flows through a memory cell connected to the first non-selected word line.

Abstract: A semiconductor device includes a sense amplifier circuit. The sense amplifier circuit includes a cross-coupled first transistor and second transistor that perform amplification. The sources of the cross-coupled transistors are respectively connected in series with a third transistor and a fourth transistor, and electrical current supply capability of the third and fourth transistors is controlled by a control voltage given to control electrodes of the third and fourth transistors. In a data retaining period, a minimum sub-threshold current necessary for retaining the data is flowed to the third and fourth transistors according to the control voltage, and bit line potential is maintained.

Abstract: Techniques for sensing a semiconductor memory device are disclosed. In one embodiment, the techniques may be realized as a semiconductor memory device comprising a plurality of memory cells arranged in an array of rows and columns and data sense amplifier circuitry coupled to at least one of the plurality of memory cells. The data sense amplifier circuitry may comprise first amplifier circuitry and resistive circuitry, wherein the first amplifier circuitry and the resistive circuitry may form a feedback loop.

Abstract: A number (Nwl) of programmed word lines in a block of NAND strings is determined by measuring a reference combined current (Iref) in the block when all of the memory cells are in a conductive state. Subsequently, to determine if a word line is a programmed word line, an additional combined current (Iadd) in the block is measured with a demarcation voltage applied to the selected word line. The selected word line is determined to be programmed word lines if Idd is less than Iref by at least a margin. Nwl can be used to adjust an erase-verify test of an erase operation by making the erase-verify test relatively hard to pass when the number is relatively small and relatively easy to pass when the number is relatively large. Or, Nwl can be used to identify a next word line to program in the block.

Abstract: A nonvolatile memory device includes a memory block, a row decoder, a voltage generator and control logic. The memory block includes memory cells stacked in a direction intersecting a substrate, the memory block being divided into sub-blocks configured to be erased independently. The row decoder is configured to select the memory block by a sub-block unit. The voltage generator is configured to generate an erase word line voltage to be provided to a first word line of a selected sub-block of the sub-blocks and a cut-off voltage, higher than the erase word line voltage, to be provided to a second word line of the selected sub-block during an erase operation. The control logic is configured to control the row decoder and the voltage generator to perform an erase operation on the selected sub-block.

Abstract: Methods and systems are disclosed for dynamic healing of non-volatile memory (NVM) cells within NVM systems. The dynamic healing embodiments described herein relax damage within tunnel dielectric layers for NVM cells that occurs over time from charges (e.g., holes and/or electrons) becoming trapped within these tunnel dielectric layers. NVM operations with respect to which dynamic healing processes can be applied include, for example, erase operations, program operations, and read operations. For example, dynamic healing can be applied where performance for the NVM system degrades beyond a selected performance level for an NVM operation, such as elevated erase/program pulse counts for erase/program operations and bit errors for read operations. A variety of healing techniques can be applied, such as drain stress processes, gate stress processes, and/or other desired healing techniques.

Abstract: A semiconductor device is disclosed in which a plurality of memory cores are provided on a semiconductor chip. Each of the memory cores comprises: first and second circuit regions and a first and second through electrode groups. a first power supply is supplied in the first circuit region in which a data bus for parallel data is driven, and a second power supply separated from the first power supply is supplied in the second circuit region in which the parallel data and serial data are bidirectionally converted. The first through electrode group includes through electrodes supplying the first power supply to the first circuit region, and the second through electrode group includes through electrodes supplying the second power supply to the second circuit region.

Abstract: A memory operate in a normal mode of operation or a testing mode of operation. In the testing mode of operation, the memory can measure various benchmarks of performance, such as read speed. The memory can perform an asynchronous read operation to read a word of electronic data that corresponds to an address or a page read operation in which multiple asynchronous read operations are performed to read multiple words of electronic data, also referred to as a page of electronic data, that correspond to multiple addresses. The memory can measure a time required, referred to as read speed, to read the word of electronic data or the multiple words of electronic data from the memory.

Abstract: A memory circuit includes a memory cell, a data line coupled to the memory cell, a sense amplifier having an input terminal, a precharge circuit coupled to the input terminal of the sense amplifier, a first transistor of a first type, and a second transistor of the first type. The first transistor is coupled between the input terminal of the sense amplifier and the data line, and the second transistor is coupled between to the input terminal of the sense amplifier and the data line. The first transistor has a first threshold voltage, and the second transistor has a second threshold voltage lower than the first threshold voltage.

Abstract: A semiconductor memory device and an operating method thereof are provided. The semiconductor memory device includes: a memory cell array including a plurality of memory cells; and a peripheral circuit programming first, second, third, and fourth memory cells connected to one word line and successively arranged, among the plurality of memory cells, wherein the peripheral circuit is configured to program the first and fourth memory cells in a first interval and program the second and third memory cells in a second interval. A semiconductor memory device having enhanced performance characteristics and an operating method thereof are provided.

Abstract: A semiconductor memory device includes a memory cell array having a plurality of bit lines and a plurality of word lines intersecting each other and a plurality of nonvolatile memory cells; and a page buffer for each bit line including a latch configured to store one of data to be written to a first nonvolatile memory cell selected by each word line and data read from the first nonvolatile memory cell, wherein before reading out data, the page buffer configured to store in a replica capacitor a voltage value of a word line adjacent to the selected word line when a second nonvolatile memory cell is turned on, the replica capacitor including a first capacitor and a second capacitor connected in parallel, and the page buffer is configured to vary when the latch judges the data from the first nonvolatile memory cell according to the voltage value.

Abstract: A non-volatile memory device using a variable resistive element is provided. The non-volatile memory device includes a memory cell array having a plurality of non-volatile memory cells, a first voltage generator configured to generate a first voltage, a voltage pad configured to receive an external voltage that has a level higher than the first voltage, a write driver configured to be supplied with the external voltage and configured to write data to the plurality of non-volatile memory cells selected from the memory cell array; a sense amplifier configured to be supplied with the external voltage and configured to read data from the plurality of non-volatile memory cells selected from the memory cell array, and a row decoder and a column decoder configured to select the plurality of non-volatile memory cells included in the memory cell array, the row decoder being supplied with the first voltage and the column decoder being supplied with the external voltage.

Abstract: When writing into an antifuse memory element finishes, a value of resistance of the memory element rapidly decreases; accordingly, an output voltage of a boosting circuit which produces a writing voltage rapidly decreases. By detecting a change in the output voltage of the boosting circuit to control a writing command, the writing operation can be stopped immediately after the memory element is shorted. Thus, unnecessary current consumption caused by continuing a writing operation on the shorted memory element can be suppressed.

Abstract: Embodiments of a memory are disclosed that may allow for a negative boost of data lines during a write. The memory device may include a data input circuit, an address decode circuit and a plurality of sub-arrays. Each of the sub-arrays may include a plurality of columns, a write selection circuit, a first write driver circuit, a second write driver circuit, and a boost circuit. Each of the columns may include a plurality of data storage cells. The write selection circuit may select a column of the plurality of columns. Each of the write driver circuits may be configured to discharge a data line of a selected column into a common node. The boost circuit may be configured to initialize the common node to the first voltage level and couple the common node to a second voltage level, where the second voltage level is lower than the first voltage level.

Abstract: Memory technology adapted to store data in a binary format. Such technology includes a semiconductor memory device having memory cells, each having a substrate and at least three graphene layers that are oriented to define a graphene stack disposed in a plane. The graphene stack of each memory cell is connected to a bit line and to a ground connection so that a conductive path is defined in the plane of the graphene stack. The in-plane conductivity of the graphene stack of each memory cell is altered during programming of the memory cell to define a binary value of bits stored in the memory cell.

Abstract: A circuit includes a tracking write circuit and a write circuit. Various write signals of the write circuit are generated based on tracking signals of the tracking write circuit. The write signals are used in a write operation of a memory cell.

Abstract: Exemplary embodiments of the present invention disclose a method and system for substituting a group of memory cells for a defective group of memory cells in a memory. In a step, an exemplary embodiment replaces a signal path to a group of defective memory cells with a signal path to a redundant group of memory cells. In another step, an exemplary embodiment isolates the signal path to the redundant group of memory cells from a load imposed by the signal path to the replaced group of defective memory cells.

Abstract: A memory with extra digit lines in full size end arrays with an open digit architecture, which can use the extra digit lines to form repair cells. In one example, folded digit sense amplifiers are connected to an end array with an open digit architecture such that each sense amplifier corresponds to a group of four digit lines. Two digit lines of the group connect to two open digit sense amplifiers and the other two digit lines connect to the corresponding folded digit sense amplifier. A repair method can be performed on memories including the end arrays with folded digit sense amplifiers. A row in a core array including a replaceable IO is activated and a row in an end array is activated. The repair cells in the end array can be sensed by the folded digit sense amplifiers to generate a replacement IO, which is selected rather than the replaceable IO.

Abstract: A method and apparatus for continued operation of a memory module, including a first and second memory device, when one of memory devices has failed. The method includes receiving a write operation request to write a data word, having first and second sections, by a first memory module. The memory module may have a first memory device and a second memory device, for respectively storing the first and second sections of the data word. A determination if one of the first and second memory devices is inoperable is made. If one of the first and second memory devices is inoperable, a write operation is performed by writing the first and second sections of the data word to the operable one of the first and second memory devices.

Abstract: The present disclosure includes apparatuses and methods related to performing compare and/or report operations using sensing circuitry. An example method can include charging an input/output (IO) line of a memory array to a voltage. The method can include determining whether data stored in the memory array matches a compare value. The determination of whether data stored matches a compare value can include activating a number of access lines of the memory array. The determination can include sensing a number of memory cells coupled to the number of access lines. The determination can include sensing whether the voltage of the IO line changes in response to activation of selected decode lines corresponding to the number of memory cells.

Abstract: A bit line sense amplifier and a layout method therefor which can reduce coupling capacitance. The bit line sense amplifier is disposed between a first memory cell block and a second memory cell block adjacent to the first memory cell block and configured to include first and third switching elements substantially symmetrically formed in a first direction so that the drain terminals of the first and third switching elements face each other, second and fourth switching elements substantially symmetrically formed in the first direction so that the drain terminals of the second and fourth switching elements face each other, a first line configured to electrically couple the gate terminal of the first switching element and the drain terminal of the second switching element, and a second line configured to electrically couple the gate terminal of the third switching element and the drain terminal of the fourth switching element.

Abstract: In accordance with an embodiment of the disclosure, systems and methods are provided for reducing an amount of peak power consumption in a device. In certain implementations, a first signal and a second signal are received, wherein the first signal and the second signal are indicative of amounts of power consumption in a device. The first signal is combined with the second signal to generate a combined signal, and at least a portion of the second signal is shifted in time to cause a combination of the first signal and the shifted portion to have a peak amplitude less than a peak amplitude of the combined signal.

Abstract: A row decoding circuit including row decoding blocks is provided. Each of the row decoding blocks includes row decoders. Each of the row decoders receives a pre-charge signal, and includes an inverter, a selecting transistor and at least one switch transistors. The inverter receives the corresponding pre-charge signal, and outputs a first control signal. The first source/drain of the selecting transistor is coupled to a system high voltage, the gate receives the first control signal, and the second source/drain outputs a corresponding row selecting signal to a memory array of a memory device. The switch transistors are coupled between the second source/drain of the selecting transistor and a corresponding first reference signal in series. When the selecting transistor is controlled by the first control signal and turned on, the first reference signal is set to a high voltage level.

Abstract: A method, system, and apparatus for communicating data with a seismic sensor are provided. The method comprises identifying data to be transmitted and one or more seismic events that correspond to the data to be transmitted. One or more seismic events are created that are distinguishable into binary code from one or more seismic sensors within the array. Seismic events can be distinguished by their pattern or frequency. A first frequency can be assigned as a first binary code and a second frequency can be assigned as a second binary code. Likewise, different patterns of acoustic energy can designate different binary codes. Combinations of patterns and frequencies can be used together to create distinct distinguishable seismic events.