Abstract: Users may have a set duration during which they may consume content, or they may have a variable duration during which they may consume content. A content pacing service is disclosed so that a portion of an item of content may be conveyed in the set duration during which a user is to consume the content. In one embodiment, the rate at which the content is conveyed is increased or decreased so that a reference point in the item of content (e.g., the end of a chapter in an audiobook) is reached approximately when the duration of the user's content consumption ends.

Abstract: A method for cataloguing audio-visual data including indexing a plurality of audio-visual segments by specifying a storage location and recording time of each segment. A segment hierarchy is created based on the locations and times of each recording. The plurality of audio-visual segments can be recorded with a mobile digital video recorder onto a removable medium located within a vehicle such that the mobile digital video recorder can identify the vehicle in which the removable medium is located in while recording each segment.

Abstract: The present invention discloses methods and devices for distributed audio/video (A/V) synchronization and playback. Methods include the steps of: enabling identification of an A/V orchestrator by at least one external A/V system using a data-exchange protocol system; enabling configuration information to be available to at least one external A/V system; identifying A/V data from an A/V source to at least one external A/V system; repetitively synchronizing at least one respective system clock with an orchestra timing on the A/V orchestrator; and repetitively sending at least one synchronization notification to at least one external A/V system, wherein at least one synchronization notification is configured to: indicate a given timing in the orchestra timing during A/V playback, indicate a given position in the A/V data during A/V playback; and instruct at least one external A/V system to move to a currently-playing A/V segment in the A/V data for A/V playback.

Abstract: A method implemented by a status-monitoring device connected between a storage device and a corresponding output unit includes: a) determining presence of a storage device according to a first packet from the storage device; b) when it is determined that the storage device is present, generating a pulse signal according to a second packet from the storage device; c) generating a driving signal indicating a status associated with the storage device according to at least a logic level of the pulse signal; and d) sending the driving signal to the output unit for driving the output unit to output an output signal indicating the status.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region coupled to a source line, a second region coupled to a bit line. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region coupled to a carrier injection line configured to inject charges into the body region through the second region.

Abstract: A microelectronic package can include a substrate having first and second surfaces, first, second, and third microelectronic elements each having a surface facing the first surface, terminals exposed at the second surface, and leads electrically connected between contacts of each microelectronic element and the terminals. The substrate can have first, second, and third spaced-apart apertures having first, second, and third parallel axes extending in directions of the lengths of the apertures. The contacts of the first, second, and third microelectronic elements can be aligned with one of the first, second, or third apertures. The terminals can include first and second sets of first terminals configured to carry address information. The first set can be connected with the first and third microelectronic elements and not with the second microelectronic element, and the second set can be connected with the second microelectronic element and not with the first or third microelectronic elements.

Abstract: Apparatuses included a single-ended main input/output line in a semiconductor device are described. An example apparatus includes: a pair of differential data lines coupled to a sense amplifier; a single-ended data line; a first transistor coupled between the one of the pair of differential data lines and the power line and coupled to the single-ended data line at a control node thereof; a second transistor coupled between the single-ended data line and the power line and coupled to the one of the pair of differential data lines at a control node thereof; and a third transistor coupled between the single-ended data line and the other of the pair of differential data lines.

Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.

Abstract: Methods of operating a die, including counting primary clock cycles of a clock signal in a counter, monitoring a signal indicative of high current demand during secondary clock cycles of the clock signal, determining a total unit consumption of current responsive to a particular value of the signal indicative of high current demand during the secondary clock cycles of the clock signal, and pausing an access operation for the die at a designated point. When a value of the counter matches an assigned counter value of the die while the access operation is paused, determining whether a value of the total unit consumption of current exceeds a unit limit, and resuming the access operation and resetting the value of the total unit consumption of current if the value of the total unit consumption of current is less than or equal to the unit limit.

Abstract: According to one embodiment, an amplifier includes a first inverter which inverts and delays a first signal to generate a second signal. A second inverter inverts and delays a third signal to generate a fourth signal. A first transistor includes a gate electrode supplied with the second signal. A second transistor includes a gate electrode supplied with the fourth signal. An output terminal is coupled to one terminal of the second transistor and outputs a fifth signal. A third inverter inverts and delays the fifth signal to generate a sixth signal. A first discharge circuit discharges one terminal of the first transistor and the one terminal of the second transistor based on the first, sixth, or fourth signal, and includes one terminal coupled to the other terminal of each of the first and second transistors.

Abstract: A sense structure may include sense amplifiers each having measuring and reference terminals for receiving a measuring and a reference current, respectively, output circuitry for providing an output voltage based upon the measuring and reference currents, and voltage regulating circuitry in cascode configuration for regulating a voltage at the measuring and reference terminals. The regulating circuitry may include measuring and regulating transistors and a reference regulating transistor having a first conduction terminal coupled with the measuring terminal and with the reference terminal, respectively, a second conduction terminal coupled with the output circuitry and a control terminal coupled with a biasing terminal. Biasing circuitry is for providing a biasing voltage to the biasing terminal, and common regulating circuitry is for regulating the biasing voltage. Each sense amplifier may also include local regulating circuitry for regulating the biasing voltage applied to the biasing terminal.

Abstract: A sense amplifier includes a cross latch, a first pass gate, a second pass gate, a first data line, a second data line, a first circuit, and a second circuit. The cross latch has a first input/output (I/O) node and a second I/O node. The first pass gate is coupled between the first data line and the first I/O node. The second pass gate is coupled between the second data line and the second I/O node. The first circuit is coupled with the first I/O node and the second data line. The second circuit is coupled with the second I/O node and the first data line. The first circuit is configured to be turned off when the second data line has a first logical value and to be at least lightly turned on when the second data line has a voltage level between the first logical value and a second logical value different from the first logical value.

Abstract: A memory device may include a plurality of first sense amplifiers including a plurality of corresponding first input terminals, a plurality of second sense amplifiers including a plurality of corresponding second input terminals, the plurality of first and second sense amplifiers being suitable for amplifying data received through the respective plurality of first and second input terminals, and for outputting the amplified data which include first and second data outputted by the plurality of first sense amplifiers and third and fourth data outputted by the plurality of second sense amplifiers; a plurality of first pipe latches suitable for latching and outputting the first and second data at a specific interval; a plurality of second pipe latches suitable for latching and outputting the third and fourth data at a specific interval; and an input/output line coupled to the plurality of first and second pipe latches, suitable for outputting the first, second, third and fourth data.

Abstract: A semiconductor system may include a first semiconductor device configured to output commands, addresses and data. The semiconductor system may include a second semiconductor device configured to convert a logic level combination of the data when only any one of bits of the data is a different logic level, and store the data in response to the commands and the addresses, in a write operation.

Abstract: A control method of a memory device, a memory device and a memory system are provided. The memory system includes a memory control unit and a memory die. The memory die performs a data access operation asynchronously with respect to a system clock according to address information and an access signal generated from the memory control unit. When operating in a read mode, the memory die generates a data tracking signal according to a memory internal read time which is an elapsed time for data to be read to be read out from the memory die. The memory control unit and the memory die obtain required data according to respective data tracking signals transmitted therebetween. The control method defines an asynchronous memory interface protocol which realizes reliable and high speed data transmission.

Abstract: An electronic circuit is disclosed for dividing the frequency of a periodic signal, wherein at least one of the memory elements is arranged with its output terminal connected to the input terminal of another memory element wherein the electronic circuit is configured to generate an output signal having a smaller fundamental frequency than the clock signal at at least one of the output terminals. Each memory element is configured to change and hold a voltage at the output terminal based on a voltage at the input terminal at times controlled by a clock signal received at the clock terminal. At least two of the memory elements are stacked in the sense that the bottom terminal of a first memory element is connected to the top terminal of a second memory element to enable the charge to flow from the first memory element to the second memory element.

Abstract: A magnetic random access memory (MRAM) cell including a magnetic tunnel junction containing: a storage layer including at least one storage ferromagnetic layer, each storage ferromagnetic layer having a storage magnetization; an antiferromagnetic storage layer pinning the storage magnetization at a low threshold temperature and freeing them at a high temperature threshold; a reference layer; and a tunnel barrier layer between the reference layer and the storage layer. The magnetic tunnel junction also includes a free ferromagnetic layer having a free magnetization adapted to induce a magnetic stray field magnetically coupling the free ferromagnetic layer with the storage layer; such that the storage magnetization can be switched by the magnetic stray field when the magnetic tunnel junction is at the high temperature threshold. The disclosed MRAM cell has low power consumption.

Abstract: An STTMRAM element includes a magnetic tunnel junction (MTJ) having a perpendicular magnetic orientation. The MTJ includes a barrier layer, a free layer formed on top of the barrier layer and having a magnetic orientation that is perpendicular and switchable relative to the magnetic orientation of the fixed layer. The magnetic orientation of the free layer switches when electrical current flows through the STTMRAM element. A switching-enhancing layer (SEL), separated from the free layer by a spacer layer, is formed on top of the free layer and has an in-plane magnetic orientation and generates magneto-static fields onto the free layer, causing the magnetic moments of the outer edges of the free layer to tilt with an in-plane component while minimally disturbing the magnetic moment at the center of the free layer to ease the switching of the free layer and to reduce the threshold voltage/current.

Abstract: The present disclosure concerns a magnetic random access memory cell containing a magnetic tunnel junction formed from an insulating layer comprised between a sense layer and a storage layer. The present disclosure also concerns a method for writing and reading the memory cell comprising, during a write operation, switching a magnetization direction of said storage layer to write data to said storage layer and, during a read operation, aligning magnetization direction of said sense layer in a first aligned direction and comparing said write data with said first aligned direction by measuring a first resistance value of said magnetic tunnel junction. The disclosed memory cell and method allow for performing the write and read operations with low power consumption and an increased speed.

Abstract: A memory device is configured to identify a set of bit cells to be changed from a first state to a second state. In some examples, the memory device may apply a first voltage to the set of bit cells to change a least a first portion of the set of bit cells to the second state. In some cases, the memory device may also identify a second portion of the bit cells that remained in the first state following the application of the first voltage. In these cases, the memory device may apply a second voltage having a greater magnitude, duration, or both to the second portion of the set of bit cells in order to set the second portion of bit cells to the second state.

Abstract: To provide a memory cell for storing multilevel data that is less likely to be affected by variations in characteristics of transistors and that is capable of easily writing multilevel data in a short time and accurately reading it out. In writing, a current corresponding to multilevel data is supplied to the transistor in the memory cell and stored as the gate-drain voltage of the transistor in the memory cell. In reading, a current is supplied to the transistor in the transistor with the stored gate-drain voltage, and the multilevel data is obtained from the voltage supplied to generate a current that is equal to the current.

Abstract: Provided is a memory device having a plurality of memory cells and a refresh circuit. Each of the memory cells is configured to retain multiple data as a potential of a node connected to a gate of a first transistor, one of a source and a drain of a second transistor, and one of electrodes of a capacitor. The refresh circuit is configured to refresh the memory cells. That is, the refresh circuit is configured to determine an interval between refresh operations, estimate a change of the potential of the node due to the leakage of the charge, and provide a refresh potential to the memory cells, where the refresh potential is a sum of the potential read from the node and the potential lost due to the charge leakage.

Abstract: Embodiments of an electroentropic memory device comprising an array of electroentropic storage devices (EESDs) are disclosed, as well as methods of making and using the electroentropic memory device. The memory device includes a plurality of address lines arranged in rows to select a row of the EESDs and a plurality of data lines arranged in columns to select a column of the EESDs, wherein each EESD is coupled in series between an address line connected to one side of the EESD and a data line connected to an opposing side of the EESD. The memory device may have a stacked architecture with multiple layers of address lines, data lines, and EESDs. The disclosed electroentropic memory devices are operable in ROM and RAM modes. EESDs in the disclosed electroentropic memory devices may include from 2-4096 logic states and/or have a density from 0.001 kb/cm3 to 1024 TB/cm3.

Abstract: Systems and methods are disclosed for increasing the performance of static random access memory (SRAM). Various systems herein, for example, may include or involve dual- or multi-pipe, multi-bank SRAMs, such as Quad-B2 SRAMs. In one illustrative implementation, there is provided an SRAM memory device including a memory array comprising a plurality of SRAM banks and pairs of separate and distinct pipes associated with each of the SRAM banks, wherein each pair of pipes may provide independent access to its associated SRAM bank.

Abstract: The present invention discloses an erasure circuitry, a method for erasing a volatile memory, a volatile memory and a processing unit coupled with an operating system, where the erasure circuitry is adapted to erase the volatile memory at occurrence of a predefined event. The erasure circuitry includes a control unit for initiating a dummy operation to randomize data of one or more memory cells at the occurrence of a predefined event. The control unit is adapted to receive the addresses of the memory blocks from a processing unit via an operating system.

Abstract: In one aspect, a method includes receiving a differential strobe signal including first and second components; buffering, by a first buffer, both the first and second components; and buffering, by a second buffer, the first component. The method includes receiving, by a control logic block, the output of the second buffer. The method includes, after a period when the values of both the first and second components are at a first logic state, but before receiving a burst of clock edges in the differential strobe signal, detecting a transition in the first component from the first logic state to a second logic state, and in response to the detected transition, asserting an enable signal. The method further includes receiving, by a gating logic block, the enable signal and the output of the first buffer, and, when the enable signal is asserted, un-gating the output of the first buffer.

Abstract: Provided is a semiconductor device including: a memory cell array including a plurality of memory cells disposed in a matrix; and a peripheral circuit adjacent to the memory cell array. Each of the memory cells includes: a capacitive element including a lower electrode having a cylinder shape extending in a direction perpendicular to a principal surface of a substrate; and a switch transistor provided between the capacitive element and a bit line, turning on/off of the switch transistor being controlled based on a potential of a word line. The peripheral circuit includes a signal line that is adjacent to the lower electrode in a horizontal direction parallel to the principal surface and is supplied with a fixed potential, or a pair of signal lines respectively supplied with complementary potentials.

Abstract: A fine grained negative wordline scheme for SRAM memories is disclosed. The scheme includes a circuit having a static random access memory (SRAM) cell including at least a wordline coupled to a plurality of NFETs of a transistor array. The circuit further includes a wordline driver including a plurality of inverters coupled between a wordline group decode node, a power supply and the wordline. Overvoltage on the wordline driver and NFETs of the SRAM cell are eliminated by applying a power gating mode and lowering the power supply voltage.

Abstract: A memory macro comprises a plurality of columns and a plurality of footers. A column of the plurality of columns comprises a plurality of nodes corresponding to a plurality of memory cells in the column. A footer of the plurality of footers corresponds to each column of the plurality of columns, is coupled with the plurality of nodes of the each column, and, in response to a column select signal of the plurality of columns, is configured to have a first current-sinking capability or a second current-sinking capability different from the first current-sinking capability.

Abstract: A memory device includes a first memory array comprising a first bit cell and a second bit cell that are configured to provide a first reference signal and a second reference signal, respectively; a second memory array comprising a third bit cell that is configured to store a first logical state; a reference signal provision (RSP) unit, coupled to the first memory array, and configured to short the first and second reference signals so as to provide an averaged reference signal; and a sensing amplifier, coupled between the RSP unit and the second memory array, and configured to use the averaged reference signal to read out the first logical state stored by the third bit cell.

Abstract: A semiconductor device and a method of operating the same are provided. The method includes performing a program operation on a memory cell so that a threshold voltage of the memory cell is greater than a main verifying voltage, and while the program operation is performed, a bit line voltage applied to a bit line connected to the memory cell gradually increases based on the threshold voltage of the memory cell and the number of times a program voltage is applied to a word line connected to the memory cell.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cells, a peripheral circuit performing a program operation or erase operation of the memory cell array; and a control logic controlling the peripheral circuit. The control logic controls the peripheral circuit such that a first program allowable voltage applied to bit lines of the memory cell array during a first program operation of the program operation and a second program allowable voltage applied during a second program operation of the program operation are different from each other.

Abstract: A non-volatile storage system is provided that includes a reversible resistance-switching memory cell and a controller coupled to the reversible resistance-switching memory cell. The controller is configured to program the reversible resistance-switching memory cell to three or more memory states while limiting the current through the memory cell to less than between about 0.1 microamp and about 30 microamps.

Abstract: Resistance variable memory cells having a plurality of resistance variable materials and methods of operating and forming the same are described herein. As an example, a resistance variable memory cell can include a plurality of resistance variable materials located between a plug material and an electrode material. The resistance variable memory cell also includes a first conductive material that contacts the plug material and each of the plurality of resistance variable materials and a second conductive material that contacts the electrode material and each of the plurality of resistance variable materials.

Abstract: The apparatuses and methods described herein may operate to measure a voltage difference between a selected access line and a selected sense line associated with a selected cell of a plurality of memory cells of a memory array. The voltage difference may be compared with a reference voltage specified for a memory operation. A selection voltage(s) applied to the selected cell for the memory operation may be adjusted responsive to the comparison, such as to dynamically compensate for parasitic voltage drop.

Abstract: A device is disclosed that includes a driver, a sinker, a memory column, a reference column, a reference resistor and a sensing unit. At least one of the driver and the sinker has a trimmable resistance. For write operation, one of resistive memory cells is conducted based on a row location in the memory column thereof, the driver provides a write current flowing therethrough and the trimmable resistance is trimmed based on the row location. For read operation, the sensing unit senses a read current of the memory column and a reference current of the reference column and the reference resistor when one of the resistive memory cells and a positionally corresponding one of the reference bit cells are conducted.

Abstract: A semiconductor storage device includes a variable resistive element, which changes a resistance value according to a polarity and a magnitude of an applied voltage, as a memory element. The semiconductor storage device includes a standby mode in which a power source voltage or a ground voltage is applied to both of a word line and a bit line. The semiconductor storage device includes a data write mode in which a voltage difference equal to or more than a first voltage is applied between the word line and the bit line. The semiconductor storage device includes a read mode in which a voltage difference smaller than the first voltage is applied between the word line and the bit line by changing only one voltage of the word line and the bit line which is applied in the standby mode, and data written in the memory element is read.

Abstract: A nonvolatile memory storage device includes a ferroelectric (FE) material coupled with a piezoresistive (PR) material through an inherent piezoelectric response of the FE material, wherein an electrical resistance of the PR material is dependent on a compressive stress applied thereto, the compressive stress caused by a remanent strain of the FE material resulting from a polarization of the FE material, such that a polarized state of the FE material results in a first resistance value of the PR material, and a depolarized state of the FE material results in a second resistance value of the PR material.

Abstract: A bitwise bidirectionally rewritable nonvolatile semiconductor storage device capable of performing a high-speed data rewrite, while enhancing endurance characteristics and data-retention characteristics of a memory cell. To achieve high-speed generation of rewrite-bit information indicating that a data rewrite is needed or not, the structure employs a logic circuit corresponding to the number of change patterns of write conditions and concurrently compares between read-out data RO of memory at the start of the data rewrite and prepared write data DIN. After an electrical data rewrite of the memory, the data rewrite is verified based on the rewrite-bit information stored in an internal buffer circuit. This protects an already-rewritten memory cell from unnecessary additional rewrite.

Abstract: Included are memory cells each including a resistance change element and a control circuit. The circuit performs an On writing process for applying, to the memory cell, an On writing pulse for the cell to be in a resistance state where a resistance value of the resistance change element is lower than a first reference value and an Off writing process for applying an Off writing pulse with an opposite polarity to the On writing pulse for a high resistance state with a second reference value or greater. The circuit applies, in the On writing process, a trial pulse having the same polarity as that of the On writing pulse and having the pulse width shorter than that of the On writing pulse and a reset pulse having the same polarity as that of the On writing pulse, in this order before applying the On writing pulse to the cell.

Abstract: A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; a gate positioned between the

Abstract: A content addressable memory having at least one CAM cell including first and second inverters cross-coupled between first and second storage nodes; a first transistor coupling the first storage node to a bitline, the first transistor being controlled by a first control signal; a second transistor coupling the second storage node to the bitline, the second transistor being controlled by a second control signal; and a control circuit adapted to perform a CAM read operation by pre-charging the bitline to a first voltage level, and then selectively activating either the first or second transistor based on a bit of input data.

Abstract: Apparatus and methods are disclosed, including an apparatus having first and second units of vertically arranged strings of memory cells, each unit including multiple tiers of a semiconductor material, each tier including an access line of at least one memory cell and a channel of a decoder transistor, wherein the channel of the decoder transistor of each of the multiple tiers of the first unit of memory cells is coupled to the channel of the decoder transistor of a corresponding tier of the second unit of memory cells. Methods of forming such apparatus are disclosed, as well as methods of operation, and other embodiments.

Abstract: A semiconductor memory device includes a first memory string including a first memory cell and a second memory cell, a second memory string including a third memory cell, a bit line connected to both one end of the first memory string and one end of the second memory string, a first word line connected to gates of the first and third memory cells, a second word line connected to a gate of the second memory cell, and a control circuit configured to determine a program condition of the first memory cell that have been selected for a write operation, and perform the write operation for the third memory cell based on the program condition of the first memory cell.

Abstract: A memory management method, a memory storage device and a memory controlling circuit unit are provided. The method comprises: obtaining an erased state voltage of a first memory cell and a programmed state voltage of the first memory cell, where the first memory cell is operated in a first programming mode; and operating the first memory cell in a second programming mode if a width of a gap between the erased state voltage and the programmed state voltage is larger than a first threshold value. Accordingly, the reliability of the first memory cell may be improved.

Abstract: A method for programming a memory including a plurality of memory cells is provided. The method comprises selecting a cell and executing a program and program verify operation for the cell, including applying a sequence of program pulses and performing program verify steps. The sequence includes a starting pulse having a starting magnitude. The program verify steps use a program verify level. The method also comprises determining the starting magnitude for a next cell as a function of a magnitude of the program pulse in an instance of the program verify step in which the current cell passes verify at the program verify level.

Abstract: Aspects of a continuous-time memory cell circuit are described. In various embodiments, the memory cell circuit may comprise a memory cell, a current source coupled to the memory cell, and circuitry for programming the memory cell at an adaptive rate, based on a target voltage for programming, using a feedback loop between a gate terminal of the memory cell and a reference control input. Based on the circuitry for programming, the memory cell may be programmed according to various voltage and/or current references, by linear injection and/or tunneling mechanisms. According to various aspects, the circuitry for programming drives a memory cell to converge to a voltage target for programming within a short period of time and to a suitable level of accuracy.

Abstract: A non-volatile memory device includes a memory array having memory cells arranged in wordlines and receiving a supply voltage. A row decoder includes an input and pre-decoding module, which is configured to receive address signals and generate pre-decoded address signals at low voltage, in the range of the supply voltage. A driving module is configured to generate biasing signals for biasing the wordlines of the memory array starting from decoded address signals, which are a function of the pre-decoded address signals, at high voltage and in the range of a boosted voltage higher than the supply voltage. A processing module is configured to receive the pre-decoded address signals and to jointly execute an operation of logic combination and an operation of voltage boosting of the pre-decoded address signals for generation of the decoded address signals.

Abstract: A method, an electronic device and a controller for recovering an array of memory cells are provided. The method comprises the following steps. Whether a recovery control signal is received or not is determined. A retention checking procedure is executed for identifying whether a threshold voltage distribution of at least one bit of the memory cells in high threshold state is shifted or not, if the recovery control signal is received. A retention writing procedure is executed on the memory cells, if the memory cells in high threshold state do not pass the retention checking procedure.

Abstract: A method of operating a semiconductor memory device including a plurality of cell strings coupled to dummy word lines and normal word lines includes performing a first sub-program operation on selected normal memory cells by sequentially applying first program pulses to a selected normal word line and performing a second sub-program operation on the selected normal memory cells by sequentially applying second program pulses greater than the first program pulses to the selected normal word line, wherein at least one of the dummy word lines is biased in a same manner as the selected normal word line whenever each of the first program pulses is applied to the selected normal word line.