Patents Issued in August 1, 2023
  • Patent number: 11716775
    Abstract: Aspects relate to a soft physical cell identifier (PCI) change within a wireless network. A scheduling entity may communicate with a set of one or more scheduled entities within a first cell utilizing a first PCI. The scheduling entity may determine that a second PCI of a second cell co-located with the first cell has been assigned to the scheduling entity, for example, as a result of a PCI collision. The scheduling entity may implement a soft PCI change from the first PCI to the second PCI during a transition period within which the set of one or more scheduled entities may be transferred from the first cell to the second cell. The scheduling entity may then discontinue using the first PCI after completion of the transition period.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: August 1, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Jianghong Luo, Junyi Li, Karl Georg Hampel, Navid Abedini, Tao Luo, Luca Blessent, Naeem Akl
  • Patent number: 11716776
    Abstract: A method for pairing a terminal with an access point in a wireless communication network is described. The network comprises a plurality of access points that are centrally coordinated by a manager device. The method comprises the following steps executed by at least one access point: receiving a first message comprising information indicating that said terminal wishes to pair with said access point; sending a second message to said manager device, said second message comprising information indicating that said terminal wishes to pair with said access point; adding, in at least one beacon frame of said access point, information indicating that a pairing session is active, only on receipt of a message from said manager device notifying said access point to engage a pairing session with said terminal; and pairing said access point and said terminal.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: August 1, 2023
    Assignee: SAGEMCOM BROADBAND SAS
    Inventor: Sylvain Le Roux
  • Patent number: 11716777
    Abstract: A method, a device, and a non-transitory storage medium are described in which a dual connectivity path selection service is provided. The service may select a network path for dual connectivity. The service may use mapping information that may correlate network parameters and values to dual connectivity configurations. The service may compare parameters included in a configuration request pertaining to end devices with the mapping information for selection of a dual connectivity configuration.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: August 1, 2023
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jignesh S. Panchal, Maqbool Chauhan, Sudhakar Reddy Patil
  • Patent number: 11716778
    Abstract: A system and method to determine location information with respect to a plurality of portable devices, with potentially a large number of portable devices such as 40 or more portable devices in proximity to the system. The system may connect to and locate each of the plurality of portable devices in proximity to the system. The location information may be determined with respect to an object, such as a vehicle or building, and optionally within a larger system of objects, such as a mass transit system.
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: August 1, 2023
    Assignees: DENSO International America, Inc., DENSO CORPORATION
    Inventor: Eric John Smith
  • Patent number: 11716779
    Abstract: Systems, methods, apparatuses, and computer program products for user equipment context relocation at radio access network notification area edge are provided.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: August 1, 2023
    Assignee: Nokia Technologies Oy
    Inventors: Ahlem Khlass, Daniela Laselva, Subramanya Chandrashekar
  • Patent number: 11716780
    Abstract: Methods and Systems for modifying or releasing a Multicast/Broadcast (MB) session for delivery of MB Data to a plurality of Electronic Devices (EDs) connected to a (Radio) Access Network (R)AN node is disclosed. The method includes receiving one or more triggers, and instructing the various network functions and (R)AN nodes to modify (or release) the MB session dependent on the received trigger.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: August 1, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ngoc Dung Dao, Xu Li
  • Patent number: 11716781
    Abstract: Systems and methods are disclosed for a WTRU to operate using multiple schedulers. The WTRU may exchange data with the network over more than one data path, such that each data path may use a radio interface connected to a different network node and each node may be associated with an independent scheduler. For example, a WTRU may establish a RRC connection between the WTRU and a network. The RRC connection may establish a first radio interface between the WTRU and a first serving site of the network and a second radio interface between the WTRU and a second serving site of the network. The RRC connection may be established between the WTRU and the MeNB and a control function may be established between the WTRU and the SCeNB. The WTRU may receive data from the network over the first radio interface or the second radio interface.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: August 1, 2023
    Assignee: INTERDIGITAL PATENT HOLDINGS, INC.
    Inventors: Ghyslain Pelletier, Paul Marinier, Diana Pani, Stephen E. Terry, Pascal M. Adjakple, Samian Kaur
  • Patent number: 11716782
    Abstract: Certain aspects of the present disclosure provide a technique for signaling user equipment (UE) assistance information (UAI) indicating a preferred set of connected discontinuous reception (CDRX) parameters, a start offset, and/or a slot offset to a network entity. For example, a UE signals the UAI when operating in a dual connectivity mode involving a new radio (NR) and a long term evolution (LTE). The UE signals the UAI via a new information element (IE). The UE receives a new set of CDRX parameters from the network entity based on the UAI. The UE uses the new set of CDRX parameters for a CDRX operation.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: August 1, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Syam Pavan Vadapalli, Roop Sagar Inakollu, AnkammaRao Ravuvari
  • Patent number: 11716783
    Abstract: Embodiments herein provide a method for handling a user plane by a UE configured for dual connectivity operation. The method includes receiving a RRC reconfiguration message including one or more Layer 2 indications and a Layer 2 configuration corresponding to one or more radio bearers from one of a MN and a SN involved in a dual connectivity operation of the UE. Further, the method includes performing, by the UE, one of: reestablishing of a RLC entity and a data recovery procedure for a PDCP entity corresponding to the radio bearer based on the one or more Layer 2 indications and the Layer 2 configuration received in the RRC reconfiguration message, and reestablishing of a RLC entity and reestablishing of a PDCP entity corresponding to the radio bearer based on the one or more Layer 2 indications and the Layer 2 configuration received in the RRC reconfiguration message.
    Type: Grant
    Filed: May 31, 2021
    Date of Patent: August 1, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Neha Sharma, Mangesh Abhimanyu Ingale
  • Patent number: 11716784
    Abstract: A Real-Time Application (RTA) interface between the Medium Access Control (MAC) and Application (APP) layers of interworking communications in the OSI model for use in wireless local area networks (WLANs). The interface between MAC and APP layers can be utilized for RTA packets, while non-RTA packets can still use the regular OSI model. In initializing a new RTA session the APP layer communicates a set of requirements to the MAC layer. The MAC layer monitors the channel and measures key performance indicators (KPIs) and either accepts or rejects the request. The interoperability between the APP and MAC layers provide enhanced abilities to reduce RTA packet latencies, as well as other benefits.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: August 1, 2023
    Assignee: SONY GROUP CORPORATION
    Inventors: Liangxiao Xin, Mohamed Abouelseoud, Kazuyuki Sakoda
  • Patent number: 11716785
    Abstract: A terminal device for use with a wireless telecommunications system, the terminal device comprising: a transmitter; a receiver configured to receive a measurement radio signal from each of one or more potential relay nodes of the wireless telecommunications system, each measurement radio signal being transmitted using the same predetermined radio frequency band and identifying the one of the potential relay nodes from which it is transmitted; and a controller configured: to measure a characteristic of each received measurement radio signal, and based on each received measurement radio signal and its measured characteristic, to determine a suitable one of the one or more potential relay nodes for acting as a relay node for relaying the further radio signal between the terminal device and the infrastructure equipment.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: August 1, 2023
    Assignee: Convida Wireless, LLC
    Inventors: Brian Alexander Martin, Shin Horng Wong, Martin Warwick Beale, Hiromasa Uchiyama, Hideji Wakabayashi, Shinichiro Tsuda
  • Patent number: 11716786
    Abstract: The present invention provides a method by which a relay terminal determines priority in a wireless communication system including a base station, the relay terminal, and a remote terminal, the method comprising: acquiring remote terminal related information; acquiring the remote terminal related information, and then determining the priority between pieces of the remote terminal related information and the priority between the remote terminal related information and relay terminal related information; and transmitting the information on the basis of the priority, wherein the relay terminal transmits, on the basis of the priority determined by the relay terminal, the information by applying different physical channel parameters.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: August 1, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Seungmin Lee, Hanbyul Seo
  • Patent number: 11716787
    Abstract: A wireless-access point includes a first radio to transmit RF signals in a first channel; a second radio to transmit, simultaneously to transmissions of the RF signals by the first radio, RF signals in a second, non-overlapping channel; and a plurality of planar antennas coupled with corresponding first and second radios to receive the RF signals. First and second planar antennas are coupled with the first radio to receive therefrom, in the first channel, a first RF signal and a second RF signal, respectively. The first planar antenna is arranged with its normal along a first direction. The second planar antenna is arranged with its normal along a second, different direction. A third planar antenna is coupled with the second radio to receive therefrom a third RF signal in the second channel, the third planar antenna being arranged with its normal along a third direction.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: August 1, 2023
    Assignee: Everest Networks, Inc.
    Inventors: Van Hoang Nguyen, Jean-François Frigon, Samer Abielmona, Arbinder Singh Pabla
  • Patent number: 11716788
    Abstract: A heater control system includes a heater driver, a current sensor, a slope calculator, and a mode selector. The heater driver is configured to control current to a heater. The current sensor is configured to sense current supplied to the heater. The slope calculator is configured to calculate a slope of the current supplied to the heater. The mode selector is configured to adjust current supplied to the heater by the heated driver based on the slope of the current.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: August 1, 2023
    Assignee: Gentherm GmbH
    Inventors: Shane Greenwood, Casey Saenz
  • Patent number: 11716789
    Abstract: A system includes a current source circuit; a system power input; and load switching circuitry coupling the current source circuit and the system power input to an output configured to couple to a vaporizer heating element. The current source circuit, the system power input, and the load switching circuitry form part of an integrated circuit. Related apparatus, systems, techniques, and articles are also described.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: August 1, 2023
    Assignee: JUUL Labs, Inc.
    Inventors: Joseph R. Fisher, Jr., Nicholas J. Hatton, Andrew L. Murphy, Hugh Pham, Val Valentine
  • Patent number: 11716790
    Abstract: Disclosed herein is a plane heater that generates heat by using graphene or the like as the conductive heat generation material thereof. The plane heater includes: a nonconductor substrate; a heat generation material applied to the nonconductor substrate; and a pair of electrodes configured to generate resistance heat in the heat generation material. The pair of electrodes include a first electrode configured to be connected to one pole of a power source, and a second electrode configured to be connected to the other pole of the power source. The sectional areas of at least some portions of the first electrode and the second electrode are determined such that a plurality of electric circuits formed by the first electrode, the heat generation material, and the second electrode can have the theoretically same resistance.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: August 1, 2023
    Assignee: CHARMGRAPHENE CO., LTD.
    Inventor: Yong-Ki Kim
  • Patent number: 11716791
    Abstract: Disclosed herein is a plane heater that generates heat by using graphene or the like as the conductive heat generation material thereof. The plane heater includes: a nonconductor substrate; a heat generation material applied to the nonconductor substrate; and a pair of electrodes configured to generate resistance heat in the heat generation material. The pair of electrodes include a first electrode configured to be connected to one pole of a power source, and a second electrode configured to be connected to the other pole of the power source. The sectional areas of at least some portions of the first electrode and the second electrode are determined such that a plurality of electric circuits formed by the first electrode, the heat generation material, and the second electrode can have the theoretically same resistance.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: August 1, 2023
    Assignee: CHARMGRAPHENE CO., LTD.
    Inventor: Yong-Ki Kim
  • Patent number: 11716792
    Abstract: The invention concerns a conductive pattern sheet for use in a glazing, comprising a substrate, a conductive pattern arranged on the substrate, wherein the conductive pattern comprises first and second busbars arranged at opposing edges of the conductive pattern for connecting a power supply thereto, a plurality of conductive lines each conductive line arranged between the first and second busbars, wherein at least a portion of the plurality of conductive lines is configured to have a transition region wherein a change from a first resistance per unit length (R1) at a first end of the transition region to a second resistance per unit length (R2) at a second end of the transition region occurs over a predetermined length (L) of the transition region wherein a rate of change of resistance per unit length (R1-R2)/L is from 1 to 16,000 ohms per centimetre squared and the substrate is a polymer sheet.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: August 1, 2023
    Assignee: PILKINGTON GROUP LIMITED
    Inventor: Leigh Francis Mellor
  • Patent number: 11716793
    Abstract: In an embodiment a microwave oven includes (i) a housing including two surfaces upon which the microwave oven can be set for operation; (ii) a magnetron located inside the housing; a door hinged along a hinged surface of the housing; and (iii) a user interface located on a surface of the housing opposing the hinged surface.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: August 1, 2023
    Inventor: Robert W. Connors
  • Patent number: 11716794
    Abstract: A biodegradable microwave susceptor and constructs incorporating the susceptor are disclosed for heating a food item in a microwave oven. The biodegradable microwave susceptor includes a patterned susceptor layer of metal on a biodegradable substrate. Selected areas of the susceptor layer may be demetallized to remove susceptor material. The susceptor may be incorporated into a construct for containing or supporting a food item to be heated.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: August 1, 2023
    Inventor: Jeffrey T. Watkins
  • Patent number: 11716795
    Abstract: An agricultural work vehicle for operating in a field includes a chassis, a cab mounted to the chassis, a controller for controlling operation of the work vehicle, and a lighting system including a array field light. The array field light projects a light emission to illuminate a defined zone. A light control module is disposed in electrical communication with the controller and operably controls the at least one array field light. A sensing device senses an area surrounding the work vehicle. The sensing device transmits a signal indicative of a detected object to the controller, which in turn determines if the detected object is in the defined zone. If the detected object is in the defined zone, the light control module controllably adjusts an output from the array field light so that only a portion of the defined zone in which the object is not located is illuminated.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: August 1, 2023
    Assignee: DEERE & COMPANY
    Inventors: Nathan R. Demski, Brian M. Huenink, Eric A. Keen
  • Patent number: 11716796
    Abstract: A tunable lighting system includes a first LED having a first spectral output, a second LED having a second spectral output, and a correction circuit including a correction LED. The correction circuit in the tunable lighting system controls the correction LED to emit light that, when combined with light output from the first LED and light output from the second LED, produces a selected spectral characteristic.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: August 1, 2023
    Assignee: LEDdynamics, Inc.
    Inventors: William R. McGrath, Zachary Blanchard, Oliver Piluski, Jason Orzell, Neil P. Cannon
  • Patent number: 11716797
    Abstract: A device corrects an indirect lighting color in response to changes in a vehicle interior finishing material. An input unit of the device receives a finishing material color of a vehicle interior and a target indirect lighting color. A light source control map of the device includes light source control signals of indirect lighting based on finishing material colors and target indirect lighting colors. A controller of the device generates a light source control signal according to the finishing material color and the target indirect lighting color input to the input unit from the light source control map. The controller also corrects the color of a light source of control target indirect lighting by the generated light source control signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: August 1, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Cheol Min Park, Dae Seon Lee, Jung Hyun Cho, Kwang Il Chang, Nu Ri Jeon
  • Patent number: 11716798
    Abstract: A controller and a method for controlling at least two light sources is disclosed.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: August 1, 2023
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Bartel Marinus Van De Sluis, Berent Willem Meerbeek, Marcellinus Petrus Carolus Michael Krijn, Leendert Teunis Rozendaal
  • Patent number: 11716799
    Abstract: The present disclosure discloses a display device, including a glass substrate and a plurality of light emitting diodes (LEDs). The glass substrate includes a first side and a second side. The LEDs include a first LED and a second LED. Compared with a reference anode signal, a first anode signal received by the first LED has a first anode signal difference and a second anode signal received by the second LED has a second anode signal difference. The first anode signal difference is smaller than the second anode signal difference. Compared with a reference cathode signal, a first cathode signal received by the first LED has a first cathode signal difference and a second cathode signal received by the second LED has a second cathode signal difference. The first cathode signal difference is larger than the cathode anode signal difference.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: August 1, 2023
    Assignee: AU OPTRONICS CORPORATION
    Inventor: Shiang-Lin Lian
  • Patent number: 11716800
    Abstract: A control system for an LED array relies on defining a first and a second group of separately addressed LED pixels, with the first group including pixels with an average current no less than the current at a Q point and a second group including pixels with an average current less than the current at a Q point. An amplitude signal provided to the first group of separately addressed LED pixels is selectively modulated, while providing a DC mode 100% duty cycle. An amplitude signal provided to the second group of separately addressed LED pixels is fixed, and a modulated duty cycle is provided.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: August 1, 2023
    Assignee: Lumileds LLC
    Inventors: Antonio Lopez Julia, Ronald Johannes Bonne, Zhi Hua Song
  • Patent number: 11716801
    Abstract: An LED illumination device for rapidly releasing residual capacitance, which includes a bridge rectifier chip, a current-limiting chip, a light-emitting group, a resistor group and a capacitor. The light-emitting group includes a plurality of first and second LED chips. The resistor group includes a plurality of first and second resistor chips. The first working voltage of the first LED chip is different from the second working voltage of the second LED chip. The first resistance value of the first resistor chip is different from the second resistance value of the second resistor chip. Each first LED chip corresponds to one of the first resistor chips, and each second LED chip corresponds to one of the second resistor chips. When the power supply is turned off, the residual capacitance remaining in the capacitor can be released by cooperation of the first resistor chips and the second resistor chips.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: August 1, 2023
    Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.
    Inventors: Chia-Tin Chung, Pei-Chun Liu
  • Patent number: 11716802
    Abstract: A load control device (e.g., an LED driver) for controlling the intensity of a lighting load (e.g., an LED light source) may provide a wide output range and flicker-free adjustment of the intensity of the lighting load. The load control device may comprise a load regulation circuit, a control circuit, and a filter circuit (e.g., a boxcar filter circuit) that operates in a different manner in dependence upon a target current. When the intensity of the lighting load is near a low-end intensity, the control circuit may adjust an operating frequency of the load regulation circuit in response to the target current, and may control the filter circuit to filter a current feedback signal during a filter window that repeats on periodic basis. When the intensity of the lighting load is near a high-end intensity, the control circuit may control the filter circuit to constantly filter the current feedback signal.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: August 1, 2023
    Assignee: Lutron Technology Company LLC
    Inventors: Stuart W. DeJonge, Steven J. Kober, Mark S. Taipale
  • Patent number: 11716803
    Abstract: The present application relates to a method and an apparatus for controlling a device, a smart home device and system and a storage medium the device may be a lighting device. The method for controlling a device comprises: receiving a data stream including data for playing audio; acquiring reference data corresponding to a device control command controlling the device to perform one or more functions; determining whether at least a portion of the data in the data stream matches the reference data; and controlling, in case at least a portion of the data in the data stream matches the reference data, the device to perform one or more of the functions according to the corresponding device control command.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: August 1, 2023
    Inventors: Weihu Chen, Guangting Guo, Hong Zhao, Jinpeng Hu, Mathew Sommers
  • Patent number: 11716804
    Abstract: A light fixture for an indoor grow facility is provided. The light fixture includes a plurality of LED lights, a controller, a digital communication module, and an analog communication module. The controller is in signal communication with the plurality of LED lights. The digital communication module receives a digital control signal. The analog communication module receives an analog control signal simultaneously with the digital control signal. The controller is configured to select between either the digital control signal or the analog control signal for controlling the plurality of LED lights.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: August 1, 2023
    Assignee: HGCI, Inc.
    Inventor: Dengke Cai
  • Patent number: 11716805
    Abstract: A matchless plasma source is described. The matchless plasma source includes a controller that is coupled to a direct current (DC) voltage source of an agile DC rail to control a shape of an amplified square waveform that is generated at an output of a half-bridge transistor circuit. The matchless plasma source further includes the half-bridge transistor circuit used to generate the amplified square waveform to power an electrode, such as an antenna, of a plasma chamber. The matchless plasma source also includes a reactive circuit between the half-bridge transistor circuit and the electrode. The reactive circuit has a high-quality factor to negate a reactance of the electrode. There is no radio frequency (RF) match and an RF cable that couples the matchless plasma source to the electrode.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: August 1, 2023
    Assignee: Lam Research Corporation
    Inventors: Maolin Long, Yuhou Wang, Ricky Marsh, Alex Paterson
  • Patent number: 11716806
    Abstract: In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: August 1, 2023
    Assignee: Motorola Mobility LLC
    Inventors: Alberto R Cavallaro, Maninder S Sehmbey
  • Patent number: 11716807
    Abstract: The devices and methods described below provide for a forearm handguard for a rifle with multiple integrated power and communication channels that are accessible to any accessory through the different rail interface systems of the handguard. Any suitable rail interface systems may be used.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: August 1, 2023
    Inventors: Steve I. Aguilar, Vasilios K. Kapogianis
  • Patent number: 11716808
    Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: August 1, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hongqing Zhang, Arthur J. Higby, David J. Lewison, Philipp K. Buchling Rego, Jay A. Bunt, James Busby, Levi Campbell
  • Patent number: 11716809
    Abstract: A display device is provided, which includes a display panel including a first surface and a second surface of the display panel disposed opposite to each other; a backlight module including a first surface and a second surface of the backlight module disposed opposite to each other, wherein the first surface of the backlight module is attached to the second surface of the display panel; a circuit board including an end attached to the first surface of the display panel and another end bent to the second surface of the backlight module; and an adhesive layer including a first surface and a second surface disposed opposite to each other, wherein the first surface of the adhesive layer is bonded to a side of the backlight module close to the circuit board, and the second surface of the adhesive layer is bonded to the circuit board.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: August 1, 2023
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Dong Tian
  • Patent number: 11716810
    Abstract: A wiring board includes a first interconnect structure including a first interconnect layer, and a first insulating layer including a non-photosensitive thermosetting resin as a main component thereof, a second interconnect structure including second interconnect layers, and second insulating layers including a photosensitive resin as a main component thereof, and laminated on the first interconnect structure, and an encapsulating resin layer including a non-photosensitive thermosetting resin as a main component thereof, and laminated on an uppermost second insulating layer. An uppermost second interconnect layer includes a pad protruding from the uppermost second insulating layer. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad. Thermal expansion coefficients of the first insulating layer and the encapsulating resin layer are lower than that of the second insulating layers.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: August 1, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Masaya Takizawa, Rie Mizutani, Hiroshi Taneda, Yoshiki Akiyama, Noriyoshi Shimizu
  • Patent number: 11716811
    Abstract: A printed wiring board includes an insulating layer, and a conductor layer including a solid layer and wirings. The solid layer has an opening part. The wirings are formed in the opening part. The opening part includes first and second opening parts. The wirings include first and second wirings. The first wiring has a first land, a first portion, and a second portion. The second wiring has a second land, a third portion, and a fourth portion extending in parallel to the second portion. A first boundary between the first and second portions is in the second opening part. The first portion is bending at the first boundary and increasing distance between the first and second wirings. A second boundary between the third and fourth portions is in the second opening part. The third portion is bending at the second boundary and increasing distance between the first and second wirings.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: August 1, 2023
    Assignee: IBIDEN CO., LTD.
    Inventor: Kenji Murase
  • Patent number: 11716812
    Abstract: A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: August 1, 2023
    Inventors: Yongzhen Gao, Shangkun Wu, Zhimei Zhang, Xia Gao, Weidong Zhong
  • Patent number: 11716813
    Abstract: A module includes a wiring board having a first main surface, a first component mounted on the first main surface and having a first height H1, a second component mounted on the first main surface and having a second height H2 lower than the first height H1, and a sealing resin arranged so as to cover the first component and the second component while covering the first main surface. Compared to a first connection terminal used for connection between the first component and the first main surface, a second connection terminal used for connection between the second component and the first main surface has a higher height. A surface of the first component on a side far from the first main surface and a surface of the second component on a side far from the first main surface are exposed from the sealing resin.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: August 1, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Kyo Shin
  • Patent number: 11716814
    Abstract: A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first ILB electrode is configured to be bonded to an integrated circuit chip using one of the first bonding segment or the second bonding segment.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: August 1, 2023
    Assignee: Synaptics Incorporated
    Inventors: Toshifumi Ogata, Atsushi Maruyama, Goro Sakamaki
  • Patent number: 11716815
    Abstract: In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: August 1, 2023
    Assignee: OSRAM GmbH
    Inventors: Michael Beck, Sebastian Jooss, Gerhard Behr
  • Patent number: 11716816
    Abstract: This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: August 1, 2023
    Assignee: IMBERATEK, LLC
    Inventors: Antti Iihola, Timo Jokela
  • Patent number: 11716817
    Abstract: A board design assistance device includes a design data acquirer to acquire design data for a printed circuit board, a first determiner to determine, based on the design data for the printed circuit board, whether a lengthwise direction of board fiber in the printed circuit board is perpendicular to a longitudinal direction of an electronic component mounted on the printed circuit board, a second determiner to determine, based on the design data for the printed circuit board, whether a wire is routed crosswise from a pad receiving the electronic component mounted on the printed circuit board, and a notifier to provide a notification including error information specifying an electronic component determined to have a longitudinal direction not perpendicular to the lengthwise direction of the board fiber and determined to be connected to a pad from which a wire is not routed crosswise.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: August 1, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shinichiro Horiuchi, Toru Tateishi, Kohji Matsuura
  • Patent number: 11716818
    Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: August 1, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Yong Goo Son, Kun Seok Lee, Jung Ok Moon, Kiseok Lee, Seung Heon Lee
  • Patent number: 11716819
    Abstract: The present invention relates to methods and systems for deposition of metal conductors using asymmetrical electrolytic plating, in which one surface (e.g., top) of a substrate is coated with an electrical conductor, and an opposite (e.g., bottom, or other) surface of which is not coated. A channel is formed between the two sides of the substrate, passing through the substrate and, in some embodiments, passing through the conductor. Electrolytic plating is performed such that metal is deposited from the edge of the conduct proximal to the channel, along the side walls of the channel, and up to, and in some embodiments on to, the other side of the substrate. Use of etching or plate resist layers are also contemplated.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: August 1, 2023
    Assignee: Averatek Corporation
    Inventors: Michael Riley Vinson, Shinichi Iketani
  • Patent number: 11716820
    Abstract: A light-emitting device can be folded in such a manner that a flexible light-emitting panel is supported by a plurality of housings which are provided spaced from each other and the light-emitting panel is bent so that surfaces of adjacent housings are in contact with each other. Furthermore, in the light-emitting device, in which part or the whole of the housings have magnetism, the two adjacent housings can be fixed to each other by a magnetic force when the light-emitting device is used in a folded state.
    Type: Grant
    Filed: October 11, 2022
    Date of Patent: August 1, 2023
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yoshiharu Hirakata, Yasuhiro Jinbo, Shunpei Yamazaki
  • Patent number: 11716821
    Abstract: A cable tray and method of use is provided with the cable tray having a bottom extending along a horizontal panel with two opposite side edges. A pair of side walls attaches to the two opposite side edges. A first positioning rack extends between the side walls. The first positioning rack is orthogonal to the tray bottom and the side walls. A second positioning rack extends between the side walls. The second positioning rack is orthogonal to the tray bottom and the side walls. A first foot bar affixes to an underside of the tray bottom. The first foot bar is vertically aligns with the first positioning rack. A second foot bar affixes to the underside of the tray bottom. The second foot bar vertically aligns with the second positioning rack. Each of the first positioning rack and second positioning rack includes cable support apertures.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: August 1, 2023
    Inventors: Michael J Kroger, Brian K Amaral, Alia W Kroger, Robert F Cutler, III, Kimberly M Cipolla
  • Patent number: 11716822
    Abstract: The present disclosure relates to a display module, a display device, and an assembling method of the display module. The display module includes: a display panel; a backplane disposed on one side of the display panel away from a light emitting surface of the display panel; a reflective sheet disposed between the display panel and the backplane; and an adapter bracket disposed between the reflective sheet and the backplane, and configured to connect with an external support structure located outside the display module, wherein the adapter bracket has a first surface and a second surface, the first surface is fixed on a surface of the backplane adjacent to the display panel in a surface contact manner, and the second surface supports the reflective sheet.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: August 1, 2023
    Assignees: K-TRONICS (SUZHOU) TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hao Liu, Lihua Sheng, Yunben Shen, Yefei Ma
  • Patent number: 11716823
    Abstract: The present disclosure provides a support assembly and a storage and deployment apparatus for a flexible display panel. The support assembly of the present disclosure is configured to support a flexible display panel, and includes: a support structure configured to support the flexible display panel, and a driving structure configured to drive the support structure against the flexible display panel. At least a portion of the support structure is fixedly connected to the flexible display panel so that when the flexible display panel is reciprocated in a first direction and a second direction, the support structure is switchable between a first state and a second state. The support structure has a smaller support surface in the first state than in the second state, and the first direction is opposite to the second direction.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: August 1, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Junhuan Liu, Hong Zhu
  • Patent number: 11716824
    Abstract: A cover apparatus for controlling airflow in a computing system. The cover apparatus includes a cover bracket configured to attach to the computing system in alignment with an opening of a module within the computing system. The cover bracket defines an aperture through which one or more components can be inserted into and removed from the module. The cover apparatus includes a cover door attached to the cover bracket and configured to rotate relative to the cover bracket between an open position and a closed position. The cover door closes the first aperture of the cover bracket with the cover door in the closed position. The cover apparatus includes a catch configured to apply a force to the cover door in the closed position. The force is sufficient to maintain the cover door in the closed position but allows a user to manually open the cover door for accessing the module.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: August 1, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Ming-Lung Wang, Hung-Wei Chen, Liang-Ju Lin