Abstract: A delay-compensating power management circuit is provided. The power management circuit includes a power management integrated circuit (PMIC) configured to generate a time-variant voltage(s) based on a time-variant target voltage(s) for amplifying an analog signal(s) associated with a time-variant power envelope(s). A voltage processing circuit is provided in the power management circuit to determine a temporal offset, which can be positive or negative, between the time-variant power envelope(s) and the time-variant target voltage(s). Accordingly, the voltage processing circuit modifies the time-variant target voltage(s) to substantially reduce the determined temporal offset and thereby realign the time-variant target voltage(s) with the time-variant power envelope(s). By realigning the time variant target voltage(s) with the time-variant power envelope(s), it is possible to align the time-variant voltage(s) with the time-variant power envelope(s) to reduce distortions (e.g.

Abstract: Maximum voltage detection in a power management circuit is provided. In embodiments disclosed herein, the power management circuit includes a voltage processing circuit configured to receive a first time-variant target voltage having a first group delay relative to a time-variant target voltage and a second time-variant target voltage having a second group delay relative to the time-variant target voltage. The voltage processing circuit includes a maximum signal detector circuit configured to generate a windowed time-variant target voltage that is higher than or equal to a highest one of the first time-variant target voltage and the second time-variant target voltage in a group delay tolerance window(s) defined by the first group delay and the second group delay. In this regard, the windowed time-variant target voltage can tolerate a certain amount of group delay within the group delay tolerance window(s).

Abstract: Low power radio frequency (RF) receivers and related circuits are described.

Abstract: A circuit to modulate the power supply to track input or output voltages provided to or output by a plurality of amplifiers to reduce power dissipation is provided. The circuit may include a peak detection circuit configured to receive a plurality of voltages respectively corresponding to the plurality of amplifiers, and to detect and output information regarding a maximum instantaneous voltage from the received plurality of voltages, and a summing circuit configured to output a sum of the information regarding the maximum instantaneous voltage and an amplifier headroom voltage. A reference voltage may be provided for the supply voltage responsive to the output sum. The circuit may also include a scaling circuit configured to scale the output sum, and the reference voltage may be a scaled reference voltage output by the scaling circuit.

Abstract: The disclosure provides a Sense Amplifier (SA), a memory and a method for controlling the SA, and relates to the technical field of semiconductor memories. The SA includes: an amplifier module; an offset voltage storage unit electrically connected to the amplifier module and configured to store an offset voltage of the amplifier module in an offset elimination stage of the SA; and a load compensation unit electrically connected to the amplifier module and configured to compensate a difference between loads of the amplifier module in an amplification stage of the SA. The disclosure may improve an accuracy of reading data of the SA.

Abstract: An output stage of an operational amplifier includes a low voltage (LV) metal oxide semiconductor (MOS) device and a dynamic current limit circuit. An output current of the operational amplifier flows through the LV MOS device. The dynamic current limit circuit is configured to sense a drain voltage of the LV MOS device and increase a clamping voltage for the LV MOS device when the drain voltage of the LV MOS device is less than a threshold voltage.

Abstract: Methods and systems for optimizing amplifier operations are described. The described methods and systems particularly describe a feed-forward control circuit that may also be used as a feed-back control circuit in certain applications. The feed-forward control circuit provides a control signal that may be used to configure an amplifier in a variety of ways.

Abstract: In accordance with an embodiment, a circuit includes: a first super source follower; a compensation circuit having a compensating node configured to provide a voltage of opposite phase of a voltage of an internal node of the first super source follower; and a first compensation capacitor coupled between an input of the first super source follower and the compensating node of the compensation circuit.

Abstract: A difference between subsequent measures of a second signal when a first signal crosses a threshold value can be used to estimate a delay between the first and second signal. The delay can be used to compensate for delays between an envelope power supply signal and a radio frequency (RF) input signal.

Abstract: A power amplifier module includes a first amplifier, a power splitter, a second amplifier, a third amplifier, a phase shifter, a combining unit, and a controller. The first amplifier amplifies a first signal and outputs a second signal. The power splitter splits the second signal into a third signal and a fourth signal. The second amplifier amplifies the third signal and outputs a fifth signal. The third amplifier amplifies the fourth signal and outputs a sixth signal. The phase shifter receives the fifth signal and shifts a phase of the fifth signal. The combining unit combines the fifth signal having the phase shifted by the phase shifter and the sixth signal and outputs an amplified signal of the second signal. The controller outputs a first control signal for controlling a power level of the sixth signal output from the third amplifier.

Abstract: The present invention provides an audio control circuit comprising an USB interface and a processing circuit is disclosed. The USB interface is used to connect to a host device, and the processing circuit is configured to perform enumeration with the host device via the USB interface, and the processing circuit is further configured to determine if the host device operates in a BIOS stage or an operating system stage to generate a control signal according to packets of the enumeration. When the processing circuit determines that the host device operates in the BIOS stage, the processing circuit generates the control signal to enable a de-pop circuit; and when the processing circuit determines that the host device operates in the operating system stage, the processing circuit generates the control signal to disable the de-pop circuit.

Abstract: A phase-variable frequency multiplier includes: a 90-degree divider for dividing an input signal into an I-signal and a Q-signal; an amplitude setting circuit for distributing each of the I-signal and the Q-signal to two paths, setting amplitudes of two of four signals including the two distributed I-signals and the two distributed Q-signals depending on a phase shift amount of the input signal, and outputting as set signals, the four signals including the signals with the set amplitudes; a first mixer for multiplying one of the two I-signals included in the set signals by one of the two Q-signals included in the set signals to generate a first signal having a frequency being twice the frequency of the input signal; a second mixer for multiplying the other of the two I-signals included in the set signals by the other of the two Q-signals included in the set signals to generate a second signal with an amplitude ratio with respect to the first signal, being a tangent or a reciprocal of a tangent of the phase sh

Abstract: A method for fabricating a surface acoustic wave (SAW) device includes forming an interdigital transducer (IDT) having lead-out portions and arrays of interdigital electrodes on a substrate, wherein the interdigital electrodes include central portions, end portions, and intermediate portions between the end portions and the lead-out portions; forming a protective layer on the IDT; forming a first temperature compensation layer on the protective layer; forming openings in the first temperature compensation layer to expose portions of the protective layer on the central portions and the intermediate portions of the interdigital electrodes; and etching the exposed portions of the protective layer, and etching the central portions and the intermediate portions of the interdigital electrodes to a preset thickness, to form protruding structures at the end portions of the interdigital electrodes.

Abstract: Provided by a bandpass filter circuit and a multiplexer. The bandpass filter circuit includes at least one electromagnetic LC filter circuit and at least one acoustic wave resonance unit. The at least one acoustic wave resonance unit includes an input port, an output port, at least one circuit element and at least three resonators. The at least one electromagnetic LC filter circuit is electrically connected to the at least one acoustic wave resonance unit, and the at least three resonators include at least one first resonator and at least one second resonator. In a case where the at least one first resonator includes one first resonator, the first resonator is connected in series between the input port and the output port.

Abstract: A multiplexer includes a common terminal, a first filter connected to the common terminal, a wiring line connecting the common terminal and the reception filter to each other, a second filter connected to a connection node on the wiring line, a third filter connected to a connection node on the wiring line, a wiring line connecting the connection node and the transmission filter to each other, a wiring line connecting the connection node and the first filter to each other, and an inductor connected between a wiring region of the wiring line that extends from the connection node to the first filter and the ground or between the wiring line and the ground. The length of a portion of the wiring line extending from the common terminal to the connection node is longer than the length of a portion of the wiring line extending from the common terminal to the connection node.

Abstract: Acoustic filters, resonators and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate includes a diaphragm that spans a cavity in the substrate. A conductor pattern includes an interdigital transducer (IDT) with interleaved parallel fingers on the diaphragm. A center-to-center spacing between two adjacent parallel fingers is greater than or equal to 2.5 times a thickness of the diaphragm and less than or equal to 15 times the diaphragm thickness.

Abstract: A packaged acoustic wave filter component can include an acoustic wave device including a first piezoelectric layer and an interdigital transducer electrode on the first piezoelectric layer. A support layer may be included over the acoustic wave device, and the packaged hybrid filter component can also include a bulk acoustic wave resonator over the support layer. A cap layer may extend over and encapsulate the bulk acoustic wave resonator. One or more external vias may extend through the support layer and the underlying layers of the acoustic wave device to provide electrical communication with the packaged bulk acoustic wave generator.

Abstract: A wafer level package comprises a functional wafer with a first surface, device structures connected to device pads arranged on the first surface. A cap wafer, having an inner and an outer surface, is bonded with the inner surface to the first surface of the functional wafer. A frame structure surrounding the device structures is arranged between functional wafer and cap wafer. Connection posts are connecting the device pads on the first surface to inner cap pads on the inner surface. Electrically conducting vias are guided through the cap wafer connecting inner cap pads on the inner surface and package pads on the outer surface of the cap wafer.

Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.

Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a piezoelectric plate having front and back surfaces, a portion of the piezoelectric plate forming a diaphragm, and a conductor pattern on the front surface, the conductor pattern including an interdigital transducer (IDT), interleaved fingers of the IDT on the diaphragm. A ratio of a mark of the interleaved fingers to a pitch of the interleaved fingers is greater than or equal to 0.12 and less than or equal to 0.3. The pitch of the interleaved fingers is greater than or equal to 6 times a thickness of the piezoelectric plate and less than or equal to 12.5 times the thickness of the piezoelectric plate.

Abstract: Electro-acoustic resonator and method for manufacturing the same An electro-acoustic resonator comprises an acoustic mirror (120) disposed on a carrier substrate (110), a bottom electrode (130) and a piezoelectric layer (140). A structured silicon dioxide flap layer (150) is disposed on the piezoelectric layer (140), both layers having a common contact surface. Direct disposal of the silicon dioxide (150) on the piezoelectric layer (140) increases the quality factor of the resonator and leads to enhanced RF filter performance.

Abstract: There are disclosed matrix filters having an antenna port, receive ports and transmit ports. A receive matrix filter is coupled between each receive port and the antenna port; an a transmit matrix filter is coupled between the antenna port and each transmit port. An impedance at the receive port is matched to an input impedance of a low noise amplifier (LNA), an impedance at the transmit port is match to an output impedance of a power amplifier (PA), and an impedance at the antenna port is match an impedance of an antenna.

Abstract: Certain aspects of the present disclosure provide a surface acoustic wave (SAW) resonator with piston mode design and electrostatic discharge (ESD) protections. An example electroacoustic device generally includes a piezoelectric material and a first electrode structure disposed above the piezoelectric material. The first electrode structure comprises first electrode fingers arranged within an active region having a first region and a second region. At least one of the first electrode fingers has at least one of a different width or a different height in the first region than in the second region, and the first electrode fingers comprise a first electrode finger that has a width or height in the second region that is less than a corresponding width or height of the at least one of the first electrode fingers in the second region.

Abstract: Acoustic resonator devices, filter devices, and methods of fabrication are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. At least a portion of an edge of the diaphragm is at an oblique angle to the fingers.

Abstract: A multiplexer includes an antenna terminal, an inductance element, and a transmission-side filter and a reception-side filter connected to the antenna terminal. The transmission-side filter has a first pass band, and the reception-side filter has a second pass band. The reception-side filter is connected to the antenna terminal through the inductance element. A center frequency of the second pass band is higher than a center frequency of the first pass band. The reception-side filter includes parallel arm resonance portions including a first parallel arm resonance portion connected closest to the inductance element. An electrostatic capacitance of the first parallel arm resonance portion is larger than an electrostatic capacitance of any other parallel arm resonance portions.

Abstract: An acoustic wave filter includes at least one serial arm resonance circuit on a path connecting input/output terminals, and at least one parallel arm resonance circuit between a node on the path and a ground, in which each of the at least one serial arm resonance circuit and the at least one parallel arm resonance circuit includes an acoustic wave resonator, a first parallel arm resonance circuit of the at least one parallel arm resonance circuit includes a bridging capacitor connected in parallel to the acoustic wave resonator, an anti-resonant frequency of the first parallel arm resonance circuit is positioned on a higher-frequency side than the pass band, and a resonant frequency of a first serial arm resonance circuit of the at least one serial arm resonance circuit is positioned on a lower-frequency side than the anti-resonant frequency of the first parallel arm resonance circuit.

Abstract: An electronic component includes circuits that function independently of one another, and a switch electrically connected to the circuits. The electronic component includes a base body and two or more input/output terminals. The base body includes a main surface. The two or more input/output terminals are provided to the main surface of the base body, and include two first input/output terminals adjacent to each other. The switch changes one of the two first input/output terminals adjacent to each other to a hot terminal and changes the other to a ground terminal.

Abstract: Bulk acoustic wave resonators of two or more different filters can be on a common die. The two filters can be included in a multiplexer, such as a duplexer, or implemented as standalone filters. With bulk acoustic wave resonators of two or more filters on the same die, the filters can be implemented in less physical space compared to implementing the same filters of different die. Related methods, radio frequency systems, radio frequency modules, and wireless communication devices are also disclosed.

Abstract: A relay control apparatus according to an embodiment of the present disclosure includes: a relay disposed on a main path between a battery cell and a pack terminal and for electrically connecting or disconnecting the main path according to an operation state of the relay; and a comparator for receiving a comparison voltage from the main path and outputting a result signal to the relay based on a difference between a reference voltage and the comparison voltage, the relay is receives the result signal and controls the operation state of the relay to a turn-on state or a turn-off state according to the magnitude of the received result signal.

Abstract: An inverter logic circuit includes a bipolar junction transistor and a zener diode. The zener diode is connected between the base of the bipolar junction transistor and ground (or other reference voltage). The zener diode is reverse biased such that a leakage current through the zener diode allows for sufficient current through the emitter-base terminals of the bipolar junction transistor when a voltage is applied across the emitter and base terminals of the bipolar junction transistor to turn the transistor ON in the absence of an external signal to the base. As such the bipolar junction transistor functions as a normally ON bipolar junction transistor.

Abstract: An electronic component is switched under the control of a pulse-width modulation signal. The electronic component outputs an output signal that is controlled by a control signal. The switching on or off is initiated within a pulse-width modulation cycle period at a level change time by a change of the pulse-width modulation signal. The control signal is set within each PWM cycle period to a first control value between the level change time and a first switching time, to a second control value between the first switching time and a second switching time, and to a third control value from the second switching time until a final gate-voltage value is reached on the gate of the electronic component. Each switching time of a PWM period is determined in dependence on an amplitude value determined during a preceding PWM cycle period, to limit amplitudes of the oscillation of the output signal.

Abstract: A high-voltage semiconductor switch is provided. The high-voltage semiconductor switch comprises one or more switch subcircuits, wherein each switch subcircuit may comprise one or more FET circuits and voltage-shifting transistor. The high-voltage semiconductor switch may be configured based on operational and environmental requirements, such as those of a quantum computing system, wherein the high-voltage switch may be located in a cryostat or vacuum chamber.

Abstract: An apparatus includes a moveable electrode which moves along an interstitial pathway defined by four fixed electrodes. The first and second fixed electrodes are separated by a first distance. The third and fourth fixed electrodes are separated by a second distance and adjacent to the first and second fixed electrodes, respectively. A capacitance sensing circuit coupled to the four fixed electrodes determines a first capacitance using the first and second fixed electrodes and a second capacitance using the third and fourth fixed electrodes. In some examples, the apparatus also comprises fifth and sixth fixed electrodes separated by a third distance and orthogonal to the first and second fixed electrodes and seventh and eighth fixed electrodes separated by a fourth distance and orthogonal to the third and fourth fixed electrodes. The fifth and seventh fixed electrodes are adjacent, and the sixth and eighth fixed electrodes are adjacent.

Abstract: A clock generator includes a resistor-capacitor-based voltage-controlled oscillator (RC-based VCO) that generates an output signal with oscillation frequency controlled by an input voltage at an input node; and a temperature compensator that generates the input voltage to compensate change of the oscillation frequency associated with a change in temperature.

Abstract: Digital values obtained from an output of a preceding circuit element are temporarily stored and made available for a subsequent circuit element at a controlled moment of time. A digital value is received for temporary storage, as well as a triggering signal, a triggering edge of which defines an allowable time limit before which a digital value must appear at said data input to become available for said subsequent circuit element. A sequence of first and second pulse-enabled subregister stages is used to temporarily store said digital value. Said triggering signal is provided to said first pulse-enabled subregister stage delayed with respect to the triggering signal received by said second pulse-enabled subregister stage. The length of the delay is a fraction of a cycle of the triggering signal.

Abstract: A level shifter can achieve a level shift by a wide margin. The level shifter includes a latch circuit, a clamping circuit, a protection circuit, and an input circuit. The latch circuit is coupled between a high-voltage terminal and a pair of output terminals for outputting a pair of output signals. The clamping circuit is coupled between a medium-voltage terminal and the pair of output terminals and limits the minimum voltage of the pair of output signals to the medium voltage. The protection circuit is set between the latch circuit and the input circuit, and prevents an excessive voltage drop between the input circuit and the pair of output terminals. The input circuit includes an input transistor pair coupled between the protection circuit and a low-voltage terminal having a low voltage. The input transistor pair receives a pair of input signals and operates accordingly.

Abstract: A wobulated signal generator includes a chain of delay elements and control circuitry. The chain of delay elements includes first delay elements, second delay elements, and third delay elements. The control circuitry, in operation, enables a number of the first delay elements, disables a number of the third delay elements, and enables a selected number of the second delay elements, defining a period of time between two consecutive rising edges of a digital wobulated signal at an output of the wobulated signal generator. The control circuitry monitors an average frequency of the digitally wobulated signal, and selectively modifies the number of enabled first delay elements and the number of disabled third delay elements based on the monitored average frequency of the digitally wobulated signal.

Abstract: Methods and apparatuses are provided for temperature independent resistive-capacitive delay circuits of a semiconductor device. For example, delays associated with ZQ calibration or timing of the RAS chain may be implemented that to include circuitry that exhibits both proportional to absolute temperature (PTAT) characteristics and complementary to absolute temperature (CTAT) characteristics in order to control delay times across a range of operating temperatures. The RC delay circuits may include a first type of circuitry having impedance with PTAT characteristics that is coupled to an output node in parallel with a second type of circuitry having impedance with CTAT characteristics. The first type of circuitry may include a resistor and the second type of circuitry may include a transistor, in some embodiments.

Abstract: A device comprises a data terminal, a clock terminal and a digital circuitry. The data terminal is configured to be connected to a serial data line. The clock terminal is configured to be connected to a serial clock line for receiving a clock signal. The digital circuitry is coupled to the data terminal and to the clock terminal. The digital circuitry is configured to operate using a time base signal provided via a further clock terminal to the device or using an internal clock signal that is generated by an internal oscillator of the device. Furthermore, a method for operating a device is described.

Abstract: A device includes a phase-locked loop (PLL) having a reference input. The device has a storage element and a reference clock generator having an interface clock input, a reference clock output, and a programmable clock divider. The reference clock generator is coupled to the storage element. The reference clock output is coupled to the reference input. The reference clock generator is configured to change a divide ratio for the programmable clock divider based on a value in the storage element such that a frequency of the reference clock output remains unchanged when a frequency of the interface clock input changes.

Abstract: A non-linear charge pump for phased lock loops. Furthermore, an auxiliary charge pump apparatus, comprising a positive switch electrically connected to a current source configured to supplement power to a charge pump, a negative switch electrically connected to a current sink configured to discharge power from the charge pump, a windowing comparator, further comprising an input signal received from a phase-locked loop, a first comparator configured to compare the input signal against a high voltage threshold, a second comparator configured to compare the input signal against a low voltage threshold, an AND logic gate configured to provide a window signal and an activation circuit electrically connected to the positive switch and negative switch. Additionally, a non-linear charge pump system and method for reacquiring frequency lock of a phase lock loop.

Abstract: There is a need to maintain or enhance the magnetic field correction accuracy of a physics package while making the physics package more compact and portable. A triaxial magnetic field correction coil is provided inside a vacuum chamber surrounding a clock transition space having atoms disposed therein. The triaxial magnetic field correction coil is formed into a shape such that it is possible to correct, for magnetic field components of three axial directions passing through the clock transition space, a constant term, a first order spatial derivative term, a second order spatial derivative term, a third or higher order spatial derivative term, or some given combination of these terms. The triaxial magnetic field correction coil can be used in, for example, a physics package for an optical lattice clock.

Abstract: This description relates generally to piecewise temperature compensation. In an example, a circuit includes a knee code selector that can be configured to set a knee point temperature for a correction current responsive to a respective knee point temperature code of knee point temperature codes and a respective temperature sense signal of temperature sense signals. The circuit includes an output circuit that can be configured to provide the correction current responsive to the respective temperature sense signal and temperature voltages, and a trim digital to analog converter (DAC) that can be configured to provide a piecewise compensation current responsive to the correction current and a respective trim code of trim codes.

Abstract: Disclosed herein are related to systems and methods for a successive approximation analog to digital converter (SAR ADC). In one aspect, the SAR ADC includes a calibration circuit configured to receive some or all of the plurality of bits corresponding to the input voltage and accumulates or averages at least some of the bits corresponding to the input voltage. The calibration circuit is configured to provide a first offset signal to control a first offset associated with a first comparator, a second offset signal to control a second offset associated with a second comparator, or reduce an offset difference associated with the first offset and the second offset.

Abstract: Various embodiments provide a filter for propagation delay compensation and interpolation in encoder digital signal processing. The filter can include a first low pass filter configured to reduce noise of a digital input comprising a measured angular position; a first differentiator configured to receive a filtered digital input and to calculate a speed from a difference in time of the measured angular position and a previous angular position; a second low pass filter configured to reduce noise from the speed; a second differentiator configured to receive a filtered speed and to calculate acceleration using a difference in time of the filtered speed and a previous speed; a third low pass filter configured to reduce noise of the acceleration; and a delay compensator configured to receive the filtered digit input, the filtered speed, and a filtered acceleration, and to calculate a propagation delay compensated digital output.

Abstract: An analog switch circuit in a successive approximation register analog-to-digital converter for a wide sampling rate includes a first PMOS switch controlled by a voltage of a second control node, second PMOS switch controlled by a control voltage, a first control switch unit controlling voltages of first and second control nodes, a first NMOS switch controlled by a voltage of a fourth control node, a second NMOS switch controlled by the control voltage und, and a second control switch unit controlling voltages of third and fourth control nodes.

Abstract: A DAC, for use in an iADC, is configured for converting a multi-bit word to an analog feedback signal. The DAC comprises a MMS logic block. It further comprises a plurality of output elements configured to generate respective analog portions based on a selection vector and a signal combiner for combining the analog portions to the analog feedback signal. In the MMS logic block switching blocks are arranged cascaded. Each switching block receives at least a portion of the multi-bit word, splits the portion into two sub-portions and forwards them to one subsequent switching block or to one output element. A weight factor is adjusted by multiplying it with the difference of the two sub-portions. A weight accumulator accumulates successive adjusted weight factors, wherein the way of splitting the portion of a further multi-bit word is determined based on the sign of the weight accumulator.

Abstract: Provided is a DA converter for outputting an analog signal according to an input digital signal, including a plurality of current output units to be input with the digital signal, which output a current according to the digital signal to a corresponding wiring, a conversion unit provided with a plurality of feedback paths respectively coupled to wirings corresponding to the current output units, and which selects at least one wiring among the wirings corresponding to the current output units and output an analog signal according to a current flowing in the selected wiring, and a first noise reduction unit provided with a plurality of first switches each of which switches whether to electrically connect to at least one wiring among the wirings corresponding to the current output units, and reduces a noise component generated in at least one of the plurality of current output units from the electrically coupled wiring.

Abstract: Systems and methods are disclosed for implementing a low latency decoder. In certain embodiments, an apparatus may comprise decoder configured decode a codeword of bits, including: a variable node processor configured to provide a plurality of variable-to-check (v2c) message vectors to the edge combiner in parallel, the plurality of v2c message vectors including estimates for a selected set of bits of the codeword; the edge combiner configured to generate a plurality of output message vectors for a plurality of check node vectors based on the plurality of v2c message vectors, and provide the plurality of output message vectors to the plurality of check node vectors simultaneously; a check node processor configured to update the plurality of check node vectors based on the plurality of output message vectors; and a convergence checker circuit configured to detect a valid code word based on bit value estimates from the variable node processor.

Abstract: A low density parity check (LDPC) decoder initializing variable nodes with a value of a codeword and outputting the updated variable nodes as decoded messages with reference to an irregular parity check matrix. The LDPC decoder includes a plurality of unit logic circuits operating in a single mode in which all the unit logic circuits update one variable node group including at least one variable node, or a multi-mode in which each of the unit logic circuits updates a plurality of variable node groups in parallel by updating different variable nodes, and a mode controller controlling the plurality of unit logic circuits to update a high-degree variable node group having a degree greater than a threshold degree among the variable node groups in the single mode, and update a low-degree variable node group having a degree less than or equal to the threshold degree among the variable node groups in the multi-mode.