Abstract: Core-shell microparticles, along with methods of their fabrication and use, are provided. The core-shell microparticles may include a core comprising a first metallic material having a first chromium content and a shell surrounding the core and comprising a second metallic material having a second chromium content that is less than the first chromium content. For example, the first chromium content may be 5% by weight or greater of elemental chromium within the first metallic material.

Abstract: Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

Abstract: A laminated substrate that includes a substrate body having a plurality of laminated ceramic layers containing a first glass; a wiring conductor within the substrate body and made from silver, copper, a silver alloy, or a copper alloy; and a thermal conductor within or on a main surface of the substrate body. The thermal conductor is at least one of (1) a thermal via penetrating a part of a first ceramic layer of the plurality of laminated ceramic layers in a thickness direction thereof, and (2) a heat spreader extending along a main surface of the first ceramic layer of the plurality of laminated ceramic layers. A first thermal conductivity of the thermal conductor is higher than a second thermal conductivity of the first ceramic layer, and the thermal conductor contains an insulating ceramic as a main material thereof, and further contains a second glass.

Abstract: The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal, and a lead-tellurium-lithium-oxide dispersed in an organic medium.

Abstract: This invention relates to antimicrobial materials and articles, such as fibres, yarns, and their incorporation into textiles, packaging for food or beverages, or articles of clothing such as gloves. The antimicrobial fibres and yarns may be formed of a polymer and may comprise silver particles dispersed therein. The present invention contemplates a polymer batch precursor to the fibre of the invention and further products formed of the fibre or the polymer batch, for example textiles.

Abstract: A method for producing a metal-ceramic substrate with at least one electrically conductive via, in which one metal layer, respectively, is attached in a planar manner to a ceramic plate or a ceramic layer to each of two opposing surface sides of the ceramic layer is provided. The method includes introducing a metal-containing, powdery and/or liquid substance into a hole in the ceramic layer delimiting the via prior to the attachment of both metal layers, or subsequent to the attachment of one of the two metal layers to form an assembly. Prior to the attachment of the other one of the two metal layers, and the assembly is subjected to a high-temperature step above 500° C. in which the metal-containing substance wets the ceramic layer at least partially with a wetting angle of less than 90°.

Abstract: The invention relates to methods of depositing silver onto a substrate using a dilute silver salt solution.

Abstract: Attaching electronic components to a substrate can be challenging in certain applications. By utilizing printed conductive ink to fill vias, one or more conductive layers may be provided, which allow for fine pin pitches or other crowded substrates to utilize multiple layers for traces connecting the contact pad to the pins of an electronic component. By applying a substrate with conductive ink and then selectively applying a solderable ink on the conductive ink, and with conductive ink filling the vias, electronic components may be attached to a substrate that provides mechanical attachment and electrical connectivity which may also be formable or flexible.

Abstract: An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.

Abstract: A semiconductor package includes a die and a patterned conductive layer electrically connected to the die. The patterned conductive layer includes a connection pad and a trace. The semiconductor package further includes an encapsulation layer encapsulating the die and the patterned conductive layer. The semiconductor package further includes an electrical connection element disposed on the connection pad and a protection layer including a sidewall portion surrounding the electrical connection element.

Abstract: Methods of manufacturing a hermetically sealed wet electrolytic capacitor and a hermetically sealed wet electrolytic capacitor are described. A method of manufacturing a wet electrolytic capacitor includes forming a cathode of the capacitor by forming a case comprising a metal substrate, the metal substrate having an alloyed surface, depositing a smooth film comprising palladium and copper as a tacking layer on the alloyed surface of the metal substrate, and depositing a rough, high surface area layer on the tacking layer to achieve a high capacitance cathode. A first terminal is electrically connected to the cathode. An anode is formed. A second terminal is electrically connected to the anode. An electrolytic solution is disposed within the case, and the case is hermetically sealed.

Abstract: A thick film resistor excluding a toxic lead component from a conductive component and glass and having characteristics equivalent to or superior to conventional resistors in terms of, in a wide resistance range, resistance values, TCR characteristics, current noise characteristics, withstand voltage characteristics and the like. The thick film resistor is formed of a fired product of a resistive composition, wherein the thick film resistor contains ruthenium-based conductive particles containing ruthenium dioxide and a glass component essentially free of a lead component and has a resistance value in the range of 100 ?/? to 10 M?/? and a temperature coefficient of resistance within ±100 ppm/° C.

Abstract: The invention relates to compositions, methods and preparation of such compositions to protect metals from corrosion, especially acid corrosion. The compositions of this invention may be added to acids to protect metals from their corrosive influence, particularly at elevated temperatures. These compositions are of particular utility in the oil and gas (petroleum) industry. Also disclosed are “corrosion inhibition intensifiers” to enhance the corrosion inhibition properties of other corrosion inhibitors. Formulations which control ferric ions in acidic solutions are also disclosed. These may be combined with inhibited acids and some compositions provide both corrosion inhibition and ferric ion control.

Abstract: A method for treating a sulfur-containing fabric and sulfur-containing fabrics with excellent antimicrobial properties are disclosed. First an aluminum salt is added to a sulfur-containing fabric. That product is then rinsed. The rinsed product is combined with an antimicrobial. In one embodiment, the sulfur-containing fabric is combined with an aqueous solution of an oxidizing agent prior to the addition of the aluminum salt. Fabrics treated by the method retain excellent antimicrobial activity even after repeated washings.

Abstract: A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Abstract: An organic vehicle used in the manufacture of electroconductive silver paste. The organic vehicle comprises an organic binder, a surfactant, and an organic solvent. The preferred embodiment of the invention utilizes at least one of PVP, PMMA, or PVB as the organic binder, allowing for high compatibility with the metallic particles and resulting in an electroconductive paste with low viscosity for fine line printability. Another aspect of the invention relates to an electroconductive paste composition. The preferred embodiment utilizes metallic particles, glass frit, and an organic vehicle comprising a binder, namely at least one of PVP, PMMA, or PVB, a surfactant, and an organic solvent.

Abstract: A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

Abstract: The invention relates to compositions, methods and preparation of such compositions to protect metals from corrosion, especially acid corrosion. The compositions of this invention may be added to acids to protect metals from their corrosive influence, particularly at elevated temperatures. These compositions are of particular utility in the oil and gas (petroleum) industry. Also disclosed are “corrosion inhibition intensifiers” to enhance the corrosion inhibition properties of other corrosion inhibitors. Formulations which control ferric ions in acidic solutions are also disclosed. These may be combined with inhibited acids and some compositions provide both corrosion inhibition and ferric ion control.

Abstract: A sensor element, comprising first and second measuring paths, wherein the first measuring path extends via a first segment of a first material and the second measuring path at least partially extends via this first segment of the first material, wherein the second measuring path extends additionally via a second segment, which is composed of a second material different from the first material.

Abstract: A conductive paste for forming external electrodes for a multilayer ceramic electronic component. The paste contains a glass composition containing (a) BaO, (b) at least one of SrO and CaO, (c) ZnO, (d) B2O3, and (e) at least one selected from the group consisting of SiO2, Al2O3, and TiO2, in which the total content percentage of BaO, SrO, and CaO is 30 mol % or more, the molar ratio represented by B2O3/(SiO2+Al2O3+TiO2) is 0.7 to 1.5, and the content percentage of ZnO is 0 to 5 mol %.

Abstract: The invention provides an electroconductive paste comprising 50-90 wt. % of copper particle, 0.5-10 wt. % of a glass frit, 0.1-5% wt. % of adhesion promoter, which is at least one selected member from the group consisting of cuprous oxide, titanium oxide, zirconium oxide, boron resinate, zirconium resinate, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide, and zinc oxide, and 5-20 wt. % of an organic vehicle. An article comprising an aluminum nitride substrate and electroconductive paste of the invention is also provided. A method of forming an electroconductive circuit comprising is also provided.

Abstract: A method for applying a protective layer to protect against an impact stress includes mixing a sealing alloy in a powder form with a binder and water to form a pasty compound, applying the pasty compound on a surface to be protected, drying the applied pasty compound, and heating the dried applied pasty compound to a temperature of at least 800° C.

Abstract: The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

Abstract: A method of manufacturing electrodes for a flat heat generator is provided for creating electrodes in an arbitrary shape on an arbitrary site of an arbitrarily shaped flat heat generator, to allow a required portion to generate heat, and to allow a heat source to move. The method includes the steps of forming a negative film for ultraviolet exposure masking from a master which has a set of electrodes for the flat heat generator designed in an arbitrary shape and at an arbitrary site, forming a thin-film member including an uncured portion of epoxy film, by irradiating the thin-film member with ultraviolet rays through masking of the negative film, dissolving the uncured portion of epoxy resin with a developing solution to form the set of electrodes, and depositing a metal on the set of electrodes through an ionization reaction within an electrolytic solution bath to from an electrodes.

Abstract: An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 ?m or smaller, in terms of the width of the exposed substrate area, and having a height of 3 ?m or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 ?m or finer is formed therefrom.

Abstract: Described are methods for preparing copper(I) 5-nitrotetrazolate, which include reacting copper(II) sulfate pentahydrate, sodium nitrite, 5-aminotetrazole, and at least one of nitric acid and urea in water.

Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.

Abstract: Disclosed is a zirconium-based metal pretreatment coating composition that includes a metal chelator that chelates copper in the metal pretreatment coating composition and thereby improves adhesion of paints to a metal substrate coated with the pretreatment coating composition. The pretreatment coating composition has a longer pot life than one without the metal chelator and therefore can accommodate a wide latitude of application times. The chelating agent is present in a sufficient amount to ensure that in the deposited pretreatment coating on the metal substrate the average total atomic % of copper to atomic % of zirconium is equal to or less than 1.1. The pretreatment coating composition is useful for treating a variety of metal substrates.

Abstract: Embodiments of the present subject matter provide a compound and material that may be used as a lead-free primary explosive. An embodiment of the present subject matter provides the compound copper(I) nitrotetrazolate. Certain embodiments of the present subject matter provide methods for preparing lead-free primary explosives. The method includes: providing cuprous salt; providing water; providing 5-nitrotetrazolate salt; combining the cuprous salt, water and 5-nitrotetrazolate salt to form a mixture; and heating the mixture. The method may also include providing cuprous chloride and providing sodium 5-nitrotetrazolate. Certain embodiments of the present subject matter also provide methods for preparing copper(I) nitrotetrazolate. The method includes: providing cuprous salt; providing water; providing 5-nitrotetrazolate salt; combining the cuprous salt, water and 5-nitrotetrazolate salt to form a mixture; and heating the mixture.

Abstract: Described are compounds and materials that may be used as a lead-free primary explosive, such as copper(I) nitrotetrazolate. Copper(I) nitrotetrazolate may he prepared by a process comprising the steps of: combining cupric salt, water and 5-nitrotetrazolate salt to form a mixture, heating the mixture, adding a reducing agent and stirring with continued heating. The method may also include combining cupric chloride, sodium 5-nitrotetrazolate and sodium ascorbate.

Abstract: An object of the present invention is to provide a high-purity aqueous copper sulfonate solution and a simplified method of producing this solution. The aqueous copper sulfonate solution of the present invention is characterized in that the copper concentration therein is at least 90 g/L, the content of metal impurities is less than 10 mg/L as metal for each metal impurity, the content of chlorine is less than 10 mg/L, and the sulfonic acid is a sulfonic acid represented by the following general formula R—(SO3H)n (in the formula, R represents a lower alkyl group, lower alkylidene group, lower alkylene group, or hydroxyalkyl group and n represents 1 or 2).

Abstract: Embodiments of the present subject matter provide a compound and material that may be used as a lead-free primary explosive. An embodiment of the present subject matter provides the compound copper(I) nitrotetrazolate. Certain embodiments of the present subject matter provide methods for preparing lead-free primary explosives. The method includes: providing cuprous salt; providing water; providing 5-nitrotetrazolate salt; combining the cuprous salt, water and 5-nitrotetrazolate salt to form a mixture; and heating the mixture. The method may also include providing cuprous chloride and providing sodium 5-nitrotetrazolate. Certain embodiments of the present subject matter also provide methods for preparing copper(I) nitrotetrazolate. The method includes: providing cuprous salt; providing water; providing 5-nitrotetrazolate salt; combining the cuprous salt, water and 5-nitrotetrazolate salt to form a mixture; and heating the mixture.

Abstract: A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink in the form of liquid droplets on a surface of a ceramic molded body using a liquid droplet ejecting method, the ceramic molded body being made of a material containing ceramic particles and a binder. The ink contains a water-based dispersion medium, and metal particles dispersed in the water-based dispersion medium, wherein the water-based dispersion medium contains oxygen molecules and nitrogen molecules, and wherein when the water-based dispersion medium is analyzed using a gas chromatography method, a total amount of the oxygen and nitrogen molecules contained in the water-based dispersion medium is 12 ppm or less.

Abstract: A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method, includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; sugar alcohol derived from a disaccharide; and a polyglycerol compound having a polyglycerol skeleton. H shown in the following formula (I) is 0.10 to 0.80.

Abstract: This is to provide a conductive paste with higher electroconductivity containing, as raw materials: a metallic powder; a thermosetting resin; and a flux-activating compound having a carboxyl group and a phenolic hydroxyl group, which is applicable to the fine pitch-utilization.

Abstract: A method of coloring solder is provided. The method includes providing an aqueous coloring agent solution essentially containing 31-32% wt of copper sulfate, 64-65% wt of water and 3-4% wt of salt and an anti-caking agent, drying a solder seam with a dry cloth to remove excess flux, applying the aqueous coloring agent solution directly onto the solder seam; and wiping away excess amounts of the aqueous coloring agent solution with a second dry cloth.

Abstract: A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 ?m, and the glass powder is a Bi2O3—SiO2—B2O3 type glass powder, and the content of the glass powder is in a range of from 1 to 6 wt % based on the weight of the paste.

Abstract: A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; inositol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.050 to 0.

Abstract: A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; galactitol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.10 to 0.

Abstract: To provide an ink composition capable of forming a metallic material which is excellent in adhesion to a substrate and free from ion migration. An ink composition having fine metallic copper particles and/or fine copper hydride particles, and fine silver oxide particles or fine metallic silver particles, dispersed in a water-insoluble organic liquid, which composition has a solid content concentration of from 10 to 80 mass % and contains from 5 to 90 parts by mass of the fine metallic copper particles and/or fine copper hydride particles, and from 10 to 95 parts by mass of the fine silver oxide particles or fine metallic silver particles, per 100 parts by mass of the total solid content in the ink composition.

Abstract: Embodiments of the present subject matter provide a compound and material that may be used as a lead-free primary explosive. An embodiment of the present subject matter provides the compound copper(I) nitrotetrazolate. Certain embodiments of the present subject matter provide methods for preparing lead-free primary explosives. The method includes: providing cuprous salt; providing water; providing 5-nitrotetrazolate salt; combining the cuprous salt, water and 5-nitrotetrazolate salt to form a mixture; and heating the mixture. The method may also include providing cuprous chloride and providing sodium 5-nitrotetrazolate. Certain embodiments of the present subject matter also provide methods for preparing copper(I) nitrotetrazolate. The method includes: providing cuprous salt; providing water; providing 5-nitrotetrazolate salt; combining the cuprous salt, water and 5-nitrotetrazolate salt to form a mixture; and heating the mixture.

Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.

Abstract: A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: wherein M represents a metal ion. The metallic-organic self-decomposition molecules and the metal grains are evenly mixed in the solvent, and the metallic-organic self-decomposition molecules are adsorbed on surfaces of the metal grains.

Abstract: The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.

Abstract: To provide an ink composition capable of forming a metallic material which is excellent in adhesion to a substrate and free from ion migration. An ink composition having fine metallic copper particles and/or fine copper hydride particles, and fine silver oxide particles or fine metallic silver particles, dispersed in a water-insoluble organic liquid, which composition has a solid content concentration of from 10 to 80 mass % and contains from 5 to 90 parts by mass of the fine metallic copper particles and/or fine copper hydride particles, and from 10 to 95 parts by mass of the fine silver oxide particles or fine metallic silver particles, per 100 parts by mass of the total solid content in the ink composition.

Abstract: The various embodiments of the present invention generally relate to the deposition of a seedlayer for a magnetic recording medium used for perpendicular magnetic recording (PMR) applications, where the seedlayer provides for grain size refinement and reduced lattice mis-fit for a subsequently deposited underlayer or granular magnetic layer, and where the seedlayer is deposited using a nickel (Ni) alloy based sputter target. The nickel (Ni) alloy can be binary (Ni—X; Ni—Y) or ternary (Ni—X—Y). In addition, the binary (Ni—X; Ni—Y) or ternary (Ni—X—Y) nickel (Ni) based alloys can be further alloyed with metal oxides, thus forming seedlayer thin films with a granular microstructure containing metallic grains, surrounded by an oxygen rich grain boundary. The nickel-based alloys (with or without metal oxides) of the various exemplary embodiments can be made by powder metallurgical technique or by melt-casting techniques, with or without thermo-mechanical working.

Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

Abstract: A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.

Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.

Abstract: An organometallic precursor mixture for forming a metal alloy pattern and a method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corrosion can be readily formed using the organometallic precursor mixture by and exposing step without using a separate photosensitive resin.