Abstract: The invention relates to a method for providing a metallic surface with a coating by applying one or more layers of one or more metal-containing slips to the surface. At least one of the slips comprises a coloring and/or color-imparting substance which has no influence on the properties of the completed coating and/or can be decomposed by thermal treatment, and the local thickness of the applied slip layer is determined on the basis of the local color intensity of the layer.

Abstract: A lightweight modified filter material, a preparation method therefor and use thereof, the lightweight modified filter material being prepared from the following components in parts by mass: 75-100 parts of waste glass, 5-20 parts of a metal oxide modifier and 1-10 parts of a foamer. The lightweight modified filter material has the advantages of being lightweight, having large specific surface area, a high isoelectric point, porosity and the like, increasing the isoelectric point and service life of the filter material. The added metal oxide can be combined with SiO2 in the glass to form Si—O-Me (Me metal ions) and enter the glass network.

Abstract: Disclosed herein are ink compositions for making a conductive copper structure. The ink composition comprise a copper metal precursor compound, a chelating agent, and a reducing agent. In some embodiments, the redox potential of the reducing agent is adjusted for controlled reduction of copper ion in the copper metal precursor to metal copper metal. Also disclosed herein are methods for making the ink compositions and methods for using the same.

Abstract: An agent in the form of potassium hydroxide (KOH) in a pharmaceutically acceptable composition is used in the dermal treatment of actinic keratosis. The composition may be an aqueous alkaline solution of potassium hydroxide and topically applied to the skin or on the scalp, within the face, the neck, the nose, as well as on the bosom.

Abstract: There is provision of a member used in a plasma processing apparatus configured to generate plasma from a gas in a processing vessel and to process a substrate disposed on a mounting base in the processing vessel using the plasma. The member includes a surface exposed to the plasma in the processing vessel in a state installed in the processing vessel, and a coating layer including cobalt which covers a part of the surface.

Abstract: Included are drilling fluids for drilling in a subterranean formation. A drilling fluid may include: an aqueous base fluid and a betaine shale stabilizer comprising glycine betaine HCl.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing a specific ammonium salt is provided.

Abstract: Cobalt-based alloy compositions are described herein having properties compatible with thermal spray and sintering techniques. Such alloy compositions can provide claddings to a variety of metallic substrates having complex geometries, wherein the claddings exhibit desirable density, hardness, wear resistance and corrosion resistance. Briefly, an alloy composition described herein comprises 15-25 wt. % chromium, 15-20 wt. % molybdenum, 0-15 wt. % tungsten, 10-20 wt. % nickel, 2.5-3.5 wt. % boron, 2.5-4.5 wt. % silicon, 1-2 wt. % carbon and the balance cobalt, wherein a ratio of boron to silicon (B/Si) in the alloy composition ranges from 0.5 to 1.0.

Abstract: Electrically-conductive silver metal can be provided in a thin film or pattern on a substrate from a silver complex having reducing silver ions and represented by: wherein L represents an ?-oxy carboxylate; P represents a primary alkylamine compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. The silver complex is mixed in a hydroxy-free, nitrile-containing aprotic solvent with a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. The reducible silver ions in the a thermally sensitive thin film or pattern can be thermally converted to electrically-conductive metallic silver under suitable heating conditions to provide a product article that can be used in various devices.

Abstract: Embodiments herein relate to methods, apparatus, and systems for electroplating metal into recessed features using a superconformal fill mechanism that provides relatively faster plating within a feature and relatively slower plating in the field region. Moreover, within the feature, plating occurs faster toward the bottom of the feature compared to the top of the feature. The result is that the feature is filled with metal from the bottom upwards, resulting in a high quality fill without the formation of seams or voids, defects that are likely where a conformal fill mechanism is used. The superconformal fill mechanism relies on the presence of a sacrificial oxidant molecule that is used to develop a differential current efficiency within the feature compared to the field region. Various plating conditions are balanced against one another to ensure that the feature fills from the bottom upwards. No organic plating additives are necessary, though plating additives can be used to improve the process.

Abstract: Proposed is a method for polishing a semiconductor substrate including an intermediate polishing step of polishing in such a way that the number of surface defects having heights of less than 3 nm is 45% or more of the total number of the surface defects on the surface of a semiconductor substrate, and a final polishing step of finish-polishing the semiconductor substrate after the intermediate polishing step.

Abstract: The present invention is directed to an electrode for energy storage devices and a method for making the electrode for energy storage devices is disclosed, where a flexible binder in the electrode formulation is activated by certain additives and is uniformly deposited on to the active and conductive particles by high speed mixing. The particles deposited with activated binder particles are then pressed together to form free standing electrode film. High performance and cost effective products, such as free standing electrode films, laminated electrodes, ultracapacitors, lithium ion capacitors, batteries, fuel cells and hybrid cells which are the combination of the above devices, and the energy storage system or the system blocks, such as modules, can be manufactured using this process.

Abstract: The present invention relates to an activation composition for activation of silicon substrates, which is an aqueous solution comprising a source of palladium ions, a source of fluoride ions and at least two aromatic acids. The present invention further relates to a method for its use and optionally for subsequent metallization of such treated substrates. The method can be employed in semiconductor and solar cell manufacturing.

Abstract: The pretreatment solution for electroless plating of the present invention is composed of noble metal colloidal nanoparticles, a sugar alcohol, and water. The colloidal nanoparticles are gold, platinum, or palladium, have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass. The sugar alcohol is at least one selected from the group consisting of tritol, tetritol, pentitol, hexitol, heptitol, octitol, inositol, quercitol, or pentaerythritol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total. The electroless plating method of the present invention uses the pretreatment solution and performs the electroless plating in an electroless plating bath.

Abstract: An aqueous composition for forming a chemical conversion layer on a metal surface, wherein the composition contains at least one active component for the formation of the chemical conversion layer, as well as at least one thickener, and has a viscosity in the range between 10 mPa*s and 10000 mPa*s.

Abstract: A non-hydroxylic-solvent soluble silver complex comprises a reducible silver ion complexed with an ?-oxy carboxylate and an oxime compound. The non-hydroxylic-solvent soluble silver complex can be represented by the following formula (I): (Ag+)a(L)b(P)c?? (I) wherein L represents the ?-oxy carboxylate; P represents the oxime compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. Such complexes can be incorporated into photosensitive compositions in method to provide thin films or patterns in various articles to provide electrically-conductive silver metal.

Abstract: The present invention relates to an ink composition and a writing instrument. The ink composition comprises 10 to 70 wt % of a metallic pigment, 10 to 30 wt % of a resin, 0 to 20 wt % of a colorant, 0 to 20 wt % of an auxiliary agent and a solvent as the remainder; the solvent is a main solvent or a mixture of the main solvent and an auxiliary solvent; the resin includes a film-forming resin and a thickening resin; the present invention uses a low-level monohydric alcohol solvent as the main solvent, a polyvinyl acetal resin as the film-forming resin, and further includes the auxiliary agent, the metallic pigment or the colorants, so the ink composition with such good characteristics as being environmental friendly, drying quickly, being written smoothly and having strong compatibility to general writing surfaces is produced.

Abstract: A method for forming an ink jet image on a substrate includes ink jetting an ink jettable and UV-curable composition onto the substrate in an imagewise fashion to form an ink jetted image on the substrate. The ink jettable and UV-curable composition includes: a reactive polymer comprising: (a1) or (a2) recurring units comprising pendant metal complexing water-solubilizing groups, (b) at least 5 mol % of recurring units having a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, or lactam group, or a pendant precursor moiety for the pendant amide, hydroxyl, or lactam group. The ink jetted image is cured to form a UV-cured ink jet image on the substrate. The ink jettable and UV-curable composition can also include metal nanoparticles or reducible metal ions that can serve as catalytic sites for electroless plating.

Abstract: A power electronics module including an insulated patterned metal substrate, a semiconductor bonded to the substrate, and an agglomeration of solid metal particles mechanically bound to each other and the substrate and arranged to form electrical interconnects between the semiconductor and a bus bar, a control board, a sensor, or a combination thereof.

Abstract: A panel includes a display window and a supporting body integrated with the display window. The display window is made of sapphire and the supporting body is made of ceramic materials. The supporting body is integrally formed with the supporting body by sintering process. A method for manufacturing the panel is also provided.

Abstract: The present invention provides blue colored aqueous dispersion of silver nanoparticles and process for preparation thereof. The present invention also provides compositions comprising blue colored dispersion of silver nanoparticles. The blue colored aqueous dispersion comprising silver nanoparticles wherein dispersion is characterized by —having plasmonic peaks in the range 330-335 nm and 650-720 nm combined with missing plasmonic peaks in the range 390 to 410 nm and 410-500 nm in UV-Vis spectrum, —the dispersion having silver nanoparticles of anisotropic shape with majority of particles (>65%) having equivalent diameter in range of 0.5 to 6 nm, —Molar extinction coefficient greater than 10.1 preferably in the range of 10.1 to 15.7 mM?1 cm?1 at wavelength of maximum absorption in the range of 650-720 nm, —Dispersion stability of at least 15 months, —Minimum Bactericidal Concentration (MBC) lower than 0.10 ppm preferably in the range of 0.055-0.099 ppm.

Abstract: An ink includes a palladium salt, an organic amine that forms a palladium complex from the palladium salt, and, at least one solvent, the solvent has a boiling point at about the decomposition temperature of the palladium complex.

Abstract: A process for depositing a metal includes disposing an activating catalyst on a substrate; contacting the activating catalyst with a metal cation from a vapor deposition composition; contacting the substrate with a reducing anion from the vapor deposition composition; performing an oxidation-reduction reaction between the metal cation and the reducing anion in a presence of the activating catalyst; and forming a metal from the metal cation to deposit the metal on the substrate.

Abstract: Methods of treating of stannous oxide particles having at least a partial surface crust of stannic oxide by contacting the particles with a reducing agent for a period of time sufficient to produce stannous oxide are provided. The stannous oxide particles produced are readily soluble in organic sulfonic acids.

Abstract: One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and has at least one functional group capable of forming a chemical bond with the metal. Another aspect of the present invention is an electronic device. A third aspect of the present invention is a solution comprising the anchor compound.

Abstract: A Group 3a ink, comprising, as initial components: a polyamine solvent; a Group 3a material/organic complex; and, a reducing agent; wherein the molar concentration of the reducing agent exceeds the molar concentration of the Group 3a material/organic complex; wherein the Group 3a ink is a stable dispersion and wherein the Group 3a ink is hydrazine and hydrazinium free. Also provided are methods of preparing the Group 3a ink and of using the Group 3a ink to deposit a Group 3a material on a substrate for use in a variety of semiconductor applications, such as metallization of silicon devices in VLSI technology, the growth of semiconducting III-V alloys, thin film transistors (TFTs), light emitting diodes (LEDs); and infrared detectors.

Abstract: The present disclosure is related to a cladding composition. The cladding composition may include cladding powder particles and flux particles. The flux particles may have an average particle size of less than about 40 ?m, and more than about 50% of the flux particles may adhere to the surfaces of the cladding powder particles.

Abstract: Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006×10?3 mol/L to 12.5×10?3 mol/L are contained.

Abstract: A current collector is covered with sodium metal through: (1) applying a sodium dispersion containing sodium metal and at least one substance selected from the group consisting of an imide salt and a binder, on a current collector in an inert gas environment (with an oxygen concentration of not more than 0.01% and a dew point of not more than ?10° C.), followed by heating and drying; (2) pressure bonding a piece of solid sodium metal having a surface which exhibits a metallic luster onto a current collector in the aforementioned inert gas environment; (3) vapor-depositing sodium metal on a current collector in a reduced pressure environment; or (4) immersing a current collector having a surface fired at a temperature ranging from 150 to 300° C. in molten sodium metal after removing a coating film which is generated on a surface and formed from impurities, in the aforementioned inert gas environment.

Abstract: An electroless silver plating ink useful in a one step process for coating an article substrate with a bright metallic silver plate, wherein the silvering ink comprises a silver diammine ion, [Ag(NH.sub.3).sub.2].sup.+, in dimethyl sulfoxide.

Abstract: The present disclosure is directed to a process for producing a low gloss metallic color coating composition having a target gloss value. The low gloss metallic color coating composition can be produced from a high gloss metallic color coating composition with the addition of a matting agent. The disclosure is also directed to a coating system using the process. This disclosure is also directed to a method for matching color, flake appearance, and gloss of a coating. The processes, methods and systems of this disclosure are particularly useful for producing a low gloss metallic color coating composition having a target gloss value when the high gloss metallic color coating composition comprises both metallic effect pigments and color pigments.

Abstract: Disclosed are coating compositions, such as primer compositions, suitable for providing corrosion protection to metal substrates, as well as related coated articles and methods.

Abstract: Disclosed is a metal pattern composition including a conductive metal or a conductive metal precursor compound, and a carboxylic acid-amine base ion pair salt.

Abstract: A method of supplying a Zn—Al alloy to a molten zinc pot which accommodates a molten zinc bath in a hot dip galvanizing line, includes: supplying the Zn—Al alloy from a supply portion provided at a lower portion of an insertion guide having a pipe shape, in which the supply portion is immersed between an inner wall of the molten zinc pot on a downstream side in a travelling direction of a steel sheet and a front support roll installed in the molten zinc bath at a depth within ±400 mm from a lower end of the front support roll, and an inside of the insertion guide is pressurized by inert gas to prevent the molten zinc bath from advancing to the inside of the insertion guide.

Abstract: Disclosed is a metal pattern composition including a conductive metal or a conductive metal precursor compound, and a carboxylic acid-amine base ion pair salt.

Abstract: A metal-coated material comprising a metal-coated lipid bilayer vesicle and a preparation method thereof are provided. A metal-coated material comprising a metal-coated lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si) on its surface. a method for preparing the metal-coated lipid bilayer vesicle comprising the following steps: (1) rendering the functional group(s) having the ability of carrying the metal catalyst to the surface of lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si bonding) on its surface, at or after the formation, by self-organization, of the lipid bilayer vesicle; (2) immobilizing the metal catalyst on the surface of the lipid bilayer vesicle; (3) optionally, reducing the metal catalyst; and (4) performing electroless plating.

Abstract: A method for depositing gallium using a gallium ink, comprising, as initial components: a gallium component comprising gallium; a stabilizing component; an additive; and, a liquid carrier; is provided comprising applying the gallium ink on the substrate; heating the applied gallium ink to eliminate the additive and the liquid carrier, depositing gallium on the substrate; and, optionally, annealing the deposited gallium.

Abstract: Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.

Abstract: The present invention relates to a silver ink composition comprising: silver complexes obtained by reacting one or more silver compounds selected from chemical formula 1 with one or more ammonium carbamate-based compounds or ammonium carbonate-based compounds selected from chemical formula 2 to chemical formula 4; and oxime-based compounds.

Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.

Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.

Abstract: An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.

Abstract: A palladium precursor composition contains a palladium salt and an organoamine. The composition permits the use of solution processing methods to form palladium layers.

Abstract: A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.

Abstract: A method for preparing a Group 1a-1b-3a-6a material using a selenium/Group 1b ink comprising, as initial components: a selenium component comprising selenium, an organic chalcogenide component having a formula selected from RZ—Z?R? and R2—SH, a Group 1b component and a liquid carrier; wherein Z and Z? are each independently selected from sulfur, selenium and tellurium; wherein R is selected from H, C1-20 alkyl group, a C6-20 aryl group, a C1-20 alkylhydroxy group, an arylether group and an alkylether group; wherein R? and R2 are selected from a C1-20 alkyl group, a C6-20 aryl group, a C1-20 alkylhydroxy group, an arylether group and an alkylether group; and wherein the selenium/Group 1b ink is a stable dispersion.

Abstract: Methods of treating of stannous oxide particles having at least a partial surface crust of stannic oxide by contacting the particles with a reducing agent for a period of time sufficient to produce stannous oxide are provided. The stannous oxide particles produced are readily soluble in organic sulfonic acids.

Abstract: Disclosed are methods for treating metal substrates that include contacting the metal with pretreatment compositions comprising: (a) a group IIIB metal, a group IVB metal and/or a group VB metal; and (b) a rheology modifier composition.

Abstract: Classes of liquid aminosilanes have been found which allow for the production of silicon carbo-nitride films of the general formula SixCyNz. These aminosilanes, in contrast, to some of the precursors employed heretofore, are liquid at room temperature and pressure allowing for convenient handling. In addition, the invention relates to a process for producing such films. The classes of compounds are generally represented by the formulas: and mixtures thereof, wherein R and R1 in the formulas represent aliphatic groups typically having from 2 to about 10 carbon atoms, e.g., alkyl, cycloalkyl with R and R1 in formula A also being combinable into a cyclic group, and R2 representing a single bond, (CH2)n, a ring, or SiH2.

Abstract: A gallium ink is provided, comprising, as initial components: a gallium component comprising gallium; a stabilizing component; an additive; and, a liquid carrier; wherein the gallium ink is a stable dispersion. Also provided are methods of preparing the gallium ink and for using the gallium ink in the preparation of semiconductor films (e.g., in the deposition of a CIGS layer for use in photovoltaic devices).

Abstract: The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below: