Abstract: A water retention agent for a cementitious composition, characterized in that it takes the form of a liquid aqueous suspension of at least one polysaccharide at a mass concentration of between 15 and 30% in an aqueous solution of a strong base salt, excluding ammonium salts, with an anionic strength of between 1.25 mol/L and 15 mol/L, having a pH greater than 9 and containing an attapulgite in micronized form and at least one non-phyllitic mineral powder, referred to hereafter as filler, which is chemically inert in the aqueous suspension and which has a grain size of between 0.1 and 100 micrometers, the aqueous suspension being stable at least in a temperature range of between 5° C. and 30° C. The water retention agent is suitable for increasing both the viscosity and the water retention capacity of cementitious compositions without affecting the spreading ability thereof.

Abstract: Catalytic partial oxidation using a metal oxide catalyst surface treats crumb rubber that is recovered from waste rubber tires. Advantages of using catalytically oxidized crumb rubber relative to using non-catalytically oxidized crumb rubber in making the rubberized concrete, includes superior mechanical strength and water-repealing capability, lower oxidation temperature and shorter oxidation time, and accelerated hydration times. Rubber oil (a gas condensate) co-produced from the crumb rubber partial oxidation process is equal to or better than the commercial superplasticizers. Industrial scale partial oxidation employs a continuous flow tubular reactor where a crumb rubber/catalyst mixture is fed into the reactor co-currently with an air/nitrogen mixture.

Abstract: Disclosed is a method for polishing a silicon wafer, wherein a surface to be polished of a silicon wafer is rough polished, while supplying a polishing liquid, which is obtained by adding a water-soluble polymer to an aqueous alkaline solution that contains no free abrasive grains, to a polishing cloth. Consequently, the surface to be polished can be polished at high polishing rate and the flatness of the edge portion including roll-off and roll-up can be controlled.

Abstract: Disclosed herein is a composition comprising a formula emulsion wherein the formula emulsion comprises a cationic or amphoteric surfactant, a wax emulsion, a thickener, and at least two silicone oils having different viscosities, wherein the composition is free of abrasives and organic solvents. The weighted average viscosity of the silicone oils is 2200 to 2400 centistokes (cSt).

Abstract: The present invention relates to novel nanoparticles based on cellulose and a process for producing them and their use.

Abstract: A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the materials selectivity in the CMP process and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper.

Abstract: A method and apparatus for making and applying an organic wax for protecting surfaces. The method includes steps for creating the invention as well as using the invention. Application of the invention to the surface includes applying the wax to the hands allowing the wax to melt before applying the wax to the surface. The wax is applied in a horizontal motion and then leveled with a foam and or cotton cloth. The wax is then allowed to dry and after 15 minutes the coated surface is buffed with a clean cloth to a lustrous shine. After a curing period the treated surface is wiped with a clean cloth.

Abstract: A water-based, non-oily, scented, liquid composition, with an ultraviolet filter, to be applied manually by brush or sponge, or by using an air gun, to surfaces of a synthetic nature. When impregnated, such surfaces recover their shine to an extent according to the number of layers applied, and are renewed in appearance.

Abstract: Polish compositions for coating pharmaceutical solid dosage forms such as tablets are disclosed. The polish composition comprises water, coating agent, and a film forming agent. Polished pharmaceutical solid dosage forms such as tablets comprising a polished exterior surface are also disclosed. Processes of polishing pharmaceutical solid dosage forms such as tablets are disclosed.

Abstract: A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition preferably further contains an alkali compound, a water-soluble polymer, or a chelating agent. The polishing composition is suitable for use in polishing an edge of an object such as a semiconductor substrate.

Abstract: Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of ammonia; 0.2˜1 weight % of a hydroxyalkycellulose-based polymer for modifying rheology of the composition; 0.03˜0.5 weight % of a polyoxyethylenealkylamine ether-based nonionic surfactant; 0.01˜1 weight % of a quaternary ammonium base and the balance of deionized water.

Abstract: A coating film forming liquid containing a saccharide, and titanium oxide fine particles having peroxy groups or titanium oxide fine particles not having peroxy groups is applied onto a surface of a substrate such as glass, metal or a tile, and then heating is carried out at a high temperature, thus forming on the substrate a super-hydrophilic photocatalytic coating film that contains titanium oxide fine particles and has a water contact angle in a state in which the photocatalyst is not excited of less than 10°.

Abstract: The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by weight copolymer of acrylic acid and methacrylic acid, and balance water, wherein the copolymer of acrylic acid and methacrylic acid has a monomer ratio (acrylic acid/methacrylic acid) in the range of 1:30 to 30:1 and the copolymer has a molecular weight in the range of 1K to 1000K.

Abstract: The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.

Abstract: The present invention provides an aqueous slurry composition that comprises cerium oxide and/or cerium oxide-containing mixed rare earth oxide abrasive particles, a polyacrylate, and an agent that retards hard settling. The agent that retards hard settling is preferably a polysaccharide such as xanthan gum, microcrystalline cellulose and/or sodium alginate, the latter of which may be treated with a divalent metal salt such as calcium carbonate. The slurry composition according to the invention can be used to polish glass and glass ceramics at a high removal rate, but does not hard settle upon extended static conditions and can be easily resuspended. The present invention also provides a method of polishing a glass or glass ceramic substrate using the slurry composition.

Abstract: A polishing composition for reducing the haze level of the surface of silicon wafers contains hydroxyethyl cellulose, polyethylene oxide, an alkaline compound, water, and silicon dioxide.

Abstract: The present invention relates to a polishing composition more suitable for use in polishing synthetic resin products or metal products. The polishing composition includes a reaction product produced by a reaction between a polyalkylene oxide and a compound having a functional group having reactivity with a hydroxyl group, aluminum oxide, a polishing accelerator including at least one salt selected from the group consisting of a metal salt of an inorganic acid or organic acid and an ammonium salt of an inorganic acid or organic acid, and water.

Abstract: The present invention relates to a polishing composition that can be preferably used to polish a silicon wafer. The polishing composition includes a block polyether represented by the chemical formula HO—(EO)a—(PO)b—(EO)c—H, wherein EO represents an oxyethylene group, PO represents an oxypropylene group, each of a and c represents the polymerization degree of ethylene oxide, b represents the polymerization degree of propylene oxide, and each of a, b, and c is an integer of 1 or greater; silicon dioxide; a basic compound; at least either one of hydroxyethyl cellulose and polyvinyl alcohol; and water.

Abstract: A polishing composition of the present invention, which is used in polishing the edge of a wafer for semiconductor devices, effectively suppresses remaining amounts of abrasives on the wafer. The polishing composition includes silicon dioxide, an alkaline compound, a water-soluble polymer, and water. The average primary particle diameter DSA of the silicon dioxide is at least 40 nm. The ratio D95/D5 of the silicon dioxide is no more than 3.8. The value D95/D5/DSA of the silicon dioxide is no more than 0.07.

Abstract: A polishing material is provided in which the dispersibility of the abrasive grains of the polishing material having, as a major component, rare earth oxides including cerium oxide is made better and the hardness of abrasive grain precipitates is reduced, and at the same time high efficiency of polishing can be achieved stably. According to the present invention, in a polishing material having, as the major component, rare earth oxides including cerium oxide, any one of crystalline cellulose, calcium secondary phosphate, a condensate of sodium &bgr;-naphthalenesulphonate and formalin, and synthetic silica is contained as an anti-solidification agent capable of softening abrasive grain precipitates of the polishing material when the abrasive grains of the polishing material are dispersed into a dispersion medium, and sodium hexametaphosphate or pyrophosphate is contained as a dispersant capable of dispersing the abrasive grains of the polishing material into the dispersion medium.

Abstract: A wax or polish also known as a surface protectant where ones primary reason for applying it is to impart a long lasting and specific scent or fragrance to a surface, such as that of an automobile, or any other surface of choice. As a secondary consideration the product will also offer surface protection from the elements.

Abstract: A composition for application to a substrate to form a an electrically conductive coating thereon. The composition includes a sol-gel solution filled with a conductive powder. The coating may be conductive or resistive depending on the application. A process is provided for applying such a coating by mixing a sol-gel solution with up to about 90% by weight of the solution of a conductive powder selected from the group consisting of ceramics, inter-ceramics, semi-conductors and metals so as to provide a uniform stable dispersion. The stable dispersion is applied to a substrate and the coated substrate is fired at a temperature sufficient to remove organic constituents and to produce at least a partially conductive film on the substrate. A heating device is also provided which is a product of the above process.

Abstract: To provide a polishing composition which enables maintenance of excellent properties and high quality of the surface of a hard disk without lowering polishing rate during polishing of the surface, and which can provide a polished surface in which the amount of dub-off is considerably reduced as compared with that of a conventional level, a polishing composition containing water, a polishing material (particularly alumina), a polishing accelerator, and at least one of hydroxypropyl cellulose and hydroxyalkyl alkyl cellulose is provided.

Abstract: A polishing compound containing cocoon-shaped silica particles and crystal silica particles, and water-soluble polymers including; at least one type selected from the groups including ammonium nitrate and ammonium acetate, and at least one type selected from methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, and the group including carboxymethylcellulose.

Abstract: This invention provides a chemical mechanical polishing slurry for polishing a metal film formed on an insulating film with a concave on a substrate wherein the slurry contains a thickener without an ionic group with an opposite sign to a charge on a polishing material surface to 0.001 wt % or more and less than 0.05 wt % to the total amount of the slurry and has a slurry viscosity of 1 mPa·s to 5 mPa·s both inclusive. The polishing slurry may be used in CMP to form a reliable damascene electric connection with excellent electric properties at a higher polishing rate, i.e., a higher throughput while preventing dishing or erosion.

Abstract: There is provided a polishing compound for sheet metal coating comprising an polishing material and a surfactant in which a RB ceramics and/or CRB ceramics powder is used at least as a part of the polishing material, thereby shortening a stain removing process of a coated surface in reparative sheet metal coating work of cars, etc. without conducting a washing process thereafter.

Abstract: The object is to provide a water/oil repellent composition which can simultaneously perform a water/oil treatment and a polishing treatment to leather products such as leather shoes, etc., by using one water/oil repellent composition, and can also exert excellent water/oil repellent effect and excellent polishing effect. It is constituted so that microcapsules, in which a polishing agent is encapsulated, are dispersed in a water/oil repellent agent.

Abstract: To provide a polishing composition which enables maintenance of excellent properties and high quality of the surface of a hard disk without lowering polishing rate during polishing of the surface, and which can provide a polished surface in which the amount of dub-off is considerably reduced as compared with that of a conventional level, a polishing composition containing water, a polishing material (particularly alumina), a polishing accelerator, and at least one of hydroxypropyl cellulose and hydroxyalkyl alkyl cellulose is provided.

Abstract: The invention provides a mixture for polishing surfaces. The mixture includes polishing particles having an average size of less than 10 .mu.m and water. It also includes an accelerator for chemically attacking a surface and a starch for reducing vibration of polishing machines.

Abstract: A composition for removing a substance from a surface is prepared by: forming a gelatinous base material comprising water and a rheology agent; forming a solvent; forming a neutralizing agent; combining the gelatinous base material and the solvent with microscopic crystalline particles and an agent which reduces the effective rubbing coefficient of the microscopic crystalline particles to form a non-neutralized composition; and combining the non-neutralized composition with the neutralizing agent to form the composition. Foreign substances can be removed from a finished surface and the visibility of superficial scratches in the finished surface can be reduced by gently rubbing the composition on the finished surface and then removing the composition. The composition includes microscopic (approximately 1 micron) crystalline particles which contact, dislodge and remove the foreign substance or minute portions of the finish.

Abstract: A stable and non-separable composition comprised of starch and a water-immiscible material can be prepared in the absence of external emulsifying or dispersing agents by thoroughly solubilizing an aqueous dispersion of the starch at elevated temperatures and incorporating the water-immiscible material into the non-retrograded starch under conditions of high turbulence. The resulting dispersions form soft gels that can be easily converted to pourable fluids by the application of heat. Upon drying, these dispersions yield solid compositions that are easily redispersed in water to form smooth, stable dispersions. These compositions are useful as thickening agents, suspending agents, waterproof coating materials, adhesives, fat substitutes, and seed coatings. They are receptive to the addition of a variety of other water-immiscible materials, such as volatile and essential oils, food flavorants, medicinals, waxes, agricultural chemicals, and the like.

Abstract: In the new process, cleaning and care preparations for floors, shoes, leather and furniture are produced by mixing a wax emulsion containing alkyl glycoside as emulsifier with the other constituents of the preparation. The alkyl glycosides correspond to the following general formulaR--O(--G).sub.n Iin which R is a long-chain C.sub.8-22 alkyl radical, G is a glycoside-bonded residue of a monosaccharide and n has a value of 1 to 10. The wax emulsions are distinguished by particular particle fineness and extremely good compatibility with the other constituents of the preparations.

Abstract: A composition which comprises approximately by weight 1 to 8 percent of a hydrocarbon solvent; 1 to 4 percent of a silicone; 1 to 5.5 percent of at least one nonionic surfactant; 0.5 to 3 percent of an alkali metal neutralized tall oil fatty acid and 0.25 to 2.5 percent of an unneutralized tall oil fatty acid.

Abstract: A final polishing composition for polishing a silicon wafer used as a substrate crystal in electrical integrated circuits comprises water, colloidal silica, a water-soluble polymeric compound, and a water-soluble salt.

Abstract: A cored multi-shell emulsion particle consisting of a core particle, a void layer existing in the exterior of the core particle and a shell layer, each of which has a diameter of .phi., d and D, respectively, and the ratio of .phi., d and D is in the following range..phi./D=0.1-0.6d/D=0.2-0.8 (d>.phi.)The particle exhibits excellent hiding power, brightness, gloss and thermal insulation property as an organic pigment without impairing drying ability and strength of coated layer.

Abstract: An improved polish having improved rub-out characteristics results when a silylated polyether film former is incorporated into a conventional polish formulation. The silylated polyether contains at least one polyoxyalkylene block selected from the group consisting of polyoxyethylene and polyoxypropylene in its molecule wherein the polyoxyalkylene block is attached through an organic connecting group to a silicon atom bearing at least one hydrolyzable group. A preferred water-in-oil emulsion embodiment of the polish is particularly suitable for automotive or marine applications.

Abstract: A nail cosmetic composition comprising 3% to 15% by weight of nitrocellulose, 3% to 15% by weight of a resin, 2% to 8% by weight of a plasticizer, 60% to 85% by weight of a solvent, 1% to 10% by weight of a matting agent, and 0.1% to 2.5% by weight of mica in the form of a leaf. This nail cosmetic composition advantageously provides an excellent mat finish without impairing the other desired characteristics, especially the peeling resistance, of the nail cosmetic composition.

Abstract: A nail lacquer remover of the transparent gel type, consisting essentially of: (1) 30-65% by weight of a carbonate selected from the group consisting of ethylene carbonate, propylene carbonate, butylene carbonate and glycerine carbonate; (2) 10-50% by weight of 1,3-dimethyl-2-imidazolidinone; (3) 0.2-20% by weight of hydroxypropyl cellulose; and (4) 13-40% by weight of water. The nail lacquer remover has low flammability, and does not cause drying and cracking of nails.

Abstract: A novel nail polish composition having a low viscosity, i.e. not greater than about 200 cps comprising from about 3.0% to about 24.0% a shade paste, suitable film former and thinner and a pen-like means for applying said nail polish having a substantially non-bristle nib.

Abstract: A composition containing ethanolamine, a silicate and a protective colloid is useful to restore broken, crazed, or alligatored finishes without removing the intact finish beneath.

Abstract: A composition for polishing silicon and germanium comprises a synthetic amorphous silica polishing agent and a suspending agent selected from the group consisting of water-soluble carboxypolymethylene gums and xanthum gums. The composition may be used for polishing in the form of an aqueous alkaline slurry.

Abstract: A food base preservative for material surfaces such as finished furniture surfaces, painted surfaces, glass surfaces, vinyl plastic surfaces, and the like. The preservative solution is made from okra, water and a food preservative agent, and it is used by impregnating soft cloths, such as towels, with the solution and shining material surfaces with the impregnated cloths.

Abstract: The invention relates to a polishing material of the type containing powdered cerium oxide suspended in water.According to the invention, this polishing material also contains, in combination, a substance for use as a thickener and a substance for reducing the surface tension.The polishing material is particularly useful for polishing ophthalmic lenses made from organic materials.

Abstract: A composition for finishing lithographic printing plates having an oil phase which preferentially adheres to the image areas and an aqueous phase which desensitizes the metal carrier and aids in maintaining its hydrophilic character upon storage.

Abstract: A solution for use in suspending 0.05 to 15 micron ceria or alumina particles to produce a slurry for polishing lenses and semiconductor wafers is disclosed. The solution consists of water containing from 0.06 to 0.75 percent by weight of xanthan gum and from 0.5 to 5.0 percent by weight of a dispersing agent selected from the group consisting of the condensate of formaldehyde with naphthalene monosulfonic acid, polymethacrylic acid and their ammonium and alkali metal salts. The slurry is prepared by mixing one volume of the solution with about two volumes of water and then dispersing alumina, ceria, or zirconia particles in the resultant mixture. The quantity of ceria or alumina dispersed is in the range 10 to 20 percent by weight based on the combined weight of solution and added water.

Abstract: An alkaline cleaning and conditioning composition for ceramic surfaces is provided in the form of an abrasive powder mixture including a surfactant, and a silicone oil absorbed in a water soluble absorbent powder.

Abstract: A composition capable of rendering the surface of a substrate such as a wooden parquet floor shiny, without prior stripping and without subsequent polishing, by simply applying and drying the same on such surface, and which composition is a true, anhydrous solution, comprising at least six and preferably seven constituents which consist, in critical proportions, of a solid, film-forming macromolecular compound, a hard resin, a liquid plasticizer, a solid plasticizer and a solvent mixture consisting of at least one lower alkanol and a liquid co-solvent, as well as, as an optional seventh component, of a silicone oil, all of which constituents must fulfill certain physical and/or physico-chemical requirements in order to obtain a fully satisfactory anhydrous floor care agent.

Abstract: A process for producing a novel heteropolysaccharide by a bacterial fermentation in which a new bacteria is incubated in a final fermentation medium containing a suitable carbohydrate source, a source of magnesium ions, a source of phosphorus and nitrogen, and water, the incubation taking place at a temperature of about 25 to 35.degree.C. for about 35 to 60 hours. The heteropolysaccharide produced by the above process are used to thicken aqueous media. Compositions containing the above polysaccharide in combination with certain salts containing di- and trivalent metal ions are useful for example, in drilling fluids, paint compositions, polishes and as additives for foods.

Abstract: A waxing and protective coating composition embodying the invention comprises a mixture of wax residue such as paraffin and microcrystalline wax, chlorinated solvent, petroleum distillate, and a nonionic surfactant such as nonylphenoxypoly-(ethyleneoxy)ethanol and a small amount of [N,N,N',N'-tetrakis (2-hydroxypropyl)ethylenediamine].

Abstract: The invention encompasses intermediate, starch-containing products in which the starch thickening capacity is inhibited by an aqueous dispersant system. These intermediate products can be readily converted into a starch thickened end-product by combining the intermediate product with additives which dissipate the inhibitory effect of the aqueous dispersant. The intermediate products may be provided as a concentrate which contains cold-water swelling starch granules suspended in an aqueous media adapted to effectively maintain the starch granules in an unswollen form. The intermediate products may be suitably formulated with all the desired recipe ingredients except the amount of water needed to convert it into a starch thickened end-product.