Abstract: Buckling of a vitreous silica crucible 12 or inward fall of a sidewall 15 is effectively suppressed. The vitreous silica crucible 12 includes the cylindrical sidewall 15 having an upward-opening rim, a mortar-shaped bottom 16 including a curve, and a round portion 17 connecting the sidewall 15 and the bottom 16. In the vitreous silica crucible 12 the per-unit area thermal resistance in the thickness direction of the sidewall 15 is higher than that of the round portion 17.

Abstract: A method and a device for igniting silicon rods outside a CVD-reactor. A silicon rod is disposed inside a chamber of a casing of an ignition device. At least one pair of contact electrodes applies a first voltage supplied by a transformer with an open circuit voltage sufficiently high to initialize a current flow in and ignite the silicon rod. Optionally, the silicon rod may be heated by a current flow and/or an external heating unit to a temperature within a predetermined range. The silicon rod is removed from the ignition device and may be exposed to a depositing process inside a CVD-reactor. The ignition of the silicon rod outside the CVD-reactor facilitates a new ignition for the depositing process.

Abstract: The present invention relates generally to nanocomposite materials. The present invention relates more particularly to hybrid fibers as well as devices including them and methods for making them. Accordingly, one aspect of the invention is a hybrid fiber including a plurality of nanowires, each nanowire having a length, a width, and a thickness, the length being at least 10 times the width and at least 10 times the thickness; and a plurality of binder elements, each binder element having a length, a width, and a thickness, each substantially smaller than the average length of the nanowires and at least one of which is less than about 10 nm in dimension, the binder elements being arranged to intercouple individual nanowires. In certain embodiments, the binder elements are carbon nanotubes, and the nanowires are formed from silicon carbide.

Abstract: A silicon single crystal growth method of pulling up and growing a single crystal from a melt of a silicon raw material melted in a quartz crucible based on a Czochralski method, the method comprising the steps of: applying a direct current voltage in such a manner that an outer wall of the quartz crucible acts as a positive electrode and an electrode immersed into the melt of the silicon raw material acts as a negative electrode, the immersed electrode being placed separately from a pulling member for pulling the single crystal; and growing the single crystal with the pulling member while passing an electric current through the electrode, and a pulling apparatus thereof.

Abstract: A silicon single crystal growth method of pulling up and growing a single crystal from a melt of a silicon raw material melted in a quartz crucible based on a Czochralski method, the method comprising the steps of: applying a direct current voltage in such a manner that an outer wall of the quartz crucible acts as a positive electrode and an electrode immersed into the melt of the silicon raw material acts as a negative electrode, the immersed electrode being placed separately from a pulling member for pulling the single crystal; and growing the single crystal with the pulling member while passing an electric current through the electrode, and a pulling apparatus thereof.

Abstract: The present invention resides in a silicon single crystal growth method of pulling up and growing a single crystal from a melt of a silicon raw material in a quartz crucible based on a Czochralski method, wherein the method comprises the steps of: applying a DC voltage between an outer wall of the quartz crucible acts as a positive electrode and a pulling wire or pulling shaft for pulling up the silicon single crystal acts as a negative electrode; and fixing an electric current flowing through the silicon single crystal over a period of time for pulling up the single crystal, to grow the single crystal; as well as a pulling apparatus therefor. This allows for provision of the silicon single crystal growth method and the pulling apparatus therefor, capable of generating appropriately crystallized layers, i.e.

Abstract: The axial temperature gradient G at the vicinity of the solid-liquid interface 24 in an ingot is calculated in consideration of the heating value of a heater 18, the dimensions and physical property values of furnace inside components and the convection of the melt 12 before pulling up the single crystal ingot 15 by a puller 10 by use of a numerical simulation of synthetic heater transfers and a numerical simulation of melt convection. Then, the pulling velocity V of the single crystal ingot is determined from an value experienced of the ratio C=V/G of the pulling velocity V and the axial temperature gradient G of the single crystal ingot at which the single crystal ingot becomes defect-free, obtained when the single crystal ingot was pulled up by a same type puller as the puller in the past, and the axial temperature gradient G calculated by use of the simulations.

Abstract: To precisely predict the distribution of densities and sizes of void defects comprising voids and inner wall oxide membranes in a single crystal. The computer-based simulation determines, at steps 1 to 7, the distribution of temperatures within a single crystal 14 growing from a melt 12 from the time of its pulling-up to the time of its completing cooling with due consideration paid to convection currents in the melt 12. The computer-based simulation, at steps 8 to 15, determines the density of voids considering the cooling process of the single crystal separated from the melt, that is, the pulling-up speed of the single crystal after the separation from the melt, and reflecting the effect of slow and rapid cooling of the single crystal in the result, and relates the radius of voids with the thickness of inner wall oxide membrane developed around the voids.

Abstract: The present invention relates to a single crystal silicon, in wafer and ingot form, which contains an axially symmetric region which is free of agglomerated intrinsic point defects. The region extends from a circumferential edge of the wafer or constant diameter region of an ingot, axially inwardly toward a central axis such that the entire wafer, a constant diameter portion of the ingot, or an annular-shaped portion of wafer or ingot is free of agglomerated intrinsic point defects. The present invention further relates to these axially symmetric regions wherein silicon self-interstitials are the predominant intrinsic point detect.

Abstract: By using a semiconductor single crystal pulling apparatus for growing single crystals by the Czochralski method while rotating the melt by a magnetic field and electric current, namely by the EMCZ method, which comprises a main pulling means for pulling a single crystal, a holding mechanism for gripping an engaging stepped portion formed on the single crystal through engaging members and a sub pulling means for moving the holding mechanism up and down and in which an electric current is passed through the main pulling means and through the sub pulling means, it is possible to prevent heavy single crystals from undergoing a falling accident and, at the same time, effectively reduce the power consumption. In this pulling apparatus, it is effective to feed an electric current to the sub pulling means alone and it is desirable to dispose two or more electrodes whether the pulling means is of a shaft type or wire type.

Abstract: A method of manufacturing a damage-resistant silicon wafer is provided. The method comprises adding polycrystalline silicon to a crucible, adding a nitrogen-containing dopant to the crucible, heating the polycrystalline silicon to form a melt of nitrogen-doped silicon, pulling a nitrogen-doped silicon crystal from the melt using a seed crystal according to the Czochralski technique, forming a silicon wafer from the silicon crystal, the silicon wafer having an edge, and rounding the edge of the silicon wafer. The method may optionally include applying an electrical potential across the crucible while pulling the nitrogen-doped silicon crystal from the melt.

Abstract: A novel method for growing semiconductor material including GaN is disclosed. The method involves placing a first substance into a growth reactor, supplying a second gaseous substance into the grouth reactor, and applying electrical field to the second gaseous substance to produce the cry stalline compound material.

Abstract: A method for manufacturing a solid single crystal of an electrically conductive material by pulling from a molten mass of this material, the material presenting atom clusters at melt. The method includes: a melt stage so as to obtain a molten mass, the melt stage procuring a colder zone of the molten mass, from which the single crystal will be pulled, and a hotter zone having sufficient temperature to melt the atom clusters; a stage of application to the molten mass of a rotating magnetic field allowing the atom clusters to be displaced from the colder zone to the hotter zone; and a stage of growth by pulling of the single crystal after the atom clusters have been displaced from the colder zone to the hotter zone.

Abstract: A semiconductor crystal growing apparatus includes a device for applying a magnetic field to inside a semiconductor melt and a device for passing a current through the semiconductor melt. An electrode for applying the current to the inside of the semiconductor melt extends through a tube surrounding the electrode.

Abstract: An apparatus for growing a single crystal of semiconductor is provided, which makes it possible to grow a heavy single crystal of semiconductor of 100 kg or greater in weight even if a growing single crystal contains a neck. In the apparatus, the first and second electrodes are provided such that the first ends of the first and second electrodes are electrically connected to the power supply and the second ends of the first and second electrodes are contacted with the melt in the crucible. During the growth process, a specific voltage is applied across the first ends of the first and second electrodes, thereby forming the electrical current path interconnecting the second ends of the first and second electrodes in the melt. The magnetic field is generated with the magnetic field generator to intersect with the electrical current path in the melt. No electric current flows through the growing single crystal from the melt.

Abstract: A low-cost method of manufacturing a silicon wafer is provided. The method comprises providing a crucible for melting silicon; adding silicon to the crucible; melting the silicon to form a melt; applying an electrical potential across the crucible; pulling a silicon crystal from the melt according to the Czochralski technique at a pulling rate of greater than 1.1 mm/min; and forming a silicon wafer from the silicon crystal. The method may also include adding a nitrogen-containing dopant to the crucible. Furthermore, the method may include etching the wafer first in an alkaline etching solution, and then in an acidic etching solution. The method may also include simultaneously depositing an epitaxial first film on the frontside of the wafer and a second film on the backside of the wafer, wherein the second film traps impurities on the backside of the wafer so the impurities do not contaminate the frontside of the wafer while the epitaxial first film is being grown.

Abstract: A first step models a hot zone in a pulling apparatus of a single crystal as a mesh structure, and a second step inputs physical property values of each member corresponding to meshes combined for each member of the hot zone into a computer. A third step obtains the surface temperature distribution of each member on the basis of the calorific power of a heater and the emissivity of each member, and a fourth step obtains the internal temperature distribution of each member on the basis of the surface temperature distribution and the thermal conductivity of each member, and then further obtains the internal temperature distribution of a molten liquid being in consideration of convection. A fifth step obtains the shape of the solid-liquid interface between the single crystal and the molten liquid in accordance with an isothermal line including a tri-junction of the single crystal. A sixth step repeats said third to fifth steps until the tri-junction becomes the melting point of the single crystal.

Abstract: In an apparatus for growing a semiconductor single crystal from semiconductor melt, a crucible retains the semiconductor melt. An electrode contacts with the semiconductor melt and applies current to the semiconductor melt. The electrode is formed of the same material as the semiconductor crystal.

Abstract: A method of manufacturing a high-purity epitaxial silicon wafer is provided. The method includes providing a quartz crucible for melting silicon; adding silicon to the crucible; heating the crucible to form a melt; applying an electrical potential across the crucible; pulling a silicon crystal from the melt; forming a silicon wafer from the silicon crystal, the wafer having a frontside and a backside; and simultaneously depositing an epitaxial first silicon film on the frontside of the wafer and a polycrystalline second silicon film on the backside of the wafer.

Abstract: In a process for producing a planar body of an oxide single crystal with a &mgr; pulling-down method, a shoulder portion having a larger width is grown without any polycrystal regions, cracks or crystal deteriorations in a central portion of the planar body. A raw material of the oxide single crystal is melted in a crucible. A seed crystal is contacted to a melt of the raw material near an opening of a nozzle 13 of the crucible. Then, the melt 18 is drawn from the opening by pulling down the seed crystal to form a planar body 14A. A temperature distribution of the nozzle 13 in a direction perpendicular to the drawing direction B is controlled by supplying heat to the nozzle 13 and/or by removing heat from the nozzle 13.

Abstract: An apparatus for growing a single crystal of semiconductor is provided, which makes it possible to grown a heavy single crystal of semiconductor of 100 kg or greater in weight even if a growing single crystal contains the neck. In the apparatus, the first and second electrodes are provided in such a way that the first ends of the first and second electrodes are electrically connected to the power supply and the second ends of the first and second electrodes are contacted with the melt in the crucible. During the growth process, a specific voltage is applied across the first ends of the first and second electrodes, thereby forming the electrical current path interconnecting the second ends of the first and second electrodes in the melt. The magnetic field is generated with the magnetic field generator to intersect with the electrical current path in the melt. No electric current flows through the growing single crystal from the melt.

Abstract: In an apparatus for growing a semiconductor crystal from semiconductor melt, a crucible retains the semiconductor melt. An electrode contacts with the semiconductor melt and applies current to the semiconductor melt. The electrode is formed by the same material as the semiconductor crystal.

Abstract: There is provided a quartz glass crucible for pulling a silicon single crystal and a production process for the crucible, wherein an inner surface of the crucible is crystallized without addition of impurities during pulling a silicon single crystal, thereby impurities serving as causes of crystal defects being not incorporated into the silicon single crystal, so that deterioration of its inner surface is suppressed to improve a crystallization ratio, and accordingly productivity of the quartz glass crucible as well as a quality of the silicon single crystal is improved, and the quartz glass crucible for pulling a silicon single crystal comprises a crucible base body (3) made of a translucent quartz glass layer and a synthetic quartz glass layer (4) formed on an inner wall surface of the crucible base body (3), wherein a portion encircled by a brown ring on an inner surface of the quartz glass crucible is uniformly crystallized during pulling the silicon single crystal.

Abstract: A method of manufacturing a crystal of silicon in accordance with a Czochralski method, includes the steps of applying an electric potential across a quartz crucible containing a silicon melt, and pulling a crystal of silicon from the silicon melt.

Abstract: The invention features a method of controlling the depth of a melt for or crystal growth. According to the method, an input signal is applied through a crucible and a material disposed within the crucible. An output signal generated in response to the input signal is measured. The output signal relates to the depth of the melt. An amount of the source material introduced into the melt is adjusted to maintain the depth of the melt at a substantially constant level using the output signal.

Abstract: A method is provided for producing a KTiOPO.sub.4 which is grown at a temperature higher than its Curie temperature using a TSSG method. The grown KTiOPO.sub.4 single crystal is maintained in contact with a melt while the crystal is maintained at a temperature higher than the Curie temperature. A d.c. current is applied in this state across a seed crystal and the melt, while the single crystal is cooled to a temperature lower than the Curie temperature. The value of current density D, defined by the formula D=Ip/(a+b), where Ip is the impressed current and a, b are crystal sizes along a and b axes, respectively, is selected to be 0.01 mA/cm.sup.2 .ltoreq.D.ltoreq.1.0 mA/cm.sup.2. In this manner, the produced KTiOPO.sub.4 is processed into a single domain crystal.