Abstract: According to one embodiment, a substrate processing device includes a stage configured to mount a substrate, a mold having a first surface facing an upper surface of an outer peripheral edge of the substrate and a second surface facing a side surface of an outer peripheral continuous with the upper surface of the outer peripheral edge, a mold moving mechanism configured to move the mold to bring the first surface close to the upper surface of the outer peripheral edge of the substrate and the second surface close to the side surface of the outer peripheral of the substrate, and a nozzle arranged in the mold, wherein the nozzle ejects resist.

Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.

Abstract: A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.

Abstract: A system for the flux free processing of a plurality of solder balls on a wafer, comprising: an articulable vacuum support chuck for maintaining support of a plurality of solder balls on a wafer being processed. An articulable flux-free binder applicator arranged in binder depositing relationship with the wafer within the treatment chamber. An articulable fluid dispenser is arranged in a binder-applied minimization-treatment with respect to the flux free binder applied to the wafer within the treatment chamber.

Abstract: A mask assembly for thin film deposition and a method of manufacturing the same. The mask assembly includes a glass mask having a first surface and a second surface opposite the first surface, a first metal layer patterned above the first surface of the glass mask, and a second metal layer patterned below the second surface of the glass mask. A plurality of deposition areas are arranged on the glass mask, and a plurality of deposition pattern portions each having a plurality of slits are patterned in the plurality of deposition areas.

Abstract: Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.

Abstract: A guiding board for a ball placement machine has a board body. The board body has a top surface, a bottom surface, a ball-dropping area, and multiple guiding grooves. The ball-dropping area is defined on the top surface. The guiding grooves are defined in the ball-dropping area and are parallel to each other. Each guiding groove has a bottom and multiple ball-dropping holes defined in the bottom and extending through the bottom surface of the board body.

Abstract: A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.

Abstract: An adhesive frame includes a clear flexible sheet member with an optional printed ink layer disposed on a border of a first side of the clear flexible sheet member. A semi-permanent adhesive layer is disposed on a second side of the clear flexible sheet member at the border of the clear flexible sheet member. No adhesive is disposed in the middle of the adhesive frame, either through using a patterned adhesive or through use of a liner. Such adhesive frames allow for quick and easy mounting of visual media on nearly any surface. Media can be quickly removed and replaced from underneath the adhesive frame because of the lack of adhesive in the middle portion of the adhesive frame.

Abstract: A cover (54, 54A-B) enclosing with clearance (65) an acoustic damping resonator (24) on a working gas path liner (22) of a gas turbine component (28). The cover includes a coolant inlet chamber (56, 56B) with a top wall (58, 58B) that is closer to the liner than a top wall (32) of the resonator, and extends upstream from the resonator relative to the working gas flow (48). Compressed air (26) surrounds the cover at a higher pressure than the working gas and flows (44) into and through the coolant inlet chamber, then through holes (34) in the resonator, then exits through holes (38) the liner into the working gas. The coolant inlet chamber directs the flow of compressed air over a weld (50) of the upstream wall (40) of the resonator to cool it. The cover may be formed as a box (57) or a sleeve (69).

Abstract: A thin film deposition apparatus that may prevent a patterning slit sheet from sagging and increase a tensile force of the patterning slit sheet, and a method of manufacturing an organic light-emitting display device using the same.

Abstract: A patterning slit sheet assembly for performing a deposition process to form a thin film on a substrate in a desired fine pattern. The patterning slit sheet assembly includes a patterning slit sheet having a plurality of slits, a frame combined with the patterning slit sheet to support the patterning slit sheet, and a support unit including an upper member that is allowed to be moved or fixed to support the patterning slit sheet when a gravitational force is applied to the patterning slit sheet and a lower member disposed more apart from the patterning slit sheet than the upper member, wherein the upper member is fixed on the lower member.

Abstract: A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit.

Abstract: A wiping element made of a rubber-elastic or ductile-elastic material for the protection of components mobile against one another, wherein at least one wiping lip (2) is provided on a wiping ring (1). The wiping element has a protective lip (4), which is or can be fixed in a detachable fashion to the wiping ring (1). In a wiper arrangement (10), the wiping ring (1) is arranged position-stable on a first component and lies with the wiping lip (2) and the protective lip (4) adjacent to a second component. With the use of such a wiper arrangement (10) for the painting of components mobile against one another, at least one component is painted in the fixed state of the protective lip (4) and the protective lip (4) is then detached from the wiping ring (1).

Abstract: Discussed is a method for manufacturing a mask for a solar cell according to an embodiment, the method including preparing a plate formed of a nonmetallic material, and irradiating the plate with a laser and forming a plurality of slits.

Abstract: A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit.

Abstract: An apparatus for etching features in an etch layer is provided. A plasma processing chamber is provided, comprising a chamber wall, a chuck, a pressure regulator, an electrode or coil, a gas inlet, and a gas outlet. A gas source comprises a fluorine free deposition gas source and an etch gas source. A controller comprises at least one processor and computer readable media, comprising computer readable code for providing a conditioning for a patterned pseudo-hardmask, wherein the conditioning comprises computer readable code providing a fluorine free deposition gas comprising a hydrocarbon gas, computer readable code for forming a plasma, computer readable code for providing a bias less than 500 volts, and computer readable code for forming a deposition on top of the patterned pseudo-hardmask, computer readable code for etching the etch layer, and computer readable code for cyclically repeating the conditioning and etching at least twice.

Abstract: A mask assembly for thin film vapor deposition of a flat panel display is disclosed. In the mask assembly, a cleansing solution remaining in the gap between a unit mask and a frame after cleansing the mask assembly may be minimized. The mask assembly includes a frame and a plurality of unit masks. The frame includes a pair of first supporting portions and a pair of second supporting portions that surround an opening. The plurality of unit masks have at least one set of pattern openings, and the unit masks are fixed on the first supporting portion while having a tensile force applied thereto. The first supporting portion includes a first surface and a second surface. The unit masks are fixed on the first surface, and the second surface has a height difference to the first surface along a thickness direction of the unit masks from the first surface.

Abstract: An inertial masking assembly that allows multiple thin film structures to be deposited on a single substrate by rotation of a shadow mask relative to the substrate. The assembly rotates the position of the shadow mask by the conservation of momentum. The substrate is seated on means for rotating the substrate in a confined orbit within the mask. Abruptly changing the angular velocity of the mask causes the mask to rotate under the substrate, which is mediated by a combination of friction and the substrate's inertia.

Abstract: In a mask assembly and a method of fabricating the same, when the mask assembly is fabricated by tensile welding a pattern mask to a mask frame, a tensile welding portion of the pattern mask welded to the mask frame is structurally changed. Thus, the pattern mask can be easily welded to the mask frame, and patterns of the pattern mask can be precisely aligned, thereby minimizing stain failure rate due to the mask assembly. The mask assembly includes: a mask frame including an opening and a support; and a pattern mask including a pattern portion having a plurality of patterns arranged in a matrix and a plurality of tensile welding portions extending from the pattern portion in a first direction and spaced apart from each other in a second direction perpendicular to the first direction.

Abstract: The present invention provides a support material (137) used to support a substrate (150) during processing. The support material (137) comprises a non-woven material comprising a top region and a bottom region, wherein the top region (420) is less resilient than the bottom region (410). The non-woven material also has a first surface (141A) adjacent to the top region, and a first end and a second end. In some embodiments, the bottom region comprises a synthetic fabric and the top region comprises a polymeric material. Other embodiments of the invention include an apparatus and methods for processing substrates in a screen printing chamber that can deliver a repeatable and accurate screen printed pattern on one or more processed substrates using a non- woven support material. In one embodiment, the screen printing chamber is adapted to perform a screen printing process within a portion of a crystalline silicon solar cell production line in which a substrate is patterned with a desired material.

Abstract: A tension apparatus for extending a patterning slit sheet included in a thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The tension apparatus, wherein a plurality of patterning slits are formed along a first direction in the patterning slit sheet, and distances between adjacent patterning slits are different from each other, includes: a light source disposed to face the patterning slit sheet and irradiating light toward the patterning slit sheet; a tension member combined to at least one end of the patterning slit sheet, and applying a predetermined tensile force on the patterning slit sheet; and a master glass onto which light irradiated from the light source and passed through the patterning slit sheet is projected.

Abstract: An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.

Abstract: An apparatus for applying a liquid to a moving web has an applicator element having a surface extending transverse to the web-travel direction and positioned to contact the moving web. Liquid applied to the surface is transferred to the moving web where the moving web contacts the surface. A support spaced in the web-travel direction from the applicator element has a plurality of guides extending transverse to the web-travel direction, with at least some of the guides overlapping others of the guides. Respective shields slidable in the guides transverse to the direction extend between the web and the surface so that where the shields extend between the moving web and the surface there is generally no transfer of the liquid from the surface to the moving web. Respective adjusters connected to the shields shift same in the respective guides between positions spaced from one another to positions at least partially overlapping one another.

Abstract: An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.

Abstract: A tool is provided for applying a flowable composition onto a receiving surface. The tool includes a polyceramic coating on a surface thereof and may take the form of a stencil or mold. Also provided are an apparatus and a method that uses the tool. In use, the tool is placed such that its polyceramic-coated surface is in contact with the flowable composition, which, in turn, simultaneously contacts the receiving surface.

Abstract: An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer, the coating material is then applied onto the object by the injector. This can increase the coating speed and quality.

Abstract: A device for flowing a liquid on a surface comprises: a flow path. A first port supplies the liquid to one end of the flow path and applies a first port pressure for retaining the liquid when the flow path is remote from the surface. A second port receives the liquid from the other end of the flow path and applies a second port pressure such that the difference between the first and second negative port pressures is oriented to promote flow of the liquid from the first port to the second port via the flow path in response to the flow path being located proximal to the surface and the liquid in the device contacting the surface. The first and second port pressures are such that the liquid is drawn towards at least the second port in response to withdrawal of the flow path from the surface. Such devices may employ microfluidic technology and find application in surface patterning.

Abstract: In printing of a bonding material in which a board is supported from a component mounting-side surface on which a plurality of components are mounted, and a bonding material is printed on a working-side surface which is a surface opposed to the component mounting-side surface of the board, an edge portion region of the board supported by a board transporting unit is included in a support region of the board during the printing so as to enlarge the support region of the board having the components mounted thereon in high density and to achieve reliable and high precision printing of the bonding material.

Abstract: Techniques for magnetic device fabrication are provided. In one aspect, a method of patterning at least one, e.g., nonvolatile, material comprises the following steps. A hard mask structure is formed on at least one surface of the material to be patterned. The hard mask structure is configured to have a base, proximate to the material, and a top opposite the base. The base has one or more lateral dimensions that are greater than one or more lateral dimensions of the top of the hard mask structure, such that at least one portion of the base extends out laterally a substantial distance beyond the top. The top of the hard mask structure is at a greater vertical distance from the material being etched than the base. The material is etched.

Abstract: A stencil device ensures that solder paste is accurately applied to a printed circuit board to create a substantially zero signal degradation solder bridge electrical connection. The printed circuit board is defined by a dielectric structure core having a first surface which further includes a first conducting pad having an edge and a second conducting edge having an edge separated from and adjacent to the edge of the first conducting pad. The edges of the first and second conducting pads define therebetween a surface area of the first surface. The stencil device includes a stencil plate member defining a first opening sized to substantially correspond to the first conducting pad, a second opening sized to substantially correspond to the second conducting pad, and a third opening. The third opening links the first opening to the second opening at a size to correspond to a partial portion of the surface area of the first surface between the edges of the first and second conducting pads.

Abstract: A mask and a deposition apparatus using the same are disclosed. One embodiment of the mask is used for depositing a thin film on the substrate having a plurality of sub-pixel regions. The mask includes a first region having a plurality of the first openings, each of which corresponds to one of the plurality of sub-pixel regions. The mask also includes second regions having a plurality of the second openings, each of which corresponds to at least two of the plurality of the sub-pixel regions. The second regions are positioned on both sides of the first region.

Abstract: An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.

Abstract: An apparatus for applying thermal interface material (TIM) is disclosed. The apparatus has a substantially rigid frame with four corners. The frame includes a cross-shape opening having four tapered arms, and each of the four tapered arms is oriented towards one of the four corners of the frame.

Abstract: A device for flowing a liquid on a surface comprises: a flow path. A first port supplies the liquid to one end of the flow path and applies a first port pressure for retaining the liquid when the flow path is remote from the surface. A second port receives the liquid from the other end of the flow path and applies a second port pressure such that the difference between the first and second negative port pressures is oriented to promote flow of the liquid from the first port to the second port via the flow path in response to the flow path being located proximal to the surface and the liquid in the device contacting the surface. The first and second port pressures are such that the liquid is drawn towards at least the second port in response to withdrawal of the flow path from the surface. Such devices may employ microfluidic technology and find application in surface patterning.

Abstract: A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predetermined pattern and a surface roughness of the mask.

Abstract: A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate supporting and clamping assembly to support and clamp a substrate in a print position. The substrate supporting and clamping assembly includes at least one support member to support the substrate in a print position, a pair of rail members, coupled to the frame, adapted to engage opposite edges of the substrate, and a clamping mechanism, coupled to the frame, to move at least one of the rail members against the substrate to clamp the substrate.

Abstract: In a substrate holder for holding a circuit board onto which a viscous material for bonding electronic components is printed by use of a squeegee through a screen mask, a first holding area for holding the screen mask and a second holding area for holding the circuit board are provided on a base surface. The squeegee is supported by at least one of the first holding area and the second holding area. The squeegee is abutted against the circuit board being held to the second holding area, via the screen mask placed on the circuit board.

Abstract: A screen-printing plate is provided with a plurality of printing patterns disposed in a single plate frame. Each printing pattern is formed with a plurality of mesh holes. At least two different aperture ratios of the mesh holes forming the printing patterns are provided according to the positions of regions on the screen-printing plate in which the printing patterns are disposed. The aperture ratio of the mesh holes forming the printing patterns positioned in a region close to the periphery of the plate frame is set higher than the aperture ratio of the mesh holes forming the printing patterns positioned in a central region of the plate frame.

Abstract: A grease applicator is assembled from three parts, a base unit, a cap unit and a slider unit. The base unit has tenons that couple with corresponding slots in the cap unit to form a cavity with a window opening on a first surface and a slider opening on a second surface where a plane parallel to the second surface is perpendicular to a plane parallel to the first surface. A slider unit is inserted into the slider opening and forms a top surface to the window opening and forming a window cavity for containing a predetermined amount and volumetric shape of grease. The grease applicator is applied to a heat sink with the grease in the window cavity contacting a surface of the heat sink. The slider unit is extracted while pressure is applied to a surface of the grease applicator applying a uniform volume of grease.

Abstract: To shorten the time required to clean a printing mask used in printing solder paste pattern, an unused surface of a cotton cleaning sheet is brought into contact with a transfer surface of a printing mask while a feed roller, suction roller, take-up roller, solvent dispenser and air blower are moved horizontally in an integral fashion in a direction perpendicular to the direction in which a tape substrate is conveyed, thereby cleaning the printing mask along the shorter, widthwise direction of the tape substrate.

Abstract: Cream solder stored in a squeegee head is pressurized by a pressurizing plate, and the squeegee head is slid on a mask plate, so that the cream solder is printed onto a substrate via pattern apertures. This is done by a screen printing apparatus, in which pressurized solder is accommodated, and the solder is brought into contact with a surface of the mask plate via an opening formed on a lower face of the cell. A rectifier is disposed in the cell for blocking the cream solder from flowing into a specific area just above the opening. This structure allows the solder to flow into the opening in a slant direction, and causes the solder to roll. This mechanism prevents the solder from being hardened due to staying stagnant just above the opening, and thus prevents defective printings.

Abstract: A filling squeegee and a scraping squeegee are provided in a printing apparatus. The filling squeegee is moved without contacting a surface of a mask in order to fill a solder paste into openings of the mask. Unnecessary solder paste on the surface of the mask is scraped by the scraping squeegee. The solder paste is prevented from being improperly filled in or scraped from the openings even if a speed of the squeegee is increased, so that the solder paste can be printed stably on circuit board.

Abstract: A stencil design for solder paste printing, or other metal stencil printing, is disclosed. A stencil for stencil printing of solder onto a semiconductor wafer for semiconductor wafer bumping includes a substrate. The substrate has a hole defined therein substantially shaped to correspond to and receptive to the semiconductor wafer. An interior edge of the substrate surrounds the hole, and has an upper lip under which the semiconductor wafer is positioned. The upper lip of the interior edge of the substrate surrounding the hole substantially prevents the solder from flowing onto sides and a bottom of the semiconductor wafer during stencil printing of the solder. The cross-profile shape of the upper lip may in one embodiment be rectangular, whereas in another embodiment be triangular.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e.

Abstract: Cream solder stored in a squeegee head is pressurized by a pressurizing plate, and the squeegee head is slid on a mask plate, so that the cream solder is printed onto a substrate via pattern apertures. This is done by a screen printing apparatus, in which pressurized solder is accommodated, and the solder is brought into contact with a surface of the mask plate via an opening formed on a lower face of the cell. A rectifier is disposed in the cell for blocking the cream solder from flowing into a specific area just above the opening. This structure allows the solder to flow into the opening in a slant direction, and causes the solder to roll. This mechanism prevents the solder from being hardened due to staying stagnant just above the opening, and thus prevents defective printings.

Abstract: An apparatus and method is disclosed for applying a coating of material to a predefined area on a surface of a part. A movable stencil is provided having a wall or surface with a predefined aperture corresponding to a pattern of the defined area to be coated. A wiper, such as a doctor blade or squeegee, is provided for filling the aperture with the coating of material to be applied to the part. A pad, preferably of silicon rubber, is provided for receiving the coating of material as the coating material passes through the aperture of the stencil and for applying the coating of material to the part in response to relative movement between the part and the pad.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, the solder dispensing unit includes a squeegee arm with a solder gathering head. During operation using the squeegee arm with the solder gathering head, two circuit boards are fed to the working area, and both of the circuit boards are serially processed, with excess solder being removed from the board after the processing of each of the boards.

Abstract: A device for dosing and distribution of hotmelt on a substrate is provided. The device includes substrate throughput, hotmelt supply, at least one hotmelt application position with a stencil, hotmelt distribution and a squeegee device. The hotmelt distribution includes a hotmelt dispensing nozzle. A dosing unit and drive for moving the dosing unit to and fro along said squeegee device are also provided. The hotmelt dispensing nozzle is fitted on the movable dosing unit.