Abstract: The invention is a method and apparatus for encapsulating semiconductor dies via stencil printing in which, after the dies have been stencil printed with encapsulant and prior to removal of the stencil from the dies, the edges of the encapsulating material are partially cured in order to prevent or minimize slump of the encapsulant in the time period between removal of the stencil and full curing of the encapsulant. In particular, the stencil can be provided with a plurality of light pipes that terminate at the edges of the apertures within which the dies are placed. Ultraviolet (UV) or other curing light is provided through the light pipes to the edges of the encapsulating material. Some general or localized heating can be provided to enhance or accelerate the light curing of the edges of the encapsulant, but without substantially curing the remainder of the encapsulating material.

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

Abstract: The machine comprises: a mobile rest plane for tiles on which the tiles transit in a predetermined advancement direction; a decorating apparatus which comprises a plurality of cylinders, located above the mobile rest plane; means for setting the plurality of cylinders in rotation each about an axis thereof, and with a predetermined stagger of one of the plurality of cylinders with respect to others of the plurality of cylinders. The means for setting the plurality of cylinders in rotation employ a mechanical transmission of drive to the plurality of cylinders which comprises a driven gear coaxially and solidly associated to each of the plurality of cylinders. The driven gears are drawn in rotation, with couplings allowing no relative dragging, by a chain and have diameters which are different from diameters of the plurality of cylinders to which they are solidly constrained.

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e.

Abstract: A stencil (8) with a tension part combined with an operational device allowing deposition of solder paste to replace constituents on an electronic board. The stencil consists of a flat sheet (1), of rectangular shape, made of synthetic flexible material or metal and outfitted with transfer openings (2) for transferring and distributing a product. Two of the parallel sides of the sheet are connected to rigid and mobile vertical tabs (3) in an affixed position on a tension unit of the sheet. The other two parallel sides of the sheet, orthogonal to the former ones, are extended with flexible walls (6), orthogonal to the sheet. Bead folds (7) separate the perforated sheet and each of the flaps and delimit the sheet. The flaps freely rotate around the folds. The invention also has an operational device consisting of arm (20) with several jointed strands outfitted with a sole means of locking (22) its joints. The stencil may be configured and moved in accordance with 6 degrees of freedom.

Abstract: The present invention is a film forming unit for applying a coating solution to a substrate to form a coating film on the substrate, which has a heating and/or cooling member brought into direct or indirect contact with said substrate for changing a temperature of at least a peripheral portion of the substrate. By changing the temperature of a perimeter portion of the substrate by means of it, a temperature of the coating solution applied on the substrate can be changed. Consequently, surface tension of the coating solution decreases or increases, and swelling of the coating solution occurring at the substrate perimeter portion and reduction in film thickness can be prevented. As a result, a coating film with a predetermined film thickness is formed also on the perimeter portion of the substrate, thus making it possible to enhance yield.

Abstract: An application device for applying at least a solder resist onto both surfaces of a printed circuit board that are in particular provided with structurized printed conductors comprises at least two application bodies that can be assigned to the corresponding surface of the board and are rotatably supported. To simplify the structure of the application device while allowing a more rapid and well-reproducible application at both sides of a printed circuit board at the same time, the application bodies are two screen printing drums arranged at both sides of an essentially horizontal transport path of the printed circuit board, wherein a transport means comprises conveyor belts along the transport path for transporting the printed circuit board, and the transport means further comprises pressing means that can be pressed onto a surface of the board for holding the board on the conveyor belts.

Abstract: A method and apparatus is provided for transporting circuit boards in a screen printer. In embodiments of the present invention, a transportation system is provided for a printer that prints material on a substrate. The transportation system has the ability to independently move substrates from one position to another within the printer without moving other substrates contained within the transportation system. In one embodiment, the transportation system includes a conveyor system and a plurality of lifters that lift substrates off of the conveyor system to prevent at least one substrate from moving when other substrates are moved by the conveyor system. In another embodiment, the transportation system includes a conveyor system and a plurality of retractable pins, that are individually controllable to be raised above the conveyor system to contact at least one substrate on the conveyor system and prevent the substrate from moving when other substrates are moved by the conveyor system.

Abstract: The invention greatly improves an efficiency of a whole of aparts mounting process. In a method of applying an adhesive material to a parts mounted circuit board, a recess portion surrounding a part of a circuit board in which the parts are already mounted is provided on a back surface, a portion corresponding to a position at which the parts of the circuit board should be mounted is protruded in the recess portion, and a mask having a through hole for applying the adhesive material in the protruding portion is used. Then, the mask is mounted on the circuit board and the adhesive material is pressed out from a through hole by a squeegee in a screen printing apparatus so as to be applied.

Abstract: A coating mask device for a lighting device in which a mask body is divided into a plurality of sections so that the mask body can be easily handled. The coating mask device for a lighting device includes a support jig 10, on which a component part 14 of the lighting device can be placed, and a mask body 20 having an opening 22 corresponding to a coat-forming region 15 of the lighting device component part 14. The mask body 20 is divided into a partial mask 21, having the opening 22, and a main mask 23 for covering that region of the component part other than that region covered by the partial mask 21. The partial mask 21 is removable from the main mask 23. The whole of the mask body 20 does not need to be exchanged, and it is only necessary to exchange the partial mask 21 which is compact and lightweight.

Abstract: A screen printing apparatus for applying a printing agent in different thicknesses to a plate. A mask of the apparatus has a width corresponding to or matching the widths of two plates to be printed. A first portion of the mask, for applying a first printing to the plate, is reduced by recessing an upper surface of the mask portion, with screen holes being provided therein pursuant to a desired pattern. A second portion of the mask, for applying a second printing to the plate, is provided with screen holes in a different pattern. Recesses are provided in the lower surface of the second portion of the mask for receiving the printing agent applied via the first portion of the mask, thereby preventing the printing agent from attaching to the second portion of the mask. A single printing operation, on two plates disposed side by side, is performed by moving a squeegee having two portions with different thicknesses or heights. The plate to be printed can be shifted under the lower surface of the mask.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, a solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: A screen printing apparatus and method for forming printed wiring on a substrate, such as a wafer. The apparatus includes a reservoir disposed beneath a screen having a plurality of openings forming a pattern thereon. Disposed within the reservoir is a printing paste. The screen is pressed into the printing paste such that convex structures are formed on the upper surface of the screen, and are printable onto the substrate. A wiper is also movably disposed within the reservoir, cooperating with the screen to establish contact between the screen and the substrate.

Abstract: A dual track stencil system includes a plurality of pairs of adjustable conveyor rails, including a first pair of conveyor rails and a second pair of conveyor rails. The first and second pairs of conveyor rails of the dual track system are advantageously adjustable to accommodate variable width circuit boards or operation of the system in single track mode. The first and second pairs of conveyor rails can be independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks.

Abstract: An external electrode forming apparatus is used to form external electrodes on the component chips. The external electrode forming apparatus comprises a component conveyer belt, a belt feeding mechanism, a component-inserting machine, a component-reversing machine, a paste-coating machine, and a component-discharging machine. For the component-inserting machine, the component-reversing machine, and the component-discharging machine, pressure pins are used to insert or move the component chips. These pressure pins have at the tip part a taper portion with a tip shape smaller than that of the component holding hole. Since the pressure pins of this type are used, the tip portions of these pressure pins may be prevented from impinging upon the opening edges of the component holding holes, and the pressure pins after the impingement may be hindered from forcibly being inserted into the component holding holes, whereby damage to the interiors of the component holding holes can be extremely diminished.

Abstract: It is an object to provide an apparatus for manufacturing adhesive layers which can be manufactured in a manufacturing process which is fine, which exhibits an excellent mounting efficiency, which does not require a plating process and which is clean, double-sided substrates and multilayer substrates. A bonding-layer forming portion (5) incorporates a bonding portion (1), a hole machining portion (2), a charging portion (3) and a separating portion (4). A double-sided-substrate forming portion incorporates a bonding portion (6), a hole machining portion (7), a charging portion (8) and a separating portion (9), further incorporating a laminating portion (10), a resin hardening portion (11) and a pattern forming portion (12).

Abstract: A transport head (10) and a method for transporting flux and solder balls (50) to locations for bonding pads (46) on a workpiece (44). To transfer flux, a first pattern definition mask (12) is attached to the transport head (10) and allows selector pins (64) to fully extend and receive flux for transport to the bonding pads (46) on the substrate (44). To transfer the solder balls (50), pattern definition mask (12) attached to the transport head (10) defines locations that are to be populated with the solder balls (50). The transport head (10) transfers the solder balls (50) to the bonding pads (46) of the substrate (44).

Abstract: A nozzle apparatus and method of use for extruding a conductive paste through a stencil or screen onto a substrate are disclosed. The nozzle includes a body and a conformable insert for contacting the screen. The method comprises the steps of obtaining a substrate and a patterned screen, contacting the screen with a nozzle comprising a nozzle body and a conformable nozzle insert, and extruding a paste through the nozzle and screen onto the substrate. The apparatus and method are particularly useful for producing patterned lines from extruded pastes in the manufacture of microelectronic components.

Abstract: A dispenser for a surface mounting paste or the like comprises a substrate 12 and a plurality of nozzles 9, 10 and 11 attached thereto such that they can be vertically driven. The paste dispenser 8 is moved by means of a squeegee moving mechanism.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area at which the circuit boards are stenciled and includes a stencil having two patterns formed thereon. In one embodiment, the stencil system includes a solder dispensing system for dispensing solder paste onto the stencil.

Abstract: A screen printing method is provided in which the exchange of machine types is achieved in a short time and even minute patterns or narrowly pitched patterns can be precisely positioned for screen printing. The method comprises finding an amount of movement of the circuit board from positions of recognition marks (2, 2) on a circuit board (1) and positions of recognition marks (5, 5) on a screen plate (4), positioning the circuit board (1) in relation to the screen plate (4) on the basis of the amount of movement of the circuit board (1), detecting a discrepancy between a pattern of apertures (18) and a pattern of lands (19) in a particular portion of the circuit board (1), finding a positional correction from the discrepancy, and positioning the circuit board (1) in relation to the screen plate (4) on the basis of the amount of movement of the circuit board and the positional correction.

Abstract: An installation for coating the surface of a web of material with a paste. A printing screen has a doctor blade lying within for applying the print paste through holes in the printing screen onto the web. A counter roll cooperates with an electromagnet to producing a controllable level of contact pressure of the doctor blade against the printing screen. The roll body of the counter roll is provided with a coating that has piezoelectric elements and is divided into sections specific to the width, each section being individually controllable. This permits dynamic control of the application of paste over the width of the web.

Abstract: A nozzle apparatus and method of use for extruding a conductive paste through a stencil or screen onto a substrate are disclosed. The nozzle includes a body and a conformable insert for contacting the screen. The method comprises the steps of obtaining a substrate and a patterned screen, contacting the screen with a nozzle comprising a nozzle body and a conformable nozzle insert, and extruding a paste through the nozzle and screen onto the substrate. The apparatus and method are particularly useful for producing patterned lines from extruded pastes in the manufacture of microelectronic components, and are even more particularly adapted for use in producing patterns in substrates having high aspect ratio openings.

Abstract: An apparatus for dispensing solder paste for application through a stencil or a screen to a circuit board includes a housing having an elongated chamber along a longitudinal axis and a rotatable member within the chamber. The housing has an inlet connected to a supply of solder paste and an elongated opening at the bottom of the chamber for delivering solder paste from the chamber. The rotatable member creates a pressure gradient within the chamber and causes delivery of the solder paste through the opening at controlled pressure. The rotatable member is spaced from an inner surface of the housing defining the chamber. The axis of rotation of the rotatable member is movable in two directions and the speed of rotation is adjustable. The forces on the rotating member are monitored in order to monitor solder conditions.

Abstract: The invention herein relates to a kind of integrated circuit solder ball implant machine that is mainly comprised of a machine base, a solder ball implant device, a solder ball loading device, an integrated circuit component positioning device and an integrated circuit mold ejection device, the innovations of which includes the utilization of the aforesaid integrated circuit component positioning device that reciprocates leftward and rightward at the lower extent of the solder ball implant device as well as the aforesaid solder ball loading device that is vibrated forward and backward to directly transport the solder balls through the feed holes of the solder ball implant device such that each of the solder balls are reliably, accurately, soundly and expeditiously carried and positioned onto integrated circuit component in the integrated circuit component positioning device.

Abstract: The array of recesses in a ball grid array carrier or (device) are populated with solder balls through a closely spaced tooling plate or stencil which has a like array of apertures. A solder bin is moved along side rails over the stencil allowing solder balls to fill the apertures in the stencil settling on the corresponding recesses and held there by adhesive. Excess solder balls are moved along by the movement of the bin. The bin is held in close contact with the stencil to avoid misplacement of the balls by bowing the stencil and by forcing it into a plane coplanar with the bottom of the bin. Alternative techniques are magnetic or vacuum areas of the bottom of the bin to ensure complete contact with the stencil.

Abstract: An apparatus is provided for applying solder paste to the contact elements of ball grid array components, which is economical to manufacture and simple to handle, and which nonetheless offers the possibility of being able to apply a desired amount of solder precisely to the contact elements of a ball grid array component.

Abstract: The process and apparatus of the present invention teaches how to treat a well-integrated woven or non-woven web of hydrophobic fibers to make selective areas hydrophyllic. It also can be used to make a web of hydrophyllic fibers selectively hydrophobic. It uses a plurality of selectively adjustable covers on an applicator roll rotating in a bath of liquid to place the liquid material on selective areas of the moving web. In a preferred embodiment the web is non-woven and the fibers are hydrophobic in nature, e.g., dry-laid or melt-blown polypropylene or polyethylene fibers or spun-bonded hydrophobic filaments. A woven web made of cotton or other hydrophyllic fibers may also be used if the end result is to create partially hydrophobic areas on a hydrophyllic web. The areas of liquid are positioned on the web only where desired so as to eliminate the excessive cost of unwanted and unnecessary coating material. If the web is hydrophobic, the liquid makes that area hydrophyllic.

Abstract: A device for preserving solder paste in the manufacturing of printed circuit board assemblies. In one embodiment, the preserving device has a frame adapted to be positioned on a stencil plate of a solder paste stenciling machine and a cover coupled to the frame. The frame has a wall that is configured to substantially surround at least a portion of the solder paste on the stencil plate between printing cycles. In a preferred embodiment, the wall is configured to surround a working region on the stencil plate defined by the area on the stencil plate that the solder paste contacts during a printing cycle. The cover is coupled to the frame to form a protective compartment that substantially houses the solder paste between printing cycles. As a result, the preserving device restricts the airflow across the solder paste to protect the solder paste from environmental elements within the stenciling machine.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: An apparatus and method for applying material to the crests or troughs of corrugated sheet material or selected portions of substantially flat sheet material. A first roller is provided with a plurality of circumferentially-undulating flutes disposed about it peripheral surface. The flutes define first roller crests and first roller troughs. A second roller is provided with a plurality of circumferentially-undulating flutes disposed about its peripheral surface. The flutes define second roller crests and second roller troughs. The first roller and second roller are synchronized so that as the rollers rotate the crests of one roller nest in the troughs of the other roller. The crests or troughs of the first roller are provided with one or more nozzles which apply the desired quantity of coating material to the corrugated sheet material crests or troughs as the first and second roller crests and troughs nest.

Abstract: A solder ball placement and alignment apparatus for placing and aligning a plurality of solder balls onto solder pads on a multi-chip substrate includes a placement tray and a base seat. The placement tray includes a solder ball gate, means for controlling movement of the gate, a plurality of placement through holes that correspond to the solder pads on the substrate, and a plurality of alignment cavities disposed on the underside of the placement tray. The solder ball gate is slidably mounted to the placement tray and, when the gate is at a first position, an opening in the placement tray is uncovered thereby permitting solder balls to be removed when the placement and alignment apparatus is tilted toward the direction of the opening. When the gate is at a second position, the opening of the placement tray is covered. The movement of the gate is controlled by an electromagnet and associated control circuit means or a mechanical device.

Abstract: Methods and apparatus are disclosed for imprinting a catalyst and/or adsorbent composition on a flat or corrugated substrate. The coated substrate is useful in pollutant treating devices to remove pollutants from a gas.

Abstract: A universal fixture for holding printed circuit boards during stencil printing and other manufacturing processes related to printed circuit boards. In one embodiment, a universal fixture for holding a printed circuit board has a platform with a work surface, a first support member attached to the platform to hold a portion of a printed circuit board, and a second moveable support member attached to the first support member to support another portion of the printed circuit board. The platform is preferably adapted to be attached to a workstation of a processing machine, such as a stenciling machine for printing solder or adhesive onto the printed circuit board. The first support member preferably has an elongated sidewall, a first endwall extending transversely from the sidewall, and a second endwall spaced apart from the first endwall along the sidewall and extending transversely from the sidewall.

Abstract: A rotary coater device (12) is provided, comprising front and rear frame plates (30) having mounted therebetween: a die bracket assembly (100), a screen assembly (200), a heater hood assembly (300), and an impression roll assembly (400). The die bracket assembly (100) includes (i) a die (500) positionable within a screen (202) and having an opening (550), the die being movable from an operating position wherein the die opening is proximate to an inner surface of the screen to an idle position wherein the die is drawn away from the inner surface; and (ii) a pivotable support arm (102a) fixedly attached at one end to a positioning mechanism (112) and removably attached at an opposite end to the die, the pivotable support arm being pivotable away from the screen when the opposite end is detached from the die to expose the screen for removal from the coater device.

Abstract: Apparatus is provided for applying glue or a similar adhesive onto a substrate such as a paper web. It comprises a nozzle plate (20) with exit openings (29) with a small diameter, which are arranged in at least two rows (32,33), staggered closely behind one another in the transport direction (4). The rows are also transversely offset with respect to each other such that the outlet openings of one row (33) are aligned with the spaces (37) defined between the outlet openings of another row (32). In this manner, side edge portions (47) of the adhesive issued from the outlet openings of the one row (33) contact and merge with the side edge portions (47) of the adhesive issued from the outlet openings of the other row (32) whereby a continuum of adhesive is produced.

Abstract: A process is provided for forming a conductive line between a conductor and a spacer formed on a substrate of a field emission display. In one embodiment, the process performs the steps of disposing a screen between the substrate and a distributing member, the screen having an opening which permits the extrusion a conductive material, and moving the distributing member relative to the screen to extrude the conductive material through the opening and form a conductive line connecting the conductor and the spacer, wherein the snap off distance is varied according as the distributing member moves along the substrate.

Abstract: An apparatus for transferring and spreading a high-viscosity bonding agent to a thickness of about 10 .mu.m on a bonding-agent onto a member. The device includes a squeegee table on which a bonding agent is spread, and a film moving device for feeding a film made of elastic material from one end to the other end of the squeegee table at a predetermined speed and sticking the film onto the bonding agent. The film moving device then peels the film off the spreading side at a speed at which the upper half of the bonding agent layer is peeled off from the other end of the squeegee table, whereby the thickness of the bonding agent is reduced to half of that which has been spread on the squeegee table. The film moving device then feeds the film having the bonding agent onto a member and peels off the film from the member, thereby transferring a bonding agent having a thickness of about 1/4 of the thickness of the bonding agent spread on the spreading side, not greater than 10 .mu.m, for example, to the member.

Abstract: A screen printing machine comprising a backing plate with holes conforming to components attached to the surface of a flexible circuit board. The machine includes a screen which patterns solder paste on the surface of the circuit board while the circuit board is on the backing plate. Also included is a spring loaded element disposed adjacent to the backing plate which applies a predetermined continuous force to the four corners of the circuit board. This force is applied in a diagonal direction to the corners to stretch the circuit board so that the circuit board is parallel to the backing plate during screening.

Abstract: A solder paste stencil printing apparatus in which a stencil plate having a porous figure printing area may be used for single component solder paste application. The printing operation is performed by alignment of the stencil pattern figure over the appropriate component substrate pads. With the stencil plate being held in place by downward force, solder paste is dispensed over the stencil plate pattern allowing gravity flow of the paste material into the stencil pattern pores. Excess paste material is squeegeed level to the top surface of the stencil plate and the plate lifted from the substrate surface leaving solder paste in the configured pattern. An associated stencil plate holder matched to the printer head shaft allows any number of stencil plate patterns to be made available for solder paste application.

Abstract: System for producing a plurality of semiconductor device assemblies utilizing a grid array of conductive epoxy for connecting them to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.

Abstract: An method and apparatus for forming adhesive and solder pads on a printed circuit board to surface mount electrical components to the board. In accordance with an embodiment of the invention, a solder paste is deposited onto the printed circuit board through a first stencil that has a plurality of first openings. The solder paste forms a plurality of solder pads on the board. A second stencil is then positioned on the printed circuit board. The second stencil has a plurality of second openings, and a recess in its bottom face configured to receive the plurality of solder pads. After the second stencil is positioned on the printed circuit board so that the solder pads are received in the recess on the bottom face of the second stencil, an adhesive material is deposited onto the board through the second openings of the second stencil to form a plurality of adhesive pads on the board.

Abstract: This invention provides for methods and apparatus for increasing the speed of material deposition by a blade element traversing across an apertured mask. The invention involves varying the velocity of the blade element as it sweeps across different sections of the apertured mask. Varying the sweep velocity of the blade element allows for increases in the average speed of material deposition while retaining precision in the application of material deposited through the apertured mask.

Abstract: In a method of coating a curved panel in a cathode ray tube, by placing on the inner surface of a panel having a curved surface a screen frame of a boat-shaped configuration across the bottom of which a screen printing screen is stretched; and by moving a squeegee pushed against the surface of the screen so that ink coated on the surface of the screen passes through the screen and prints on the inner surface of the panel, a fluorescent screen having a good and even film is fabricated on the inner surface of the cathode ray tube panel having a curved face, by a screen printing. In the method, electro-conductive terminals for electro-deposition are not required, steps are reduced, production costs are reduced, and production quality is stabilized.

Abstract: A hot melt material coating system (10) is provided, comprising (i) a rotary coater (12) driven by a motor (604); (ii) a rotary coater position, speed and direction indicator (610) operatively connected to the rotary coater and providing a signal representing the position, speed and direction thereof; (iii) a web position, speed and direction indicator (612) operatively connected to the web and providing a signal representing the position, speed and direction thereof; and (iv) a control system (600).

Abstract: A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

Abstract: A stencil for applying solder paste in a desired pattern for mounting electronic components on a surface of a circuit board, said stencil including a sheet having holes therethrough in a pattern corresponding to the desired pattern, a smooth upper surface for receiving the solder paste thereon, and a smooth lower surface for contacting the surface of the circuit board, the upper surface having relieved portions so as to increase the friction between the upper surface and the solder paste being squeegeed thereover.

Abstract: An apparatus for spreading and depositing a viscous liquid or paste-like material on a substrate includes a housing removably insertable into a diamond- or square-shaped squeegee blade holder, the blade holder itself mounted to a squeegee head assembly of a screen or stencil printer. The squeegee head assembly is driven in a linear direction over and above the substrate, dragging the blade over the substrate and forcing deposition of the material onto the substrate. The housing includes a pair of oppositely-disposed locking clamps that attach to both ends of the housing. A shaft having a blade secured thereto is disposed through the channels of the clamps and within a groove of the housing, and the shaft is rotatable within the housing and the locking clamps so that the angle of attack between the blade and substrate can be selectively adjusted and, once the appropriate angle of application is selected, the blade is fixed in position by tightening the clamps against the shaft.

Abstract: A rotary coater device (12) is provided, comprising front and rear frame plates (30) having mounted therebetween: a die bracket assembly (100), a screen assembly (200), a heater hood assembly (300), and an impression roll assembly (400). The die bracket assembly (100) includes (i) a die (500) positionable within a screen (202) and having an opening (550), the die being movable from an operating position wherein the die opening is proximate to an inner surface of the screen to an idle position wherein the die is drawn away from the inner surface; and (ii) a pivotable support arm (102a) fixedly attached at one end to a positioning mechanism (112) and removably attached at an opposite end to the die, the pivotable support arm being pivotable away from the screen when the opposite end is detached from the die to expose the screen for removal from the coater device.

Abstract: An apparatus and method for applying material to the crests or troughs of corrugated sheet material or selected portions of substantially flat sheet material. A first roller is provided with a plurality of circumferentially-undulating flutes disposed about it peripheral surface. The flutes define first roller crests and first roller troughs. A second roller is provided with a plurality of circumferentially-undulating flutes disposed about its peripheral surface. The flutes define second roller crests and second roller troughs. The first roller and second roller are synchronized so that as the rollers rotate the crests of one roller nest in the troughs of the other roller. The crests or troughs of the first roller are provided with one or more nozzles which apply the desired quantity of coating material to the corrugated sheet material crests or troughs as the first and second roller crests and troughs nest.