Abstract: An organic film deposition apparatus includes: a deposition source that discharges a deposition material; a deposition source nozzle unit located at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet spaced apart from the deposition source nozzle unit and having a plurality of patterning slits arranged in a second direction perpendicular to the first direction; a first blocking member between the substrate and the deposition source and movable together with the substrate to be positioned to screen at least a part of the substrate; and a second blocking member between the first blocking member and the substrate and fixedly held relative to the deposition source, wherein the substrate is spaced apart from the organic film deposition apparatus and at least one of the substrate or the organic film deposition apparatus moves relative to the other.

Abstract: In a mask assembly and a method of fabricating the same, when the mask assembly is fabricated by tensile welding a pattern mask to a mask frame, a tensile welding portion of the pattern mask welded to the mask frame is structurally changed. Thus, the pattern mask can be easily welded to the mask frame, and patterns of the pattern mask can be precisely aligned, thereby minimizing stain failure rate due to the mask assembly. The mask assembly includes: a mask frame including an opening and a support; and a pattern mask including a pattern portion having a plurality of patterns arranged in a matrix and a plurality of tensile welding portions extending from the pattern portion in a first direction and spaced apart from each other in a second direction perpendicular to the first direction.

Abstract: An apparatus for masking an article with masking material is disclosed. The apparatus generally includes a spray head connected to a primary channel which forms a passage for the masking material. This channel has two sections, the first of which terminates in a junction with the spray head and is angled from the second section.

Abstract: A thin film deposition apparatus that is suitable for manufacturing large-sized display devices on a mass scale and that can be used for high-definition patterning, a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus, and an organic light-emitting display device manufactured by using the method.

Abstract: A painting apparatus for applying a coating material to a member surface of a member comprises a housing, at least one slide rail, a rack assembly, a cross beam and a spraying device. The slide rail may be mountable within the housing and may have a plurality of rack positions. The rack assembly is mountable within the housing at one of the rack positions. The rack assembly is configured to support the member such that the member surface is exposed. The cross beam may be coupled to the slide rail. The cross beam is movable along the slide rail and is positionable at the rack positions. The spraying device is mountable on the cross beam and is configured to move along the cross beam while spraying the coating material onto the member surface.

Abstract: A device for depositing an organic material includes a substrate; a mask having an opening portion and a shield portion; a fixing member for fixing the substrate and the mask to each other; a deposition source comprising a plurality of nozzles arranged in a first direction and configured to spray the organic material; and a plurality of shield plates near the plurality of nozzles on the deposition source. An angle ? between the substrate and a line extended from a distal end of one of the nozzles to a center of a distal end of a corresponding one of the shield plates is greater than or equal to a taper angle ? of the shield portion of the mask.

Abstract: A thin film deposition apparatus, which has high external light transmittance and a cathode having a uniform thickness, is disclosed. In one embodiment, the thin film deposition apparatus includes a deposition source spaced apart from a center of the substrate and configured to emit a deposition material toward the substrate and a blocking member disposed on the substrate and configured to block at least part of the deposition material emitted from the deposition source, wherein an opening is defined on at least one side of the blocking member.

Abstract: A method and apparatus for the formation of coplanar electrical interconnectors. Solder material is deposited onto a wafer, substrate, or other component of an electrical package using a complaint mold such that the terminal ends of the solder material being deposited, i.e., the ends opposite to those forming an attachment to the wafer, substrate, or other component of an electrical package are coplanar with one another. A complaint mold is used having one or more conduits for receiving solder material and having a compliant side and a planar side. The compliant side of the mold is positioned adjacent to the wafer, substrate, or other component of an electrical package allowing solder material to be deposited onto the surface thereof such that the planar side of the compliant mold provides coplanar interconnectors. An Injection Molded Solder (IMS) head can be used as the means for filling the conduits of the compliant mold of the present invention.

Abstract: A mask for performing high speed media finishing on airfoils includes a thicker portion and a thinner portion. The thicker portion is spaced further from an edge that will become a leading edge in the final airfoil than the thinner portion. The media is redirected by the thicker portion toward the edge where the finishing is to occur.

Abstract: In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.

Abstract: Absorbent nappy/diaper pads composed of a first absorbent base material, and a second absorbent material consisting of superabsorbent polymer powders, are made by a unit (3) that comprises a conveyor (11) carrying the first absorbent material along a predetermined feed path (P), and a feed system (24) by which the superabsorbent polymer powders are released onto the feed path (P); the feed system (24) comprises a fixed duct (27) with an outlet (45) directed at the feed path (P), and a valve (34), positioned along an intermediate segment of the duct (27), by which the superabsorbent polymer powders are dispensed intermittently and controllably.

Abstract: An apparatus for depositing annular or circular wedge coatings with arbitrary dependence of thickness versus position includes a coating tool in which at least one substrate is disposed in a line of sight arrangement vs. least one deposition source, each substrate having an axis of symmetry and associated with a single mask having an aperture and positioned between the substrate and the least one deposition source, the mask and the substrate arranged to perform a relative rotation around a common axis to follow a law of motion which results in the deposition of a coating with a desired law of variation of thickness vs. position on the circumference of the substrate. The relative rotation is imparted by a motor. In embodiments in which there are a plurality of substrates and associated single masks, the substrates are positioned on a planet carrier independently rotatable by another motor.

Abstract: A lithographic apparatus is disclosed that has a first substrate table arranged to hold a substrate and a second substrate table arranged to hold a substrate, an imprint template holder arranged to hold an imprint template, and an imprintable medium dispenser, wherein the first substrate table is moveable between a first position located at or adjacent to the imprintable medium dispenser, and a second position located at or adjacent to the imprint template holder, and the second substrate table is moveable between the first and second positions, such that the first and second substrate tables swap positions.

Abstract: The present invention describes two systems (100, 300) for encapsulation of semiconductor dies. Both systems (100, 300) involve attaching an encapsulation spacer (102, 302, 302a, 302b) having one or more apertures (104, 304) on an associated substrate (150) so that a group of chips is located within the aperture (104, 304). The first system (100) involves dispensing encapsulant (103) directly into an aperture. The second system (300) involves attaching an encapsulant delivery layer (350, 351) onto the encapsulation spacer and discharging encapsulant into an aperture via a recessed gate (308).

Abstract: A thin film deposition apparatus including a chamber; a deposition source accommodated in the chamber and configured to discharge a deposition material; a deposition source nozzle unit located at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet located opposite the deposition source nozzle unit inside the chamber and including a plurality of patterning slits arranged in a second direction perpendicular to the first direction, the patterning slit sheet being spaced apart from the substrate, and the thin film deposition apparatus being configured to perform a deposition while at least one of the substrate or the thin film deposition apparatus moves relative to the other in the first direction.

Abstract: A thin film deposition apparatus that can be easily used to manufacture large-sized display devices on a mass scale and that improves manufacturing yield, and a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus.

Abstract: A method of masking cooling holes of a turbine component, in particular a turbine blade or vane, for a coating process is provided. The component includes an external surface to be coated, at least one internal cavity having an opening towards the outside of the component, and cooling holes extending from the at least one internal cavity to the external surface. The method comprises the steps of: filling the cooling holes with a masking material and hardening the masking material. The masking material, water, is used to fill in the cooling holes. The hardening is done by freezing the water to water ice. A method of coating an external surface of a turbine component and a device for use in a masking process for masking cooling holes in a turbine component are also provided.

Abstract: With abluminal side of a stent masked, the luminal side of the stent is selectively coated with a substance, such as an anti-coagulant, a platelet inhibitor and/or a pro-healing substance. The stent can be masked by inserting it into a rigid mandrel chamber or by compressing a masking sleeve onto the outer side of the stent. A spray nozzle inserted into the masked stent spray coats the substance onto the luminal side. The sprayed coating can be cured onto the stent such as by inserting an electrical-resistance heater bar into the stent.

Abstract: A thin film deposition apparatus that forms a thin film on a substrate includes: a deposition source that discharges a deposition material; a deposition source nozzle unit that is disposed at a side of the deposition source and includes a plurality of deposition source nozzles; a patterning slit sheet that is disposed opposite to the deposition source nozzle unit and includes a plurality of patterning slits; and a blocking member that is disposed between the substrate and the deposition source, wherein the thin film deposition apparatus is separated from the substrate by a predetermined distance, the substrate is moved relative to the thin film deposition apparatus, and the blocking member is moved along with the substrate to screen at least one portion of the substrate.

Abstract: A method for depositing a protective layer of material on a localized area on a substrate, such as a pattern of photo resist, includes forming a controlled environment around the substrate and positioning a hollow needle adjacent to the localized area on the substrate. A liquid comprising the material is directed through the hollow needle onto the localized area, so as to deposit a layer of the material on the localized area. The layer of material may act as a Z-contrast forming layer in TEM.

Abstract: A drive for drawing an absorbent web of dry wipes from a supply and an application applying moisture to a selected width of the webs.

Abstract: The invention provides a cylinder bore spraying apparatus capable of carrying out honing processing and finishing after a sprayed film is formed in a cylinder bore in a state where the cylinder bore is deformed by a dummy head. A sprayed film is formed on an inner peripheral surface of a cylinder bore by a spraying gun in a state where a dummy head is pressed against a cylinder block such that a cylinder head is fastened to the cylinder block by a bolt. Thereby, a deformed state of a cylinder bore is simulated. A protection mask prevents the sprayed film from adhering to the dummy head and is detachably attached to the liner hole of the dummy head.

Abstract: There is provided a bump printing apparatus and a method of controlling the same that can increase the printability of solder bumps being printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation; and air nozzles provided within the printing table and providing air suction to bring the board into close contact with the printing table and spraying air to separate the mask from the board.

Abstract: The present invention provides a solder ball printing apparatus and a solder ball printing method in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball feeding unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached so as to surround a solder ball shaking and discharging port of the solder ball feeding unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball loading members, each of which is arranged in the front and rear of the wire member in a convex shape to load the solder balls into an opening area of a mask.

Abstract: A substrate treatment apparatus which uniformly forms a fine resist pattern with a desired dimension within a plane of a substrate is disclosed. In a solvent vapor supply unit, a solvent vapor discharge nozzle is provided which can discharge a solvent vapor for swelling a resist pattern while moving above the front surface of a wafer. The wafer for which developing treatment has been finished and on which a resist pattern has been formed is carried into the solvent vapor supply unit, and the solvent vapor discharge nozzle is moved above the front surface of the wafer, so that the solvent vapor discharge nozzle supplies the solvent vapor onto the front surface of the wafer. This uniformly supplies a predetermined amount of solvent vapor to the resist pattern on the front surface of the wafer. As a result, the solvent vapor causes the resist pattern to evenly swell by a predetermined dimension, so that a resist pattern with a desired dimension is finally uniformly formed within the plane of the wafer.

Abstract: A device for coating printed circuit boards with a fluid coating compound applied to the board surface is disclosed. The device has a conveyor for the printed circuit boards, a sprayer arranged over or under the conveyor, and a covering element on at least one side over an edge area of the printed circuit boards, wherein the area of the covering element covering the edge area of the printed circuit board can be moved away from the printed circuit board. The device also has a wiper, which wipes the coating compound moved away from the printed circuit board off from the covering element and supplies it to a holding tank.

Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

Abstract: A tool is provided for applying a flowable composition onto a receiving surface. The tool includes a polyceramic coating on a surface thereof and may take the form of a stencil or mold. Also provided are an apparatus and a method that uses the tool. In use, the tool is placed such that its polyceramic-coated surface is in contact with the flowable composition, which, in turn, simultaneously contacts the receiving surface.

Abstract: An aperture mask assembly includes a rotatable frame and a mask having apertures. A clamping arrangement is used to tension the mask and to conform the mask to a shape defined by the frame. Tension is applied to the mask in a direction substantially parallel to an axis of the frame and/or around the circumference of the shape defined by the frame. Deposition material emanating from a deposition source located within the rotatable frame is deposited through the mask apertures onto a web.

Abstract: An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer, the coating material is then applied onto the object by the injector. This can increase the coating speed and quality.

Abstract: An apparatus for surface-to-surface application of a liquid media to a substrate. The apparatus comprises a housing and a device movably mounted within the housing. The housing has an external surface and an outlet. The device has an outer surface and an inner cavity for receiving the liquid media. The outer surface includes at least one recess in flow communication with the inner cavity such that liquid media can be delivered from the inner cavity to the recess. As the device moves within the housing, the at least one recess periodically passes by the outlet such as to apply to a substrate being conveyed past the outlet, in surface-to-surface contact with the external surface of the housing, a liquid media in a pattern corresponding in shape to the recess.

Abstract: The invention relates to methods and apparatuses that reduce problems encountered during coating of a device, such as a medical device having a cylindrical shape. In an embodiment, the invention includes an apparatus including a bi-directional rotation member. In an embodiment, the invention includes a method with a bi-directional indexing movement. In an embodiment, the invention includes a coating solution supply member having a major axis oriented parallel to a gap between rollers on a coating apparatus. In an embodiment, the invention includes a device retaining member. In an embodiment, the invention includes an air nozzle or an air knife. In an embodiment, the invention includes a method including removing a static charge from a small diameter medical device.

Abstract: An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a wafer edge ring is formed with a spin coating apparatus provided with a wafer edge exposure (WEE) system. In further embodiments, a wafer edge ring is used to contain a liquid over a wafer active surface during a processing operation. In one embodiment, the wafer edge ring contains a liquid having a higher refractive index than air while exposing a photoresist on the wafer by immersion lithography. In another embodiment, the wafer edge ring contains a curable liquid material while forming a chip scale package (CSP) sealing layer on the wafer.

Abstract: Impurities can be eluted simultaneously from a plurality of local areas of a surface layer of a semiconductor substrate. A supporting unit supports the substrate, and a sample plate is disposed on the surface of the substrate. The sample plate has a plurality of holes that expose the local areas of the surface of the substrate. Eluant is provided onto the local areas of the surface layer of the substrate through the holes in the sample plate. The impurities are thus dissolved by the eluant to produce a sample. A nozzle transfers the sample from the local areas of the surface of the substrate to a plurality of sample cups. Therefore, samples from the surface layer of the substrate may be produced in a short amount of time.

Abstract: For producing a ceramic material, a mask having a predetermined shape is located on a substrate, and a spacing is formed between the substrate and the mask. An aerosol, which contains a carrier gas and raw material particles dispersed in the carrier gas, is jetted out onto the substrate, and the jetted-out aerosol is caused to flow into the spacing between the substrate and the mask. The raw material particles, which are contained in the aerosol, are deposited in the spacing between the substrate and the mask, and a molded body having the same shape as the shape of the mask is formed.

Abstract: A solution containing a sample is provided vibration by a vibrating element, the solution is atomized in a status retaining its activities as minute particulate substances, and the solution and/or the atomized minute particulate substances are electrically charged by wires applied a high voltage. Then, the particles are dried out during flying, the particles are deposited onto a substrate grounded by electrostatic force, and to be immobilized in a status keeping its activities.

Abstract: An apparatus for surface-to-surface application of a liquid media to a substrate. The apparatus comprises a housing and a device movably mounted within the housing. The housing has an external surface and an outlet. The device has an outer surface and an inner cavity for receiving the liquid media. The outer surface includes at least one recess in flow communication with the inner cavity such that liquid media can be delivered from the inner cavity to the recess. As the device moves within the housing, the at least one recess periodically passes by the outlet such as to apply to a substrate being conveyed past the outlet, in surface-to-surface contact with the external surface of the housing, a liquid media in a pattern corresponding in shape to the recess.

Abstract: A shadow mask for uniformly forming an organic luminescent layer of an organic electroluminescent device is disclosed. The shadow mask includes a plurality of striped slots aligned in one direction, the striped slots having a plurality of inclined surfaces formed on each side thereof. Due to a step difference, the inclined surfaces prevent shadows from occurring, thereby uniformly forming the organic luminescent layer.

Abstract: Some embodiments include an apparatus comprising a spray head to spray a substrate, the substrate having a region to be sprayed and a region to be masked, the two regions separated by a boundary, and a mask having channels, the mask located between the spray head and the substrate. In an embodiment, the mask further has a lip to prevent flux overspray from falling onto a substrate below. In an embodiment, flux overspray removal is assisted with a vacuum system. Other embodiments are described and claimed.

Abstract: A flux spray head, a mask, and an integrated circuit substrate are arranged in a flux spray station to reduce flux overspray during a spraying operation. A support element within the spray station is used to align the substrate with the mask and spray head. A portion of the mask contacts the substrate along a boundary between a region to be sprayed and a region to be masked. The flux spray head sprays the substrate while a portion of the mask is in contact with the boundary of the region to be masked. In an embodiment, the mask may comprise one or more replaceable non-stick stencil elements and associated springs to press the stencil elements against the substrate. Each stencil element may have a wall to contact the substrate along a portion of the boundary.

Abstract: A substrate processing system includes a source unit configured to supply a deposition material to a substrate, a substrate holder configured to hold a substrate to receive the deposition material, a shadow mask comprising a frame that includes two opposing arms; and a crossbar configured to be mounted to the two opposing arms. The frame and the crossbar define a plurality of openings that allow the deposition material supplied by the source unit to be deposited on the substrate. A transport mechanism can produce relative movement between the shadow mask and the substrate.

Abstract: A spray painting tool for painting key caps is disclosed, which comprises: a platform, having a plurality of columns formed on a top surface of the same; a panel, having a plurality of holes formed thereon at positions corresponding to the plural columns for allowing the plural columns to pass through the panel therefrom; a diaphragm, disposed on the panel while aligning a plurality of holes formed thereon with the plural columns for allowing the plural columns to pass through the diaphragm therefrom; and at least a holding unit, each being arranged on the panel at a position corresponding to one of the plural column for fixedly securing a key cap. As the diaphragm can be easily replaced, the spray painting tool can be used repetitively without worrying the stacking of residue paint on its panel. Moreover, as the spray painting tool is simple in structure and ease to use, painting key caps can be achieved with lower cost and less time.

Abstract: Device for protectively covering a first portion of a first surface when a second portion of a second surface adjoining the first surface is painted. The device includes a plate having a generally elongated rectangular shape and a distal edge. One side of the plate defines a working surface against which paint is collected during painting the second portion. The device also includes a flexible member that has a tip coupled to the plate, an elongated middle portion formed of flexible material and operative to generate a resilient force upon bending, and a bottom portion to be coupled to an end of an elongated handle. When a user bends the middle portion and positions the distal end against one of the first and second surfaces and positions the other end of the handle coupled to the bottom portion against a third surface, the device is held in place by itself due to the resilient force.

Abstract: A system that applies strips of material, such as labels, to a cylindrical body, such as a bottle. The system includes a vacuum cylinder that holds the labels. The vacuum cylinder rotates bringing the labels into contact with a rotary application head that applies hot melt adhesive to the passing labels. The rotary application head includes a feed channel system that cooperates with a mask cylinder to controllably apply the adhesive. The adhesive covered label then is fixed to a bottle or other device that is rotating in a carousel.

Abstract: A user places a vinyl stencil on the lawn, securing it with a set of U-shaped pins, nails or stones, bricks, weights or the like. The stencil has a plurality of holes and the user places white paint over the hole. The user then removes the stencil, which leaves their lawn with a white dotted pattern on their lawn. The user then paints the laws according to the pattern left by the stencil. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

Abstract: A device for flowing a liquid on a surface comprises: a flow path. A first port supplies the liquid to one end of the flow path and applies a first port pressure for retaining the liquid when the flow path is remote from the surface. A second port receives the liquid from the other end of the flow path and applies a second port pressure such that the difference between the first and second negative port pressures is oriented to promote flow of the liquid from the first port to the second port via the flow path in response to the flow path being located proximal to the surface and the liquid in the device contacting the surface. The first and second port pressures are such that the liquid is drawn towards at least the second port in response to withdrawal of the flow path from the surface. Such devices may employ microfluidic technology and find application in surface patterning.

Abstract: A tire cleaning shield for protecting areas of a vehicle adjacent to a tire includes a panel that has a bottom edge, a top edge, a first lateral edge, a second lateral edge, a first side and a second side. The panel has an opening therein extending into the first side and outwardly of the second side. The opening has a generally same diameter as a diameter of the tire. A drip pan has a front edge, a back edge, and a pair of side edges. The front edge is hingedly coupled to the bottom edge of the panel. The tire is centered in the opening so areas adjacent to the tire are shielded when the tire is sprayed with cleaning chemicals.

Abstract: A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.

Abstract: An apparatus for wetting an advancing filament bundle. A fluid is applied by means of a nozzle in the form of a fluid spray jet to the filament bundle advancing in spaced relationship with the nozzle. A portion of the spray jet is shielded before impacting upon the filament bundle, so that the application of fluid to the filament bundle is determined by the degree of shielding of the spray jet. With that, the invention is adapted for finely adjusting the fluid application to the filament bundle.

Abstract: A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predetermined pattern and a surface roughness of the mask.