Mask Or Stencil Patents (Class 118/406)
  • Patent number: 11589487
    Abstract: A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: February 21, 2023
    Assignee: JABIL INC.
    Inventors: Luke Rodgers, Erik Gjovik
  • Patent number: 11213851
    Abstract: A high speed granule delivery system and method is disclosed for dispensing granules in intermittent patterns onto a moving asphalt coated strip in the manufacture of roofing shingles. The system includes a granule hopper and a rotationally indexable pocket wheel in the bottom of the hopper. A series of pockets are formed in the circumference of the wheel and the pockets are separated by raised lands. A seal on the bottom of the hopper seals against the raised lands as the wheel is indexed. In use, the pockets of the pocket wheel drive through and are filled with granules in the bottom of the hopper. As each pocket is indexed beyond the seal, it is exposed to the moving asphalt coated strip below and its granules fall onto the strip to be embedded in the hot tacky asphalt.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: January 4, 2022
    Assignee: BMIC, LLC
    Inventor: James A. Svec
  • Patent number: 10889022
    Abstract: A device and a method for specifically influencing the technological properties of individual regions of a sheet-like material are provided, including the following steps: a) fixing the sheet-like material or a pre-compacted material nonwoven or a material fibre cake on a workbench, b) placing at least one applicator on the upper side and/or the underside of the sheet-like material, the material nonwoven or the material fibre cake, c) specifically moving the at least one applicator on the upper side and/or the underside and pressing an improving medium into partial regions of the sheet-like material, the material nonwoven or the material fibre cake in a predetermined amount and under a predetermined pressure, d) optionally, subsequently pressing the pre-compacted material nonwoven or the material fibre cake to form a sheet of the desired thickness.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: January 12, 2021
    Assignee: FLOORING TECHNOLOGIES LTD
    Inventors: Norbert Kalwa, Gerhard Stahl
  • Patent number: 10737344
    Abstract: A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: August 11, 2020
    Assignee: FLEX LTD.
    Inventors: Zohair Mehkri, Anwar Mohammed, Jesus Tan, David Geiger, Murad Kurwa
  • Patent number: 10723147
    Abstract: A method of forming a digital print on a surface by applying powder of dry ink including colourants on the surface, bonding a part of the dry ink powder to the surface by a digital heating print head such that the digital print is formed by the bonded dry ink colourants and removing non-bonded dry ink from the surface.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: July 28, 2020
    Assignee: CERALOC INNOVATION AB
    Inventors: Darko Pervan, Tony Pervan
  • Patent number: 10639822
    Abstract: A method of producing a transdermal absorption sheet including: preparing a mold having needle-like recessed portions including tapered inlet portions; preparing a liquid feeder including an opening portion and a lip land portion; filling the needle-like recessed portions with a solution by feeding the solution to the mold and moving the liquid feeder in a traveling direction while bringing an upstream end of the lip land portion on an upstream side of the liquid feeder in the traveling direction into contact with the mold; and forming needle portions and a sheet portion using a polymer solution. In the filling of the solution, when the upstream end of the lip land portion on the upstream side aligns with an upstream side inlet surface of one of the needle-like recessed portions, the shortest distance from a downstream side inlet surface of the needle-like recessed portion to a surface of the lip land portion on the upstream side is 220 ?m or less.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: May 5, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Keio Okano, Yoshinobu Katagiri
  • Patent number: 9956580
    Abstract: A mask for masking a component at an annular boundary comprises a wall (90, 92) having an inner first rim portion having a first inner diameter (D1) and an outward rebate (140) adjacent the first rim portion.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: May 1, 2018
    Assignee: United Technologies Corporation
    Inventors: Christopher W. Strock, Charles R. Beaudoin, Robert D. Richard, Steven G. Lemay
  • Patent number: 9359765
    Abstract: A high speed granule delivery system and method is disclosed for dispensing granules in intermittent patterns onto a moving asphalt coated strip in the manufacture of roofing shingles. The system includes a granule hopper and a rotationally indexable pocket wheel in the bottom of the hopper. A series of pockets are formed in the circumference of the wheel and the pockets are separated by raised lands. A seal on the bottom of the hopper seals against the raised lands as the wheel is indexed. In use, the pockets of the pocket wheel drive through and are filled with granules in the bottom of the hopper. As each pocket is indexed beyond the seal, it is exposed to the moving asphalt coated strip below and its granules fall onto the strip to be embedded in the hot tacky asphalt. Well defined patterns of granules are possible at high production rates.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: June 7, 2016
    Assignee: Building Materials Investment Corporation
    Inventor: James A. Svec
  • Patent number: 8857330
    Abstract: A holding mechanism 40 is made up of a shaft support 44 that is provided while joined to a joint and that has a vertically-oriented pivot 44a, a shaft member 45 that horizontally extends from the shaft support 44 and that is turnable around the pivot 44a, and a fitting section 36 that is formed in a squeegee unit 16 and to which the shaft member 45 is removably fitted. Thereby, the entirety of the squeegee unit 16 becomes removably attachable by only moving the squeegee unit 16 in a horizontal direction.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: October 14, 2014
    Assignee: Panasonic Corporation
    Inventors: Hideki Uchida, Isao Horie, Takashi Yazawa
  • Patent number: 8846439
    Abstract: There is provided a pattern forming apparatus which transfers a paste to a predetermined position of a pattern forming object fixed to a table through a pattern forming mask having opening portions at predetermined positions using a discharge mechanism part. To realize a pattern forming which allows the stable forming of a fine pattern with high accuracy and allows the paste to be surely filled into fine through holes, a corner portion of a distal end of the discharge mechanism part in contact with the pattern forming mask is formed into a concave shape, and a surface of the distal end portion of the discharge mechanism part including the concave shaped portion is covered with a film having liquid repellency so that the rolling of the paste is accelerated in a region formed by the concave shaped portion to form a fine pattern with high accuracy.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: September 30, 2014
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Nobuyuki Ushifusa, Naohito Uemura, Shigeru Suzuki
  • Patent number: 8794611
    Abstract: The invention relates to a method for coating a catalyst support body, which comprises: providing the catalyst support body as well as slurry located within a pan; introducing an open input end of the catalyst support body into the slurry; and, subsequently, directing an amount of the slurry though the input end and into the inside of the catalyst support body. At least a part of the circumference of the input end is covered with an impermeable sealing element while slurry is directed through the open end. In this way, contact between slurry and a circumferential outer surface of the catalyst support body is prevented and slurry is provided through the open end to an inner surface of the catalyst support body. Further, the invention relates to a loading platform for carrying out the method. The inventive assembly comprises a loading platform adapted for releasably holding a catalyst support body, and a cover mechanism having a sealing holder and a ring shaped sealing element attached to the sealing holder.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: August 5, 2014
    Assignee: BASF SE
    Inventor: Kai Schmitz
  • Publication number: 20140182513
    Abstract: An extrusion nozzle for applying a paste to a green sheet. The nozzle having a center orifice with a leading edge and a trailing edge. The leading edge comprising a tip having a durometer value of about 40 D shore. The leading edge may comprise a urethane material. The trailing edge may either be a carbide rod or it may comprise a material with a durometer value of about 60 D shore. The trailing edge may also comprise a urethane material. The urethane material may be molded onto the nozzle and ground down to meet the specifications required for the application of the paste.
    Type: Application
    Filed: January 3, 2013
    Publication date: July 3, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: International Business Machines Corporation
  • Patent number: 8720369
    Abstract: The present invention relates to the application of surface coatings to treated aluminum articles utilized on aircraft, and more particularly to a system for masking portions of aluminum aircraft wheel and brake components for application of surface coatings to reduce or prevent wear and/or corrosion to the aluminum article. The system may be utilized for new aluminum aircraft components as well as aircraft components that have been subjected to non-destructive testing. The masking components are constructed and arranged to cooperate with portions of the aluminum component in a sequential manner to allow for application of multiple layers of primer and/or topcoat without removal of prior masking components so that a coated component complies with the manufacturer's written requirements for that component.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: May 13, 2014
    Assignee: The Lost Boy Group, LLC
    Inventors: Jason E. Rayman, Richard W. Brown
  • Patent number: 8632854
    Abstract: A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: January 21, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae-Mork Park, You-Min Cha, Won-Seok Cho, Jae-Hong Ahn, Min-Jeong Hwang
  • Publication number: 20130316492
    Abstract: There is provided a pattern forming apparatus which transfers a paste to a predetermined position of a pattern forming object fixed to a table through a pattern forming mask having opening portions at predetermined positions using a discharge mechanism part. To realize a pattern forming which allows the stable forming of a fine pattern with high accuracy and allows the paste to be surely filled into fine through holes, a corner portion of a distal end of the discharge mechanism part in contact with the pattern forming mask is formed into a concave shape, and a surface of the distal end portion of the discharge mechanism part including the concave shaped portion is covered with a film having liquid repellency so that the rolling of the paste is accelerated in a region formed by the concave shaped portion to form a fine pattern with high accuracy.
    Type: Application
    Filed: March 18, 2013
    Publication date: November 28, 2013
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Nobuyuki USHIFUSA, Naohito UEMURA, Shigeru SUZUKI
  • Patent number: 8512473
    Abstract: A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: August 20, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae-Mork Park, You-Min Cha, Won-Seok Cho, Jae-Hong Ahn, Min-Jeong Hwang
  • Patent number: 8470126
    Abstract: An apparatus for etching features in an etch layer is provided. A plasma processing chamber is provided, comprising a chamber wall, a chuck, a pressure regulator, an electrode or coil, a gas inlet, and a gas outlet. A gas source comprises a fluorine free deposition gas source and an etch gas source. A controller comprises at least one processor and computer readable media, comprising computer readable code for providing a conditioning for a patterned pseudo-hardmask, wherein the conditioning comprises computer readable code providing a fluorine free deposition gas comprising a hydrocarbon gas, computer readable code for forming a plasma, computer readable code for providing a bias less than 500 volts, and computer readable code for forming a deposition on top of the patterned pseudo-hardmask, computer readable code for etching the etch layer, and computer readable code for cyclically repeating the conditioning and etching at least twice.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: June 25, 2013
    Assignee: Lam Research Corporation
    Inventors: Ben-Li Sheu, Rajinder Dhindsa, Vinay Pohray, Eric A. Hudson, Andrew D. Bailey, III
  • Publication number: 20130119518
    Abstract: A method for growing semiconductor wafers by lateral diffusion liquid phase epitaxy is described. Also provided are a refractory device for practicing the disclosed method and semiconductor wafers prepared by the disclosed method and device. The disclosed method and device allow for significant cost and material waste savings over current semiconductor production technologies.
    Type: Application
    Filed: May 17, 2012
    Publication date: May 16, 2013
    Applicant: MCMASTER UNIVERSITY
    Inventors: Adrian Kitai, Haoling Yu, Bo Li
  • Patent number: 8236108
    Abstract: An inertial masking assembly that allows multiple thin film structures to be deposited on a single substrate by rotation of a shadow mask relative to the substrate. The assembly rotates the position of the shadow mask by the conservation of momentum. The substrate is seated on means for rotating the substrate in a confined orbit within the mask. Abruptly changing the angular velocity of the mask causes the mask to rotate under the substrate, which is mediated by a combination of friction and the substrate's inertia.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: August 7, 2012
    Assignee: University of South Florida
    Inventor: Casey W. Miller
  • Publication number: 20120114853
    Abstract: The invention relates to a method for coating a catalyst support body, which comprises: providing the catalyst support body as well as slurry located within a pan; introducing an open input end of the catalyst support body into the slurry; and, subsequently, directing an amount of the slurry though the input end and into the inside of the catalyst support body. At least a part of the circumference of the input end is covered with an impermeable sealing element while slurry is directed through the open end. In this way, contact between slurry and a circumferential outer surface of the catalyst support body is prevented and slurry is provided through the open end to an inner surface of the catalyst support body. Further, the invention relates to a loading platform for carrying out the method. The inventive assembly comprises a loading platform adapted for releasably holding a catalyst support body, and a cover mechanism having a sealing holder and a ring shaped sealing element attached to the sealing holder.
    Type: Application
    Filed: March 24, 2010
    Publication date: May 10, 2012
    Applicant: BASF SE
    Inventor: Kai Schmitz
  • Patent number: 8141512
    Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.
    Type: Grant
    Filed: December 29, 2007
    Date of Patent: March 27, 2012
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Tso-Hung Yeh, Hung-Yi Chang, Chih-Lung Hsiao
  • Patent number: 8113143
    Abstract: A coating apparatus and method are disclosed that applies a coating to a product in a uniform and controlled manner. The coating apparatus comprises a feeding stage, an optional pre-treatment stage, at least one coating stage and a finishing stage. The coating stage(s) comprise a coating material feeder and a coating device. The coating device includes an aperture conforming to the perimeter of a substrate to be coated in a first and second dimension. As the substrate passes through the aperture, coating material is applied in a uniform and consistent layer ranging from 0.001 inches to 0.250 inches. The coating material also back fills minor surface imperfections and blemishes on the substrate to achieve a consistent finish across the whole area where coating material is applied. The coating device includes first and second shell portions. The first shell portion has a concave surface surrounding the aperture portion.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: February 14, 2012
    Inventors: Kendall W. Prince, Gordon L. King, Roderick Hughes, Richard B. Flora
  • Patent number: 8007867
    Abstract: The present invention provides a method for manufacturing a multilayer information recording medium including at least two information recording portions and a resin layer interposed between the information recording portions, both of which are disposed on a signal substrate. The method includes a first process of forming a predetermined information recording portion on one principal surface of the signal substrate and a second process of passing a part of a resin-containing coating, which is supplied on a screen having an application region with a plurality of first pores and a removal region with a plurality of second pores, through the first pores by sliding a squeegee on the screen so as to form a coating layer on the predetermined information recording portion, and curing the resin contained in the coating layer so as to form the resin layer. The first process and the second process are carried out respectively a predetermined number of times.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: August 30, 2011
    Assignee: Panasonic Corporation
    Inventors: Yuuko Tomekawa, Morio Tomiyama, Keiji Nishikiori
  • Patent number: 7938636
    Abstract: A fluorescence-containing material injection apparatus of the present invention includes a fluorescence-containing material temperature control section, a fluorescence-containing material stirring section, a fluorescence-containing material remaining amount sensor, and a fluorescence-containing material injection amount adjustment section, by which disproportion in the mixture ratio of contaminates in a fluorescence-containing material M is restrained. This makes it possible to evenly apply a fluorescence-containing material onto a semiconductor light emitting element.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: May 10, 2011
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Toshio Hata, Hideaki Tatsuta, Hiromu Tagashira, Taiji Morimoto
  • Patent number: 7938063
    Abstract: An intaglio printing press includes, a rotary screen comprising a hollow cylinder, which has a small hole group for special ink supply formed in a circumferential surface of the hollow cylinder and which is supported rotatably, and a squeegee contacting an inner peripheral surface of the hollow cylinder, a rubber roller supported rotatably to oppose an outer peripheral surface of the hollow cylinder at a position where the squeegee contacts the inner peripheral surface of the hollow cylinder, and a sheet supplied with special ink, which has been stored within the hollow cylinder, by the squeegee via the small hole group of the hollow cylinder. The intaglio printing press further includes special ink guide means, such as guide grooves, for guiding a surplus of the special ink, which is not supplied to the sheet by the squeegee, to the small hole group of the hollow cylinder.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: May 10, 2011
    Assignee: Komori Corporation
    Inventors: Isao Komuro, Akehiro Kusaka
  • Patent number: 7854196
    Abstract: The invention relates to an apparatus for the coating or flocking of articles, especially of textile material, mats, ceramic, plastic, paper, wood, metal or the like, with a container (12) for receiving a flock or coating material, and with a setting device (16) which is arranged on the container (12) and which has a stencil frame (23) having at least one printing motif (27), the setting device (16) receiving at least one adjusting element (32) which acts in the X- and Y-direction and engages on the stencil frame (23), and the setting device (16) comprising arranged fixing elements (34) which are provided outside the stencil frame (23) at least for arranging an aligning device (38) for the stencil frame (23), in order to align the coating or printing motif (27) of the stencil frame (23) in the X- and Y-direction with respect to the fixing elements (34) by means of the aligning device (38).
    Type: Grant
    Filed: May 9, 2007
    Date of Patent: December 21, 2010
    Assignee: Heinz Walz GmbH
    Inventor: Markus Walz
  • Patent number: 7814861
    Abstract: A device for coating printed circuit boards with a fluid coating compound applied to the board surface is disclosed. The device has a conveyor for the printed circuit boards, a sprayer arranged over or under the conveyor, and a covering element on at least one side over an edge area of the printed circuit boards, wherein the area of the covering element covering the edge area of the printed circuit board can be moved away from the printed circuit board. The device also has a wiper, which wipes the coating compound moved away from the printed circuit board off from the covering element and supplies it to a holding tank.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: October 19, 2010
    Assignee: all4-Holding AG
    Inventors: Marc Hubner, Thomas Echensperger
  • Patent number: 7779776
    Abstract: A tool is provided for applying a flowable composition onto a receiving surface. The tool includes a polyceramic coating on a surface thereof and may take the form of a stencil or mold. Also provided are an apparatus and a method that uses the tool. In use, the tool is placed such that its polyceramic-coated surface is in contact with the flowable composition, which, in turn, simultaneously contacts the receiving surface.
    Type: Grant
    Filed: July 18, 2005
    Date of Patent: August 24, 2010
    Assignee: Tessera, Inc.
    Inventors: Jesse Burl Thompson, Hilda Cantor Tadio, Salvador A. Tostado, Apolinar Alvarez, Jr.
  • Patent number: 7757627
    Abstract: An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer, the coating material is then applied onto the object by the injector. This can increase the coating speed and quality.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: July 20, 2010
    Assignee: Inventec Corporation
    Inventors: Yi-Lun Cheng, Feng-Ku Wang, Chun-Lung Lin, Chih-Kai Yang
  • Publication number: 20090013929
    Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.
    Type: Application
    Filed: December 29, 2007
    Publication date: January 15, 2009
    Applicant: FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: TSO-HUNG YEH, HUNG-YI CHANG, CHIH-LUNG HSIAO
  • Patent number: 7412923
    Abstract: A stencil device ensures that solder paste is accurately applied to a printed circuit board to create a substantially zero signal degradation solder bridge electrical connection. The printed circuit board is defined by a dielectric structure core having a first surface which further includes a first conducting pad having an edge and a second conducting edge having an edge separated from and adjacent to the edge of the first conducting pad. The edges of the first and second conducting pads define therebetween a surface area of the first surface. The stencil device includes a stencil plate member defining a first opening sized to substantially correspond to the first conducting pad, a second opening sized to substantially correspond to the second conducting pad, and a third opening. The third opening links the first opening to the second opening at a size to correspond to a partial portion of the surface area of the first surface between the edges of the first and second conducting pads.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: August 19, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ian P. Shaeffer, Everett Basham, Christopher D. Price
  • Patent number: 7383770
    Abstract: A printing device, a production unit and a production method of electronic parts suitable for production of precise electronic parts are provided. A squeegee is attached to a rotating machine, and is autorotated and self-driven, and moreover, a printing pressure is generated in the squeegee, and resin is strongly filled, thereby achieving a print having a precision-shape. Further, with a perforated plate as a boundary, upper and lower chambers are provided so as to control a pressure, thereby performing cutting and dispensing of the resin and achieving a print having a precision-shape. This method is applied to the packaging of electronic parts.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: June 10, 2008
    Assignee: Tokai Shoji Co., Ltd.
    Inventor: Kenji Kambara
  • Publication number: 20080087178
    Abstract: An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.
    Type: Application
    Filed: February 20, 2007
    Publication date: April 17, 2008
    Applicants: Samsung Techwin Co., Ltd., PHOENIX DIGITAL TECH CO., LTD.
    Inventors: Min-hyun Jo, Weon-woo Nam, Joo-han Kim
  • Publication number: 20080087548
    Abstract: A mandrel for electroforming printing screens, the mandrel comprising: a mandrel plate onto which metal is to be deposited to form a printing screen, the mandrel plate including a main deposition surface onto which metal is to be deposited to define a main body of the printing screen, at least one pair of edge sections at opposed edges of the main deposition surface which include edge deposition surfaces which extend out of a plane defined by the main deposition surface onto which metal is to be deposited to define attachment elements of the printing screen, and corner sections at respective corners of the deposition surface; non-conductive elements, as edge elements, which are disposed at the edge sections such as to define an extent of the edge sections; and non-conductive elements, as corner elements, which are disposed at the corner sections such as to shield the same and define an extent of the main deposition surface at the corner sections.
    Type: Application
    Filed: October 19, 2005
    Publication date: April 17, 2008
    Inventor: Lee Edward James Bailey
  • Patent number: 7291226
    Abstract: A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: November 6, 2007
    Assignee: Lexmark International, Inc.
    Inventors: Jonathan H. Laurer, Jeanne M. Saldanha Singh, Paul T. Spivey, Mary C. Smoot
  • Patent number: 7185419
    Abstract: A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predetermined pattern and a surface roughness of the mask.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: March 6, 2007
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Chang Ho Kang, Tae Seung Kim
  • Patent number: 7096781
    Abstract: A screen printing apparatus for printing on a board, such as a circuit board, through a screen using a paste prior to surface-mounting electronic components on the board, and more particularly a screen printing apparatus that performs a screen printing while automatically discharging the paste that is accommodated inside the main body.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: August 29, 2006
    Assignee: Tani Denkikogyo Co., Ltd.
    Inventors: Tomoya Katano, Makoto Hashimoto
  • Patent number: 7087116
    Abstract: A method and apparatus for achieving a level exposed surface of a viscous material pool for applying viscous material to at least one semiconductor component by contacting at least a portion of the semiconductor component with viscous material within a reservoir. A level viscous material exposed surface is achieved by using at least one mechanism in association with the reservoir. The mechanism is configured to level the exposed surface of viscous material and maintain the exposed surface at a substantially constant level. The reservoir may be shaped such that the exposed surface of viscous material is supplied to a precise location.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: August 8, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Walter L. Moden, Syed S. Ahmad, Gregory M. Chapman, Tongbi Jiang
  • Patent number: 7077908
    Abstract: In a substrate holder for holding a circuit board onto which a viscous material for bonding electronic components is printed by use of a squeegee through a screen mask, a first holding area for holding the screen mask and a second holding area for holding the circuit board are provided on a base surface. The squeegee is supported by at least one of the first holding area and the second holding area. The squeegee is abutted against the circuit board being held to the second holding area, via the screen mask placed on the circuit board.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: July 18, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tatsuki Nogiwa, Hidehiko Uemura, Hironori Uemura
  • Patent number: 7045011
    Abstract: An integrated circuit screen printing nozzle that has a nozzle body, a first inner layer on the nozzle body, a second outer layer on the first layer, and an opening through the nozzle body, the first layer, and the second layer. The first and second layers can be an insert held within the body. The opening allows paste material to flow through the screen printing nozzle to the stencil mask. Also, the second outer layer includes a contact surface adapted to contact the stencil mask. One feature of the invention is that the first layer is softer (has a lower durometer) than the second layer. This allows the second layer to be more durable than the first layer and for the first layer to provide additional flexibility to the second layer. Therefore, the invention provides a nozzle that has the high durability characteristics of a hard outer surface with the compliance of a soft nozzle.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: May 16, 2006
    Assignee: International Business Machines Corporation
    Inventors: David C. Long, Jason S. Miller, Randall J. Werner
  • Patent number: 7040221
    Abstract: To keep a printing paste, which is most influential to a printing performance, always in a uniform state, carry out printing at a high accuracy and in a stable manner, and use an expensive paste with no waste, there is provided a printing paste automatic supplying apparatus which supplies a predetermined amount of printing paste (5) by charging the printing paste (5) in a printing paste supply bag (15) and pressurizing the printing paste (5), provided with a mechanism for opening and closing a printing paste supply port (7) by bringing a printing paste supply plate (6) having the printing paste supply port (7) into contact with the back surface side of a squeegee (4) and vertically moving them, and further provided with a scraper (9) which scrapes up the printing paste on a screen printing plate (3).
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: May 9, 2006
    Assignee: Minami Co., Ltd.
    Inventors: Takehiko Murakami, Shunji Murano, Takamasa Miyata
  • Patent number: 7009114
    Abstract: A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: March 7, 2006
    Assignee: Murata Manufacturing Co., LTD
    Inventors: Jun Urakawa, Mitsuyoshi Nishide, Isao Kato, Norio Yoshida, Tomonori Ito
  • Patent number: 6997107
    Abstract: A cream solder cartridge used in a screen printing apparatus which prints cream solder on a board through pattern holes by sliding, on a mask plate, a closed squeegee that is stored with cream solder inside is composed of a long and narrow concave portion made of a flexible film-like material, a brim portion projecting from the outer periphery of the concave portion, and a film-like cover sheet that is stuck to the brim portion and thereby closes the opening of the concave portion. This configuration makes it possible to supply paste at a low cost and to perform a viscosity adjustment easily by externally stirring the paste accommodated inside.
    Type: Grant
    Filed: June 16, 2003
    Date of Patent: February 14, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiko Abe, Seiichi Miyahara, Yuji Otake
  • Patent number: 6991717
    Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: January 31, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Gregory F. King, John S. Huizinga, James N. Dobbs, Luther E. Erickson, Daniel H. Carlson, Dale L. Ehnes, Gary A. Shreve
  • Patent number: 6981859
    Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: January 3, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shingo Okuyama, Tadahiro Nakagawa, Takehiko Miura, Makoto Fukuda
  • Patent number: 6962111
    Abstract: A screen-printing plate is provided with a plurality of printing patterns disposed in a single plate frame. Each printing pattern is formed with a plurality of mesh holes. At least two different aperture ratios of the mesh holes forming the printing patterns are provided according to the positions of regions on the screen-printing plate in which the printing patterns are disposed. The aperture ratio of the mesh holes forming the printing patterns positioned in a region close to the periphery of the plate frame is set higher than the aperture ratio of the mesh holes forming the printing patterns positioned in a central region of the plate frame.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: November 8, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuma Tanaka, Yuki Yamamoto, Takaaki Kawai
  • Patent number: 6890384
    Abstract: A method and apparatus for achieving a level exposed surface of a viscous material pool for applying viscous material to at least one semiconductor component by contacting at least a portion of the semiconductor component with viscous material within a reservoir. A level viscous material exposed surface is achieved by using at least one mechanism in association with the reservoir. The mechanism is configured to level the exposed surface of viscous material and maintain the exposed surface at a substantially constant level. The reservoir may be shaped such that the exposed surface of viscous material is supplied to a precise location.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: May 10, 2005
    Assignee: Micron Technology, INC
    Inventors: Walter L. Moden, Syed S. Ahmad, Gregory M. Chapman, Tongbi Jiang
  • Patent number: 6858249
    Abstract: Method for partially applying high viscosity liquids to a supporting material whereby the liquid is applied by means of a nozzle which opens into an orifice, and is extruded through a screen on to the supporting material, which rests on a pressure-resistant substrate, but distinguished by the geometry of the nozzle being so arranged that the nozzle outlet slit opens into an orifice which feeds the liquid to the screen, and in that orifice an increase of pressure in the liquid is generated so that the pressure in the liquid at the nozzle orifice is higher than the pressure in the nozzle outlet slit.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: February 22, 2005
    Assignee: Beiersdorf AG
    Inventor: Michael Zschaeck
  • Patent number: 6852366
    Abstract: Method for applying liquids, in particular thermoplastics, to a substrate, whereby the substance is melted, heated and by means of a nozzle or doctor blade is passed through a perforated cylinder on to a supporting material, distinguished by the perforated cylinder being heated in the arc segment where the liquid passes through, which arc segment covers an angle of up to 180°, preferably between 5° and 90° in relation to the center point of the screen.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: February 8, 2005
    Assignee: Beiersdorf AG
    Inventor: Michael Zschaeck
  • Patent number: 6814804
    Abstract: A filling squeegee and a scraping squeegee are provided in a printing apparatus. The filling squeegee is moved without contacting a surface of a mask in order to fill a solder paste into openings of the mask. Unnecessary solder paste on the surface of the mask is scraped by the scraping squeegee. The solder paste is prevented from being improperly filled in or scraped from the openings even if a speed of the squeegee is increased, so that the solder paste can be printed stably on circuit board.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: November 9, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Onishi, Shoji Sato, Takao Naito, Takaaki Higashida, Akira Kabeshita