Work Holders, Or Handling Devices Patents (Class 118/500)
  • Patent number: 11345038
    Abstract: A biological reaction apparatus for receiving at least one substrate having a sample located in a sample region, and a separate cover, such that a reaction chamber is formed between the cover and substrate over the sample region, wherein the apparatus includes a locating means to locate the substrate; a cover locating means for locating and moving the cover with respect to the substrate; a fluid dispensing means for dispensing fluid into the reaction chamber; and a draining mechanism; wherein the draining mechanism includes wicking means.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: May 31, 2022
    Assignee: LEICA BIOSYSTEMS MELBOURNE PTY LTD
    Inventors: Stuart Elliot, Andrew McLellan, Chester Henderson, Mark Dockrill, Simon Harris, Peter Riddell
  • Patent number: 11322379
    Abstract: A wafer storage box, wafer transfer device and wafer storage box and transfer assembly. The wafer storage and transfer assembly includes a chassis which is capable of translating or rotating, a sliding shaft, connecting levers, arms and at least two positioning sidewall. The chassis includes a groove. The sliding shaft can translate along the groove. The connecting levers are connected to the sliding shaft. Each arm extends from a connecting lever. The two positioning sidewall are respectively arranged on opposite sides of the chassis. Each positioning sidewall includes tracks accommodating the pins of connecting levers. The width of each of the tracks reduces from the front end of the positioning sidewall to the back end of the positioning sidewall. The wafer storage and transfer assembly can vacuum adsorb several wafers to achieve high efficiency of wafer storing and transferring.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: May 3, 2022
    Assignee: DLY Technologies Inc.
    Inventor: Shih Feng Pan
  • Patent number: 11309200
    Abstract: A back side substrate support portion 6 includes a lower side inclined face 622 on which an end of a back face of a substrate W slides, and a substrate support portion 632 that is located above the lower side inclined face 622 and can support an edge portion of the substrate W. When a container main body opening portion 21 is closed by a lid body 3, the edge portion of the substrate W slides on the lower side inclined face 622 and reaches the substrate support portion 632. At least a portion of the lower side inclined face 622 is configured from a second member that is different from a first member that configures the substrate support portion 632, and the second member has a lower maximum static friction coefficient and lower wear resistance than the first member.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: April 19, 2022
    Assignee: MIRAIAL CO., LTD.
    Inventor: Satoko Kai
  • Patent number: 11298715
    Abstract: A coating mask for bearing and covering a portion of a to-be-plated component includes at least one bearing unit. Each bearing unit includes a first bearing portion, a second bearing portion, and at least two ribbed plates. An annular groove is defined between the first bearing portion and the second bearing portion. The at least two ribbed plates are formed in the annular groove. Each of the at least two ribbed plates includes a first ribbed portion and a second ribbed portion connected to the first ribbed portion. The first ribbed portion is connected to the second bearing portion; the second ribbed portion is connected to the first bearing portion. An included angle ?1 is defined by the first ribbed portion and the second ribbed portion, and ?1 is an obtuse angle. The disclosure also relates to a coating device.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: April 12, 2022
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ya-Lan Feng, Chun-Cheng Ko
  • Patent number: 11292023
    Abstract: The present invention provides a substrate processing apparatus including: a process chamber having a process space in which a substrate is processed; a substrate support including a susceptor having a plurality of pocket grooves recessed in a circumferential direction from a top surface with a circular plate shape so that the substrate is seated, a shaft configured to rotate the susceptor, and a satellite seated in the pocket groove and on which the substrate is seated; and a gas injection unit disposed at an upper portion of the process chamber to face the substrate support, thereby injecting a process gas toward the substrate support.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: April 5, 2022
    Assignee: WONIK IPS CO., LTD.
    Inventors: Woo Young Park, Ja Hyun Koo, Chang Hee Han, Sung Eun Lee, Sung Ho Jeon, Byoung Guk Son, Sung Ho Roh, Yeong Taek Oh
  • Patent number: 11282721
    Abstract: A vertical heat treatment apparatus includes: a substrate holder including a column, substrate holding parts configured to hold the substrates, and gas flow guide parts installed in the column in a corresponding relationship with the substrates; an elevator stand configured to support the substrate holder and to load the substrate holder into the reaction vessel from below the reaction vessel; a rotating mechanism installed in the elevator stand and configured to rotate the substrate holder about a vertical axis; a process gas supply port and an exhaust port respectively formed at a rear side and a front side of a substrate holding region; and a plurality of baffle parts installed independently of the substrate holder so that the baffle parts protrude from the outside toward spaces between the gas flow guide parts adjoining each other and run into the spaces.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: March 22, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroki Iriuda, Kohei Fukushima
  • Patent number: 11274371
    Abstract: Provided is a susceptor, capable of preventing occurrence of scratches on the back surface of a wafer attributable to lift pins, and reducing unevenness of the in-surface temperature distribution of the wafer. A susceptor according to one embodiment of this disclosure has a susceptor main body and a plate-shaped member, and when a wafer is conveyed, the front surface of the plate-shaped member ascended by lift pins supports the central part of the back surface of the wafer by surface contact. A separation space between the plate-shaped member and the susceptor main body, in a state in which the plate-shaped member is placed on the recessed part, enters further into the central side of the plate-shaped member, in a direction from the front surface to the back surface of the susceptor.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: March 15, 2022
    Assignee: SUMCO CORPORATION
    Inventors: Shoji Nogami, Naoyuki Wada, Masaya Sakurai, Takayuki Kihara
  • Patent number: 11276602
    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate includes first and second major surfaces, and at least one groove. The second major surface is opposite to the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided between the groove and the gas feed channel. The ceramic dielectric substrate includes holes communicating with the groove and the gas feed channel and piercing the ceramic dielectric substrate in a first direction from the base plate toward the ceramic dielectric substrate. The first porous part includes at least one porous region including pores, and at least one dense region denser than the porous region. The porous region further includes at least one dense part.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: March 15, 2022
    Assignee: Toto Ltd.
    Inventors: Jun Shiraishi, Shuichiro Saigan, Tatsuya Mori, Masahiro Watanabe, Yuki Sasaki
  • Patent number: 11273464
    Abstract: A substrate processing apparatus includes a cover member placed to surround a substrate held by a rotary holder; a collecting member placed in an exhaust path formed between the cover member and the rotary holder; and a solvent supply placed above the collecting member and configured to supply a solvent to the collecting member. The solvent supply includes an inner storage space surrounding the substrate; an outer storage space surrounding the inner storage space; and a partition wall extending along a circumferential direction to partition the inner storage space and the outer storage space. Multiple communication holes are extended to penetrate the partition wall such that the solvent introduced into the outer storage space flows to the inner storage space. Multiple dripping holes are extended to penetrate a bottom wall of the inner storage space such that the solvent within the inner storage space drops toward the collecting member.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 15, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Satoshi Shimmura, Yuji Sakai, Kenta Shibasaki, Koji Takayanagi, Kenji Yada, Hiroichi Inada, Shinichi Seki, Kento Ogata
  • Patent number: 11248295
    Abstract: A wafer carrier for use in a chemical vapor deposition (CVD) system includes a plurality of wafer retention pockets, each having a peripheral wall surface surrounding a floor surface and defining a periphery of that wafer retention pocket. Each wafer retention pocket has a periphery with a shape defined by at least a first arc having a first radius of curvature situated around a first arc center and a second arc having a second radius of curvature situated around a second arc center. The second arc is different from the first arc, either by its radius of curvature, arc center, or both.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: February 15, 2022
    Assignee: Veeco Instruments Inc.
    Inventors: Sandeep Krishnan, Lukas Urban
  • Patent number: 11232959
    Abstract: Substrates can be suppressed from being separated from supporting grooves. A substrate processing apparatus includes a substrate holding unit and a processing tub. The substrate holding unit is configured to hold multiple substrates. The processing tub is configured to store a processing liquid therein. The substrate holding unit includes a supporting body, an elevating device and a restriction unit. The supporting body has multiple supporting grooves and is configured to support the multiple substrates with a vertically standing posture from below in the multiple supporting grooves, respectively. The elevating device is configured to move the supporting body between a standby position above the processing tub and a processing position within the processing tub. The restriction unit is configured to be moved up and down along with the supporting body by the elevating device and configured to restrict an upward movement of the substrates with respect to the supporting body.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: January 25, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takumi Honda, Koji Yamashita, Shinji Tahara, Hironobu Hyakutake
  • Patent number: 11226368
    Abstract: A method of controlling a placement apparatus including a stage, a support table, a rotary drive mechanism rotating the stage including a first motion conversion mechanism configured to convert a rotary motion of a drive motor into a linear motion of a moving body and a second motion conversion mechanism configured to convert a linear motion of the moving body into a rotary motion of the stage, and a controller. The method includes a first correction step of calculating a first correction value of a drive angle of the stage for a linear movement amount of the moving body, a second correction step of obtaining a second correction value based on an error for each predetermined pitch, and a drive step of rotationally driving the stage based on the first and second correction values obtained in the first correction step and the second correction step.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: January 18, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Tomoya Endo
  • Patent number: 11219915
    Abstract: A positioning clamp for spray-coating of a wheel trim ring includes a lower base plate, a circular bracket, an upper base plate, a plurality of guide rods, a plurality of sliding support parts and a distance adjusting mechanism. The distance adjusting mechanism is configured to drive the plurality of sliding support parts to approach a central position along the guide rods and to move away from the central position along the guide rods. According to the positioning clamp for spray-coating of the wheel trim ring, the position of each sliding support part can be adjusted to adapt to wheel trim rings of different sizes. Therefore, the positioning clamp for spray-coating of the wheel trim ring can replace a large number of positioning clamps of different sizes, and has the advantages of being simple in structure, stable and reliable in positioning, low in manufacturing cost and the like.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: January 11, 2022
    Assignee: CITIC DICASTAL CO., LTD.
    Inventors: Zuo Xu, Xiao Liu, Yudong Li, Xiaopeng Chen
  • Patent number: 11203808
    Abstract: A mask plate includes a plurality of first supporting and shielding strips, and a plurality of second supporting and shielding strips. The second supporting and shielding strips and the first supporting and shielding strips perpendicularly intersect. The first supporting and shielding strips and the second supporting and shielding strips are provided with at least one objective supporting and shielding strip, and an edge of a predetermined surface of the objective supporting and shielding strip parallel to an extending direction of the objective supporting and shielding strip is provided with a thinned area; the thinned area extends in the extending direction of the objective supporting and shielding strip, and has a thickness smaller than a thickness of other areas except the thinned area; and the predetermined surface is a surface of the objective supporting and shielding strip facing a deposition material when a mask evaporation is performed through the mask plate.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: December 21, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Haibin Zhu, Weijie Wang, Fengjie Zhang, Bo Jiang
  • Patent number: 11195704
    Abstract: Pedestal assemblies for processing apparatus, such as plasma processing apparatus are provided. In one example implementation, a plasma processing apparatus can include a processing chamber having a processing chamber interior. The apparatus can include a plasma source configured to induce a plasma in the processing chamber interior. The apparatus can include a pedestal configured to support a substrate in the processing chamber interior during processing of the substrate. The apparatus can include a focus ring configured to be disposed around a periphery of the substrate when the substrate is supported on the pedestal. The focus ring can have a plurality of uniformly spaced apart slots. Each slot can be configured to engage with a corresponding protrusion located on the pedestal.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: December 7, 2021
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
    Inventors: Martin L. Zucker, Tinghao Frank Wang
  • Patent number: 11161221
    Abstract: A device for maintaining a plurality of doors in an upright position includes a body with a plurality of connecting portions extending therefrom. Each connecting portion has a connecting surface configured to abut a side of one of the doors.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: November 2, 2021
    Assignee: 637894 Ontario Inc.
    Inventor: Marcel St. John
  • Patent number: 11133209
    Abstract: Disclosed is a transfer head for transferring micro-LEDs from a first substrate to a second substrate, particularly, using a vacuum adsorption method. The transfer head includes a porous member having a plurality of pores, in which the micro-LEDs are transferred by creating or releasing a vacuum pressure in the pore of the porous member.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: September 28, 2021
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Patent number: 11133207
    Abstract: A method for forming a film is provided. The method includes sequentially placing a first wafer, a second wafer, and a third wafer in a chamber. The first wafer is separated from the second wafer by a first distance, the second wafer is separated from the third wafer by a second distance, and the first distance is smaller than the second distance. At least one process gas is introduced sequentially passing through the first wafer, the second wafer and the third wafer in the chamber.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: September 28, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Bin Yang, Feng-Yu Chen, Jian-Lun Lo
  • Patent number: 11133203
    Abstract: Temperature uniformity in a mounting surface of a mounting table is improved. A plasma processing apparatus includes the mounting table having thereon the mounting surface on which a work-piece serving as a plasma processing target is mounted; a coolant path formed within the mounting table along the mounting surface of the mounting table; and an inlet path connected to the coolant path from a backside of the mounting surface of the mounting table and configured to introduce a coolant into the coolant path. The inlet path is extended from the backside of the mounting surface of the mounting table such that an extension direction of the inlet path is inclined at an angle greater than 90° with respect to a flow direction of the coolant flowing through the coolant path, and then, connected to the coolant path.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: September 28, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Satoshi Suzuki, Akira Ishikawa
  • Patent number: 11118267
    Abstract: A method of processing a substrate, includes: mounting at least one substrate on at least one substrate holder configured to rotate about an axis of the at least one substrate holder, the at least one substrate holder being provided along a circumferential direction of a rotary table installed inside a processing chamber; holding the at least one substrate by the at least one substrate holder in a contact manner by bringing a substrate contact portion into contact with at least three points on a lateral surface of the at least one substrate mounted on the at least one substrate holder; and performing a substrate process while rotating the rotary table and rotating the at least one substrate holder about the axis of the at least one substrate holder in a state where the at least one substrate is held by the at least one substrate holder in the contact manner.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: September 14, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hitoshi Kato, Toshiyuki Nakatsubo, Takeshi Kobayashi, Tomoya Hasegawa
  • Patent number: 11107998
    Abstract: A transparent electrode includes a conductive layer and at least one metal affinity layer adjacent to the conductive layer. The conductive layer is composed of silver as a main component. The metal affinity layer contains an organic compound and a lanthanoid. The organic compound is a compound including a heteroatom having an unshared electron pair in a molecule.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: August 31, 2021
    Assignee: KONICA MINOLTA, INC.
    Inventors: Noboru Sekine, Hiroki Kurata
  • Patent number: 11088014
    Abstract: An embodiment is a method. The method includes: dispensing a plurality of precursor materials over a collective wafer platter holding a plurality of wafers; heating the collective wafer platter while dispensing the precursor materials; rotating the collective wafer platter around a first axis while dispensing the precursor materials and heating the collective wafer platter; rotating the wafers around respective second axes while dispensing the precursor materials and heating the collective wafer platter, the first axis different from each of the second axes; and singulating integrated circuit devices from each of the wafers.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: August 10, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Yung-Chang Chang
  • Patent number: 11079018
    Abstract: A container for exchanging a fluid under pressure has a cylindrical tank with caps and seals at opposite ends of the tank. The caps are moved between the unsealed arrangement and the sealed arrangement using a tie rod engaging threaded bores in the caps. Each seal is held in a groove in a flange of each cap which is spaced from a shoulder between the flange and the cap's head. In the sealed arrangement, the seals are radially compressed between the flange and the tank's interior sidewall. With a central tie rod threadedly connected to threaded bores at the center of the caps, rotating the caps relative to the tank axially moves the caps between the sealed arrangement and the unsealed arrangement. The top cap has a fill port with a threaded plug, an inlet port, and an outlet port with a tube extending to the bottom of the tank.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: August 3, 2021
    Inventor: Joseph F. Foreman
  • Patent number: 11075105
    Abstract: Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: July 27, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yogananda Sarode Vishwanath, Steven E. Babayan, Stephen Prouty, Andreas Schmid
  • Patent number: 11053582
    Abstract: The present invention provides a support that comprises: an electrically conductive biased table; an insulating electrostatic substrate carrier 20 in the form of a cylinder having a shoulder 21, the bottom face of the substrate carrier 20 facing the biased table and its top face 22 presenting a bearing plane designed to receive a substrate; and an electrically conductive clamping collar for clamping the shoulder 21 against the biased table. The support also has at least one electrically conductive element 201-202-203 for connecting the bearing plane to the shoulder 211.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: July 6, 2021
    Assignee: ION BEAM SERVICES
    Inventors: Frank Torregrosa, Laurent Roux
  • Patent number: 11049751
    Abstract: The invention relates to a cassette supply system to store and handle cassettes for substrates and a processing apparatus for processing substrates equipped with said system. The system having a cassette storage provided with base plate constructed and arranged to support cassettes. Also a cassette handler with an end effector with at least one protrusion to support and position the cassette on the end effector is provided to transfer cassettes to and from the base plate. The base plate may be provided with a substantially flat surface to support the cassettes.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 29, 2021
    Assignee: ASM IP Holding B.V.
    Inventor: Chris de Ridder
  • Patent number: 11043405
    Abstract: A method includes transferring a wafer from a process chamber onto a plurality of robotic fingers outside the process chamber, elevating a wafer chuck until reaching the wafer, applying a first suction force to the wafer using a vacuum hole on the wafer chuck, and applying a second suction force toward the wafer using a porous pipe around the wafer chuck.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: June 22, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Ting-Yu Kang
  • Patent number: 11028472
    Abstract: An apparatus and method for metallizing parts in an efficient manner. The apparatus includes a plurality of plates stacked vertically and spaced from one another, wherein each plate has an outer perimeter. There is a plurality of part supports arranged about the outer perimeter of each plate. A support frame is secured to the plurality of plates such that it may rotate about the outer perimeter of the plates while maintaining substantially the same distance from the outer perimeter of each plate. There is one or more rotation drive systems attached to the support frame and positioned such that one or more compliant drive fingers are in close proximity to the outer perimeter of each plate. The stacked plates may be moved between a metallizer and parts loading and unloading stations in a convenient manner.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: June 8, 2021
    Inventors: Donald G. Parent, John F. Feeley
  • Patent number: 11020766
    Abstract: A spin coating apparatus, system, and/or method that increase the uniformity of a coating material on a substrate. The spin coating system may be specifically directed for use with polygonal shaped substrates. The spin coating system may include a process chamber within which the substrate is located, spinning on a chuck, during operation. The spin coating system may include gas injection ports that inject a gas into the process chamber so that the gas contacts the substrate along corner portions of its front surface. This injection of the gas increases pressure and prevents excessive build-up of the coating material that may otherwise occur when spin coating polygonal shaped substrates.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: June 1, 2021
    Inventors: Gary Hillman, Joseph Deghuee
  • Patent number: 11015244
    Abstract: A reaction chamber includes an enclosure having an interior coated with a metal nitride compound providing an average reflectivity to internal infra-red radiation of greater than 90%. The metal nitride compound can be titanium nitride, zirconium nitride, hafnium nitride, or a nitride of another metal, and can be between 0.1 and 10 microns thick, preferably between 4 and 5 microns thick. The layer does not tarnish, and can withstand reaction chamber temperatures up to at least 250° C., preferably up to 300° C. It is applied by a deposition process, such as PVD, CVD, thermal spray, or cathodic arc, wherein the enclosure itself is the metal nitride deposition enclosure. Uniformity of deposition can be improved by rotating the deposition source through T degrees and back through T±d, with a total of 360/d repetitions. The reactor can be a CVD reactor that deposits polysilicon onto a heated filament.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: May 25, 2021
    Assignee: Advanced Material Solutions, LLC
    Inventors: Jeffrey C Gum, Bryce E Clark, Paul E Gannon, Mike McFarland, Shiva Mandepudi
  • Patent number: 11011355
    Abstract: A system for controlling a temperature of a substrate during treatment in a substrate processing system includes a substrate support defining a center zone and a radially-outer zone. The substrate is arranged over both the center zone and the radially-outer zone during treatment. A first heater is configured to heat the center zone. A second heater is configured to heat the radially-outer zone. A first heat sink has one end in thermal communication with the center zone. A second heat sink has one end in thermal communication with the radially-outer zone. A temperature difference between the center zone and the radially-outer zone is greater than 10° C. during the treatment.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: May 18, 2021
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Norman Mertke, Himanshu Chokshi
  • Patent number: 11011353
    Abstract: A substrate support in a substrate processing system includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and a controller. The controller at least one of raises the edge ring to selectively cause the edge ring to engage the substrate and lowers the inner portion to selectively cause the edge ring to engage the substrate. The controller determines when the edge ring engages the substrate and calculates at least one characteristic of the substrate processing system based on the determination of when the edge ring engages the substrate.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: May 18, 2021
    Assignee: Lam Research Corporation
    Inventors: Marcus Musselman, Andrew D. Bailey, III, Jon McChesney
  • Patent number: 11007497
    Abstract: A gas jetting apparatus capable of uniformly jetting, even onto a treatment-target object having a high-aspect-ratio groove, a gas into the groove. The gas jetting apparatus includes a gas jetting cell unit for jetting a gas toward a treatment-target object. The gas jetting cell unit includes a first cone-shaped member and a second cone-shaped member. A gap is formed between a side surface of a first cone shape and a side surface of the second cone-shaped member. Apex sides of the cone-shaped members face the treatment-target object.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: May 18, 2021
    Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Yoichiro Tabata, Kensuke Watanabe, Shinichi Nishimura
  • Patent number: 10978326
    Abstract: The present disclosure describes a device and a method for substrate storage. The device can include a first and a second groups of panels configured to form an enclosed volume, and fin structures disposed at inner surfaces of the second group of panels. Each of the fin structures can be configured to hold a substrate. Each fin structure can include a protrusion extending inwardly into the enclosed volume and a binding device disposed over the protrusion. The binding device can be configured to bind the substrate over the protrusion.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 13, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co, , Ltd.
    Inventors: Yu Ju- Chen, Ren-Hao Jheng
  • Patent number: 10968513
    Abstract: Provided is a plasma film-firming apparatus including: a chamber configured to accommodate a substrate therein; a substrate pedestal configured to disposed the substrate thereon within the chamber; a gas supply mechanism configured to supply a gas including a film-forming gas into the chamber; an exhaust mechanism configured to exhaust an inside of the chamber; and a plasma generating unit configured to generate plasma in the chamber. The substrate pedestal includes a pedestal body having a smaller diameter than that of the substrate and including a placement surface, and an annular adjustment member disposed outside the pedestal body. The adjustment member is replaceably installed. A plurality of adjustment members having various steps are provided at a position outside the substrate as the adjustment member, and among the plurality of adjustment members, an adjustment member is selected and used according to a processing condition of a plasma processing.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 6, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masashi Imanaka, Toshio Nakanishi, Minoru Honda, Koji Kotani
  • Patent number: 10971388
    Abstract: A chuck useful for supporting a wafer during an edge bevel removal (EBR) process comprises a rotatable center hub having a plurality of support arms extending outwardly from the rotatable center hub, support pins on ends of the support arms, gas passages extending through upper surfaces of the support pins, and gas conduits in the support arms. The gas conduits supply gas to the gas passages or apply a vacuum to the gas passages. The support arms can include alignment cams which are rotatable from an outer non-alignment position away from a periphery of the wafer to an inner alignment position at which the wafer is centered. During centering, the wafer is floated on a gas cushion which reduces wear of the support pins.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: April 6, 2021
    Assignee: Lam Research Corporation
    Inventors: Aaron Louis LaBrie, Robert Lynden Braendle, Cian Owen Sweeney
  • Patent number: 10955123
    Abstract: Disclosed is a method for fabricating a micro-LED module. The method includes: preparing a circuit board; forming solder bumps on one surface of the circuit board; arranging micro-LED chips on the one surface of the circuit board such that the micro-LED chips are in contact with the solder bumps; heating the solder bumps to bond the micro-LED chips to the one surface of the circuit board through the solder bumps; arranging driver ICs on the other surface of the circuit board such that the driver ICs are in contact with solders on the other surface of the circuit board in a state in which the micro-LED chips are bonded to the circuit board; and heating the solders to bond the driver ICs to the other surface of the circuit board through the solders. The micro-LED chips are arranged on the one surface of the circuit board after the flatness of the circuit board is enhanced.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: March 23, 2021
    Assignee: LUMENS CO., LTD.
    Inventor: Juok Seo
  • Patent number: 10950472
    Abstract: A ring support is attached to an inner wall surface of a chamber that houses a semiconductor wafer to support a susceptor. When the semiconductor wafer is placed on the susceptor, an inner space of the chamber is separated into an upper space and a lower space. Particles are likely to accumulate on a lower chamber window as a floor part of the chamber. However, since the upper space and the lower space are separated, the semiconductor wafer can be prevented from being contaminated by the particles flowing into the upper space and adhering to a surface of the semiconductor wafer even when the particles on the lower chamber window are blown up by irradiation with flash light.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: March 16, 2021
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Takahiro Yamada, Makoto Abe, Kazuhiko Fuse, Jun Watanabe, Shinji Miyawaki
  • Patent number: 10930492
    Abstract: A method for producing a SiC epitaxial wafer using an apparatus including a mounting plate having a recessed accommodation portion and a satellite disposed in the recessed accommodation portion, and configured so that a SiC substrate is placed on an upper surface thereof. The method includes supplying a dopant carrier gas to an outer circumference of the SiC epitaxial wafer from between the recessed accommodation portion and the satellite.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: February 23, 2021
    Assignee: SHOWA DENKO K.K.
    Inventor: Tatsuya Masuda
  • Patent number: 10903095
    Abstract: Nitrogen gas supplied from the outside of a chamber flows into an annular first buffer to diffuse uniformly along the circumferential direction of a gas ring. The nitrogen gas filled in the first buffer flows into a second buffer with having a volume larger than that of the first buffer to diffuse more uniformly along the circumferential direction of the gas ring. The nitrogen gas filled in the second buffer flows into a labyrinth portion to flow through a bent flow path of the labyrinth portion from the inside toward the outside along the radial direction of the gas ring, so that a flow rate of the nitrogen gas decreases. The nitrogen gas flowing out of the labyrinth portion flows into a discharge flow path, and flows from the outside toward the inside along the radial direction of the gas ring to be discharged from the gas discharge opening.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: January 26, 2021
    Assignee: SCREEN HOLDINGS CO., LTD.
    Inventors: Nobuhiko Nishide, Takuya Kamimura
  • Patent number: 10879094
    Abstract: An electrostatic chucking force tool is described that may be used on workpiece carriers for micromechanical and semiconductor processing. One example includes a workpiece fitting to hold a workpiece when gripped by an electrostatic chucking force by an electrostatic chuck, an arm coupled to the workpiece fitting to pull the workpiece through the workpiece fitting laterally across the chuck, and a force gauge coupled to the arm to measure an amount of force with which the workpiece fitting is pulled by the arm in order to move the workpiece.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: December 29, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Srinivas D. Nemani, Gautam Pisharody, Seshadri Ramaswami, Shambhu N. Roy, Niranjan Kumar
  • Patent number: 10870922
    Abstract: An assembly used in a process chamber for depositing a film on a wafer including a pedestal assembly having a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal. A raising mechanism separates the pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, a lever rotatably attached to lift pad bracket, a ferroseal assembly surrounding the pad shaft, and a yoke assembly offsetting a moment to the ferroseal assembly when the lever rotates. When the pedestal assembly moves upwards, the lever rotates when engaging with the upper hard stop and roller, and separates the pad from the pedestal by a process rotation displacement.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: December 22, 2020
    Assignee: Lam Research Corporation
    Inventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
  • Patent number: 10865499
    Abstract: A susceptor for holding a semiconductor wafer during the deposition of an epitaxial layer on a front side of the semiconductor wafer, has a susceptor ring and a susceptor base, and recesses below the susceptor ring in the susceptor base which are arranged in a manner distributed rotationally symmetrically. The radial width of the recesses is greater than the radial width of the susceptor such that the susceptor ring does not completely cover the recesses.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: December 15, 2020
    Assignee: SILTRONIC AG
    Inventor: Joerg Haberecht
  • Patent number: 10847401
    Abstract: A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a water pathway disposed inside the water pathway portion and having an entire wall surface thereof constituted by the water pathway portion, wherein the baseplate and the water pathway portion are directly bonded to each other.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: November 24, 2020
    Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., TOHOKU SEIMITSU CO., LTD.
    Inventors: Norio Shiraiwa, Syuuichi Andou, Kenji Takatsuka, Katsuhiro Kosuga
  • Patent number: 10821465
    Abstract: A spherical core spraying tool comprises a spraying spindle and connecting rods; the spraying spindle is circumferentially provided with a plurality of protruding rings, and is axially provided with a strip-shaped groove; the connecting rods are disposed in the groove; one end of the spraying spindle is a power input end, and the other end is provided with a locking sleeve; the groove runs through the protruding rings. By spot-welding steel balls in an inner hole of a spherical core and fitting the spherical core over the spraying spindle, the steel balls are stuck in the groove of the spraying spindle, and the both sides of the steel balls are tightened by means of the connecting rods in abutting-against fashion, so that a plurality of spherical cores is fixed together with the spraying spindle, and the plurality of spherical cores can be spray-coated simultaneously, thereby improving the efficiency.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: November 3, 2020
    Assignee: WUZHONG INSTRUMENT CO., LTD.
    Inventors: Yushan Ma, Jun Li, Zhandong Chang, Yongxing Zhou, Yongxiang Ding, Husheng Li
  • Patent number: 10818532
    Abstract: A substrate processing apparatus includes a processing section that performs a batch process to a plurality of substrates. A first substrate transport mechanism removes one of substrates contained in a substrate container placed on a stage, and transport the substrate to a position adjusting unit, in which the position of the substrate in the rotating direction of the substrate is adjusted, and transports the substrate back to the substrate container. Then a second substrate transport mechanism collectively removes from the substrate container the substrates whose positions in the rotating direction have been adjusted by the position adjusting unit.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: October 27, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Keiji Onzuka, Kouki Murakami, Hirozumi Hoshino
  • Patent number: 10814488
    Abstract: To hold a long member in the original shape of the long member at a precise position, a long member assembling device has: a plurality of hand parts configured to grip a long member; arm parts and trunk parts configured to move the hand parts to adjust the positions of the plurality of hand parts gripping the long member; a storage unit in which the original shape of the long member is stored; and a control unit configured to, on the basis of the original shape of the long member stored in the storage unit, drive the arm parts and the trunk parts to adjust the positions of the plurality of hand parts gripping the long member such that the shape of the long member gripped by the plurality of hand parts matches the original shape of the long member stored in the storage unit.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: October 27, 2020
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Toshihiro Tombe, Takuya Goto, Takahiro Inagaki, Makoto Hirai, Naoki Goto, Masanobu Mizukami, Katsumi Nakamura
  • Patent number: 10814547
    Abstract: A method for stereolithography printing, including the steps of positioning a holder containing a printing material in a first position in a stereolithography apparatus; stereolithography printing a plurality of successive layers in said holder using radiation for solidifying the printing material, such that one or more objects are formed; moving said holder from said first position to a second position away from said first position; opening said holder and removing said one or more objects from said opened holder, in said second position of the holder.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: October 27, 2020
    Assignee: Xeikon Prepress N.V.
    Inventor: Bart Mark Luc Wattyn
  • Patent number: 10811291
    Abstract: Provided is a wafer container including a frame and at least a pair of the stents. The frame has opposite sidewalls. The at least a pair of the stents is respectively disposed on the sidewalls of the frame, wherein the at least a pair of the stents is configured to provide at least three supporting points to support at least one wafer. A method for holding at least one wafer is also provided.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: October 20, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Kang Liu, Chi-Chung Jen, Jui-Ming Huang, Wan-Ting Liao
  • Patent number: RE48903
    Abstract: An apparatus for transferring a target, such as a substrate or a substrate support structure onto which a substrate has been clamped, from a substrate transfer system to a vacuum chamber of a lithography system. The apparatus comprises a load lock chamber for transferring the target into and out of the vacuum chamber. The load lock chamber comprises a first wall with a first passage providing access between a robot space and the interior of the load lock chamber, a second wall with a second passage providing access between the interior of the load lock chamber and the vacuum chamber, and plurality of handling robots for transferring the targets comprising: a first handling robot movable within the robot space to access the substrate transfer system and the first passage; and a second handling robot movable within the load lock chamber to access the first passage and the second passage.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: January 25, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Vincent Sylvester Kuiper, Erwin Slot, Marcel Nicolaas Jacobus Van Kervinck, Guido De Boer, Hendrik Jan De Jong