Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

Abstract: A coating device includes: a stage transfer part including a first long shaft extending in a first direction and a second long shaft extending in a second direction intersecting the first direction; a stage tilting part disposed on the stage transfer part, where the stage tiling part swings about a first swing axis; a stage rotating part disposed on the stage tilting part, where the stage rotating part rotates about a first rotating axis intersecting the first swing axis; a stage aligning part disposed on the stage rotating part, where the stage aligning part includes a first short shaft extending in the first direction and a second short shaft extending in the second direction; and a stage disposed on the stage aligning part, wherein a coating target is seated on the stage, where the stage includes a monitoring camera disposed in a camera seating space defined inside the stage.

Abstract: A semiconductor device manufacturing system includes a spin coater and a coating layer inspector. The spin coater includes: a chuck, a rotation driver configured to rotate the chuck; and a solution dispenser configured to spray a solution onto a portion of the coating layer formed on an edge portion of the wafer, wherein the coating layer inspector includes an edge inspection camera and an inspection controller configured to determine a radius, eccentricity, and a top-view shape of the coating layer, based on images of the edge portion of the wafer.

Abstract: A coating film forming method includes holding a substrate by a substrate holder; forming an air flow on a front surface of the substrate; supplying a coating liquid configured to form a coating film on the front surface; forming, after moving a covering member from a first position to a second position relatively to the substrate, the air flow in a gap formed by the covering member placed at the second position and the front surface of the substrate being rotated at a first rotation number such that a flow velocity of the air flow becomes larger than that of the air flow obtained when the covering member is placed at the first position; and rotating the substrate at a second rotation number higher than the first rotation number to adjust a film thickness distribution of the coating film by scattering the coating liquid from a peripheral portion thereof.

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, the device including an assembly chamber having a space for accommodating a fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part.

Abstract: A substrate processing apparatus includes a substrate holder configured to hold a substrate, a rotary driver configured to rotate the substrate holder around a rotation axis, a processing liquid nozzle configured to eject a processing liquid toward a peripheral portion of the substrate, and a gas nozzle configured to eject a gas toward the processing liquid from a time at which the processing liquid is ejected from an ejection port of the processing liquid nozzle until a time at which the processing liquid arrives at a liquid arrival point on the substrate.

Abstract: The inventive concept provides an apparatus for processing a substrate. The apparatus includes a mount; a processing liquid supply nozzle configured to provide a processing liquid to the substrate and a discharge container including: a base plate including a liquid outlet and an exhaust port; an inner wall standing on an inner circumference of the base plate; an outer wall standing on an outer circumference of the base plate; and a barrier standing on the base plate to separate a first space connected to the liquid outlet from a second space connected to the exhaust port. The apparatus further includes an inner cover configured to guide the flow of a processing liquid from the substrate supported by the mount to the first space of the discharge container; and a flow guide mounted in the first space of the discharge container.

Abstract: A dip tank is fillable with a liquid. An accommodation device accommodates components and is rotatingly drivable around an axis of rotation. The accommodation device and the dip tank are movable relative to each other to dip the components in the dip tank or to lift the components out of the dip tank. A splash guard is provided. A lifting device is arranged to move the splash guard relative to the dip tank.

Abstract: The present invention provides a wet treatment apparatus having divided base frames and waterproofing pans, which has an enhanced waterproofing property and can be easily assembled. A wet treatment apparatus 10 is provided with a first base frame 13 and a second base frame 14. In addition, a first waterproofing pan 15 is arranged on a mounting surface 13a of the first base frame 13, and a second waterproofing pan 16 is arranged on a mounting surface 14a of the second base frame 14. A plate-shaped structure 17 having flexibility is provided on an end 15a of the first waterproofing pan 15. The plate-shaped structure 17 is configured to cover a gap between the end 15a of the first waterproofing pan 15 and an end 16a of the second waterproofing pan 16, and can waterproof a space between the end 15a of the first waterproofing pan 15 and the end 16a of the second waterproofing pan 16.

Abstract: In a spin-chuck with plural collector levels, a separate exhaust controller is provided for each level. This permits selectively varying gas flow conditions among the collector levels, so that the ambient pressure at one level does not adversely affect device performance in an adjacent level.

Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

Abstract: Techniques for arranging materials on a substrate are provided. In one embodiment, a system may comprise a driver for providing a rotational force, an outer body having an inner surface, and an inner body having an outer surface and disposed within the outer body in a concentric relationship therewith. The inner body may be coupled to the driver to be rotated by the rotational force. The system may further comprise a coupler attached to the outer body in order to retain a substrate, which forms at least one patterned groove therein. A fluid channel, which may be defined between the inner and outer bodies, may be filled with a fluid medium containing materials such as nano materials. When the inner body rotates via the rotational force, the materials contained in the fluid medium may be arranged in the patterned groove of the substrate.

Abstract: A method of applying liquid adhesive to surfaces of components of an electrochemical cell employing a needle valve applicator. The liquid adhesive is applied by dispensing it through a tubular tip connected to a pneumatically actuated needle valve applicator. The method is effective in applying adhesive to narrow width or difficult to reach surfaces of cell components in a precise, consistent and reproducible manner. In a specific application the adhesive can be applied to the narrow recessed step surrounding the terminal portion of the cathode casing of a zinc/air button cell. In such application the cathode casing may typically be rotated at speeds of between about 50 and 1000 revolutions per minute as adhesive is applied thereto from the applicator. The adhesive provides a tight seal between the cathode casing and cathode assembly, thereby preventing leakage of electrolyte from the cell.

Abstract: A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with a case where antireflection films are formed and a case where any antireflection film is not formed. Film forming unit blocks, namely, a TCT layer, a COT layer and a BCT layer, and developing unit blocks, namely, DEV layers, are stacked up in layers in a processing block. The TCT layer, the COT layer and the BCT layer are used selectively in the case where antireflection films are formed and where no antireflection film is formed. The coating and developing system is controlled by a simple carrying program.

Abstract: To achieve a uniform coating of a substrate, with an apparatus and a method for coating substrates, according to which the substrate is supported on a substrate holder in such a way that a substrate surface that is to be coated is exposed, and the substrate is rotated together with the substrate holder, a cover can be secured to the substrate holder and together with the substrate holder forms a sealed chamber for the substrate.

Abstract: In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.

Abstract: A spinning cone is positioned directly below a mixing head outlet to dispense and distribute a sticky mixture of polyurethane foam liquid chemical components. The mixing head and cone are reciprocated together across a longitudinally advancing metal strip to substantially uniformly distribute the mixture thereon. The procedure is practised in connection with the fabrication of overhead door insulated panels. In the prior art, plugging of dispensers would commonly occur within minutes, due to a build-up of adhering mixture on a surface followed by foaming. The spinning cone has dispensed satisfactorily for hours at a time.

Abstract: An apparatus and method are provided for efficiently and effectively coating a substantially flat surface, i.e., a substrate, with a high-viscosity liquid chemical, such as photoresist. The flat surface is oscillated by rotating the surface in one direction and then repeatedly reversing the direction of rotation of the surface. The chemical is spread by both the centrifugal force of the rotation of the surface and the tangential force of the angular acceleration of the surface. The tangential force helps spread the chemical without prematurely overcoming the surface tension of the chemical resulting in a particularly effective coating using substantially less chemical. Chemical is alternatively spread by vibrating the flat surface. Vibrating applies to the chemical, in addition to radial, centrifugal force, if any, non-radial forces which are not directly opposed by surface tension. The chemical is therefore spread more evenly and efficiently without overcoming the surface tension of the chemical.

Abstract: A coating apparatus comprises a spin chuck for holding and rotating a substrate, a header unit movable along a linear line connecting a position just above a center-of-rotation of the substrate, to a home position of the unit, a plurality of nozzles included in the header unit for discharging coating liquids to the substrate held on the spin chuck, the first nozzles having their respective nozzle ports arranged in line along the linear line, and a plurality of coating liquid supply means for supplying the coating liquids to the first nozzles, respectively.

Abstract: A liquid applying apparatus includes a rotary member having a disk table in which a substrate to be applied with liquid is placed; a cover member movable above the disk table and operable to define a closed space in combination with the disk table; an elevating mechanism which elevates up and down the cover member; a sealing arrangement provided between the disk table and the cover member to seal the closed space, the sealing arrangement including: a resilient sealing ring having a specified sectional size; a ring accommodation annular groove formed in either a top surface of a periphery of the disk table or an underside surface of a periphery of the cover member, the ring accommodation annular groove having a sectional size greater than the sectional size of the sealing ring and being operable to accommodate the sealing ring; a ring pressing annular ridge formed on either a top surface of a periphery of the disk table or an underside surface of a periphery of the cover member, the ring pressing annular ridge

Abstract: A semiconductor wafer 11 is mounted on an elongated member 18, one end of which is rotatable about a transverse axis (14), thereby to distribute a liquid on the upper surface of the wafer more evenly. In order to stabilize the rotation of the elongated member, a second elongated member is preferably attached end-to-end to the elongated member (18) and rotates with it. A counterweight (26) in the second elongated member moves during the rotation such that the distance between the wafer and the central axis and the distance between the center of the counterweight and the axis are substantially equal. The weight distribution is approximately symmetrical about the axis and the structure is dynamically stabilized. The counterweight and the wafer assembly may be moved during rotation by applying air pressure from a source (23) to pistons (13,26) in the two elongated member.

Abstract: A spin coating method includes the steps of applying a coating material on the surface of a substrate, rotating the substrate about a first axis, and revolving the substrate about a second axis while tilting the substrate towards the second axis. The rotating step spreads the coating material over the surface of the substrate, and the step of revolving while tilting the substrate smoothens the surface of the coating material. At least the rotating step may be performed in an atmosphere containing a solvent vapor. A spin coating apparatus includes a nozzle for applying a coating material to the surface of a substrate, a chuck for rotating the substrate about a first axis, a support arm for revolving the substrate about a second axis, and a tilting mechanism for tilting the surface of the substrate towards the center of the second axis while the substrate is revolving.

Abstract: A device is disclosed for etching silicon wafers, with a support (1) for the silicon wafers, an annular nozzle (8) being provided in the surface (9, 10) of this support that faces the silicon wafer (11), the nozzle being chargeable with compressed gas for the formation of a gas cushion between the support (1) and the silicon wafer (11), the gas exiting between the wafer (11) and the support (1) preventing passage of treatment fluid onto the underside of the wafer (11). The support (1) is located within the interior (21) of an annular tank (20) wherein at least two annular ducts (25, 26, 27) are provided which are open toward the interior (21) of this tank. Furthermore, means are included for lifting and for lowering the support (1) with respect to the tank (20) and for setting the support (1) into rotation about its axis (14) which latter is congruent with the central axis of the tank (20).

Abstract: A coating device includes a ring-shaped outer circumferential groove formed along and adjacent to the outer circumferential rim of a cup means and communicated with a processing vessel, and a processing liquid supply source connected to the outer circumferential groove through nozzles. A partition wall is erected, as an inner wall of the cup means, inside the outer circumferential groove with the nozzles and a groove interposed between them. The supply of the processing liquid can be thus made stable and processing failure because of air bubbles mixed in the liquid and irregular coating of the liquid on substrates can be prevented.

Abstract: A color filter dyeing apparatus for dyeing a color filter formed on a substrate comprises a chuck for holding the substrate on which the color filter is mounted, a dyeing solution receptacle in intimate engagement, by means of a sealing member, with the chuck or the substrate, and forming a container for containing the color filter therein, an inlet for supplying the dyeing solution into the container, and means for discharging the dyeing solution from the container.

Abstract: A wafer holding mechanism horizontally holds, one at a time, wafers which are sequentially transported thereto. Wafers are treated with liquids such as an etchant, rinsing liquid, and the like, at the same time that the wafer is rotated at a high speed. The mechanism includes a hollow rotary shaft having an upper end thrust into a housing, a rotary plate horizontally mounted on the upper end of the rotary shaft, chuck pieces provided on the rotary plate for holding an outer peripheral edge of the wafer, the chuck pieces being movable in the radial direction of the rotating plate between a holding position wherein the wafer is tightly held by the chuck pieces and a release position wherein the wafer is free to be removed from the chuck pieces.

Abstract: Rinsing methods and apparatus employ a rotatable work support to spray rinsing liquid against a surrounding wall of a processing station. The rinsing liquid washes residual processing liquid from the surrounding wall of the processing station, whereby the work support performs a cleaning function in addition to its conventional processing function.

Abstract: The present invention provides a semiconductor device manufacturing apparatus which, in processing wafers with processing liquid, prevents dust contamination of a wafer surface to be processed, enables fine control of processing liquid temperature, enables the wafer surface to be processed uniformly, permits use of only a small amount of processing liquid, and can be adapted for mixed solvents. The apparatus according to the present invention comprises a cup containing the processing liquid, vacuum chuck means holding the wafer by suction on the upper surface of the wafer, and means by which the wafer surface is brought into dynamic contact with the processing liquid.

Abstract: An improved method for coating a semiconductor wafer with a uniform layer of photoresist or other liquid film is provided. The liquid is first semi-uniformly deposited on the wafer by spraying or otherwise. Thereafter, the wafer is rotated about an axis perpendicular to the plane of the wafer and removed from the wafer. In the preferred embodiment, a number of wafers are placed about the perimeter of a large, flat disc which is rotated about its center. The liquid is spread over the surface of each wafer by the centrifugal force generated by such rotation. By placing the wafers at a distance from the axis of rotation, the centrifugal force on all points of each wafer is approximately the same, thereby providing for a uniform spreading of the film over the wafer.

Abstract: The invention described avoids all the problems of the above described prior art techniques and is characterized by holding the workpiece in an inverted position, contacting the inverted face of the workpiece with a precisely metered amount of a flowable material and rotating the workpiece in its inverted position after it has contacted the polymer to coat the workpiece with a thin, uniform layer of the flowable material. The present invention is also directed to an apparatus for coating a substrate comprising, a spindle holding the workpiece in an inverted manner so that the face of the workpiece to be coated faces downwardly towards a liquid deposit of the coating material which is supported on a nozzle beneath the spindle, which spindle may be moved to permit the inverted slice to contact the liquid deposit and means for spinning the spindle in the inverted position to spread the coating material uniformly across the face of the spinning workpiece.

Abstract: An apparatus for coating steel objects with an alloy of zinc and aluminium. The steel objects are preheated in a furnace to within 400.degree.-950.degree. C. within a protective reducing gas, and then introduced into a zinc bath containing about 5% aluminium in a cage. After a predetermined time, the cage is raised out of the bath into a centrifuging chamber having an oxygen-free atmosphere therein.

Abstract: Apparatus for treating semiconductor wafers including a reciprocating wafer tray placed between a wafer loading station and a wafer unloading station. A station for applying photoresist and a station for heating the wafer in a vacuum chamber are placed between the loading station and the unloading station and in operative relationship to the reciprocating tray. The tray has at least three wafer carrying apertures and a pair of operating apertures located between the wafer carrying apertures. Chucks are provided at each treatment station. The wafer tray is reciprocated to feed wafers sequentially from the loading station, to the applying station, to the heating station, and then to the unloading station.

Abstract: An improved galvanizing system is provided having a centrifuge assembly wherein an elongate member positively couples a motor means to a container holding articles to be spun. This positive engagement results in more rapid rotational acceleration and deceleration. A dumping means is provided to automatically remove articles from the container. Further, an automated ejection means is provided for removing the empty container from the centrifuge assembly.

Abstract: A wafer processing system for spin processing photoresist liquid on a silicon wafer and automatically sequencing them through the processor includes a shuttle having upper and lower air bearing slides. The upper slide receives the wafer from a supply magazine and centers it on a rotating chuck and the lower slide of the shuttle receives the wafer from the chuck and allows it to be transferred to a receive track.

Abstract: Apparatus comprising a vertically movable arm member pivoted at one end about a vertical axis and a chucking head mounted at the other distal end thereof, for engagement with and holding an apertured article, said chucking head being arranged to rotate the chucked article and whereby apertured articles being successively fed to a loading position are subjected to a revolving movement and an upward movement while being transferred to an unloading position via a working position where they are subjected to a desired treatment.

Abstract: Articles of almost any imaginable configuration are given a uniform, complete coating over all surfaces by placing them in a spinnable perforate container or basket that is suspended from a reversible spinning assembly which is adapted to spin the perforate container and its articles in both directions during steps of the process of pre-coating, coating, quenching or air drying.A new control system is also employed to provide rapid response in reversing directions of rotation of the perforated container or bringing it to a complete stop.

Abstract: Impregnating equipment includes a centrifuge, a tank which can be exhausted and into which an impregnating compound can be introduced, and means for attaching at an upper part of the tank a mounting for a centrifugal basket, said mounting comprising a single self-aligning or swing bearing which is supported by a support which can be locked by means of an expanding device to the upper rim of the tank. The expanding device preferably consists of three radial arms which can be retracted and extended and the ends of which are in the form of jaws, the rim of the tank consisting of a ring the radially inwardly-directed cross-section of which has a shape mating with the shape of the jaws.

Abstract: A process for removing excess molten aluminum or its alloys from articles following the aluminizing of same in such melt by high speed revolution of said articles while withdrawing from said melt.

Abstract: A plurality of articles such as sheets or lenses are simultaneously and uniformly coated by first placing them in vertical spaced relationship with respect to each other within a tank having a quantity of fluid coating material therein. The coating material flows across the surfaces to be coated. Thereafter, the sheets are lifted out of the tank into an elongated chamber above the tank in which they are spun about their vertical axes. Excess coating material is thus driven off the surfaces to be coated. Means to recover, clean, replenish and remove bubbles from the coating material are disclosed.

Abstract: Equipment for use in washing articles such as egg trays and the like wherein the articles after being washed are moved by a conveyor to a drying zone for being picked up by a rotatable carriage by which they are lifted into a hood and rotated at high speed to discharge water or other washing liquid therefrom. The movement of the conveyor and the rotation of the carriage are coordinated to start and stop the rotation of the carriage so as to dry one article after another as it is advanced to the drying zone and onto the carriage by the conveyor. The rotatable carriage includes a system for orientation of the trays or the like for discharge to the conveyor and a brake assembly for quickly decreasing the rotational velocity of the carriage.

Abstract: In a method and apparatus for applying light sensitive materials to semiconductor slices, a plurality of semiconductor slices are supported in a spaced apart array extending along an axis. The slices are supported on knife edges positioned at circumferentially spaced points about the axis and each extending angularly both with respect to the axis and with respect to the radii of the slices so that the slices are supported by means of point contact with their edge portions. In one embodiment the knife edge comprise combs mounted in a cylindrical support fixture formed from an open material and including hingedly interconnected half cylinders. In another embodiment the knife edges are supported in a cup-shaped support fixture formed from an open material and adapted to receive semiconductor slices of varying sizes and particularly broken semiconductor slices.Light sensitive material is simultaneously applied to all of the semiconductor slices in the support fixture.