Reciprocating Centrifuge Patents (Class 118/54)
  • Patent number: 9718079
    Abstract: A dip tank is fillable with a liquid. An accommodation device accommodates components and is rotatingly drivable around an axis of rotation. The accommodation device and the dip tank are movable relative to each other to dip the components in the dip tank or to lift the components out of the dip tank. A splash guard is provided. A lifting device is arranged to move the splash guard relative to the dip tank.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: August 1, 2017
    Assignee: WMV Apparatebau GmbH
    Inventors: Martin Muller, Jurgen Muller, Hubert Jongen
  • Patent number: 9687958
    Abstract: The present invention provides a wet treatment apparatus having divided base frames and waterproofing pans, which has an enhanced waterproofing property and can be easily assembled. A wet treatment apparatus 10 is provided with a first base frame 13 and a second base frame 14. In addition, a first waterproofing pan 15 is arranged on a mounting surface 13a of the first base frame 13, and a second waterproofing pan 16 is arranged on a mounting surface 14a of the second base frame 14. A plate-shaped structure 17 having flexibility is provided on an end 15a of the first waterproofing pan 15. The plate-shaped structure 17 is configured to cover a gap between the end 15a of the first waterproofing pan 15 and an end 16a of the second waterproofing pan 16, and can waterproof a space between the end 15a of the first waterproofing pan 15 and the end 16a of the second waterproofing pan 16.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: June 27, 2017
    Assignee: Ebara Corporation
    Inventor: Hiroyuki Shinozaki
  • Patent number: 8955529
    Abstract: In a spin-chuck with plural collector levels, a separate exhaust controller is provided for each level. This permits selectively varying gas flow conditions among the collector levels, so that the ambient pressure at one level does not adversely affect device performance in an adjacent level.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: February 17, 2015
    Assignee: Lam Research AG
    Inventor: Karl-Heinz Hohenwarter
  • Patent number: 7815968
    Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: October 19, 2010
    Assignee: International Business Machines Corporation
    Inventors: Gareth Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey D. Gelmore, Kathleen C. Hinge, Anurag Jain, Sung K. Kang, John U. Knickerbocker
  • Publication number: 20100047446
    Abstract: Techniques for arranging materials on a substrate are provided. In one embodiment, a system may comprise a driver for providing a rotational force, an outer body having an inner surface, and an inner body having an outer surface and disposed within the outer body in a concentric relationship therewith. The inner body may be coupled to the driver to be rotated by the rotational force. The system may further comprise a coupler attached to the outer body in order to retain a substrate, which forms at least one patterned groove therein. A fluid channel, which may be defined between the inner and outer bodies, may be filled with a fluid medium containing materials such as nano materials. When the inner body rotates via the rotational force, the materials contained in the fluid medium may be arranged in the patterned groove of the substrate.
    Type: Application
    Filed: August 20, 2008
    Publication date: February 25, 2010
    Inventor: Youngtack Shim
  • Patent number: 7455882
    Abstract: A method of applying liquid adhesive to surfaces of components of an electrochemical cell employing a needle valve applicator. The liquid adhesive is applied by dispensing it through a tubular tip connected to a pneumatically actuated needle valve applicator. The method is effective in applying adhesive to narrow width or difficult to reach surfaces of cell components in a precise, consistent and reproducible manner. In a specific application the adhesive can be applied to the narrow recessed step surrounding the terminal portion of the cathode casing of a zinc/air button cell. In such application the cathode casing may typically be rotated at speeds of between about 50 and 1000 revolutions per minute as adhesive is applied thereto from the applicator. The adhesive provides a tight seal between the cathode casing and cathode assembly, thereby preventing leakage of electrolyte from the cell.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: November 25, 2008
    Assignee: The Gillette Company
    Inventors: Daniel W. Gibbons, Michael Brovarski, Leo White
  • Patent number: 7281869
    Abstract: A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with a case where antireflection films are formed and a case where any antireflection film is not formed. Film forming unit blocks, namely, a TCT layer, a COT layer and a BCT layer, and developing unit blocks, namely, DEV layers, are stacked up in layers in a processing block. The TCT layer, the COT layer and the BCT layer are used selectively in the case where antireflection films are formed and where no antireflection film is formed. The coating and developing system is controlled by a simple carrying program.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: October 16, 2007
    Assignee: Tokyo Electron Limited
    Inventors: Masami Akimoto, Shinichi Hayashi, Yasushi Hayashida, Nobuaki Matsuoka, Yoshio Kimura, Issei Ueda, Hikaru Ito
  • Patent number: 6858088
    Abstract: To achieve a uniform coating of a substrate, with an apparatus and a method for coating substrates, according to which the substrate is supported on a substrate holder in such a way that a substrate surface that is to be coated is exposed, and the substrate is rotated together with the substrate holder, a cover can be secured to the substrate holder and together with the substrate holder forms a sealed chamber for the substrate.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: February 22, 2005
    Assignee: Steag Hama Tech AG
    Inventors: Peter Dress, Karl Appich, Peter Krauss, Jakob Szekeresch, Robert Weihing
  • Patent number: 6527861
    Abstract: In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: March 4, 2003
    Assignee: Tokyo Electron Limited
    Inventor: Takashi Takekuma
  • Patent number: 6376014
    Abstract: A spinning cone is positioned directly below a mixing head outlet to dispense and distribute a sticky mixture of polyurethane foam liquid chemical components. The mixing head and cone are reciprocated together across a longitudinally advancing metal strip to substantially uniformly distribute the mixture thereon. The procedure is practised in connection with the fabrication of overhead door insulated panels. In the prior art, plugging of dispensers would commonly occur within minutes, due to a build-up of adhering mixture on a surface followed by foaming. The spinning cone has dispensed satisfactorily for hours at a time.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: April 23, 2002
    Inventor: Arthur A. Mihalcheon
  • Patent number: 5798140
    Abstract: An apparatus and method are provided for efficiently and effectively coating a substantially flat surface, i.e., a substrate, with a high-viscosity liquid chemical, such as photoresist. The flat surface is oscillated by rotating the surface in one direction and then repeatedly reversing the direction of rotation of the surface. The chemical is spread by both the centrifugal force of the rotation of the surface and the tangential force of the angular acceleration of the surface. The tangential force helps spread the chemical without prematurely overcoming the surface tension of the chemical resulting in a particularly effective coating using substantially less chemical. Chemical is alternatively spread by vibrating the flat surface. Vibrating applies to the chemical, in addition to radial, centrifugal force, if any, non-radial forces which are not directly opposed by surface tension. The chemical is therefore spread more evenly and efficiently without overcoming the surface tension of the chemical.
    Type: Grant
    Filed: April 30, 1996
    Date of Patent: August 25, 1998
    Assignee: Semiconductor Systems, Inc.
    Inventors: Michael L. Parodi, Roy E. Hurtig
  • Patent number: 5772764
    Abstract: A coating apparatus comprises a spin chuck for holding and rotating a substrate, a header unit movable along a linear line connecting a position just above a center-of-rotation of the substrate, to a home position of the unit, a plurality of nozzles included in the header unit for discharging coating liquids to the substrate held on the spin chuck, the first nozzles having their respective nozzle ports arranged in line along the linear line, and a plurality of coating liquid supply means for supplying the coating liquids to the first nozzles, respectively.
    Type: Grant
    Filed: October 9, 1996
    Date of Patent: June 30, 1998
    Assignee: Tokyo Electron Limited
    Inventor: Masami Akimoto
  • Patent number: 5656082
    Abstract: A liquid applying apparatus includes a rotary member having a disk table in which a substrate to be applied with liquid is placed; a cover member movable above the disk table and operable to define a closed space in combination with the disk table; an elevating mechanism which elevates up and down the cover member; a sealing arrangement provided between the disk table and the cover member to seal the closed space, the sealing arrangement including: a resilient sealing ring having a specified sectional size; a ring accommodation annular groove formed in either a top surface of a periphery of the disk table or an underside surface of a periphery of the cover member, the ring accommodation annular groove having a sectional size greater than the sectional size of the sealing ring and being operable to accommodate the sealing ring; a ring pressing annular ridge formed on either a top surface of a periphery of the disk table or an underside surface of a periphery of the cover member, the ring pressing annular ridge
    Type: Grant
    Filed: March 31, 1995
    Date of Patent: August 12, 1997
    Assignee: Tatsumo Kabushiki Kaisha
    Inventors: Ryuzoh Takatsuki, Terumasa Tokimitsu
  • Patent number: 5205867
    Abstract: A semiconductor wafer 11 is mounted on an elongated member 18, one end of which is rotatable about a transverse axis (14), thereby to distribute a liquid on the upper surface of the wafer more evenly. In order to stabilize the rotation of the elongated member, a second elongated member is preferably attached end-to-end to the elongated member (18) and rotates with it. A counterweight (26) in the second elongated member moves during the rotation such that the distance between the wafer and the central axis and the distance between the center of the counterweight and the axis are substantially equal. The weight distribution is approximately symmetrical about the axis and the structure is dynamically stabilized. The counterweight and the wafer assembly may be moved during rotation by applying air pressure from a source (23) to pistons (13,26) in the two elongated member.
    Type: Grant
    Filed: March 14, 1991
    Date of Patent: April 27, 1993
    Assignee: AT&T Bell Laboratories
    Inventor: David H. Ziger
  • Patent number: 5095848
    Abstract: A spin coating method includes the steps of applying a coating material on the surface of a substrate, rotating the substrate about a first axis, and revolving the substrate about a second axis while tilting the substrate towards the second axis. The rotating step spreads the coating material over the surface of the substrate, and the step of revolving while tilting the substrate smoothens the surface of the coating material. At least the rotating step may be performed in an atmosphere containing a solvent vapor. A spin coating apparatus includes a nozzle for applying a coating material to the surface of a substrate, a chuck for rotating the substrate about a first axis, a support arm for revolving the substrate about a second axis, and a tilting mechanism for tilting the surface of the substrate towards the center of the second axis while the substrate is revolving.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: March 17, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Masahiko Ikeno
  • Patent number: 4903717
    Abstract: A device is disclosed for etching silicon wafers, with a support (1) for the silicon wafers, an annular nozzle (8) being provided in the surface (9, 10) of this support that faces the silicon wafer (11), the nozzle being chargeable with compressed gas for the formation of a gas cushion between the support (1) and the silicon wafer (11), the gas exiting between the wafer (11) and the support (1) preventing passage of treatment fluid onto the underside of the wafer (11). The support (1) is located within the interior (21) of an annular tank (20) wherein at least two annular ducts (25, 26, 27) are provided which are open toward the interior (21) of this tank. Furthermore, means are included for lifting and for lowering the support (1) with respect to the tank (20) and for setting the support (1) into rotation about its axis (14) which latter is congruent with the central axis of the tank (20).
    Type: Grant
    Filed: November 9, 1988
    Date of Patent: February 27, 1990
    Assignee: Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H
    Inventor: Franz Sumnitsch
  • Patent number: 4899686
    Abstract: A coating device includes a ring-shaped outer circumferential groove formed along and adjacent to the outer circumferential rim of a cup means and communicated with a processing vessel, and a processing liquid supply source connected to the outer circumferential groove through nozzles. A partition wall is erected, as an inner wall of the cup means, inside the outer circumferential groove with the nozzles and a groove interposed between them. The supply of the processing liquid can be thus made stable and processing failure because of air bubbles mixed in the liquid and irregular coating of the liquid on substrates can be prevented.
    Type: Grant
    Filed: April 4, 1989
    Date of Patent: February 13, 1990
    Assignees: Tokyo Electron Limited, Tel Kyushu Limited
    Inventors: Takayuki Toshima, Osamu Hirakawa
  • Patent number: 4821675
    Abstract: A color filter dyeing apparatus for dyeing a color filter formed on a substrate comprises a chuck for holding the substrate on which the color filter is mounted, a dyeing solution receptacle in intimate engagement, by means of a sealing member, with the chuck or the substrate, and forming a container for containing the color filter therein, an inlet for supplying the dyeing solution into the container, and means for discharging the dyeing solution from the container.
    Type: Grant
    Filed: December 12, 1986
    Date of Patent: April 18, 1989
    Assignee: Maeda & Associates
    Inventors: Masahiko Ikeno, Hideo Saeki
  • Patent number: 4788994
    Abstract: A wafer holding mechanism horizontally holds, one at a time, wafers which are sequentially transported thereto. Wafers are treated with liquids such as an etchant, rinsing liquid, and the like, at the same time that the wafer is rotated at a high speed. The mechanism includes a hollow rotary shaft having an upper end thrust into a housing, a rotary plate horizontally mounted on the upper end of the rotary shaft, chuck pieces provided on the rotary plate for holding an outer peripheral edge of the wafer, the chuck pieces being movable in the radial direction of the rotating plate between a holding position wherein the wafer is tightly held by the chuck pieces and a release position wherein the wafer is free to be removed from the chuck pieces.
    Type: Grant
    Filed: August 11, 1987
    Date of Patent: December 6, 1988
    Assignee: Dainippon Screen Mfg. Co.
    Inventor: Kaoru Shinbara
  • Patent number: 4674521
    Abstract: Rinsing methods and apparatus employ a rotatable work support to spray rinsing liquid against a surrounding wall of a processing station. The rinsing liquid washes residual processing liquid from the surrounding wall of the processing station, whereby the work support performs a cleaning function in addition to its conventional processing function.
    Type: Grant
    Filed: May 20, 1985
    Date of Patent: June 23, 1987
    Assignee: Machine Technology, Inc.
    Inventor: Bernard Paulfus
  • Patent number: 4655162
    Abstract: The present invention provides a semiconductor device manufacturing apparatus which, in processing wafers with processing liquid, prevents dust contamination of a wafer surface to be processed, enables fine control of processing liquid temperature, enables the wafer surface to be processed uniformly, permits use of only a small amount of processing liquid, and can be adapted for mixed solvents. The apparatus according to the present invention comprises a cup containing the processing liquid, vacuum chuck means holding the wafer by suction on the upper surface of the wafer, and means by which the wafer surface is brought into dynamic contact with the processing liquid.
    Type: Grant
    Filed: March 1, 1985
    Date of Patent: April 7, 1987
    Assignee: Nippon Kogaku K. K.
    Inventor: Masaomi Kameyama
  • Patent number: 4640846
    Abstract: An improved method for coating a semiconductor wafer with a uniform layer of photoresist or other liquid film is provided. The liquid is first semi-uniformly deposited on the wafer by spraying or otherwise. Thereafter, the wafer is rotated about an axis perpendicular to the plane of the wafer and removed from the wafer. In the preferred embodiment, a number of wafers are placed about the perimeter of a large, flat disc which is rotated about its center. The liquid is spread over the surface of each wafer by the centrifugal force generated by such rotation. By placing the wafers at a distance from the axis of rotation, the centrifugal force on all points of each wafer is approximately the same, thereby providing for a uniform spreading of the film over the wafer.
    Type: Grant
    Filed: September 25, 1984
    Date of Patent: February 3, 1987
    Inventor: Yue Kuo
  • Patent number: 4590094
    Abstract: The invention described avoids all the problems of the above described prior art techniques and is characterized by holding the workpiece in an inverted position, contacting the inverted face of the workpiece with a precisely metered amount of a flowable material and rotating the workpiece in its inverted position after it has contacted the polymer to coat the workpiece with a thin, uniform layer of the flowable material. The present invention is also directed to an apparatus for coating a substrate comprising, a spindle holding the workpiece in an inverted manner so that the face of the workpiece to be coated faces downwardly towards a liquid deposit of the coating material which is supported on a nozzle beneath the spindle, which spindle may be moved to permit the inverted slice to contact the liquid deposit and means for spinning the spindle in the inverted position to spread the coating material uniformly across the face of the spinning workpiece.
    Type: Grant
    Filed: October 29, 1984
    Date of Patent: May 20, 1986
    Assignee: International Business Machines Corporation
    Inventor: Frederick C. Ringer, Jr.
  • Patent number: 4526127
    Abstract: An apparatus for coating steel objects with an alloy of zinc and aluminium. The steel objects are preheated in a furnace to within C. within a protective reducing gas, and then introduced into a zinc bath containing about 5% aluminium in a cage. After a predetermined time, the cage is raised out of the bath into a centrifuging chamber having an oxygen-free atmosphere therein.
    Type: Grant
    Filed: November 29, 1983
    Date of Patent: July 2, 1985
    Assignee: Ra-Shipping Ltd. Oy
    Inventor: Pertti J. Sippola
  • Patent number: 4418639
    Abstract: Apparatus for treating semiconductor wafers including a reciprocating wafer tray placed between a wafer loading station and a wafer unloading station. A station for applying photoresist and a station for heating the wafer in a vacuum chamber are placed between the loading station and the unloading station and in operative relationship to the reciprocating tray. The tray has at least three wafer carrying apertures and a pair of operating apertures located between the wafer carrying apertures. Chucks are provided at each treatment station. The wafer tray is reciprocated to feed wafers sequentially from the loading station, to the applying station, to the heating station, and then to the unloading station.
    Type: Grant
    Filed: May 19, 1981
    Date of Patent: December 6, 1983
    Assignee: Solitec, Inc.
    Inventors: James C. Wills, Douglas S. Spenser
  • Patent number: 4386122
    Abstract: An improved galvanizing system is provided having a centrifuge assembly wherein an elongate member positively couples a motor means to a container holding articles to be spun. This positive engagement results in more rapid rotational acceleration and deceleration. A dumping means is provided to automatically remove articles from the container. Further, an automated ejection means is provided for removing the empty container from the centrifuge assembly.
    Type: Grant
    Filed: September 14, 1981
    Date of Patent: May 31, 1983
    Inventor: J. Calvin Birdsall
  • Patent number: 4315705
    Abstract: A wafer processing system for spin processing photoresist liquid on a silicon wafer and automatically sequencing them through the processor includes a shuttle having upper and lower air bearing slides. The upper slide receives the wafer from a supply magazine and centers it on a rotating chuck and the lower slide of the shuttle receives the wafer from the chuck and allows it to be transferred to a receive track.
    Type: Grant
    Filed: March 18, 1977
    Date of Patent: February 16, 1982
    Assignee: GCA Corporation
    Inventor: Alan G. Flint
  • Patent number: 4314524
    Abstract: Apparatus comprising a vertically movable arm member pivoted at one end about a vertical axis and a chucking head mounted at the other distal end thereof, for engagement with and holding an apertured article, said chucking head being arranged to rotate the chucked article and whereby apertured articles being successively fed to a loading position are subjected to a revolving movement and an upward movement while being transferred to an unloading position via a working position where they are subjected to a desired treatment.
    Type: Grant
    Filed: March 5, 1980
    Date of Patent: February 9, 1982
    Assignee: NTN Toyo Bearing Company, Limited
    Inventor: Osamu Deguchi
  • Patent number: 4237154
    Abstract: Articles of almost any imaginable configuration are given a uniform, complete coating over all surfaces by placing them in a spinnable perforate container or basket that is suspended from a reversible spinning assembly which is adapted to spin the perforate container and its articles in both directions during steps of the process of pre-coating, coating, quenching or air drying.A new control system is also employed to provide rapid response in reversing directions of rotation of the perforated container or bringing it to a complete stop.
    Type: Grant
    Filed: August 16, 1979
    Date of Patent: December 2, 1980
    Inventor: William H. Garrison
  • Patent number: 4196231
    Abstract: Impregnating equipment includes a centrifuge, a tank which can be exhausted and into which an impregnating compound can be introduced, and means for attaching at an upper part of the tank a mounting for a centrifugal basket, said mounting comprising a single self-aligning or swing bearing which is supported by a support which can be locked by means of an expanding device to the upper rim of the tank. The expanding device preferably consists of three radial arms which can be retracted and extended and the ends of which are in the form of jaws, the rim of the tank consisting of a ring the radially inwardly-directed cross-section of which has a shape mating with the shape of the jaws.
    Type: Grant
    Filed: August 23, 1978
    Date of Patent: April 1, 1980
    Inventor: Ernst Hubers
  • Patent number: 4148942
    Abstract: A process for removing excess molten aluminum or its alloys from articles following the aluminizing of same in such melt by high speed revolution of said articles while withdrawing from said melt.
    Type: Grant
    Filed: July 21, 1977
    Date of Patent: April 10, 1979
    Assignee: Politechmika Slaska Im. Wincentego Pstrowskiego
    Inventors: Adam Gierek, Lech Bajka, Jan Kolpak
  • Patent number: 4096295
    Abstract: A plurality of articles such as sheets or lenses are simultaneously and uniformly coated by first placing them in vertical spaced relationship with respect to each other within a tank having a quantity of fluid coating material therein. The coating material flows across the surfaces to be coated. Thereafter, the sheets are lifted out of the tank into an elongated chamber above the tank in which they are spun about their vertical axes. Excess coating material is thus driven off the surfaces to be coated. Means to recover, clean, replenish and remove bubbles from the coating material are disclosed.
    Type: Grant
    Filed: April 5, 1976
    Date of Patent: June 20, 1978
    Inventor: Alvin M. Marks
  • Patent number: 4064635
    Abstract: Equipment for use in washing articles such as egg trays and the like wherein the articles after being washed are moved by a conveyor to a drying zone for being picked up by a rotatable carriage by which they are lifted into a hood and rotated at high speed to discharge water or other washing liquid therefrom. The movement of the conveyor and the rotation of the carriage are coordinated to start and stop the rotation of the carriage so as to dry one article after another as it is advanced to the drying zone and onto the carriage by the conveyor. The rotatable carriage includes a system for orientation of the trays or the like for discharge to the conveyor and a brake assembly for quickly decreasing the rotational velocity of the carriage.
    Type: Grant
    Filed: June 17, 1976
    Date of Patent: December 27, 1977
    Inventor: Henry Y. Kuhl
  • Patent number: 3974797
    Abstract: In a method and apparatus for applying light sensitive materials to semiconductor slices, a plurality of semiconductor slices are supported in a spaced apart array extending along an axis. The slices are supported on knife edges positioned at circumferentially spaced points about the axis and each extending angularly both with respect to the axis and with respect to the radii of the slices so that the slices are supported by means of point contact with their edge portions. In one embodiment the knife edge comprise combs mounted in a cylindrical support fixture formed from an open material and including hingedly interconnected half cylinders. In another embodiment the knife edges are supported in a cup-shaped support fixture formed from an open material and adapted to receive semiconductor slices of varying sizes and particularly broken semiconductor slices.Light sensitive material is simultaneously applied to all of the semiconductor slices in the support fixture.
    Type: Grant
    Filed: July 8, 1974
    Date of Patent: August 17, 1976
    Inventor: Jearld L. Hutson