With Means To Centrifuge Work Patents (Class 118/52)
  • Patent number: 10679844
    Abstract: A spin coating device includes a base plate, a spin chuck on which a substrate material is placed, and an actuator mechanism to engage the base plate with the spin chuck such that the base plate synchronously spins along with the spin chuck. The substrate material includes a top surface coated with a film-forming substance and a bottom surface. The cleaning mechanism is below the base plate and out of optimal exposure to the bottom surface and edges of the substrate material in a state of base plate engagement. In response to disengagement of a lid configured to synchronously co-rotate with the base plate, the actuator mechanism is further configured to disengage the base plate from the spin chuck and to enable the optimal exposure of the cleaning mechanism to the bottom surface and the edges of the substrate material.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: June 9, 2020
    Assignee: C&D SEMICONDUCTOR SERVICES, INC.
    Inventors: Thanh Truong, Tri Dang, Tu Tran, Hieu Charlie Nguyen
  • Patent number: 10619894
    Abstract: A substrate processing apparatus comprises: a first solidifier and a second solidifier. The first solidifier solidifies a liquid to be solidified adhering to a front surface of a substrate by supplying a liquid refrigerant to a back surface of the substrate at a first position. The second solidifier solidifies the liquid to be solidified by at least one of a first cooling mechanism and a second cooling mechanism. The first cooling mechanism cools the liquid to be solidified by supplying a gas refrigerant toward the substrate at a second position more distant from a center of rotation of the substrate in a radial direction than the first position. The second cooling mechanism cools the liquid to be solidified by bringing a processing surface into contact with the liquid to be solidified at the second position.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: April 14, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Hiroaki Kitagawa, Dai Ueda, Katsuhiko Miya
  • Patent number: 10569297
    Abstract: A substrate is rotated with a holding rotator to form a coating liquid film on the substrate, and at least a part of an excess of the coating liquid is pushed out toward a periphery edge of the substrate by a centrifugal force caused by the rotation of the substrate to build up the excess of the coating liquid along the periphery edge of the substrate. Moreover, gas is blown to the periphery edge of the substrate through a gas nozzle to exhaust the excess of the coating liquid building up at the periphery edge. Blowing the gas toward the periphery edge of the substrate through the gas nozzle makes the coating liquid unbalanced that builds up without being exhausted outside the substrate due to its surface tension. Accordingly, the rotation achieves the coating liquid film having a uniform thickness while the coating liquid film is formed to be thick.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: February 25, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Masahiko Harumoto, Yuji Tanaka
  • Patent number: 10553422
    Abstract: A substrate treatment apparatus includes a substrate retainer that horizontally retains the substrate. A blocking portion has a lower surface facing an upper surface of said substrate and a tapered surface extending diagonally upward from an inner periphery of the lower surface toward a center of the lower surface. A rotary portion rotates the substrate and the blocking portion about a vertical rotary axis. A first supply unit supplies treatment liquid and a second supply unit supplies rinse liquid toward a tapered surface from the center of the rotated blocking portion through said opening of said blocking portion. The first supply unit supplies the treatment liquid during a first period and the second supply unit supplies the rinse liquid during a second overlapping period.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: February 4, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Noriyuki Kikumoto, Shuichi Yasuda, Kazuhiro Fujita, Michinori Iwao
  • Patent number: 10513458
    Abstract: An aspect of the present invention is directed to a method for producing a glass sheet with a coating, produced by applying a functional liquid for providing a function to the glass sheet, to at least one face of the glass sheet, including a first step of supplying the functional liquid to an ejection portion having a nozzle that ejects the functional liquid toward the glass sheet, and a second step of applying the functional liquid to the glass sheet while moving the glass sheet relative to the ejection portion in a fixed state such that the functional liquid ejected from the nozzle is applied to a predetermined region on the at least one face of the glass sheet, wherein a tube member that transports the functional liquid is connected to the ejection portion, and, in the first step, the functional liquid is supplied by the tube member to the ejection portion.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: December 24, 2019
    Assignee: NIPPON SHEET GLASS COMPANY, LIMITED
    Inventors: Toyoyuki Teranishi, Shuhei Murata, Takeshi Fujiwara, Hiroyuki Okinaka
  • Patent number: 10508860
    Abstract: A vacuum drying system includes: a support platform, which is used to support the substrate, wherein the support platform comprises a plurality of sub-platforms which are arranged along a predetermined direction and there are gaps between the adjacent sub-platforms; a mechanical arm which comprises a plurality of strip structures at positions corresponding to the gaps, and is used to place the substrate onto the support platform or move the substrate out of the support platform. Comparing to the prior art wherein the substrate is supported by a plurality of needle-shaped supports in the vacuum drying process, in the technical solution of the present disclosure, the contact area between the support platform and the substrate is much larger, which can reduce the local pressure on the substrate, thereby avoiding the display brightness mura of the substrate caused by the supporting operation in the vacuum drying process.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: December 17, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yusheng An, Qingyong Meng
  • Patent number: 10497601
    Abstract: A device and corresponding method for coating of an inner circular surface of a coating surface of a carrier wafer with a coating material. The device includes an application means for applying a coating material intended for coating of the inner circular surface to the inner circular surface, a rotating means for accommodating and rotating the carrier wafer around an axis of rotation and for distribution of the coating material on the coating surface, and a second application means for applying a coating inhibitor to an outer circular ring surface which surrounds the inner circular surface, said coating inhibitor at least inhibits the coating of the outer circular ring surface during the distribution of the coating material.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: December 3, 2019
    Assignee: EV Group E. Thallner GmbH
    Inventor: Jürgen Burggraf
  • Patent number: 10392688
    Abstract: A film forming apparatus includes: a chamber main body defining a chamber; a slit plate partitioning the chamber into a first space and a second space below the first space, the slit plate having a slit penetrating therethrough; a holder holding a target in the first space; a stage for supporting a substrate, the stage being movable in a moving direction perpendicular to a longitudinal direction of the slit in a moving area including an area directly below the slit; and a mechanism for moving the stage along the moving direction. In order to suppress scattering of particles from the target to another area other than the moving area in the second space through the slit, the stage has one or more protruding portions which provide upwardly and/or downwardly bent portions in a path around the stage between the slit and the another area in the second space.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: August 27, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Junichi Takei, Naoyuki Suzuki, Tetsuya Miyashita
  • Patent number: 10350624
    Abstract: According to one embodiment, provided is a coating apparatus. The coating apparatus includes a first discharger, a second discharger, and a third discharger. The first discharger discharges a first liquid on a top surface of a substrate. In addition, the second discharger discharges a second liquid of which surface tension is higher than surface tension of the first liquid on the top surface of the substrate. In addition, the third discharger is disposed in a side outer than the first discharger in the substrate and discharges a gas on the top surface of the substrate.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 16, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Tomoyuki Takeishi
  • Patent number: 10325787
    Abstract: According to one embodiment, a substrate processing apparatus (1) includes: a support (4) configured to support a substrate (W) in a plane; a rotation mechanism (5) configured to rotate the support (4) about an axis that crosses a surface of the substrate (W) supported by the support (4) as a rotation axis; a plurality of nozzles (6a, 6b, 6c), which are aligned from the center toward the periphery of the substrate (W) supported by the support (4), configured to eject a treatment liquid to the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5), and a controller (9) configured to control the nozzles to eject the treatment liquid at different ejection timings according to the thickness of a film of the treatment liquid formed on the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5).
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: June 18, 2019
    Assignee: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Konosuke Hayashi, Takashi Ootagaki, Yuji Nagashima, Akinori Iso
  • Patent number: 10297473
    Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: May 21, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Terufumi Wakiyama, Norihiro Ito, Jiro Higashijima
  • Patent number: 10269615
    Abstract: A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: April 23, 2019
    Assignee: LAM RESEARCH AG
    Inventors: Ulrich Tschinderle, Andreas Gleissner, Thomas Wirnsberger, Rainer Obweger
  • Patent number: 10224225
    Abstract: An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
  • Patent number: 10192771
    Abstract: A substrate holding/rotating device includes an urging unit, urging support portions of movable pins to either an open position or a hold position, first and second driving magnets, mounted in correspondence to respective movable pins of respective first and second movable pin groups and having mutually opposite magnetic pole directions, a first moving magnet, for urging the support portions of the first movable pin group to the other of either the open position or the hold position, and a second moving magnet, for urging the support portions of the second movable pin group to the other of either the open position or the hold position.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: January 29, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Hiromichi Kaba, Akihiko Taki
  • Patent number: 10160012
    Abstract: A cup intermediate portion and a cup lower portion surround a substrate. The cup intermediate portion is arranged above an upper surface of the cup lower portion. A sidewall surrounds the cup intermediate portion and the cup lower portion. A spacing between the upper surface of the cup lower portion and a lower surface of the cup intermediate portion gradually decreases outward from an outer peripheral portion of the substrate while a clearance is formed between the lower surface of the cup intermediate portion and the upper surface of the cup lower portion in respective outer peripheral portions of the cup intermediate portion and the cup lower portion. An inner peripheral surface of the sidewall is spaced apart from the clearance outside the clearance and surrounds the clearance.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: December 25, 2018
    Assignee: SCREEN Semiconductor Solutions Co., Ltd.
    Inventors: Minoru Sugiyama, Hiroshi Yoshii, Kazuo Morioka
  • Patent number: 10137482
    Abstract: A stripping device and a display substrate production line are provided. The stripping device comprises a stripping chamber. A stripping liquid with a set temperature is provided within the stripping chamber; the stripping device further comprising a liquid jet component, the liquid jet component includes a liquid supplying pipeline and a liquid jet head, the liquid supplying pipeline is configured to supply a cleaning liquid to the liquid jet head, the liquid jet head is configured to output the cleaning liquid, the liquid supplying pipeline is arranged in the stripping chamber, and the stripping liquid enables the cleaning liquid in the liquid supplying pipeline to reach the set temperature.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: November 27, 2018
    Assignees: BOE Technology Group Co., Ltd., Hefei BOE Optoelectronics Technology Co., Ltd.
    Inventors: Fan Zhang, Wei Hu, Xianhao Chen, Jianzhao Liu, Jianwei Wang, Zuhong Liu, Daeoh Oh
  • Patent number: 10134611
    Abstract: A collector assembly for use with a spin chuck includes a base component, a top component and a first intermediate component configured to be fitted between the base component and the top component. The base, top and first intermediate components are configured so as to be interconnectable to form a process enclosure and so as to be separable from one another. The base component and the intermediate component each comprise collector wall segments such that when the base, top and first intermediate components are interfitted, the wall segments together define an outer side wall of the collector assembly.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: November 20, 2018
    Assignee: LAM RESEARCH AG
    Inventors: Reinhold Schwarzenbacher, Ulrich Tschinderle
  • Patent number: 10048587
    Abstract: An apparatus for dispensing a liquid onto a substrate may comprise a reservoir for storing the liquid to be dispensed; a filter comprising an inlet and an outlet, the filter inlet in fluidic communication with the reservoir via a first valve; a dosing pump comprising an inlet, a first outlet, and a second outlet, the dosing pump inlet in fluidic communication with the reservoir and the dosing pump second outlet in fluidic communication with the filter inlet via a second valve, the dosing pump configured to dose an amount of the liquid and pump the liquid; and a dispense nozzle in fluidic communication with the dosing pump first outlet, the dispense nozzle configured to dispense the liquid onto the substrate.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: August 14, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Michael Andrew Carcasi, Wallace Paul Printz, Joshua Steven Hooge
  • Patent number: 10010766
    Abstract: In a method and related system of the invention, each golf ball component is progressed while being coated, without contacting another surface until after curing, and without the margin for error created in prior systems/methods using physical or air stream up-take supports. In one embodiment, a method of the invention comprises the steps of: progressing a golf ball component within an enclosed chamber for a controlled duration of time; at least partially covering the golf ball component with a coating material while the ball is progressed within the enclosed chamber; and at least partially curing the coating material on golf ball component in the chamber. The golf ball component may be in a state of free fall while progressed within the enclosed chamber, and in some embodiments, also during the step of curing the coating material on the golf ball component.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: July 3, 2018
    Assignee: Acushnet Company
    Inventor: Michael R. Madson
  • Patent number: 9997385
    Abstract: An apparatus and an associated method. The apparatus includes a chuck in a process chamber, an array of three or more ultrasonic sensors in the process chamber, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: June 12, 2018
    Assignee: International Business Machines Corporation
    Inventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
  • Patent number: 9989484
    Abstract: An X-ray fluorescence analyzing system includes: a cassette (3) in which a substrate (1) is housed; a vapor phase decomposing device (20) for dissolving and then drying a measurement object (2) on a sample substrate surface (11a) to be held thereon; at least one measurement substrate (12); a sample recovering device (30) for dripping and drying a recovery liquid (4), which has recovered the measurement object (2) from the sample substrate (11), onto a predetermined dripping position on a measurement substrate surface (12a) to hold the recovery liquid (4) thereon; an X-ray fluorescence spectrometer (40); a conveying device (50) for conveying the substrate (1); and a control device (60) for controlling the devices (20, 30, 40, 50). The recovery liquids (4) of the measurement objects (2) from a plurality of the sample substrates (11) are dripped and dried on the single measurement substrate surface (12a) to be measured.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: June 5, 2018
    Assignee: Rigaku Corporation
    Inventors: Motoyuki Yamagami, Hiroyuki Kawakami
  • Patent number: 9984903
    Abstract: A treatment cup cleaning method is provided, which includes: a rotating step of rotating a substrate rotating unit with a substrate being held by the substrate rotating unit; a cleaning liquid supplying step of supplying a cleaning liquid to an upper surface and a lower surface of the substrate and causing the cleaning liquid to scatter from a peripheral edge of the substrate to be applied to an inner wall of a treatment cup in the rotating step, whereby the cleaning liquid is supplied to the inner wall of the treatment cup; and a scattering direction changing step of changing a cleaning liquid scattering direction in which the cleaning liquid scatters from the peripheral edge of the substrate in the rotating step and the cleaning liquid supplying step.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: May 29, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Ayumi Higuchi, Asuka Wakita
  • Patent number: 9966255
    Abstract: Methods of densifying films, cross-linking films, and controlling the stress of films are provided herein. Methods include forming a removable film on a substrate comprising a material to be densified, and annealing the substrate to transfer stress from the removable film to the material and thereby densify the material. Some methods involve depositing a tensile capping layer on the material to be densified on a substrate and annealing the substrate at a temperature greater than about 450° C. Some methods include clamping the substrate including the material to be densified to a shaped pedestal using an electrostatic chuck to apply compressive stress to the material to be densified.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: May 8, 2018
    Assignee: Lam Research Corporation
    Inventors: Bart J. van Schravendijk, Wei Tang
  • Patent number: 9962744
    Abstract: A substrate treatment apparatus includes a turntable, a rotative drive unit, a holding pin provided on the turntable, a protection disk for covering a lower surface of a substrate, and a magnetic levitation mechanism that levitates the protection disk from the turntable. The protection disk is vertically movable relative to the turntable between a lower position and an adjacent position above the lower position and close to a lower surface of the substrate. The magnetic levitation mechanism includes a protection disk permanent magnet and an annual guard permanent magnet held by a splash guard. When a guard drive mechanism moves up the splash guard, the protection disk is levitated from the turntable and held at the adjacent position by a magnetic repulsive force generated between the permanent magnets.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: May 8, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Hiroshi Kato
  • Patent number: 9962721
    Abstract: A device for coating of a surface of a substrate with a coating material which has at least one coating component and at least one solvent, with the following features: a chamber which can be pressurized, a holding apparatus for holding the substrate on a holding surface and a spray nozzle for coating of the substrate, characterized in that the device has cooling means for cooling of at least the surface of the substrate which is held on the holding surface of the holding apparatus. Furthermore the invention relates to a corresponding method.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: May 8, 2018
    Assignee: EV GROUP E. THALLNER GMBH
    Inventor: Christoph Mayr
  • Patent number: 9960058
    Abstract: A device and method for treatment of a substrate treatment surface of a substrate with a fluid by immersion of the substrate treatment surface into the fluid. The device includes: receiving means for receiving the fluid with an immersion opening and immersion means for immersion of the substrate treatment surfaces through the immersion opening into the receiving means, Rotation means are provided for rotation of the receiving means for at least predominant discharge of the fluid from the receiving means.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: May 1, 2018
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Thomas Glinsner, Ronald Holzleitner, Thomas Wieser, Florian Schmid
  • Patent number: 9960065
    Abstract: Provided are a substrate processing apparatus, a method of manufacturing a semiconductor device, and a non-transitory computer-readable recording medium, which are capable of reducing an effect on a substrate, which is caused by a change in an atmosphere in a substrate storage container, by appropriately supplying an inert gas into the substrate storage container.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: May 1, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Junichi Kawasaki, Mitsuru Funakura
  • Patent number: 9953848
    Abstract: A substrate liquid processing apparatus of the present disclosure supplies a plurality of processing liquids from a processing liquid supplying unit in a switching manner to a substrate held on a substrate holding unit. An elevatable inner cup surrounds the substrate holding unit laterally and forms a first drain path that drains the first processing liquid. An outer cup surrounds the inner cup and forms a second drain path that drains the second processing liquid. A cover covers the outside of the outer cup, includes an eaves portion that extends inwardly from an upper side, and forms an exhaust path between the cover and the outer cup. The exhaust path is connected to the first drain path and the second drain path above inlets of the first drain path and the second drain path.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: April 24, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Terufumi Wakiyama, Norihiro Ito, Jiro Higashijima
  • Patent number: 9899240
    Abstract: A substrate treatment apparatus is provided, which includes: a seal chamber including a chamber body having an opening, a lid member provided rotatably with respect to the chamber body and configured to close the opening, and a first liquid seal structure which liquid-seals between the lid member and the chamber body, the seal chamber having an internal space sealed from outside; a lid member rotating unit which rotates the lid member; a substrate holding/rotating unit which holds and rotates a substrate in the internal space of the seal chamber; and a treatment liquid supplying unit which supplies a treatment liquid to the substrate rotated by the substrate holding/rotating unit.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: February 20, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Akio Hashizume, Yuya Akanishi, Kenji Kawaguchi, Manabu Yamamoto
  • Patent number: 9880473
    Abstract: A KrF (248 nm) photoresist patterning process flow is disclosed wherein photoresist patterns having a sub-100 nm CD are formed on a dielectric antireflective coating (DARC) thereby lowering cost of ownership by replacing a more expensive ArF (193 nm) photoresist patterning process. A key feature is treatment of a DARC such as SiON with a photoresist developer solution that is 0.263 N tetramethylammonium hydroxide (TMAH) prior to treatment with hexamethyldisilazane (HMDS) in order to significantly improve adhesion of features with CD down to about 60 nm. After the HMDS treatment, a photoresist layer is coated on the DARC, patternwise exposed, and treated with the photoresist developer solution to form a pattern therein. Features that were previously resolved by KrF patterning processes but subsequently collapsed because of poor adhesion, now remain upright and intact during a subsequent etch process used to transfer the sub-100 nm features into a substrate.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: January 30, 2018
    Assignee: Headway Technologies, Inc.
    Inventors: Jesmin Haq, Tom Zhong
  • Patent number: 9818658
    Abstract: A semiconductor wafer processing method comprising controlling the temperature of a semiconductor wafer to be within a predetermined processing temperature range by: causing a first temperature change of the semiconductor wafer using a first temperature changing unit; and subsequently causing a second temperature change using a second temperature changing unit; wherein the first change is greater than the second change; and subsequently loading the semiconductor wafer on a processing area of a semiconductor wafer processing apparatus.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: November 14, 2017
    Assignee: METRYX LIMITED
    Inventors: Robert John Wilby, Adrian Kiermasz
  • Patent number: 9786524
    Abstract: The present disclosure provides a developing unit that includes a wafer stage designed to secure a semiconductor wafer; an exhaust mechanism configured around the wafer stage and designed to exhaust a fluid from the semiconductor wafer; and a multi-switch integrated with the exhaust mechanism and designed to control the exhaust mechanism at various open states.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: October 10, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chung-Cheng Wang
  • Patent number: 9766543
    Abstract: In one embodiment, a liquid treatment method includes (A) imaging a discharging port part of the liquid nozzle each time the discharging process is performed to one substrate, and acquiring, from images thus obtained, size data on foreign matter possibly present at the discharging port part; and (B) based on a history of the size data arranged in chronological order, judging whether an abnormality in substrate-processing has occurred. In the item (B), if the number of continuous acquisition, indicating how many times the size data not smaller than a first threshold value has been acquired continuously, exceeds a predetermined value, then judging that an abnormality in substrate-processing has occurred.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: September 19, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Yuichiro Kunugimoto, Izumi Hasegawa
  • Patent number: 9768014
    Abstract: Improved wafer coating processes, apparatuses, and systems are described. In one embodiment, an improved spin-coating process and system is used to form a mask for dicing a semiconductor wafer with a laser plasma dicing process. In one embodiment, a spin-coating apparatus for forming a film over a semiconductor wafer includes a rotatable stage configured to support the semiconductor wafer. The rotatable stage has a downward sloping region positioned beyond a perimeter of the semiconductor wafer. The apparatus includes a nozzle positioned above the rotatable stage and configured to dispense a liquid over the semiconductor wafer. The apparatus also includes a motor configured to rotate the rotatable stage.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: September 19, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Jungrae Park, Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar
  • Patent number: 9685362
    Abstract: An apparatus and method for centering substrates determining on a chuck. The apparatus includes a chuck in a process chamber, the chuck configured to removeably hold a substrate for processing; an array of two or more ultrasonic sensors arranged in the process chamber, each ultrasonic sensor arranged relative to the chuck so as to send a respective ultrasonic sound wave to a respective preselected region of the substrate and receive a respective return ultrasonic sound wave from the preselected region of the substrate; and a controller connected to each ultrasonic sensor and configured to compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave from each ultrasonic sensor.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: June 20, 2017
    Assignee: International Business Machines Corporation
    Inventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
  • Patent number: 9656460
    Abstract: The disclosure provides an ink jet printing apparatus. The ink jet printing apparatus includes a support base configured to support the to-be-processed substrate; and a solvent adjusting mechanism, configured to supply a dummy region of the to-be-processed substrate on the support base with a first solvent that is same as a solvent in an ink and adjust a solvent atmosphere of the dummy region of the to-be-processed substrate on the support base, to make the solvent atmosphere of the dummy region of the to-be-processed substrate and that of a center region of the to-be-processed substrate reach a predetermined condition. The solvent adjusting mechanism is arranged on the support base.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: May 23, 2017
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Dejiang Zhao, Shinsuke Iguchi
  • Patent number: 9653367
    Abstract: A method includes performing a spin coating process. In the spin coating process, a first fluid is dispensed to a surface of a wafer. The method further includes performing an inspection of an edge area of the wafer. On the basis of the inspection of the edge area of the wafer, a defect analysis is performed. In the defect analysis, it is determined if the edge area of the wafer has a defect that is indicative of an insufficient coating of the surface of the wafer by the first fluid.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: May 16, 2017
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Torsten Maehr, Martin Freitag, Arthur Hotzel
  • Patent number: 9620393
    Abstract: A substrate treatment apparatus includes: a nozzle having an opposing surface to be opposed to and spaced from a front surface of a substrate rotated by a substrate rotating unit, the nozzle further having an outlet port provided in the opposing surface to be opposed to a rotation center of the substrate; a second liquid supply control unit which controls the second liquid supplying unit to fill a space defined between the front surface and the opposing surface with the second liquid in a liquid filled state, and then stop supplying the second liquid to form a liquid puddle in the space; and a first liquid supply control unit which controls a first liquid supplying unit to spout a first liquid from the outlet port after the formation of the liquid puddle.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: April 11, 2017
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Koji Hashimoto, Kazuki Nakamura, Takahiro Yamaguchi
  • Patent number: 9620394
    Abstract: In one embodiment, a cleaning member has an annular part and an opening positioned radially inside the annular part, and can be moved up and down between a first position and a second position relative to a cleaning nozzle. For cleaning of the back surface of the wafer, the cleaning member is placed at its first position that allows a cleaning liquid to reach the back surface of the substrate through the opening of the cleaning member. For cleaning of the cup structure, the cleaning member placed at its second position higher than the first position is being rotated, and a cleaning liquid discharged from the cleaning nozzle collides with an annular part of the cleaning member and is guided to the inner surface of a cup structure.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: April 11, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Naofumi Kishita, Yuji Sakai
  • Patent number: 9606457
    Abstract: A substrate handler for transferring substrates to be exposed from a track to a lithographic apparatus. The substrate handler comprises a controller. The controller is configured to determine an instance for starting a transfer process of a first one of the substrates. The instance is based on a predetermined processing characteristic of the lithographic apparatus, in order to maintain a transfer period of the substrate in the substrate handler substantially constant.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: March 28, 2017
    Assignee: ASML Netherlands B.V.
    Inventors: Norbertus Josephus Martinus Van Den Nieuwelaar, Petrus Franciscus Van Gils, Arthur Erland Swaving
  • Patent number: 9553003
    Abstract: In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: January 24, 2017
    Assignee: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Konosuke Hayashi, Masaaki Furuya, Takashi Ootagaki, Yuji Nagashima, Atsushi Kinase, Masahiro Abe
  • Patent number: 9532401
    Abstract: Embodiments of the invention generally relate to susceptor support shafts and process chambers containing the same. A susceptor support shaft supports a susceptor thereon, which in turn, supports a substrate during processing. The susceptor support shaft reduces variations in temperature measurement of the susceptor and/or substrate by providing a consistent path for a pyrometer focal beam directed towards the susceptor and/or substrate, even when the susceptor support shaft is rotated. The susceptor support shafts also have a relatively low thermal mass which increases the ramp up and ramp down rates of a process chamber. In some embodiments, a custom made refractive element can be removably placed on the top of the solid disc to redistribute secondary heat distributions across the susceptor and/or substrate for optimum thickness uniformity of epitaxy process.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: December 27, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Zhepeng Cong, Balasubramanian Ramachandran, Masato Ishii, Xuebin Li, Mehmet Tugrul Samir, Shu-Kwan Lau, Paul Brillhart
  • Patent number: 9500405
    Abstract: An apparatus for processing wafer-shaped articles comprises a rotary chuck adapted to hold a wafer shaped article of a predetermined diameter in a predetermined orientation. The chuck includes a heater comprising a plurality of gas nozzles directed toward a surface of a wafer shaped article when held by the chuck. The heater comprises a gas inlet and at least one heating element for heating gas to be discharged through the plurality of gas nozzles. The heater is configured to heat a wafer shaped article principally by convective heat transfer from heated gas discharged through the plurality of gas nozzles.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: November 22, 2016
    Assignee: LAM RESEARCH AG
    Inventors: Iztok Hace, Martin Navarre
  • Patent number: 9477162
    Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: October 25, 2016
    Assignee: SCREEN Semiconductor Solutions Co., Ltd.
    Inventors: Koji Kaneyama, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori, Shuichi Yasuda, Tetsuya Hamada
  • Patent number: 9463612
    Abstract: The present disclosure is a joining method that joins a target substrate and a support substrate, wherein the method has: a joining operation that includes pressing and joining the target substrate and the support substrate by interposing an adhesive therebetween; and an adhesive removing operation that includes supplying a solvent of the adhesive to the outer adhesive that is the adhesive between the target substrate and the support substrate protruding in the joining operation from the outer lateral surface of the stacked substrate made by joining the target substrate and the support substrate, and to remove the surface of the outer adhesive so that the outer adhesive is formed at a predetermined size.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: October 11, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shinji Okada, Masatoshi Shiraishi, Masatoshi Deguchi
  • Patent number: 9390946
    Abstract: A cleaning apparatus including a holding table for holding a plate-shaped workpiece, a cleaning nozzle for spraying a cleaning fluid to the plate-shaped workpiece, and a table cover for covering a circumference of the holding table. The table cover includes a top plate for covering an upper side of the holding table and a side plate for covering the circumference of the holding table. The table cover is provided with a netlike mesh sheet spaced from a lower surface of the top plate and another netlike mesh sheet spaced from an inner surface of the side plate.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: July 12, 2016
    Assignee: DISCO CORPORATION
    Inventor: Makoto Maejima
  • Patent number: 9385020
    Abstract: A substrate holding and rotating device includes: a turntable rotatable; a rotative drive unit which rotates the turntable; a holding member which is provided on the turntable and horizontally holds a substrate in upwardly spaced relation to the turntable; a vertically movable protection disk disposed between the turntable and a substrate holding position; and a magnetic levitation mechanism including a first magnet attached to the protection disk, an annular second magnet which generates a repulsive force with respect to the first magnet, a support member which non-rotatably supports the second magnet, and a relative movement mechanism which moves the support member and the turntable relative to each other.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: July 5, 2016
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Hiroshi Kato
  • Patent number: 9358555
    Abstract: Provided is a fluid dispensing system with a dispense nozzle with a threaded outer surface and a fluid dispensing apparatus with a movable dispenser arm with an opening that includes threaded inner walls that receive the dispense nozzle therein. Also provided is a method for aligning a dispense head in a coating tool. Horizontal alignment is achieved by rotating the dispense nozzle until its tip is in contact with the chuck then laterally adjusting the dispenser arm position so that the tip is positioned over a center of the chuck. Vertical alignment is achieved by rotating the dispense nozzle until an indicia of the dispense nozzle is at the same vertical location as a designated physical feature of the dispenser arm.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: June 7, 2016
    Assignee: WAFERTECH, LLC
    Inventor: Ping Chou Lu
  • Patent number: 9335371
    Abstract: A semiconductor evaluating device includes a chuck stage for holding a semiconductor device serving as a measuring object, a contact probe for evaluating an electrical characteristic of the semiconductor device by getting contact with the semiconductor device held on the chuck stage, and a fluid spraying portion for spraying a fluid onto the semiconductor device.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: May 10, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hajime Akiyama, Akira Okada, Kinya Yamashita
  • Patent number: 9233390
    Abstract: A substrate is surrounded by an inner cup and an outer cup. A distance between an upper surface of an inner cup lower portion and a lower surface of an inner cup upper portion of the inner cup is gradually reduced outward from an outer periphery of the substrate. A clearance is formed between the upper surface of the inner cup lower portion and the lower surface of the inner cup upper portion at outer peripheries of the inner cup lower portion and the inner cup upper portion. A collection space is formed between the upper surface of the inner cup lower portion and the lower surface of the inner cup upper portion. A scatter capturing space that allows a processing liquid that has passed through the clearance to scatter and captures the scattering processing liquid is formed by an outer cup. An upper portion and an outer periphery of the scatter capturing space are covered by a lower surface and an inner side surface of the outer cup, respectively.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: January 12, 2016
    Assignee: SCREEN Semiconductor Solutions Co., Ltd.
    Inventor: Minoru Sugiyama