Abstract: A plurality of workpiece-holding spindles is arranged, each engaging an article being processed, and a plurality of trays, each removably engaging a plurality of said spindles. The trays are moved along a feeding line extending along a feeding path passing near a decoration module. By a transfer assembly, the spindles carrying the articles are transferred from the trays on the feeding path, to the decoration module. A decorative treatment is applied to the articles carried by the spindles, in correspondence with at least one treatment unit (40, 41, 42) operating along the decoration module. In correspondence with a painting module operatively connected with the feeding line, the articles carried by the spindles are painted.

Abstract: A substrate processing apparatus includes an indexer block and a processing block adjacent to the indexer block in a lateral direction of the indexer block. A plurality of processing block layers are stacked in an up-down direction in the processing block. The indexer block includes a container holding portion and a first transfer robot that transfers a substrate between the substrate container held by the container holding portion and the processing block. Each of the processing block layers includes a plurality of processing units, a substrate placing portion, a dummy-substrate housing portion, and a second transfer robot that transfers a substrate between the substrate placing portion and the plurality of processing units and that transfers a dummy substrate between the dummy-substrate housing portion and the plurality of processing units.

Abstract: Gas is circulated in an entire transportation space. A robot transport device includes a transportation space in which a transport robot is provided and circulation passages by which gas in the transportation space is circulated. Around the transportation space, surrounding spaces are provided. To these surrounding spaces, an object is transported by the transport robot. The transportation space communicates with each of the surrounding spaces via each of openings. The circulation passages are provided to sandwich the transportation space to avoid a working area of the transport robot, including the openings. The circulation passages are provided in pillar portions forming the transportation space.

Abstract: A substrate treating apparatus includes a front heat-treating block, a front relay block and a solution treating block. The front heat-treating block has heat-treating units and main transport mechanisms. The front relay block has receivers and transport mechanisms. The solution treating block has solution treating units and transport mechanisms for solution treatment. The front heat-treating block and front relay block are connected to be able to transport substrates reciprocally. The front relay block and solution treating block are connected to be able to transport the substrates reciprocally. The front relay block is disposed between the solution treating block and front heat-treating block.

Abstract: A method for processing a plurality of substrates after forming a photosensitive film on each substrate includes carrying each substrate into a placement buffer including a plurality of supporters by a first transport mechanism; taking out each substrate from the placement buffer to an interface by a second transport mechanism; carrying each substrate into the exposure device; carrying each substrate out of the exposure device into the placement buffer by the second transport mechanism; taking out each substrate from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate; making each substrate stand by at the placement buffer based on timing at which the exposure device can accept each substrate; and making each substrate stand by at the placement buffer based on timing at which the developing device can accept each substrate.

Abstract: A system for heating, coating, cooling and screening a granular substrate is provided. The system, such as an apparatus for continuous coating granular particles, includes a preheater apparatus for heating granular particles, a rotary drum having an inlet horizontally coupled to the preheater for receiving heated granular particles directly from the fluidized bed preheater, a coating apparatus positioned within the drum for applying a coating to the heated granular particles, and a cooling apparatus positioned horizontally in association with the drum for cooling the granular particles subsequent to coating.

Abstract: A solvent vapor is made to adhere efficiently to the surface of a resist pattern without using an ultraviolet irradiation process to improve processing accuracy, to reduce processing time and to suppress the diffusion of the solvent outside a substrate processing system. The surface of a resist pattern R formed on a semiconductor wafer W by an exposure process and a developing process is coated with water molecules m. A solvent vapor of a water-soluble solvent, such as NMP, is spouted on the surface of the resist pattern R coated with the water molecules m. A surface layer of the resist pattern R is swollen by the solvent vapor combined with the water molecules m to achieve a smoothing process. The water molecules m and the solvent s remaining on the resist pattern R on the wafer W after the smoothing process are removed by drying.

Abstract: A spray coater having a nozzle for spraying a coating liquid, a heater, a slider mounting the nozzle and the heater, and capable of moving reciprocatorily in perpendicular two directions, and a substrate holder holding a substrate so that the surface faces downward with respect to the nozzle, the spray coater forming a thick film by spraying and applying the coating liquid to the surface of the substrate by the nozzle and then heating and drying the coating liquid by the heater, wherein an application of the coating liquid is carried out sequentially by a spray area, and the nozzle and the heater are arranged in parallel so that the drying to the spray area to which the application has been performed is carried out immediately after the application, thereby forming a flat thick film even on a large-sized substrate.

Abstract: Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Abstract: Disclosed are coating apparatus including flow coating and roll-coating that may be used for uniform sol-gel coating of substrates such as glass, solar panels, windows or part of an electronic display. Also disclosed are methods for substrate preparation, flow coating and roll coating. Lastly systems and methods for skin curing sol-gel coatings deposited onto the surface of glass substrates using a high temperature air-knife are disclosed.

Abstract: The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.

Abstract: The present invention provides a substrate double-surface hole-filling apparatus for carrying out a hole-filling operation on a substrate which has a first surface and a second surface, comprises a first feeding device, a first scraping device, a first drying device, a second feeding device, a second scraping device, a second drying device and a turnover device. The substrate double-surface hole-filling apparatus has a turnover device turning over the substrate which needs to be carried out with hole-filling operation. Therefore, the substrate double-surface hole-filling apparatus can automatically carry out the hole-filling operation on two surfaces of the substrate without manual turnover of the substrate, thus improving production efficiency.

Abstract: A camera is used to take an image of an end surface of a honeycomb structure gripped by a hand. Based on the image, an initial rotation angle of the honeycomb structure around a vertical axis at a reference position where the image has been taken is recognized. An arm turning section is driven to convey the honeycomb structure gripped by the hand from the reference position to above a plugging mask. A rotation angle required to adjust the rotation angle of the honeycomb structure on the plugging mask to a desired final rotation angle is acquired based on the initial rotation angle recognized at the reference position and a rotation angle of the honeycomb structure around the vertical axis associated with the driving of the arm turning section from the reference position to above the plugging mask. The honeycomb structure is rotated based on the required rotation angle.

Abstract: A substrate processing method for a substrate having a photosensitive film on a top surface thereof, includes cleaning a back surface of the substrate after the formation of the photosensitive film and before exposure processing; transporting the substrate to a temperature adjuster such as a cooling unit, while holding the substrate with a first holder; adjusting a temperature of the substrate with the temperature adjuster; transporting the substrate from the temperature adjuster to the exposure device with a second holder; and transporting the substrate after the exposure processing to a first platform while holding the substrate with a third holder.

Abstract: The present invention provides a production facility of hot dip galvannealed steel plate able to produce hot dip galvannealed steel plate on production conditions optimal at all times despite rapid changes in the steel type, plating deposition, and other external factors, wherein the production facility 1 of hot dip galvannealed steel plate is provided with a soaking/cooling furnace 7 for treating steel plate I running after leaving a rapid heating furnace 6 by at least one of soaking and cooling. Further, the soaking/cooling furnace 7 is configured to enable a change of the ratio in the furnace of the soaking region 15 for soaking steel plate I by soaking means 21 at a soaking temperature of 500° C. to 650° C. and the cooling region 16 for cooling the steel plate I by spray nozzles 22 by a 5° C./sec or more average cooling rate.

Abstract: Among other things, one or more techniques and systems for performing a spin coating process associated with a wafer and for controlling thickness of a photoresist during the spin coating process are provided. In particular, a thickening phase is performed during the spin coating process in order to increase a thickness of the photoresist. For example, air temperature of down flow air, flow speed of the down flow air, and heat temperature of heat supplied towards the wafer are increased during the thickening phase. The increase in down flow air and heat increase a vaporization factor of the photoresist, which results in an increase in viscosity and thickness of the photoresist. In this way, the wafer can be rotated at relatively lower speeds, while still attaining a desired thickness. Lowering rotational speed of wafers allows for relatively larger wafers to be stably rotated.

Abstract: A substrate processing apparatus including a holder for rotatably holding a substrate; a coating solution supply nozzle for supplying a coating solution onto a front surface of the substrate to be processed held by the holder; a treatment chamber housing the holder and the coating solution supply nozzle; a cooling device which cools the substrate before the coating solution is supplied to the substrate, to a predetermined temperature; a heating devices which heats the substrate coated with the coating solution to a predetermined temperature; and a transferer that transfers the substrate between the treatment chamber, the cooling device and the heating device, wherein the treatment chamber, the cooling device and the heating device are partitioned from ambient air, and wherein at least the treatment chamber is connected to a gas supply mechanism having a supply source of a gas having a kinematic viscosity coefficient higher than that of air.

Abstract: A substrate holder positioning method, capable of positioning a substrate holder without using any positioning jig, includes: measuring a first position of a substrate held on a substrate holder included in a substrate carrying mechanism; carrying the substrate held on the substrate holder to a substrate rotating unit for holding and rotating the substrate; turning the substrate held by the substrate rotating unit through a predetermined angle by the substrate rotating unit; transferring the substrate turned by the substrate rotating unit from the substrate rotating unit to the substrate holder; measuring a second position of the substrate transferred from the substrate rotating unit to the substrate holder; determining the position of the center of rotation of the substrate rotating unit on the basis of the first and the second position; and positioning the substrate holder on the basis of the position of the center of rotation.

Abstract: A method of cleaning off organic deposition material accumulated on a mask includes forming an organic deposition material pattern on a substrate using the mask, which includes a plurality of slots, in a deposition chamber including a deposition source; transporting the mask to a stock chamber that is maintained at a vacuum and adjacent to the deposition chamber; and partially cleaning off the organic deposition material accumulated along the boundaries of the slots of the mask in the stock chamber. A system to clean off an organic deposition material accumulated on a mask having a plurality of slots, includes a deposition chamber including a deposition source; and a stock chamber that is maintained at substantially the same vacuum as the deposition chamber and includes a cleaning device that cleans off the organic deposition material accumulated on the mask.

Abstract: The invention relates to a coating installation, in particular for painting motor vehicle bodies, comprising a transport path (2, 12), along which a plurality of coating objects (1) are transported one after the other through the coating installation, and a plurality of treatment stations (13-17, 18-22, 23-27), in which the coating objects (1) are treated. It is proposed that the transport path (2, 12) branches into a plurality of parallel branches (5-9), in each of which at least one of the treatment stations (13-17, 18-22, 23-27) is arranged.

Abstract: One processing block is arranged between an indexer block and another processing block. One substrate is transported to a main transport mechanism in the one processing block by a main transport mechanism in the indexer block, transported to a first processing section and a thermal processing section by the main transport mechanism in the one processing block and processing is performed on the substrate. The substrate after the processing is transported to the main transport mechanism in the indexer block by the main transport mechanism in the one processing block. Another substrate is transported to a sub-transport mechanism in a sub-transport chamber by the main transport mechanism in the indexer block, and is transported to a main transport mechanism in another processing block by the sub-transport mechanism in the sub-transport chamber.

Abstract: A coating and developing system includes a cassette station, a processing station and an inspection station interposed between the cassette station and the processing station. Time for which a substrate is held uselessly in the inspection module is reduced. A substrate carrying means disposed in the inspection module places priority to transferring a substrate between the cassette station and the processing station, and transfers a substrate to an inspection module in a part of a cycle time in which a substrate carrying means disposed in the processing station carries out one carrying cycle. It is permitted to carry out a substrate from the inspection module in a skip carrying mode, in which a substrate specified by a larger ordinal numeral is carried ahead of a substrate specified by a smaller ordinal numeral. It is inhibited to carry a substrate to the inspection module in the skip carrying mode.

Abstract: A coating and developing apparatus includes a processing block having at least one coating film-forming unit block stack and a vertically stacked developing unit block stack. Each unit block stack includes vertically stacked unit blocks, and each unit block includes processing modules containing liquid processing modules and heating modules. Each unit block includes a transport mechanism moveable along a transport passage from a carrier block side to an interface block side, to transport a substrate between the processing modules belonging to the unit block. Transfer units are provided on the carrier block sides of the coating film-forming unit blocks and the developing unit blocks respectively, for transferring a substrate to and from the transport mechanism of the associated coating film-forming or developing unit blocks. A first transfer mechanism transfers a substrate removed from a carrier to one of the transfer units associated with the coating film-forming unit blocks.

Abstract: A portable machine and process is described for covering all sides of an elongated object with a liquid without the use of brushes. The machine is particularly useful with manufactured building products such as a fence picket, trim, molding, or any other type of board. The machine generally has four stations, an entry station that drives the object down a track, a liquid application station where the object is covered by liquid that is poured over the object, a blower station where the fluid is spread evenly over the object and excess fluid is blown off, and an exit station that continues to pull the object down the track and directs the object as the object leaves the exit station. Finally, the object may enter a releasably attached drop track.

Abstract: A manufacturing method for a secondary battery electrode, includes conveying an electrode current collector; applying an active material layer-forming composition that is prepared in a slurry state onto the electrode current collector; and drying a coating film that is made of the active material layer-forming composition formed on the electrode current collector. The coating film is dried by blowing a first hot air in a direction parallel to a coating film surface of the electrode current collector.

Abstract: In order to provide an economical process for applying a coating to at least one side, optionally to both sides, of a leather, in which gentle processing of the leather is ensured and hardening thereof is avoided, an aqueous plastic dispersion having compact particles containing a blowing agent being applied to this side or these sides and being allowed to solidify, and hollow microspheres being formed from the thermoplastic compact particles by supplying heat, the invention proposes that, after solidification, the plastic dispersion containing the compact particles is subjected to the action of expanded superheated steam at a temperature between 80° C. and 100° C. (FIG. 2).

Abstract: Transport mechanisms are respectively provided in first and second processing blocks. Each transport mechanism has a hand. The hand holds the other surface of a substrate without coming into contact with an edge of the substrate. The hand is moved such that the substrate is transported between an adhesion reinforcement processing unit or a cooling unit and a coating processing unit or a development processing unit. In the adhesion reinforcement processing unit and the cooling unit, temperature processing is performed on the substrate while the back surface of the substrate is held by suction. In the coating processing unit and the development processing unit, a processing liquid is supplied to the main surface of the substrate while the back surface of the substrate is held by suction by a spin chuck.

Abstract: A substrate subjected to back surface cleaning by a back surface cleaning processing unit is held by a hand of an interface transport mechanism and transported to a cooling unit. The substrate whose temperature has been adjusted by the cooling unit is held by a hand of the interface transport mechanism and transported to an exposure device. The substrate subjected to exposure processing by the exposure device is held by a hand of the interface transport mechanism and transported from the exposure device to a substrate platform.

Abstract: A drum coating device for coating work-pieces includes a main body, a support element, a cleaning device, a spraying device, a rotary drum device, a heating device, and a drive device. The main body defines a receiving room. The support element is received in the receiving room and defines slots for receiving the work-pieces. The cleaning device cleans the work-pieces. The spraying device sprays coating materials to the work-pieces. The rotary drum device uniformly coats the coating materials on the work-pieces. The heating device heats the coating materials coated on the work-pieces. The drive device includes a rotating drive rotating the support element and a linear drive raising or lowering the support element in the receiving room.

Abstract: An interface block is constituted by a cleaning/drying processing block and a carry-in/carry-out block. The cleaning/drying processing block includes cleaning/drying processing sections and a transport section. The transport section is provided with a transport mechanism. The carry-in/carry-out block is provided with a transport mechanism. The transport mechanism carries substrates in and out of an exposure device.

Abstract: A substrate treating method including: a coating step in which a coating film of a liquid material comprising a metal and a solvent is formed on a first substrate and a second substrate; and a heating step in which the coating film is heated in a state where the first substrate and the second substrate are held in a manner such that the coating film formed on the first substrate faces the coating film formed on the second substrate.

Abstract: A method for producing apparatus for producing and photovoltaic device including semiconductor layers with halide heat treated surfaces that increase grain growth within at least one of the semiconductor layers and improve the interface between the semiconductor layers. The halide heat treatment includes applying and heating multiple coatings of a halide compound on surfaces adjacent to or part of the semiconductor layers.

Abstract: A solvent vapor is made to adhere efficiently to the surface of a resist pattern without using an ultraviolet irradiation process to improve processing accuracy, to reduce processing time and to suppress the diffusion of the solvent outside a substrate processing system. The surface of a resist pattern R formed on a semiconductor wafer W by an exposure process and a developing process is coated with water molecules m. A solvent vapor of a water-soluble solvent, such as NMP, is spouted on the surface of the resist pattern R coated with the water molecules m. A surface layer of the resist pattern R is swollen by the solvent vapor combined with the water molecules m to achieve a smoothing process. The water molecules m and the solvent s remaining on the resist pattern R on the wafer W after the smoothing process are removed by drying.

Abstract: A method and an installation are provided for preserving desired seasoning flavor profiles during the manufacturing of food-seasoning sheets. The method includes the steps of; laying a thin layer of adhesive on a base sheet; removing air from the adhesive prior to the step of laying; reducing free moisture from the adhesive during the step of laying, and depositing food-seasoning ingredients onto the thin layer of adhesive. The installation for manufacturing food-seasoning sheets includes an adhesive dispenser having a reservoir and a delivery slot communicating with the reservoir for dispensing adhesive. The dispenser has a heating element mounted thereto for heating the adhesive. The adhesive is made under a partial vacuum and it is conveyed to the dispenser in a partial vacuum.

Abstract: A molding roller includes a main body and a seamless ring-shaped resin film. The main body has a smooth circumferential surface. The resin film is coated on the circumferential surface and has a molding surface opposite to the main body. The molding surface defines a number of molding patterns. The resin film is made of ethylene tetrafluoroethylene or poly tetrafluoroethylene.

Abstract: There is provided a method of producing a composite that separates carbon dioxide that has a carbon dioxide separating film on a support includes preparing, at greater than or equal to 50° C., a coating liquid for carbon dioxide separating film formation that contains a water absorbent polymer, a carbon dioxide carrier and a gelling agent, and that gels, after being left at 12° C. at a solution film thickness of less than or equal to 1 mm, within 120 seconds and liquid not dropping-off due to gravity; coating the coating liquid on a strip-shaped support; cooling, at less than or equal to 12° C., a coated film obtained by the coating, and obtaining a gel film; and drying the gel film at least by warm air, and obtaining a carbon dioxide separating film, wherein, from coating to drying are carried out continuously while conveying the support in a given direction.

Abstract: A system and method allows for processing of two groups of medical devices, both groups being alternatingly spray coated within the same enclosure. The two groups repeatedly move back and forth between a spray area and a drying area which is isolated from the spray area. One group moves into the spray area as the other group moves out and into the drying area. Thereafter, the group in the spray area moves out and into the drying area and the other group moves back into the spraying area for a second coating. The alternating process may be repeated any number of times. The spray area may be located inside a sealed spray isolator enclosure and surrounded by gas discharge nozzles.

Abstract: An exemplary apparatus for manufacturing a light guide film having patterns simultaneously formed on two opposite surfaces thereof, includes a first conveyor roller, a second conveyor roller, a imprinting group roller, two coating devices, two solidifying devices, a first template and a second template. The imprinting group rollers are positioned between the first and second conveyor rollers, including a first imprinting roller and a second imprinting roller opposite to the first imprinting roller. The two coating devices are positioned between the first conveyor roller and the imprinting group roller. The two solidifying devices are positioned between the imprinting group rollers and the second conveyor roller. The first template has a first imprinting pattern, and is fixed on a circumferential surface of the first imprinting roller. The second template has a second imprinting pattern, and is fixed on a circumferential surface of the second imprinting roller.

Abstract: A transporting apparatus which transports a heated substrate, the substrate having a liquid containing a metal coated thereon, the transporting apparatus including a holding part which is moveable and holds the heated substrate, and a temperature control part which controls the temperature of the holding part.

Abstract: A coating and developing apparatus includes a processing block having at least one coating film-forming unit block stack and a vertically stacked developing unit block stack. Each unit block stack includes vertically stacked unit blocks, and each unit block includes processing modules containing liquid processing modules and heating modules. Each unit block includes a transport mechanism moveable along a transport passage from a carrier block side to an interface block side, to transport a substrate between the processing modules belonging to the unit block. Transfer units are provided on the carrier block sides of the coating film-forming unit blocks and the developing unit blocks respectively, for transferring a substrate to and from the transport mechanism of the associated coating film-forming or developing unit blocks. A first transfer mechanism transfers a substrate removed from a carrier to one of the transfer units associated with the coating film-forming unit blocks.

Abstract: An optical printed circuit board includes a substrate, a first cladding layer, a core layer, and a second cladding layer. The first cladding layer is formed on the substrate and defines a receiving groove. The core layer is received in the receiving groove. The second cladding layer is formed on the core layer. The refractive index of the core layer is greater than that of the first cladding layer and that of the second cladding layer. The core layer includes a bottom surface, a first refractive surface, and a second refractive surface. An included angle between the bottom surface and the first refractive surface is about 135 degrees. An included angle between the bottom surface and the second refractive surface is about 135 degrees.

Abstract: A thin film deposition apparatus and a using method thereof are disclosed. The apparatus includes a preheating chamber, a reacting chamber, a cooling chamber, and at least one transmission module. The preheating chamber is configured for preheating the substrate. The reacting chamber is configured for receiving the substrate being preheated and transferred from the preheating chamber, heating the substrate to a working temperature, depositing a thin film on the substrate under the working temperature, and cooling the substrate being deposited to a temperature lower than the working temperature. The cooling chamber is configured for receiving the substrate being deposited and transferred from the reacting chamber and further cooling the substrate. The transmission module is configured for transferring the substrate between the preheating chamber, the reacting chamber, and the cooling chamber.

Abstract: A strand is coated with a powdered material by first applying a layer of hot polymer resin to the strand, and spraying the powdered material onto the resin-coated strand from at least three nozzles disposed along the processing path and spaced radially therearound. The spray apparatus is disposed within nested containers so as to limit the escape of overspray powder. The powder-coated strand may be heat-set to increase the adhesion of the powder.

Abstract: A substrate processing apparatus is disclosed equipped with a transfer mechanism that transfers a substrate processed at a processing block to a carrier so that the increase of the number of transfer process is suppressed, improving the processing efficiency. The substrate processing apparatus is configured in such a way that, when a second-transfer module houses at least one substrate and a carrier that can house the at least one substrate is not placed in a carrier-placement unit, the at least one substrate is transferred to a buffer module. When the second transfer module houses at least one substrate and the carrier that can house the at least one substrate is placed in the carrier-placement unit, the at least one substrate is transferred to the carrier, regardless of whether or not a substrate is being transferred from the buffer module to the carrier.

Abstract: In one embodiment, a coating and developing apparatus is provided with a processing block including a liquid processing block disposed on the carrier block side and a heating processing block disposed on the interface block side. The liquid processing block includes a first unit block, a second unit block, and one or more of developing unit blocks overlying or underlying a stack of the first unit block and the second unit block. The first unit block includes antireflection film-forming modules and resist film-forming modules disposed on both sides of the transport passage thereof. The second unit block includes upper film-forming modules and hardening modules disposed on both sides of the transport passage thereof.

Abstract: A production assembly and associated process for mass producing such as a thermoplastic pallet and which utilizes a multiple insert supporting and continuously moving carousels inter-faceable with an input line upon which is transported a plurality of rigid and planar shaped inserts, as well as an output line a spaced relationship from the input line for removing, from the carousel, the resin coated articles. The invention further teaches a series of subset variants for spray applying a two part resin and hardener upon the insert according to a selected thickness, following which the inserts are cured and dried prior to transferring to the output line and in order to create a finished product.

Abstract: According to one embodiment, a film-forming apparatus includes a coating unit which introduces a liquid material to a substrate with a groove and fills the liquid material into the groove, thereby forming a liquid layer, a drying unit which solidifies the liquid layer by drying, and a vapor supply unit which applies a vapor to a surface of the liquid layer during the drying

Abstract: A dip coating apparatus includes a housing and a workpiece holder movably and rotatably received in the housing. The housing includes an immersing portion configured for carrying out immersion process and a drying portion configured for carrying out drying process. The inner spaces of the immersing portion and the drying portion are communicated with each other. The lifting workpiece holder is configured for fixed workpieces thereon and moving and rotating relative to the immersing portion and the drying portion of the housing. The workpieces are driven by the lifting-rotating to carry out the immersion process and the drying process.

Abstract: The present invention provides a production facility of hot dip galvannealed steel plate able to produce hot dip galvannealed steel plate on production conditions optimal at all times despite rapid changes in the steel type, plating deposition, and other external factors, wherein the production facility 1 of hot dip galvannealed steel plate is provided with a soaking/cooling furnace 7 for treating steel plate I running after leaving a rapid heating furnace 6 by at least one of soaking and cooling. Further, the soaking/cooling furnace 7 is configured to enable a change of the ratio in the furnace of the soaking region 15 for soaking steel plate I by soaking means 21 at a soaking temperature of 500° C. to 650° C. and the cooling region 16 for cooling the steel plate I by spray nozzles 22 by a 5° C./sec or more average cooling rate.

Abstract: This disclosure relates to systems and associated methods for applying a surface treatment to a part and curing the surface treatment without reorienting the part in the process. The systems include a first conveyor, a second conveyor, a system for applying a surface treatment, such as a powder coating application system, and a system for curing the surface treatment.