Liquid Treatment Patents (Class 118/73)
  • Publication number: 20150010692
    Abstract: Apparatus to apply a coating to media. The apparatus includes a first roller for receiving a continuous belt. The continuous belt is for receiving a coating from a second roller and for transferring the coating to media. The first roller is arranged to provide an adjustable width of the continuous belt to the second roller. The width of the continuous belt provided to the second roller is adjustable to substantially correspond to the width of the media.
    Type: Application
    Filed: January 31, 2012
    Publication date: January 8, 2015
    Inventor: Alex Feygelman
  • Publication number: 20140305371
    Abstract: A system and a method for pretreating an aluminum assembly includes selecting a blank having a thin film pretreatment layer and a lubricant coating applied to a surface. The blank is formed to a desired shape and an adhesive is applied to a selected portion of the surface. A cleaner is applied to the assembly to remove the thin film pretreatment layer and the lubricant coating from the surface except at the selected portion and a zirconium oxide conversion coating is applied to the assembly before painting.
    Type: Application
    Filed: June 26, 2014
    Publication date: October 16, 2014
    Inventors: Mark Edward Nichols, Janice Lisa Tardiff, Brian Schneider, Steven J. Simko
  • Patent number: 8840728
    Abstract: The present invention is a template treatment apparatus forming a film of a release agent on a template having a transfer pattern formed on a front surface thereof, the template treatment apparatus including: a treatment station forming a film of a release agent on the front surface of the template; and a template carry-in/out station capable of keeping a plurality of the templates, and carrying the template into/out of the treatment station, wherein the treatment station includes: a cleaning unit cleaning the front surface of the template; a coating unit applying a release agent to the cleaned front surface of the template; a heating unit baking the applied release agent; and a carry unit carrying the template to the cleaning unit, the coating unit, and the heating unit.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: September 23, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Shoichi Terada, Yoshio Kimura, Takahiro Kitano
  • Publication number: 20140259667
    Abstract: A system, kit and method for non-structural surface repair and reconditioning of industrial sized blades includes an initial evaluation and power washing step for identifying required repairs. A surface cleaning step combines power washing with application of muratic acid and various mechanical tools and techniques for removing environmental and chemical buildup. A succeeding step provides for non-structural surface repairs to the blades, such as including filling and reshaping the leading edges with the use of an impact resistant urethane and/or a fast cure epoxy and fiberglass cloth. A finish coating step includes applying a chemically resistant and submersible grade (i.e. water resistant) top coat epoxy.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Inventors: James Witt, Stephen Witt
  • Publication number: 20140220250
    Abstract: A system for painting a structure includes a motorized, wheeled vehicle that is movable along a surface and includes a frame and a lift structure coupled with the frame. The system also includes a support structure supported by the lift structure, and a table supported by the support structure. The table is translatable relative to the support structure. The system also includes a mount structure rotatably coupled with the table and a kit of parts that includes a spray head assembly configured for releasable attachment to the mount structure. The system further includes a paint reservoir and a pump, each being supported by one of the vehicle and the support structure.
    Type: Application
    Filed: April 11, 2014
    Publication date: August 7, 2014
    Inventors: Adam G. Logan, Cameron Michael Johnson, Jeffrey David Weikel
  • Publication number: 20140212581
    Abstract: A system and a method for pretreating an aluminum assembly includes selecting a blank having a thin film pretreatment layer and a lubricant coating applied to a surface. The blank is formed to a desired shape and an adhesive is applied to a selected portion of the surface. A cleaner is applied to the assembly to remove the thin film pretreatment layer and the lubricant coating from the surface except at the selected portion and a zirconium oxide conversion coating is applied to the assembly before painting.
    Type: Application
    Filed: January 28, 2013
    Publication date: July 31, 2014
    Applicant: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Mark Edward Nichols, Janice Lisa Tardiff, Brian Schneider, Steven J. Simko
  • Patent number: 8685203
    Abstract: Provided is a dry etcher including an etching device and a cleaning device, more particularly, a dry etcher including an etching device and a cleaning device to which a cleaning process is added so as to be used in a metal layer etching process. The dry etcher includes an etching device into which etching gas is injected to etch a layer formed on a substrate, a substrate transfer device transferring the substrate processed by the etching device, and a cleaning device cleaning the substrate transferred by the substrate transfer device.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: April 1, 2014
    Assignee: Semens Co., Ltd.
    Inventor: Jae-Hyun Choi
  • Patent number: 8607730
    Abstract: An apparatus and method of replacing a liquid of a circulation line in a substrate liquid processing apparatus of a single-wafer type, which can replace the liquid more efficiently, by relating the replacing method with a process-liquid replenishing method. A substrate liquid processing apparatus of a single-wafer type includes: a circulation line through which a process liquid is circulated; a tank disposed in the circulation line; a liquid level sensor disposed in the tank; a liquid replenish part configured to replenish the tank with a new process liquid, based on an output of the liquid level sensor; and a liquid-replacement control part configured to stop the operation of the liquid replenish part based on a predetermined replenish stop condition that is set cooperatively with a predetermined liquid disposal condition, and to discard all the process liquid in the tank based on the predetermined liquid disposal condition.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: December 17, 2013
    Assignee: Tokyo Electron Limited
    Inventor: Kazuyoshi Eshima
  • Patent number: 8574385
    Abstract: A communication line such as an optical fiber or cable is attached along a wall, ceiling, trim piece, or other target surface inside of a building by laying out the line from an applicator tool. An outer surface of the line is placed in a temporarily tacky condition as the line is laid out from the tool along the target surface. The temporarily tacky condition of the line is due at least in part to an adhesive component that is pre-applied to the outer surface of the line. The adhesive component is activated by an agent or medium that is associated with the applicator tool. The line becomes non-tacky after it is attached to the target surface.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: November 5, 2013
    Assignee: O FS FITFL, LLC
    Inventors: Bernard M. Malofsky, Adam G. Malofsky, Joseph E. Bradley, William H. Mann, Robert C. Table, Victor J. Morando, James M. Sellers, Nathan E. Winters, John Depiano, Paul R. Dickinson, Daniel Hendrickson
  • Publication number: 20130236644
    Abstract: A system for painting a structure includes a motorized, wheeled vehicle that is movable along a surface and includes a frame and a lift structure coupled with the frame. The system also includes a support structure supported by the lift structure, and a table supported by the support structure. The table is translatable relative to the support structure. The system also includes a mount structure rotatably coupled with the table and a kit of parts that includes a spray head assembly configured for releasable attachment to the mount structure. The system further includes a paint reservoir and a pump, each being supported by one of the vehicle and the support structure.
    Type: Application
    Filed: March 7, 2012
    Publication date: September 12, 2013
    Inventors: Adam G. Logan, Cameron Michael Johnson, Jeffrey David Weikel
  • Patent number: 8505477
    Abstract: A system for applying hot melt adhesive powder onto a non-metallic object surface comprises a convey belt, a radiation chamber, a spraying chamber and a heating chamber. The convey belt is used to deliver a non-metallic object treated by a cleaning agent and a conductive liquid through the radiation chamber where the surface of the non-metallic objected is irradiated by ultraviolet rays and ozone and then through the spraying chamber where the surface of the non-metallic object is sprayed with charged hot melt adhesive powder, and finally into the heating chamber where the hot melt adhesive powder attached onto the non-metallic object will be melted into a liquid adhesive film ready to be bonded.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: August 13, 2013
    Assignee: Orisol Asia Ltd.
    Inventors: Jakov Makover, Bar Cochva Mardix, Yaacov Sadeh
  • Patent number: 8499713
    Abstract: A method for applying a water-based coating (53) to a painted workpiece (49) is provided. The method includes spraying water (51) from an application nozzle unit (10) to the workpiece (49), feeding the water-based coating (53) to the workpiece (49), and finally applying streams of compressed air onto the water-based coating (53) to spread uniformly the water-based coating (53).
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: August 6, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yoshiyuki Nakazawa, Masazumi Watanabe
  • Publication number: 20130194350
    Abstract: A thin film forming apparatus which automatically forms, on an electrode layer formed on a substrate, a functional thin film which is crystallized from a precursor layer is disclosed, including a water-repellant film forming unit which forms, on a region other than a region on which is to be formed the functional thin film on the electrode layer, a water-repellant film which includes a self-assembled monolayer; an inkjet coating unit which coats, on the region on which is to be formed the functional thin film on the electrode layer, the precursor layer by an inkjet method; and a controller which controls, to within a predetermined time, a time from forming the water-repellant film with the water-repellant film forming unit to coating the precursor layer with the inkjet coating unit.
    Type: Application
    Filed: January 28, 2013
    Publication date: August 1, 2013
    Applicant: RICOH COMPANY, LTD.
    Inventors: Yasuhiro Watanabe, Osamu Machida, Akira Shimofuku, Ryo Tashiro, Atsushi Takeuchi
  • Publication number: 20130118403
    Abstract: A chemical bath deposition system is used for forming a buffer layer on a back electrode substrate having a photoelectric transducing layer. The chemical bath deposition system includes a chemical bath tank, a chemical-solution purification device, and a dosing device. The chemical bath tank is used for storing a buffer-layer solution including cation and anion. The cation is adapted to react with the anion to form the buffer layer when the back electrode substrate is immersed in the buffer-layer solution. The chemical-solution purification device is communicated with the chemical bath tank for removing residual cation to obtain a purified solution after the cation reacts with the anion to form the buffer layer. The dosing device is for performing compensation of the cation according to a component ratio of a purified solution.
    Type: Application
    Filed: May 9, 2012
    Publication date: May 16, 2013
    Inventors: Shih-Wei Lee, Lung-Chieh Wang, Chih-Lung Lin
  • Publication number: 20130122704
    Abstract: There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.
    Type: Application
    Filed: November 15, 2012
    Publication date: May 16, 2013
    Applicants: Dainippon Screen Mfg. Co., Ltd., EBARA CORPORATION
    Inventors: EBARA CORPORATION, Dainippon Screen Mfg. Co., Ltd.
  • Patent number: 8434423
    Abstract: Disclosed is a substrate carrying apparatus having a simple configuration capable of inhibiting the occurrence of pattern collapse. A carrying tray of the disclosed substrate carrying apparatus includes a bottom plate for supporting the substrate and a circumferential side wall being provided around the bottom plate. An opening is formed in the bottom plate. An elevating member, to and from which the substrate is to be transferred, passes through the opening. A space is temporarily formed in a carrying tray. The elevating member within the opening passes to the outside of the carrying tray through the space. When the substrate is carried, the liquid is reservoired within the carrying tray, and the substrate is carried while the liquid remained on the upper surface of the substrate.
    Type: Grant
    Filed: February 2, 2010
    Date of Patent: May 7, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Takayuki Toshima, Kazuo Terada
  • Publication number: 20130052828
    Abstract: In a substrate processing apparatus (1), a silicon oxide film on a main surface of a substrate (9) is removed in an oxide film removing part (4) and then a silylation material is applied to the main surface, to thereby perform a silylation process in a silylation part (6). It is thereby possible to lengthen the Q time from the removal of the silicon oxide film to the formation of the silicon germanium film and reduce the temperature for prebaking in the formation of the silicon germanium film.
    Type: Application
    Filed: August 21, 2012
    Publication date: February 28, 2013
    Inventors: Akio HASHIZUME, Yuya AKANISHI
  • Publication number: 20120318196
    Abstract: There is disclosed a system for forming a superconductor material on a substrate. The system may comprise a dispensing reel; a spooling reel; and at least two modular reaction chambers, wherein at least one modular reaction chamber is connected to a supply of buffer precursor material and at least one other modular reaction chamber is connected to a supply of superconductor precursor material. The modular reaction chambers may include connections capable of being modified to add or remove adjacent components. It is understood that at least one of the spooling reel and/or the dispensing reel are exposed to normal atmosphere. The deposition chamber may also comprise a distribution head that provides a laminar flow of precursor materials onto the substrate, as well as at least one lamp comprising a reflector that directs UV and/or visible light towards the tape substrate to enhance a growth rate of material.
    Type: Application
    Filed: February 2, 2012
    Publication date: December 20, 2012
    Inventors: Alex Ignatiev, Xin Zhang, Alexander A. Molodyk, Louis D. Castellani
  • Publication number: 20120251944
    Abstract: Embodiments of the disclosed technology disclose a photolithography method and apparatus, and the method comprises: hydrophobicity-treating edge portions of a surface of a substrate to be applied with photoresist; and applying hydrophilic photoresist to the surface of the substrate subject to hydrophobic treatment. With the disclosed technology, the usage amount of thinner in the edge photoresist-removing procedure can be greatly reduced or even eliminated, thereby reducing production costs and increasing production efficiency.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Weifeng ZHOU, Jianshe XUE
  • Publication number: 20120231447
    Abstract: The present disclosure provides methods for treating a surface for single-molecule imaging.
    Type: Application
    Filed: February 15, 2012
    Publication date: September 13, 2012
    Applicant: HOWARD HUGHES MEDICAL INSTITUTE
    Inventors: Zhengjian Zhang, Andrey Revyakin, Steve Chu, Robert Tijan
  • Patent number: 8030182
    Abstract: By hydrogen-terminating a semiconductor surface using a solution containing HF2? ions and an oxidant, the hydrogen termination can be quickly carried out. In this case, the semiconductor surface is silicon having a (111) surface, a (110) surface, or a (551) surface.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: October 4, 2011
    Assignee: Tadahiro OHMI
    Inventors: Tadahiro Ohmi, Akinobu Teramoto, Hiroshi Akahori
  • Publication number: 20110203518
    Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
    Type: Application
    Filed: May 4, 2011
    Publication date: August 25, 2011
    Inventors: Seiji KATSUOKA, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
  • Publication number: 20110175207
    Abstract: The invention relates to a method for producing metal oxide layers from oxides of rare earth metals on silicon-containing surfaces, to the device used to carry out the coating method, and to the use of the starting materials used in the method according to the invention for the coating method.
    Type: Application
    Filed: June 23, 2009
    Publication date: July 21, 2011
    Applicant: CARL VON OSSIETZKY UNIVERSITÄT OLDENBURG
    Inventors: Hanno Schnars, Mathias Wickleder, Katharina Al-Shamery
  • Publication number: 20110143553
    Abstract: Methods and systems for handling a substrate through processes including an integrated electroless deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electroless deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate.
    Type: Application
    Filed: December 10, 2010
    Publication date: June 16, 2011
    Applicant: Lam Research Corporation
    Inventors: Yaxin Wang, Shijian Li, Fritz Redeker, John Parks, Artur Kolics, Hyungsuk Alexander Yoon, Tarek Suwwan de Felipe, Mikhail Korolik
  • Publication number: 20100330283
    Abstract: A liquid processing apparatus processes an object to be processed W including a body part Wi and a plurality of projecting-shape parts Wm disposed on the body part Wi, with an inorganic film and a different film being laminated to each other. The liquid processing apparatus comprises: a support part 50 configured to support the body part Wi; a hydrophobic-liquid supply mechanism 30 configured to supply a hydrophobic liquid to the object to be processed W; and a rinse-liquid supply part 22 configured to supply a rinse liquid to the object to be processed W to which the hydrophobic liquid has been supplied. The hydrophobic-liquid supply mechanism 30 includes: a first hydrophobic-liquid supply part 32 configured to supply a first hydrophobic liquid for making hydrophobic the inorganic film; and a second hydrophobic-liquid supply part 37 configured to supply a second hydrophobic liquid for making hydrophobic the different film.
    Type: Application
    Filed: May 21, 2010
    Publication date: December 30, 2010
    Applicant: Tokyo Electron Limited
    Inventors: Mitsunori NAKAMORI, Akira Fujita, Takayuki Toshima
  • Patent number: 7849812
    Abstract: The present invention provides an automated continuous coating apparatus for coating industrial components such as porcelain, glass, and polymeric insulators. The apparatus consists of a several stage continuous inline operation. The stages are a cleaning operation, followed by drying and heating, coating, and curing.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: December 14, 2010
    Assignee: CSL Silicones Inc.
    Inventors: Farooq Ahmed, Faisal Huda, Seraj ul Huda, John Barr, Steve Moss
  • Publication number: 20100192851
    Abstract: A composition includes a carbon nanotube (CNT)-infused glass fiber material, which includes a glass fiber material of spoolable dimensions and carbon nanotubes (CNTs) bonded to it. The CNTs are uniform in length and distribution. A continuous CNT infusion process includes: (a) disposing a carbon-nanotube forming catalyst on a surface of a glass fiber material of spoolable dimensions; and (b) synthesizing carbon nanotubes on the glass fiber material, thereby forming a carbon nanotube-infused glass fiber material. The continuous CNT infusion process optionally includes extruding a glass fiber material from a glass melt or removing sizing material from a pre-fabricated glass fiber material.
    Type: Application
    Filed: February 26, 2010
    Publication date: August 5, 2010
    Applicant: Lockheed Martin Corporation
    Inventors: Tushar K. SHAH, Slade H. GARDNER, Mark R. ALBERDING, Harry C. MALECKI
  • Publication number: 20100130109
    Abstract: A system and method for restoring water supply pipes in buildings is provided. Compressed air is blown through one end of a cold water supply pipe, such as a cold water riser, and elsewhere on the pipe the cold water supply pipe is connected to the hot water supply pipe by an air hose. Compressed air may alternatively be blown through one end of the hot water supply pipe. To clean the pipe, abrasive particles are introduced into the stream of compressed air upstream of the section of pipe to be cleaned. To line the pipe, an epoxy coating is introduced into the stream of compressed gas upstream of the section of pipe to be lined.
    Type: Application
    Filed: November 26, 2008
    Publication date: May 27, 2010
    Applicant: RIKOS LTD.
    Inventor: Marc Leben
  • Publication number: 20100075053
    Abstract: The invention relates to a non-electrolytic method for metallizing a substrate by projecting an aerosol containing a solution of an oxidant metallic cation and of a reducing agent; said method comprising a step of—a—wetting the substrate; starting to project a metallisation according to a succession of projecting phases alternating with relaxing phases: (i) by adjusting the duration Dp of the projection phases and the duration Dr of the relaxing phases from a metallisation constant k intrinsic for each metal; and (ii) by adjusting the projection flow-rate. The metallisation projection is carried out dynamically by displacing projection means relative to the substrate in order to carry out a periodical scanning, wherein Dp correspond to the duration during which the surface unit in question is submitted to the continuous projection of the aerosol and Dr corresponds to the duration during which the part is not submitted to projection.
    Type: Application
    Filed: November 26, 2007
    Publication date: March 25, 2010
    Applicant: JET METAL TECHNOLOGIES
    Inventor: Samuel Stremsdoerfer
  • Patent number: 7635860
    Abstract: To increase productivity of organic thin-film transistors, in an organic thin-film transistor manufacturing equipment, a liquid containing at least either one of a wiring material and a semiconductor material is coated on a substrate to form a number of organic thin-film transistors. Substrate carrying means carry the substrate. The substrate is heated by a first heating means, and the temperature of the substrate is controlled by a controller. The liquid containing at least either one of the wiring material and the semiconductor material is heated by a second heating means, and the temperature of this liquid is controlled also by the controller.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: December 22, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Tomohiro Inoue, Akira Doi, Masahiko Ando
  • Patent number: 7608304
    Abstract: A substrate carrying method for removing the electrical charges on a substrate and then carrying the substrate includes forming a conductive layer with conductivity on a part of the surface of the substrate, and carrying the substrate while supporting a conductive layer-forming region of the substrate by a grounded substrate supporting unit with conductivity.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: October 27, 2009
    Assignee: Seiko Epson Corporation
    Inventor: Minoru Koyama
  • Patent number: 7601222
    Abstract: In a system for manufacturing a part, a first forming station forms the part from a supply of material. A chemical processing system chemically alters a surface of the part. The chemical processing system includes a tank, parts rotator, circulation system, and control system. The tank includes a chemical side and a rinse side. The chemical side includes a chemical solution and the rinse side includes a sprayer to spray a rinse solution on the part. The parts rotator assembly moves relative to the tank. The circulation system circulates fluid in the tank. The control system receives signals from a sensor and modulate the system in response to the signals. Additionally, in the system, a finishing station applies a finish to the item.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: October 13, 2009
    Assignee: The Boeing Company
    Inventors: Richard H. Miller, Ronald E. Jones
  • Publication number: 20090238979
    Abstract: An improved method of activating a surface to receive electroless metal plating thereon, particularly for use in activating through holes in printed circuit substrates, in which the activating solution comprising a palladium tin colloid in an acidic aqueous matrix is sparged with nitrogen gas to slow the oxidation of stannous tin contained therein. A dynamic flood conveyorized system to perform said activation is described.
    Type: Application
    Filed: March 21, 2008
    Publication date: September 24, 2009
    Inventors: William Decesare, James Watkowski
  • Publication number: 20090162995
    Abstract: By hydrogen-terminating a semiconductor surface using a solution containing HF2? ions and an oxidant, the hydrogen termination can be quickly carried out. In this case, the semiconductor surface is silicon having a (111) surface, a (110) surface, or a (551) surface.
    Type: Application
    Filed: September 20, 2005
    Publication date: June 25, 2009
    Inventors: Tadahiro Ohmi, Akinobu Teramoto, Hiroshi Akahori
  • Publication number: 20090136670
    Abstract: The present invention provides a method that can maintain the temperature of a wafer at a process temperature before a coating process is performed by supplying a photoresist. According to the present invention, a thinner which helps a diffusion of the photoresist is supplied onto the wafer before the photoresist is supplied. The thinner is supplied in a temperature-controlled state such that the wafer has the process temperature by the thinner.
    Type: Application
    Filed: September 26, 2006
    Publication date: May 28, 2009
    Inventors: Jong-Su Choi, Young-Kweon Choi
  • Publication number: 20080286458
    Abstract: A system and method for coating lenses includes loading at least one lens into a spindle assembly, which transfers the lens into a coating station. The at least one lens may include a pair of lenses, which are simultaneously loaded into the spindle assembly for transfer into the coating station. The system may further include a washing and drying station and a curing station to receive lens assemblies before and after coating and the spindle assembly may include a plurality of spindle assemblies for sequential transfer of a plurality of lenses, or lens pairs, into and out from each station of the system.
    Type: Application
    Filed: March 8, 2006
    Publication date: November 20, 2008
    Applicant: THE WALMAN OPTICAL COMPANY
    Inventor: David R. Kirchoff
  • Patent number: 7438763
    Abstract: A coating apparatus and coating method include a device for conveying an object to be coated; a coating device which is disposed in a vicinity of a conveyed surface of the object, and which discharges a coating liquid, and which forms a bridge of the liquid between the device and the object which is conveyed by the device for conveying an object to be coated, and which coats the liquid on at least one surface of the object; and a gas stream blowing device which, immediately after starting of coating, blows out a gas from a direction substantially opposite to a object conveying direction, toward a portion of the object where coating starts.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: October 21, 2008
    Assignee: FUJIFILM Corporation
    Inventor: Shin Kanke
  • Publication number: 20080138508
    Abstract: A substrate processing method is useful for forming, by electroless plating, a protective film, such as a magnetic film, which covers exposed surfaces of embedded interconnects composed of an interconnect material, such as copper or silver, embedded in fine interconnect recesses provided in a surface of a substrate. The substrate processing method includes bringing a surface of a substrate into contact with a processing solution whose temperature is adjusted to not more than 15° C., thereby activating the surface, and bringing the activated surface of the substrate into contact with a plating solution, thereby forming a metal film on the surface.
    Type: Application
    Filed: March 6, 2006
    Publication date: June 12, 2008
    Inventors: Daisuke Takagi, Xinming Wang, Akira Owatari, Masanori Ishizaka, Akira Fukunaga
  • Publication number: 20080118681
    Abstract: According to an embodiment of the present invention, a printed wiring board manufacturing apparatus being provided with a drum unit having a processing cylinder that holds the printed wiring board material and comprises a cylinder outer circumference and a processing unit that performs processing on the printed wiring board material held by the processing cylinder.
    Type: Application
    Filed: October 1, 2007
    Publication date: May 22, 2008
    Inventor: Yukihiro UENO
  • Publication number: 20070272146
    Abstract: An apparatus for measuring ejection uniformity of a slit nozzle comprises a liquid distributor that distributes liquid for each predetermined interval with respect to a widthwise direction of the slit nozzle, the liquid being ejected from the slit nozzle; and a liquid measuring unit that measures an amount of liquid distributed by the liquid distributor.
    Type: Application
    Filed: May 17, 2007
    Publication date: November 29, 2007
    Applicant: K.C. TECH CO., LTD.
    Inventor: Kang Il Cho
  • Patent number: 7228645
    Abstract: A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the nozzles as a group in each processing zone.
    Type: Grant
    Filed: January 11, 2005
    Date of Patent: June 12, 2007
    Inventor: Xuyen Ngoc Pham
  • Patent number: 7172979
    Abstract: A substrate processing apparatus has a substrate holder for detachably holding a substrate so that a surface, to be processed, of the substrate faces downward, and a sealing ring for sealing a peripheral portion of the surface, to be processed, of the substrate held by the substrate holder. The substrate processing apparatus also has a plurality of ejection nozzles disposed below the substrate holder for ejecting a treatment solution toward the surface, to be processed, of the substrate held by the substrate holder, and a mechanism for rotating and vertically moving the substrate holder and the ejection nozzles relative to each other.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: February 6, 2007
    Assignee: Ebara Corporation
    Inventors: Akihisa Hongo, Xinming Wang
  • Patent number: 6881446
    Abstract: A method for production of endless plastic hollow profiles, in particular tubes, comprises several production stages for the plastic tube and a coating stage for a metal coating. A reduced pressure is provided in the coating stage, whereby the metal is transferred into the gas phase and deposited on the tube as a surface layer homogeneously bonded thereto.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: April 19, 2005
    Assignee: Ivt Installations - und Verbindungstechnik GmbH & CO KG
    Inventor: Christoph Hennig
  • Patent number: 6830619
    Abstract: A method and apparatus for controlling a temperature of a microelectronic substrate. In one embodiment, the apparatus can include a substrate support configured to engage and support the microelectronic substrate. The apparatus can further include a temperature controller having one or more thermal links coupled directly with the substrate when the substrate is supported by the substrate support. The thermal links can maintain thermal contact with the substrate when the substrate is either stationary or mobile relative to the temperature controller. The temperature controller can heat or cool different portions of the substrate at different rates with one or more of several heat transfer devices, including liquid jets, gas jets, resistive electrical elements and/or thermoelectric elements.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: December 14, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Paul D. Shirley
  • Patent number: 6824613
    Abstract: A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: November 30, 2004
    Assignee: Ebara Corporation
    Inventors: Naoki Dai, Masaya Seki, Akihiro Yazawa, Toshio Yokoyama, Akira Owatari
  • Patent number: 6767406
    Abstract: A painting apparatus includes a conveyor having incrementally spaced attachment structures configured to secure objects thereon for painting and being movable to move the attachment structures between consecutive incremental positions in a downstream direction. The distance between consecutive incremental positions is generally equal to an incremental spacing between consecutive attachment structures. A washing station is disposed beneath the conveyor and is operable to clean objects disposed therein. A painting station downstream of the washing station includes a paint reservoir disposed beneath the conveyor and which contains a volume of paint. The reservoir can be raised to dispose the object within the volume of paint and lowered to thereby allow the object to be conveyed downstream from the painting incremental position. A heating station downstream of the paint reservoir applies heat to objects in a heating incremental position.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: July 27, 2004
    Assignee: Ames True Temper, Inc.
    Inventor: Donald Vitale
  • Publication number: 20040028816
    Abstract: A gas turbine engine wash process that facilitates reducing a formation of particulate matter within a gas turbine engine is described. The engine wash process includes injecting a first liquid into the engine to remove particulate matter formed within the engine and adversely affecting engine operation and performance. A second liquid is then injected into the engine to facilitate reducing a rate of formation of particulate matter within the gas turbine engine as the engine is operated in the future. More specifically, the second liquid is an anti-static liquid that coats compressor blades within the gas turbine engine.
    Type: Application
    Filed: August 1, 2003
    Publication date: February 12, 2004
    Inventors: John Frederick Ackerman, William Randolph Stowell, Robert Alan Johnson
  • Patent number: 6638411
    Abstract: The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution. Thereafter, the substrate is brought into contact with the plating solution to plate the substrate.
    Type: Grant
    Filed: January 27, 2000
    Date of Patent: October 28, 2003
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Koji Mishima, Mizuki Nagai, Ryoichi Kimizuka, Tetsuo Matsuda, Hisashi Kaneko
  • Patent number: 6576567
    Abstract: In a film deposition method of depositing a film by adhering an organometallic fluid onto a to-be-processed body such as a semiconductor wafer and causing a pyrolytic decomposition reaction to occur, an organic solvent such as heptadecane is first applied onto the wafer. At this time, since heptadecane has favorable wettability to the wafer, it efficiently permeates over the entire wafer and flows into holes and trenches without an occurrence of bubbles. Next, an organic metal such as a fluid mainly containing, for example, (hfac)Cu+1(tmvs) is applied onto wafer W. At this time, since the heptadecane that is first applied is a solvent for the organic metal, the organometallic fluid is highly adaptive to heptadecane, it efficiently permeates over the entire wafer W, and evenly flows into holes etc. This allows filling-in to be performed without the development of vacancies.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: June 10, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Yuichi Wada, Hiroyuki Yarita, Hisashi Aida, Naomi Yoshida
  • Patent number: 6551442
    Abstract: A method of producing a semiconductor device having a multilayered wiring conductors and a system for producing the same. The nonuniformity of SOG coating film effectively suppressed and various treatments are simple and less time-consuming. A wiring conductor is formed on a semiconductor substrate, and an insulating layer covering the wiring conductor and the semiconductor substrate is formed, and the insulating layer is then subjected to a wet etching prior to the formation of SOG layer, thereby to increase a wettabiltity by the coating solution on the insulating layer.
    Type: Grant
    Filed: January 23, 2001
    Date of Patent: April 22, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Kojiro Yuzuriha