Abstract: An applicator assembly for treating a surface includes a material applicator configured to dispense a treatment material on a surface and an applicator clamp configured to support and position a dispensing end of the material applicator. An applicator tip is inserted into a dispensing aperture formed in the applicator clamp, and the applicator tip is configured to receive the treatment material from the dispensing end of the material applicator. The applicator assembly further includes an applicator bracket configured to slidably attach the material applicator and applicator clamp to an assembly support frame. Additionally, an automated applicator actuator operatively attached to the assembly support frame and applicator bracket manipulates the applicator bracket between a first position and a second position.

Abstract: Apparatus to apply a coating to media. The apparatus includes a first roller for receiving a continuous belt. The continuous belt is for receiving a coating from a second roller and for transferring the coating to media. The first roller is arranged to provide an adjustable width of the continuous belt to the second roller. The width of the continuous belt provided to the second roller is adjustable to substantially correspond to the width of the media.

Abstract: A system and a method for pretreating an aluminum assembly includes selecting a blank having a thin film pretreatment layer and a lubricant coating applied to a surface. The blank is formed to a desired shape and an adhesive is applied to a selected portion of the surface. A cleaner is applied to the assembly to remove the thin film pretreatment layer and the lubricant coating from the surface except at the selected portion and a zirconium oxide conversion coating is applied to the assembly before painting.

Abstract: The present invention is a template treatment apparatus forming a film of a release agent on a template having a transfer pattern formed on a front surface thereof, the template treatment apparatus including: a treatment station forming a film of a release agent on the front surface of the template; and a template carry-in/out station capable of keeping a plurality of the templates, and carrying the template into/out of the treatment station, wherein the treatment station includes: a cleaning unit cleaning the front surface of the template; a coating unit applying a release agent to the cleaned front surface of the template; a heating unit baking the applied release agent; and a carry unit carrying the template to the cleaning unit, the coating unit, and the heating unit.

Abstract: A system, kit and method for non-structural surface repair and reconditioning of industrial sized blades includes an initial evaluation and power washing step for identifying required repairs. A surface cleaning step combines power washing with application of muratic acid and various mechanical tools and techniques for removing environmental and chemical buildup. A succeeding step provides for non-structural surface repairs to the blades, such as including filling and reshaping the leading edges with the use of an impact resistant urethane and/or a fast cure epoxy and fiberglass cloth. A finish coating step includes applying a chemically resistant and submersible grade (i.e. water resistant) top coat epoxy.

Abstract: A system for painting a structure includes a motorized, wheeled vehicle that is movable along a surface and includes a frame and a lift structure coupled with the frame. The system also includes a support structure supported by the lift structure, and a table supported by the support structure. The table is translatable relative to the support structure. The system also includes a mount structure rotatably coupled with the table and a kit of parts that includes a spray head assembly configured for releasable attachment to the mount structure. The system further includes a paint reservoir and a pump, each being supported by one of the vehicle and the support structure.

Abstract: A system and a method for pretreating an aluminum assembly includes selecting a blank having a thin film pretreatment layer and a lubricant coating applied to a surface. The blank is formed to a desired shape and an adhesive is applied to a selected portion of the surface. A cleaner is applied to the assembly to remove the thin film pretreatment layer and the lubricant coating from the surface except at the selected portion and a zirconium oxide conversion coating is applied to the assembly before painting.

Abstract: Provided is a dry etcher including an etching device and a cleaning device, more particularly, a dry etcher including an etching device and a cleaning device to which a cleaning process is added so as to be used in a metal layer etching process. The dry etcher includes an etching device into which etching gas is injected to etch a layer formed on a substrate, a substrate transfer device transferring the substrate processed by the etching device, and a cleaning device cleaning the substrate transferred by the substrate transfer device.

Abstract: An apparatus and method of replacing a liquid of a circulation line in a substrate liquid processing apparatus of a single-wafer type, which can replace the liquid more efficiently, by relating the replacing method with a process-liquid replenishing method. A substrate liquid processing apparatus of a single-wafer type includes: a circulation line through which a process liquid is circulated; a tank disposed in the circulation line; a liquid level sensor disposed in the tank; a liquid replenish part configured to replenish the tank with a new process liquid, based on an output of the liquid level sensor; and a liquid-replacement control part configured to stop the operation of the liquid replenish part based on a predetermined replenish stop condition that is set cooperatively with a predetermined liquid disposal condition, and to discard all the process liquid in the tank based on the predetermined liquid disposal condition.

Abstract: A communication line such as an optical fiber or cable is attached along a wall, ceiling, trim piece, or other target surface inside of a building by laying out the line from an applicator tool. An outer surface of the line is placed in a temporarily tacky condition as the line is laid out from the tool along the target surface. The temporarily tacky condition of the line is due at least in part to an adhesive component that is pre-applied to the outer surface of the line. The adhesive component is activated by an agent or medium that is associated with the applicator tool. The line becomes non-tacky after it is attached to the target surface.

Abstract: A system for painting a structure includes a motorized, wheeled vehicle that is movable along a surface and includes a frame and a lift structure coupled with the frame. The system also includes a support structure supported by the lift structure, and a table supported by the support structure. The table is translatable relative to the support structure. The system also includes a mount structure rotatably coupled with the table and a kit of parts that includes a spray head assembly configured for releasable attachment to the mount structure. The system further includes a paint reservoir and a pump, each being supported by one of the vehicle and the support structure.

Abstract: A system for applying hot melt adhesive powder onto a non-metallic object surface comprises a convey belt, a radiation chamber, a spraying chamber and a heating chamber. The convey belt is used to deliver a non-metallic object treated by a cleaning agent and a conductive liquid through the radiation chamber where the surface of the non-metallic objected is irradiated by ultraviolet rays and ozone and then through the spraying chamber where the surface of the non-metallic object is sprayed with charged hot melt adhesive powder, and finally into the heating chamber where the hot melt adhesive powder attached onto the non-metallic object will be melted into a liquid adhesive film ready to be bonded.

Abstract: A method for applying a water-based coating (53) to a painted workpiece (49) is provided. The method includes spraying water (51) from an application nozzle unit (10) to the workpiece (49), feeding the water-based coating (53) to the workpiece (49), and finally applying streams of compressed air onto the water-based coating (53) to spread uniformly the water-based coating (53).

Abstract: A thin film forming apparatus which automatically forms, on an electrode layer formed on a substrate, a functional thin film which is crystallized from a precursor layer is disclosed, including a water-repellant film forming unit which forms, on a region other than a region on which is to be formed the functional thin film on the electrode layer, a water-repellant film which includes a self-assembled monolayer; an inkjet coating unit which coats, on the region on which is to be formed the functional thin film on the electrode layer, the precursor layer by an inkjet method; and a controller which controls, to within a predetermined time, a time from forming the water-repellant film with the water-repellant film forming unit to coating the precursor layer with the inkjet coating unit.

Abstract: There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.

Abstract: A chemical bath deposition system is used for forming a buffer layer on a back electrode substrate having a photoelectric transducing layer. The chemical bath deposition system includes a chemical bath tank, a chemical-solution purification device, and a dosing device. The chemical bath tank is used for storing a buffer-layer solution including cation and anion. The cation is adapted to react with the anion to form the buffer layer when the back electrode substrate is immersed in the buffer-layer solution. The chemical-solution purification device is communicated with the chemical bath tank for removing residual cation to obtain a purified solution after the cation reacts with the anion to form the buffer layer. The dosing device is for performing compensation of the cation according to a component ratio of a purified solution.

Abstract: Disclosed is a substrate carrying apparatus having a simple configuration capable of inhibiting the occurrence of pattern collapse. A carrying tray of the disclosed substrate carrying apparatus includes a bottom plate for supporting the substrate and a circumferential side wall being provided around the bottom plate. An opening is formed in the bottom plate. An elevating member, to and from which the substrate is to be transferred, passes through the opening. A space is temporarily formed in a carrying tray. The elevating member within the opening passes to the outside of the carrying tray through the space. When the substrate is carried, the liquid is reservoired within the carrying tray, and the substrate is carried while the liquid remained on the upper surface of the substrate.

Abstract: In a substrate processing apparatus (1), a silicon oxide film on a main surface of a substrate (9) is removed in an oxide film removing part (4) and then a silylation material is applied to the main surface, to thereby perform a silylation process in a silylation part (6). It is thereby possible to lengthen the Q time from the removal of the silicon oxide film to the formation of the silicon germanium film and reduce the temperature for prebaking in the formation of the silicon germanium film.

Abstract: There is disclosed a system for forming a superconductor material on a substrate. The system may comprise a dispensing reel; a spooling reel; and at least two modular reaction chambers, wherein at least one modular reaction chamber is connected to a supply of buffer precursor material and at least one other modular reaction chamber is connected to a supply of superconductor precursor material. The modular reaction chambers may include connections capable of being modified to add or remove adjacent components. It is understood that at least one of the spooling reel and/or the dispensing reel are exposed to normal atmosphere. The deposition chamber may also comprise a distribution head that provides a laminar flow of precursor materials onto the substrate, as well as at least one lamp comprising a reflector that directs UV and/or visible light towards the tape substrate to enhance a growth rate of material.

Abstract: Embodiments of the disclosed technology disclose a photolithography method and apparatus, and the method comprises: hydrophobicity-treating edge portions of a surface of a substrate to be applied with photoresist; and applying hydrophilic photoresist to the surface of the substrate subject to hydrophobic treatment. With the disclosed technology, the usage amount of thinner in the edge photoresist-removing procedure can be greatly reduced or even eliminated, thereby reducing production costs and increasing production efficiency.

Abstract: The present disclosure provides methods for treating a surface for single-molecule imaging.

Abstract: By hydrogen-terminating a semiconductor surface using a solution containing HF2? ions and an oxidant, the hydrogen termination can be quickly carried out. In this case, the semiconductor surface is silicon having a (111) surface, a (110) surface, or a (551) surface.

Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.

Abstract: The invention relates to a method for producing metal oxide layers from oxides of rare earth metals on silicon-containing surfaces, to the device used to carry out the coating method, and to the use of the starting materials used in the method according to the invention for the coating method.

Abstract: Methods and systems for handling a substrate through processes including an integrated electroless deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electroless deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate.

Abstract: A liquid processing apparatus processes an object to be processed W including a body part Wi and a plurality of projecting-shape parts Wm disposed on the body part Wi, with an inorganic film and a different film being laminated to each other. The liquid processing apparatus comprises: a support part 50 configured to support the body part Wi; a hydrophobic-liquid supply mechanism 30 configured to supply a hydrophobic liquid to the object to be processed W; and a rinse-liquid supply part 22 configured to supply a rinse liquid to the object to be processed W to which the hydrophobic liquid has been supplied. The hydrophobic-liquid supply mechanism 30 includes: a first hydrophobic-liquid supply part 32 configured to supply a first hydrophobic liquid for making hydrophobic the inorganic film; and a second hydrophobic-liquid supply part 37 configured to supply a second hydrophobic liquid for making hydrophobic the different film.

Abstract: The present invention provides an automated continuous coating apparatus for coating industrial components such as porcelain, glass, and polymeric insulators. The apparatus consists of a several stage continuous inline operation. The stages are a cleaning operation, followed by drying and heating, coating, and curing.

Abstract: A composition includes a carbon nanotube (CNT)-infused glass fiber material, which includes a glass fiber material of spoolable dimensions and carbon nanotubes (CNTs) bonded to it. The CNTs are uniform in length and distribution. A continuous CNT infusion process includes: (a) disposing a carbon-nanotube forming catalyst on a surface of a glass fiber material of spoolable dimensions; and (b) synthesizing carbon nanotubes on the glass fiber material, thereby forming a carbon nanotube-infused glass fiber material. The continuous CNT infusion process optionally includes extruding a glass fiber material from a glass melt or removing sizing material from a pre-fabricated glass fiber material.

Abstract: A system and method for restoring water supply pipes in buildings is provided. Compressed air is blown through one end of a cold water supply pipe, such as a cold water riser, and elsewhere on the pipe the cold water supply pipe is connected to the hot water supply pipe by an air hose. Compressed air may alternatively be blown through one end of the hot water supply pipe. To clean the pipe, abrasive particles are introduced into the stream of compressed air upstream of the section of pipe to be cleaned. To line the pipe, an epoxy coating is introduced into the stream of compressed gas upstream of the section of pipe to be lined.

Abstract: The invention relates to a non-electrolytic method for metallizing a substrate by projecting an aerosol containing a solution of an oxidant metallic cation and of a reducing agent; said method comprising a step of—a—wetting the substrate; starting to project a metallisation according to a succession of projecting phases alternating with relaxing phases: (i) by adjusting the duration Dp of the projection phases and the duration Dr of the relaxing phases from a metallisation constant k intrinsic for each metal; and (ii) by adjusting the projection flow-rate. The metallisation projection is carried out dynamically by displacing projection means relative to the substrate in order to carry out a periodical scanning, wherein Dp correspond to the duration during which the surface unit in question is submitted to the continuous projection of the aerosol and Dr corresponds to the duration during which the part is not submitted to projection.

Abstract: To increase productivity of organic thin-film transistors, in an organic thin-film transistor manufacturing equipment, a liquid containing at least either one of a wiring material and a semiconductor material is coated on a substrate to form a number of organic thin-film transistors. Substrate carrying means carry the substrate. The substrate is heated by a first heating means, and the temperature of the substrate is controlled by a controller. The liquid containing at least either one of the wiring material and the semiconductor material is heated by a second heating means, and the temperature of this liquid is controlled also by the controller.

Abstract: A substrate carrying method for removing the electrical charges on a substrate and then carrying the substrate includes forming a conductive layer with conductivity on a part of the surface of the substrate, and carrying the substrate while supporting a conductive layer-forming region of the substrate by a grounded substrate supporting unit with conductivity.

Abstract: In a system for manufacturing a part, a first forming station forms the part from a supply of material. A chemical processing system chemically alters a surface of the part. The chemical processing system includes a tank, parts rotator, circulation system, and control system. The tank includes a chemical side and a rinse side. The chemical side includes a chemical solution and the rinse side includes a sprayer to spray a rinse solution on the part. The parts rotator assembly moves relative to the tank. The circulation system circulates fluid in the tank. The control system receives signals from a sensor and modulate the system in response to the signals. Additionally, in the system, a finishing station applies a finish to the item.

Abstract: An improved method of activating a surface to receive electroless metal plating thereon, particularly for use in activating through holes in printed circuit substrates, in which the activating solution comprising a palladium tin colloid in an acidic aqueous matrix is sparged with nitrogen gas to slow the oxidation of stannous tin contained therein. A dynamic flood conveyorized system to perform said activation is described.

Abstract: By hydrogen-terminating a semiconductor surface using a solution containing HF2? ions and an oxidant, the hydrogen termination can be quickly carried out. In this case, the semiconductor surface is silicon having a (111) surface, a (110) surface, or a (551) surface.

Abstract: The present invention provides a method that can maintain the temperature of a wafer at a process temperature before a coating process is performed by supplying a photoresist. According to the present invention, a thinner which helps a diffusion of the photoresist is supplied onto the wafer before the photoresist is supplied. The thinner is supplied in a temperature-controlled state such that the wafer has the process temperature by the thinner.

Abstract: A system and method for coating lenses includes loading at least one lens into a spindle assembly, which transfers the lens into a coating station. The at least one lens may include a pair of lenses, which are simultaneously loaded into the spindle assembly for transfer into the coating station. The system may further include a washing and drying station and a curing station to receive lens assemblies before and after coating and the spindle assembly may include a plurality of spindle assemblies for sequential transfer of a plurality of lenses, or lens pairs, into and out from each station of the system.

Abstract: A coating apparatus and coating method include a device for conveying an object to be coated; a coating device which is disposed in a vicinity of a conveyed surface of the object, and which discharges a coating liquid, and which forms a bridge of the liquid between the device and the object which is conveyed by the device for conveying an object to be coated, and which coats the liquid on at least one surface of the object; and a gas stream blowing device which, immediately after starting of coating, blows out a gas from a direction substantially opposite to a object conveying direction, toward a portion of the object where coating starts.

Abstract: A substrate processing method is useful for forming, by electroless plating, a protective film, such as a magnetic film, which covers exposed surfaces of embedded interconnects composed of an interconnect material, such as copper or silver, embedded in fine interconnect recesses provided in a surface of a substrate. The substrate processing method includes bringing a surface of a substrate into contact with a processing solution whose temperature is adjusted to not more than 15° C., thereby activating the surface, and bringing the activated surface of the substrate into contact with a plating solution, thereby forming a metal film on the surface.

Abstract: According to an embodiment of the present invention, a printed wiring board manufacturing apparatus being provided with a drum unit having a processing cylinder that holds the printed wiring board material and comprises a cylinder outer circumference and a processing unit that performs processing on the printed wiring board material held by the processing cylinder.

Abstract: An apparatus for measuring ejection uniformity of a slit nozzle comprises a liquid distributor that distributes liquid for each predetermined interval with respect to a widthwise direction of the slit nozzle, the liquid being ejected from the slit nozzle; and a liquid measuring unit that measures an amount of liquid distributed by the liquid distributor.

Abstract: A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the nozzles as a group in each processing zone.

Abstract: A substrate processing apparatus has a substrate holder for detachably holding a substrate so that a surface, to be processed, of the substrate faces downward, and a sealing ring for sealing a peripheral portion of the surface, to be processed, of the substrate held by the substrate holder. The substrate processing apparatus also has a plurality of ejection nozzles disposed below the substrate holder for ejecting a treatment solution toward the surface, to be processed, of the substrate held by the substrate holder, and a mechanism for rotating and vertically moving the substrate holder and the ejection nozzles relative to each other.

Abstract: A method for production of endless plastic hollow profiles, in particular tubes, comprises several production stages for the plastic tube and a coating stage for a metal coating. A reduced pressure is provided in the coating stage, whereby the metal is transferred into the gas phase and deposited on the tube as a surface layer homogeneously bonded thereto.

Abstract: A method and apparatus for controlling a temperature of a microelectronic substrate. In one embodiment, the apparatus can include a substrate support configured to engage and support the microelectronic substrate. The apparatus can further include a temperature controller having one or more thermal links coupled directly with the substrate when the substrate is supported by the substrate support. The thermal links can maintain thermal contact with the substrate when the substrate is either stationary or mobile relative to the temperature controller. The temperature controller can heat or cool different portions of the substrate at different rates with one or more of several heat transfer devices, including liquid jets, gas jets, resistive electrical elements and/or thermoelectric elements.

Abstract: A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.

Abstract: A painting apparatus includes a conveyor having incrementally spaced attachment structures configured to secure objects thereon for painting and being movable to move the attachment structures between consecutive incremental positions in a downstream direction. The distance between consecutive incremental positions is generally equal to an incremental spacing between consecutive attachment structures. A washing station is disposed beneath the conveyor and is operable to clean objects disposed therein. A painting station downstream of the washing station includes a paint reservoir disposed beneath the conveyor and which contains a volume of paint. The reservoir can be raised to dispose the object within the volume of paint and lowered to thereby allow the object to be conveyed downstream from the painting incremental position. A heating station downstream of the paint reservoir applies heat to objects in a heating incremental position.

Abstract: A gas turbine engine wash process that facilitates reducing a formation of particulate matter within a gas turbine engine is described. The engine wash process includes injecting a first liquid into the engine to remove particulate matter formed within the engine and adversely affecting engine operation and performance. A second liquid is then injected into the engine to facilitate reducing a rate of formation of particulate matter within the gas turbine engine as the engine is operated in the future. More specifically, the second liquid is an anti-static liquid that coats compressor blades within the gas turbine engine.

Abstract: The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution. Thereafter, the substrate is brought into contact with the plating solution to plate the substrate.

Abstract: In a film deposition method of depositing a film by adhering an organometallic fluid onto a to-be-processed body such as a semiconductor wafer and causing a pyrolytic decomposition reaction to occur, an organic solvent such as heptadecane is first applied onto the wafer. At this time, since heptadecane has favorable wettability to the wafer, it efficiently permeates over the entire wafer and flows into holes and trenches without an occurrence of bubbles. Next, an organic metal such as a fluid mainly containing, for example, (hfac)Cu+1(tmvs) is applied onto wafer W. At this time, since the heptadecane that is first applied is a solvent for the organic metal, the organometallic fluid is highly adaptive to heptadecane, it efficiently permeates over the entire wafer W, and evenly flows into holes etc. This allows filling-in to be performed without the development of vacancies.