Abstract: A trough including connected walls configured to hold a molten galvanization material within the trough. The trough further includes a first end comprising a first gate system. The trough further includes a second end, opposing the first end, comprising a second gate system. The trough further includes a roller connected, inside the trough, to opposing inside walls of the plurality of connected walls. The trough further includes a sump disposed within the trough. The trough further includes an inlet connected to the sump.

Abstract: A low friction rehabilitation board having an integral band retaining feature is described. The rehabilitation board may have a coefficient of static friction of no more than about 0.5 and in some embodiments no more than about 0.06. The rehabilitation board has a plurality of band retaining feature configured along one or both ends and may be an integral band retaining features being formed in the board. Additionally, the rehabilitation may include one or more band retaining features on one or both sides of the board. The unique configuration of the band retaining features enables rehabilitation method heretofore not possible with a single board. Resistance bands may be retained in the band retaining features and coupled to a user's limb, such as a foot or ankle, to resist motion, such as sliding or extending the foot along the low friction surface of the rehabilitation board.

Abstract: The invention relates to a device for the hot-dip galvanizing of components, comprising a galvanizing tank for holding the zinc melt in a tank interior formed by a wall of the galvanizing tank, according to the invention a monitoring apparatus being provided for monitoring the wall thickness of the wall of the galvanizing tank during the galvanizing operation. The invention further relates to a corresponding method for hot-dip galvanizing.

Abstract: A pickup head for engaging an integrated circuit from a first side. The pickup head can dip solder bumps disposed on an opposing second side of the integrated circuit into a layer of flux on a flat surface in a uniform manner. An arm attaches the pickup head to a mobility unit, and a retainer selectively retains the first side of the integrated circuit against the pickup head. A pivot is disposed between the arm and the retainer, and enables the retainer to pivot and the integrated circuit to freely align with the flat surface in such a manner that as many of the solder bumps as possible are in contact with the flat surface, regardless of variations in heights of the solder bumps. The solder bumps are thereby more uniformly coated with flux.

Abstract: A flux transfer apparatus has a frame having an aperture portion in its lower central portion, and a mesh is stretched across the frame with a high tension and with a mesh pitch at least smaller than the diameter of projections to be formed therein is used. Projections made of resin are provided in the mesh portion provided at the aperture portion of the frame.

Abstract: A transfer fluxing apparatus is provided. The apparatus is a flux reservoir for holding flux, a compliant pad attached to an opening in the flux reservoir and a means for controlling deposition of flux onto the compliant pad. The apparatus can be attached to an automated component placement machine. In the preferred embodiment of the invention, the control means is a valve located within the flux reservoir. The valve is opened by applying pressure to a plunger that extends through the compliant pad. When the plunger is pressed, the valve opens, and flux falls onto the compliant pad. Flux then passes through the pad to a component placement site. A method for automated fluxing and to component placement also is provided.

Abstract: A dispensing apparatus for applying a pulsed thin stream of flux to a surface such as a printed circuit board. The stream of flux is pulsed at a high rate to apply a thin layer of flux on the surface. The dispensing head consists of multiple orifices for applying the flux to the board. The streams of flux are angularly disposed and a pan is positioned for capturing flux which passes by the board. The board is conveyed by the dispensing head. Controls are incorporated for board sensing and identification, application width selection, precise pressure control, fluid flow monitoring and system safety conditions.

Abstract: A dispenser has a tube and a tip portion having a flat passage communicated with the tube and an elongated opening at a lower end thereof. The flat passage has a constant sectional area over the entire axial length thereof, so that the solder flows in the passage at a constant rate.

Abstract: A system for spraying accurately controlled quantities of a liquid mixture of two or more fluids from a plurality of fixedly positioned spray nozzles is disclosed. The nozzles are spaced to provide a substantially uniform flow pattern over a predetermined width. The fluids are supplied to separate manifolds and are distributed to the nozzles by separate feed lines running from the manifolds. All of the feed lines from a given manifold are of equal length to maintain essentially identical pressure drops. A holding tank is provided in the line between a fluid supply and its manifold to provide a fixed static pressure head from which to draw fluid.

Abstract: An apparatus for selectively tinning a zone of a plurality of leads overhanging a window of a substrate for a very large scale integrated circuit is provided, which employs a vise made up of a pair of hollow jaws forming a shaft when the jaws are in clamping position, wherein the shaft communicates with a supply of tin, a wave of tin being provided through the shaft to bathe the zone of the leads to be tinned, the apparatus further being adapted to send a jet of gas to the tinned zone of the leads.

Abstract: An apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: Apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: Apparatus and a process are disclosed for cleaning and/or fluxing circuit card assemblies. The assemblies are moved through an enclosure in which they are sprayed with cleaning and/or fluxing liquid from fenestrated cylinders rotating above and below the path of the assemblies and disposed laterally thereacross. The complex spray impact pattern created by the simultaneous movements of the assemblies and the cylinders effects thorough cleaning and/or fluxing of the assemblies. Separate control of liquid pressure from the cylinders prevents unsoldered components from being dislodged from the assemblies during cleaning and or fluxing.

Abstract: A roller-type solder coating device for applying a coating of liquid solder to a workpiece. The device has a solder bath tank, a coating roller, and a nozzle connected to a pumping chamber provided in the tank to provide a flow of the solder bath to the coating roller. A trough is positioned underneath the coating roller and similarly connected to the nozzle so as to prevent direct re-entry of the solder delivered from the nozzle into the solder bath. The tank may be sealed and inert gas introduced therein to prevent oxidation of the solder contained within the tank. A second coating roller may be provided so as to permit simultaneous coating of opposite sides of a workpiece during its passage between the coating rollers.

Abstract: Apparatus for automatically tinning leads of components mounted on tapes to carry the components through solder wave stations have adjustments incorporated to permit tinning components of different sizes. Foam generators with independent foam rate adjustments are also provided to permit the adjusting foam height separately for each component lead. Guards are used with the foam generators to select specific segments of each lead for fluxing. A vacuum port with a vertical heated connection leading to a vertically oriented heated collector insures that excess solder will not clog the collection systrem. A shield between the vacuum port and the solder wave prevents solder being ingested by the port.

Abstract: An apparatus for the application of foam flux in a system for soldering printed boards, including a flux tank, a partition possessing a top portion rising above the fixed level of flux liquid and containing near the bottom portion thereof a perforated portion, serving to divide the interior of the flux tank into an inner tank portion and an outer tank portion, and a plurality of porous tubes disposed inside the inner tank portion having one end thereof communicating with an external compressed air feed mechanism and the other end thereof closed, the improvement wherein the porous tubes are porous ceramic tubes and are each obtained by molding an aggregate of uniform and fine ceramic-forming particles into the shape of a tube with the aid of an organic plasticizer and an inorganic binder and calcining, the porous tubes possessing pore diameters in the range of 10 to 30 microns and a porosity in the range of 35 to 55%.

Abstract: A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an ominidirectional tool for deposition.

Abstract: A system for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an omnidirectional tool for deposition.

Abstract: An improved fixture is provided for use in supporting a plurality of components, particularly such as electrical or electronic components having elongated conductive terminals, during solder dip process steps or the like. The fixture comprises a generally U-shaped frame adapted to support a stacked group of channel members each having a generally U-shaped cross section to include opposed side walls with aligned slots therein. The channel members are assembled on the frame with a plurality of electrical components or the like supported between the channel member side walls and with the component terminals projecting outwardly through the side wall slots. When assembled, the fixture can be oriented as required to dip the terminals into a solder or other bath while maintaining the components in spaced relation against immersion into the bath.

Abstract: A driver and an idler roller in contact with one another are used to drive a pair of tapes carrying components through solder wave tinning apparatus immediately prior to winding the tapes and components for storage. The rollers are made of conductive material to remove electrostatic charges from the tapes and components induced by their movement through the apparatus to prevent damaging electrostatic sensitive components.

Abstract: A soldering machine for simultaneously applying liquid solder to opposite sides of the leads of a lead frame having I.C. devices thereon. The machine has sidewardly spaced rolls which define a vertically extending narrow nip therebetween through which the lead frame passes. A solder bath is disposed below the rolls so that the lower portions of the rolls dip into the bath and carry a solder film to the nip for application to opposite sides of the leads. A passage extends upwardly in isolation from the bath for permitting the lead frame to be fed vertically through the nip.

Abstract: A method and apparatus for the tinning or hot solder coating of leads of electronic components wherein the components are individually transported through the tinning process by means of a vacuum gripping device and wherein the planarity and thickness of the solder coating is controlled using pressurized gaseous material.

Abstract: A foam fluxer for fluxing surface mounted devices on printed wiring boards is suitable for low solids content fluxes. The foam fluxer is for installation in an open tank containing liquid flux positioned under a conveyor path conveying the components. The fluxer comprises an aerator chimney housing with side walls and end walls for placement in and protruding above the open tank, the housing having a top foam outlet for positioning below the conveyor path, at least one vertical internal divider located in the housing below the foam outlet, the divider forming at least two chambers, and a porous aerator tube located in each chamber with connection means for a compressed gas supply to produce foam in each chamber, the foam from each chamber joining above the divider to exit upwards from the foam outlet.

Abstract: A method and device of performing plating of an item having a row of fine parts, e.g. a flatpack IC are disclosed. The method comprises immersing said item in a bath of molten solder, removing said item from said bath while maintaining said item in an attitude such that said row of fine parts is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said fine parts, thereby decreasing the surface tension of the solder adhering to said fine parts and preventing bridges of solder from forming between said fine parts.

Abstract: A tinning station for axial lead electronic components includes a presentation system for arranging a plurality of axial lead components in an elevated linear array with adjacent components lying parallel to each other. A pair of grippers, have a pair of parallel bars each having a longitudinal slot and a length at least as long as the length of the component array. These bars are moved toward or away from each other by an actuator which is mounted on a robotic arm. This arm is programmed to position the grippers adjacent to the array so that the actuator can cause the grippers to clamp the ends of the bodies of the components in the array. Then the arm dips the leads on each side of the array into the solder flux and subsequently into molten solder, thereby tinning the leads. The thickness of the grippers defines an untinned length of each component lead. A release fixture is used to dislodge any components which do not fall from the grippers when the grippers are separated.

Abstract: An automated system for reconditioning electrical terminals of an electrical work piece, such as a leadless chip carrier. The system includes a carrousel which stops upon rotating each 360/n degrees (wherein "n" is an integer greater than three), dwells, and then resumes rotation. "n" work piece holding assemblies are respectively uniformly disposed on the carrousel and include vacuum tips extending over the periphery of the carrousel for holding work pieces over work stations positioned adjacent and around the periphery of the carrousel beneath the positions occupied by the vacuum tips when the carrousel stops and dwells. A first work piece feed mechanism is located at a sequentially first work station for feeding a work piece to the vacuum tip positioned over the first work station when the carrousel is dwelling. A flux bath is located at a sequentially second work station for bathing a work piece held by the vacuum tip positioned over the second work station when the carrousel is dwelling.

Abstract: A method and apparatus for transporting work to be processed through a series of work processing stations by moving the work along a path extending past the stations to successive positions along the path opposite the stations, respectively, and at each position extending and retracting the work into and from the respective station for processing of the work therein. The present best mode practice and embodiment of the invention are designed to coat or plate the conductors and thru-holes of printed circuit boards with solder by mounting the circuit boards in rack-like work holders, transporting the work holders in succession from an infeed station to an outfeed station along a path extending over a series of tanks containing liquid baths of acid, rinse solution, flux, solder/oil and final wash, respectively, and extending and retracting each work holder downwardly into and upwardly from each tank to successively clean, rinse, flux, solder coat and wash the circuit boards.

Abstract: A vapor phase processing machine is disclosed. The machine has an open tank which is sealed by a lid assembly which is universally free to move within selected limits established between the lid assembly and the closure arm to which it is secured.

Abstract: Solder flux is applied to the face of a printed circuit board (24) or the like by flowing a foam (30) of liquid flux bubbles upwardly through the top of a chimney flue (10) and into contact with the board face which is top passed over the top of the flue. The size of bubbles adjacent the face of the board is controlled by placing a grid screen (26) within and immediately beneath the top of the flue. The openings (26a) in the grid screen allow passage therethrough of smaller bubbles (34) but prevent passage of larger bubbles (32). The force of the board face on the foam urges the larger bubbles downwardly into contact with the grid screen where the grid wires of the screen pierce and thereby break the larger bubbles into smaller bubbles which then rise to the face of the board.

Abstract: In combination, a wave station establishing a wave of liquid solder having a convex configuration transverse to an axis which decreases in cross-sectional area with distance along the axis, apparatus transporting along the axis an electrical component having at least one linear conductor extending transverse to the axis to pass through the wave of solder, and heating and suction apparatus for removing excess solder from the conductor.

Abstract: An apparatus for automatically coating terminal leads of electrical components such as IC with solder for improving solderability thereof. A plurality of IC stored in a row within a container placed at a predetermined feed location are automatically fed onto a track extending adjacent to a series of work stations arranged in a straight path and including a soldering station in which IC are contacted with a solder wave. Driving means is provided for displacing along the track the row of IC fed thereon. The worked IC are automatically collected within an empty container placed at a predetermined receipt location.

Abstract: Method and apparatus which allows the component leads of pre-taped electronic components to be solder tinned to preserve the solderability and shelf life of such component leads. Pre-taped electronic components and the like are prepackaged in a reel and positioned in the apparatus such that the reel is free to rotate. Both leads of each component are secured to corresponding adjacent component leads by tape. The electronic components are moved through a plurality of processing stages such that one lead of each component is solder tinned, one of the processing stages removing the tape from the leads to enable the soldering thereof. After soldering of the leads, tape is applied thereto. The process is then repeated for the other leads of each component.

Abstract: Printed circuit boards which are to be tin-plated pass through a liquid application station in a horizontal direction, and thereafter through an activation station for the activation of the applied liquid. Then the printed circuit boards arrive at a receiver element of substantially U-shaped cross-sectional configuration, which subsequently is pivoted about a horizontal pivot shaft, out of a horizontal take-up position into a vertical transfer position. During this pivotal movement the printed circuit board bears upon a support element or part which supports the printed circuit board. By means of grippers the printed circuit board, previously brought by the receiver element into a vertical position, is immersed in vertical position into a solder bath. After a certain residence time the printed circuit board is inserted by the gripper into a further receiver element likewise having a U-shaped cross-sectional configuration, this receiver element being located in a vertical receiving position.

Abstract: A continuous process for applying a solder coating to copper-coated holes and tracks on a printed circuit board. The upper surface of the circuit board having a flux thereon is contacted with a contact member and the circuit board and contact member are moved through a molten bath of solder. Solder is displaced by the circuit board to produce a buoyant force which presses the circuit board against the contact member. The speed of the contact member in moving through the molten solder is controlled to determine dwell time of the circuit board and maintain contact between the circuit board and the contact member.An apparatus for continuously applying a solder coating to copper-coated holes and tracks on a printed circuit board. The apparatus includes means to contain a bath of molten solder and means to contact the upper surface of a printed circuit board.

Abstract: A tank furnace comprises a first container containing a molten flux and connected with a hoisting mechanism, and a second container containing a molten coating metal. The second container is stationary mounted so as to be placed inside the first container when in its upper position. The mechanism for advancing articles into the coating zone is connected with a device for controlling the depth of immersion of the articles being coated. The first container is fitted with electrodes.

Abstract: A metal wick to be used for the absorption of molten solder is deoxidized and flux coated by a process that does not involve the application of heat to the wick or the flux. In one embodiment the wick is cleaned by heating in a reducing atmosphere and is then immersed in a coating bath containing a solution of a rosin flux in an organic solvent. On leaving the bath the welted wick enters a low-pressure chamber in which the solvent rapidly evaporates at room temperature. In another embodiment the deoxidized wick is coated with comminuted solid resin by electro-static means.

Abstract: In fabricating sealed contacts, often their axially extending leads are solder coated to protect them from contamination and to enhance their solderability into circuits. An apparatus for solder coating the leads, which minimizes their bending, includes a conveying apparatus that moves the contacts through various stages of the solder coating apparatus to form layers of solder on the leads. These layers, which are carefully controlled, are no greater than a certain maximum thickness, and are thinner on the ends of the leads than on the side surfaces thereof.To coat the leads, the contacts are individually mounted in a plurality of holders, each of which is fixed to an individual bead of an endless bead chain of the conveying apparatus.

Abstract: Both fully automated and semi-automated methods and apparatus are described for producing armored rod saws by progressively coating a rod or wire substrate with a slurry of a flux paste adhesive and brazing metal powders, overcoating the latter with abrasive particles, followed by fusion of the brazing metal coating thence cooling same to solidify the brazing metal into a thin layer bonded to said substrate and partially embedding said abrasive particles therein with said particles projecting therefrom to provide a myriad of sharp cutting edges.

Abstract: Method and apparatus to heat fix a heat fusible xerographic powder image to a final support material in which the powder image is first transferred to a final support material and the image-bearing support material then brought into contact with a bath of hot liquid metal for a period of time sufficient to fix the image to the support material. The temperature of the bath is maintained at a temperature high enough to fuse the image but below that at which the support material is damaged. The liquid metal bath has floating on it a layer of molten non-metal to prevent oxidating of the metal and to precoat the support material on its entry into the bath to prevent particles of the liquid metal from embedding in the support material. The relative high density of the molten metal acts as a wringer to keep the plasticized coating very thin when drawn out of the bath.This is a division of application Ser. No. 500,411 , filed Aug. 26, 1974.