Forming Bevel Patents (Class 125/11.15)
  • Patent number: 10399158
    Abstract: Aspects of the disclosure are directed to a first chip ring that includes a first through slot, a second chip ring that includes a second through slot, and a component disposed between the first chip ring and the second chip ring that includes a component through slot, where the first, second and component through slots are coaxial along a slot axis this is oriented at a non-zero valued angle relative to a planar surface of the component facing at least one of the first and second chip rings.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: September 3, 2019
    Assignee: United Technologies Corporation
    Inventors: Kenneth A. Frisk, Stephen Ali, Ryan B. Noraas, Raja Kountanya, Lauren Ketschke
  • Patent number: 10183372
    Abstract: Thread repair tools having (i) a disc-shaped member with an axis of rotation extending through and dissecting first and second major surfaces of the disc-shaped member, (ii) a shaft fixedly connected to or fixedly connectable to the disc-shaped member, with the shaft extending from the second major surface of the disc-shaped member along the axis of rotation; and (iii) an abrasive surface along an outer periphery of the disc-shaped member are disclosed. Methods of making the thread repair tools, and methods of using the thread repair tools are also disclosed. Methods of using the thread repair tools include a method of: (i) connecting the thread repair tool to a hand-held powered device capable of rotating the thread repair tool along the axis of rotation of the thread repair tool, and (ii) abrading an object with the disc-shaped member of the thread repair tool as the thread repair tool is rotated along the axis of rotation by the hand-held powered device.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: January 22, 2019
    Inventors: Terry A. Lewis, Travis R. Lewis, David M. Lewis
  • Patent number: 9920868
    Abstract: The disclosure teaches an adjustable/extendable piping system/module for associating fluid access products (such as fire hydrants) to a buried fluid source. The piping system defines an adjustable configuration that allows for the overall length of the piping system to be modified to compensate for different bury depths. The disclosure further teaches a flex module configured for associating a fluid product with a piping system connected to a fluid source. The flex module is configured to flex a predefined amount to prevent damage to the system from low energy impacts.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: March 20, 2018
    Inventors: Mark Shawn Sutton, William Wade Coots
  • Patent number: 9574609
    Abstract: A superfinishing machine and a superfinishing method which can perform axially uniform finishing on a logarithmically crowned surface formed on an inner peripheral surface of an annular member in a short time, and an outer ring of a bearing having a raceway surface superfinished by the superfinishing method, are provided. A superfinishing machine 1 includes a linearly reciprocating mechanism 40 configured to linearly reciprocate a grinding stone 3 held by a pressing section 30, along a plane B touching a generatrix of the logarithmically crowned surface, and in a direction C inclined by a given angle ? with respect to a center axis O of an outer ring 10.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: February 21, 2017
    Assignee: NSK LTD.
    Inventors: Eiji Utada, Natsuki Sensui, Takayuki Watanabe
  • Patent number: 6910403
    Abstract: To cut a protecting sheet adhered over the obverse of a wafer, an inclination angle of a cutting tool is adjusted according to a form of a chamfered part of the wafer and a finishing thickness of the wafer so that the protecting sheet is cut into the required minimum size for protecting the obverse of the wafer. Thus, the protecting sheet is not included inside a removed portion in a grinding process of the reverse of the wafer with a grindstone even if the wafer is ground to have extremely thin finishing thickness. Hence, the protecting sheet is not ground while the reverse of the wafer is ground, and the grindstone is thus prevented from being clogged up with ground material of the protecting sheet.
    Type: Grant
    Filed: June 5, 2000
    Date of Patent: June 28, 2005
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Toshihiko Ishikawa, Yasushi Katagiri