Abstract: Sawing tool forms a surface structure on a road surface, has a shaft and number of diamond saw blades, each diamond saw blade has disc-shaped core with hole for placing on shaft. A segment is on outer circumference of core, and saw blades are arranged on shaft by disc-shaped core. Segments of adjacent diamond saw blades are in surface contact on longitudinal side, each segment formed from two layers adjoining one another in axial direction and extending in radial and axial direction. Axially adjoining layers of segment each have different wear resistances and wear resistance of layers in axial direction alternates over axially entire segment, so a furrow is formed by two layers adjoining one another, in order to set a grip and a noise level of the road surface. Axially adjoining layers of adjacent segments have different wear resistances forming an alternating layer structure over entire sawing tool.

Abstract: Disclosed is a lens-attached tissue cell pressurization device that is selectively coupled to an objective lens to perform pressurization in an optical device configured measure a cell tissue using the objective lens, the lens-attached tissue cell pressurization device including: a body extending in a lengthwise direction of the objective lens such that at least a portion of the objective lens is inserted into the body and having a connector selectively fixed to the objective lens; and an indenter provided at a lower end of the body, having a penetration part formed at a center of the indenter, and pressurizing the cell tissue by a change in a relative location of the objective lens and the cell tissue.

Abstract: An example polycrystalline diamond compact includes a substrate and a diamond table attached to the substrate. A multilayer joint interposes the substrate and the diamond table and comprises at least two component parts selected from the group consisting of a base layer, one or more intermediate layers, and a braze layer. The at least two component parts are formed via a thin film deposition process.

Abstract: A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes forming a heat sink in at least one of the plurality of insulator layers and proximate to the device. The heat sink includes a reservoir of phase change material having a melting point temperature that is less than an upper limit of a design operating temperature of the chip.

Abstract: Process for manufacture of a dental burr including a brazed diamond grit working surface comprising the steps of: a. providing a vacuum induction furnace and a graphite insert which is tuned to be heated at a predetermined frequency in the induction furnace, said graphite insert including a sub chamber configured for receiving at least one dental burr; b. providing a dental burr blank including a shaft portion and a working head portion; c. providing a synthetic diamond abrasive grit material, which is unprocessed for removal of ferromagnetic properties, mixture with a temporary green binder which adheres to the burr substrate and coating the working head portion with the mixture; d. placing the coated burr into the graphite insert sub chamber and heating the graphite insert to 910 to 990° C.; and e. heating the coated burr in the chamber under a vacuum for forming a diamond burr with a brazed diamond grit working surface.

Abstract: Methods of attaching a polycrystalline diamond compact (PDC) element to a substrate include maintaining a gap between the PDC element and an adjacent substrate, and at least substantially filling the gap with a deposition process. Methods of forming a cutting element for an earth-boring tool include forming a PDC element by pressing diamond crystals together, forming a substrate including a particulate carbide material and a matrix material, leaving a gap between at least portions of the PDC element and the substrate, masking surfaces of the PDC element and of the substrate that do not face the gap, and forming an adhesion material on surfaces of the PDC element and of the substrate that face the gap. Cutting elements for earth-boring tools include a PDC element attached to a substrate with at least one of diamond, diamond-like carbon, a carbide material, a nitride material, and a cubic boron nitride material.

Abstract: A coating on mono- or poly-crystalline diamond or diamond-containing material includes a first adhesive layer formed directly on the diamond or diamond-containing material, the first layer including tungsten and tungsten carbide alloyed with fluorine in an amount of 0.001 to 0.12 wt % calculated on the total weight of the first layer. The coating further includes a second protective layer formed on the first layer, the second layer including at least tungsten alloyed with fluorine in an amount of 0.001 to 0.12 wt % calculated on the total weight of the second layer. The adhesive layer provides excellent bond strength to diamond, while the protective layer provides good protection against oxidation and molten metals used for attaching the coated diamonds to tools.

Abstract: A method for slicing a workpiece into wafers in which a polyphosphate solution is applied to the workpiece during the slicing process. The method comprises the steps of positioning the workpiece, such as a silicon ingot, in the vicinity of a wire saw that can cut through the workpiece without the use of an abrasive slurry; causing an aqueous polyphosphate solution to contact the workpiece; and causing the wire saw to cut into the workpiece while the polyphosphate solution is in contact with the workpiece. After the workpiece has been cut into wafers, the polyphosphate solution is rinsed off of the wafers. Preferably, the wire saw used in this method is a diamond wire saw.

Abstract: A blade comprises a strip having a main body portion and an edge portion. Cutting medium in the form of a diamond grit is secured to the strip by braze material. The edge portion is thinner than the main body portion.

Abstract: Method and device for processing a surface (5) of a diamond (1) with a mechanical part (3) which is moved in relation to the surface (5) of the diamond (1), whereby unbound diamond grains (2) are provided in between the mechanical part (3) and the surface (5) of the diamond (1), whereby the mechanical part (3) subjects the diamond grains (2) to a rolling motion over the surface (5) of the diamond (1), such that the diamond grains (2) move in relation to the mechanical part (3) and the surface (5) of the diamond (1), whereby the mechanical part (3) makes a mechanical contact with the surface (5) of the diamond (1) via the diamond grains (2), whereby this mechanical contact represents a contact length (8) over which the diamond grains (2) roll on the surface (5) of the diamond (1), mainly according to the direction of the relative motion of the mechanical part (3) in relation to the surface (5) of the diamond (1) and, whereby the diamond grains (2), with the support of the mechanical part (3), press themselves

Abstract: The invention relates to a diamond wire of the type used in single- or multiple-wire machines for cutting blocks of hard materials, such as stone, concrete, metal or similar, in order to obtain sheets with a thickness of between 2 and 3 cm. The structure of the wire comprises a steel cable and a number of beads distributed along the length of the cable, as well as a plastic coating which is applied to the cable and secures the heads in relative positions both in terms of the longitudinal movement and rotation thereof in relation to the cable. The invention is characterised in that: each bead comprises a generally cylindrical single body of diamond material including an axial passage provided with various formations in the form of angularly equispaced ribs that project inwards and extend longitudinally; and that the external surface of the cylindrical body includes multiple corresponding angularly equispaced channels that also extend longitudinally.

Abstract: The present invention relates to a cutting tip for a cutting tool, which is used in cutting or drilling a brittle workpiece such as stone, bricks, concrete, and asphalt and has an excellent cutting speed and a long lifetime, a method of manufacturing the cutting tip, and a cutting tool including the cutting tip. The cutting tip includes an abrasive material and a sintered bonding material, wherein the bonding material is formed of a metal matrix; the metal matrix includes a phase II and/or pore having a certain size at a certain volume fraction; and the phase II is one of a non-metallic inclusion and ceramic. According to an aspect of the present invention, there is provided a cutting tip having excellent cutting speed and a long lifetime at a much lower price.

Abstract: A method of producing gemstones includes obtaining a plate of chemical vapor deposition formed diamond. The plate is cut into a plurality of geometrically optimized preforms. The preforms may be finished and cut into diamond gemstones.

Abstract: The present invention describes electroformed thin-wall nickel core drills that are impregnated with diamond abrasives. The thin-wall core drills are formed with a plurality of raised portions and an equal plurality of recessed portions, with each raised portion alternating with a recessed portion, the raised and recessed portions are substantially parallel and are connected by transition portions. In another embodiment, some of the transition regions are formed with intermediate steps or partially raised and recessed portions. These intermediate steps or partially raised or recessed portions allow more uniform distribution of matrix material across a kerf width D1 as the core drill is spun, thereby, giving the cut edge a substantially square profile.

Abstract: A machine for cutting blocks of natural or similar types of stone includes a plurality of diamond-wire loops, wound about an assembly for the support and transmission of the cutting motion to said diamond-wire loops and at least one assembly for supporting, tensioning and guiding the diamond-wire loops; said assemblies move vertically in unison on the structure of the machine; and presents said supporting, tensioning and guiding assembly comprising a set of pulleys for the support and return of each diamond-wire loop, which are mounted and registered, for wire tensioning, on a movable tensioning means whose registration movement is actuated by a tensioning control means, independently of the movable tensioning means of contiguous diamond wires.

Abstract: A diamond wire saw with an improved structure is provided. The diamond wire saw is capable of cutting operation along curved paths with small radii of curvature. In addition, the diamond wire saw is configured to prevent a diamond particle layer covering a surface thereof from flaking off. Thus, the diamond wire saw has improved durability and enhanced sharpness as well as low production cost.

Abstract: Disclosed is a laser guidance system for diamond wire stone cutting apparatus. The laser guidance system includes a targeting laser light source that is fitted to one of two wire guide wheels between which the cutting wire extends and travels. A photo sensor with laser beam detectors is attached to the other wire guide wheel. During ideal operation of the cutting apparatus, the laser beam shines through the kerf in the stone being cut. When the kerf is linearly straight, as intended, the laser beam will be clearly detected by the laser beam detectors. When the kerf is not straight, the laser beam will be at least partially obscured across the cutting span, and the laser beam detectors will detect the lack of full intensity and report this to a controller so as to indicate that adjustments are necessary to re-straighten the kerf.

Abstract: The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 ?S/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid.

Abstract: A blade comprises a strip having a main body portion and an edge portion. Cutting medium in the form of a diamond grit is secured to the strip by braze material. The edge portion is thinner than the main body portion.

Abstract: The present invention relates to a cutting tip for a cutting tool, which is used in cutting or drilling a brittle workpiece such as stone, bricks, concrete, and asphalt and has an excellent cutting speed and a long lifetime, a method of manufacturing the cutting tip, and a cutting tool including the cutting tip. The cutting tip includes an abrasive material and a sintered bonding material, wherein the bonding material is formed of a metal matrix; the metal matrix includes a phase UI and/or pore having a certain size at a certain volume fraction; and the phase II is one of a non-metallic inclusion and ceramic. According to an aspect of the present invention, there is provided a cutting tip having excellent cutting speed and a long lifetime at a much lower price.

Abstract: Disclosed is a diamond saw capable of reducing noise by installing a damper for absorbing vibration in a shank. The low noise diamond saw comprises: a shank formed of a circular metallic plate; and a diamond blade bonded to an outer circumferential surface of the shank, in which a damper is partially bonded to one or both of upper and lower surfaces of the shank by a spot welding.

Abstract: System and method for preparing a sample for micro-analysis, comprising: (a) sample precursor holding unit, for supporting and holding a sample precursor; (b) transporting and positioning unit, for transporting and positioning the sample precursor holding unit; (c) optical imaging unit, for optically imaging, recognizing, and identifying, target features on the sample precursor, and for monitoring the sample preparation; (d) picking and placing unit, for picking and placing the sample precursor and system components from initial positions to other functionally dependent positions; (e) micro-groove generating unit, for generating at least one micro-groove in a surface of the sample precursor, wherein the micro-groove generating unit includes components for controlling formation of each micro-groove in the surface; and (f) cryogenic sectioning unit, for cryogenically sectioning the sample precursor to a pre-determined configuration and size, for forming the prepared sample.

Abstract: A tool for creating uniform thickness around the edge of a stone slab for seaming or profiling thereof. The tool is used with portable routers or other handheld machines. A spindle side spacer, bearing assembly and blade side spacer establish a fixed depth at which the cutting blade is set from the base of the machine. This fixed depth creates a uniform thickness when the tool is used on the edge of a stone slab.

Abstract: Various types of diamond tools are provided by utilizing the fact that a synthetic single crystal diamond for use in a tool having a nitrogen content of 3 ppm or less exhibits an enhanced hardness in a (100) plane in a <111> direction and simultaneously the reduction in defects. The above synthetic single crystal diamond is synthesized by the temperature difference method under an ultra high pressure at high temperature and contains, in its crystals, nickel introduced by atomic substitution or boron and nickel introduced by atomic substitution.

Abstract: To provide a quartz glass tool, for silicon wafer heat treatment, having a transparent grooving face, which is free from the deposition of particles of a transition metal element foreign material derived from glass dust or diamond blade produced by breakdown of acute irregularities based on opening of very small concaves and convexes and microcracks, causes no significant change in dimension also in cleaning with hydrofluoric acid, and can maintain a high degree of cleanness even after use of a long period of time, and to provide a process for producing the same. A quartz glass tool for silicon wafer heat treatment, comprising a wafer mounting member having a grooving face formed by machining, characterized in that the whole grooving face of the wafer mounting member is transparent, the surface roughness is 0.03 to 0.3 ?m in terms of center line average roughness (Ra) and 0.2 to 3.

Abstract: The present invention provides a method for extending diamond tool life in diamond machining of materials that chemically react with the diamond tool in which the surface electric potential of the workpiece is adjusted or tuned to be adequate to inhibit the chemical reaction between the diamond tool and the workpiece during the diamond machining operation. As the chemical reaction is inhibited, the chemical wear rate of the diamond tool is reduced and diamond tool life is extended. The surface electric potential of the workpiece can be adjusted by electrically charging the workpiece. In one embodiment, conduction charging is used to adjust the surface electric potential of the workpiece to inhibit the chemical reaction between the diamond tool and the workpiece. In another embodiment, induction charging is used to adjust the surface electric potential of the workpiece to inhibit the chemical reaction between the diamond tool and the workpiece.

Abstract: A grinding and cutting head adapted to be mounted with a rotating disk of a grinding and cutting machine. The head includes a plate having a first surface which mounts at least one carrier. The carrier includes a vertical slot along one side which extends upwardly from the first surface of the plate. A generally rectangular shaped diamond cutting element is secured in the slot with first and second edges thereof exposed outwardly of the carrier. The structure provides that the one of the first and second edges are exposed in the direction of rotation of the disk.

Abstract: A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemically bonded to the superabrasive particle. The organic binder can optionally contain filler materials and/or an organometallic coupling agent to improve the retention of coated superabrasive particles. The resulting superabrasive wire saws can be produced having diameters of less than 0.5 mm which significantly reduce kerf loss. Various methods for making and using such a superabrasive wire saw are additionally disclosed and described.

Abstract: A method is described for repairing and consolidating a natural stone block (1), with internal fractures and structural discontinuities, in which around the block (1) a coating (2, 3, 4) is applied that wraps the block (1) below and along a vertical perimeter thereof and is higher than the block (1); the coating (2, 3, 4) is spaced from the block (1) and forms the liquid- and gas-tight housing and allows the resin to flow against the block (1). The containment of hydrostatic resin pressures and the control of resin consumptions are performed by an external formwork composed of the coating (2, 3, 4) and of structures (5) to a platform (11) for supporting and transporting the block (1).

Abstract: A segment type diamond tool, used for cutting or drilling brittle substances, such as stones, bricks, concrete structures, or asphalt structures, is disclosed. In the diamond tool, the segments are each set with diamonds in a single-layered structure or a multi-layered structure, and are alternately or intermittently arranged on a steel core, different from conventional diamond tools having segments randomly set with diamonds. Such a diamond arrangement of this invention allows the diamonds to more effectively perform their cutting action, and so the diamond tool has an increased cutting rate, in addition to reducing the amount of fine debris generated during a cutting or drilling process to ill-affect worker's health or cause environmental pollution.

Abstract: A dry method of concrete floor or concrete surface restoration uses the process of grinding a concrete surface to be resurfaced while extracting and retaining dust during the grinding process. The grinding process is repeated each time using finer grinding grit until a preselected degree of smoothness of the concrete surface is achieved. A sealer is applied to the concrete surface which has been ground to the predetermined degree of smoothness. In a preferred embodiment, two coats of sealer are applied and the sealer is preferably a water-based, odorless, penetrating alkaline siliconate solution. The method of the present invention limits down time to aisles and main areas during the restoration process, as well as limiting the dust and odor during the process to provide a lustrous smooth surface on the concrete.

Abstract: Disclosed are a new diamond cutting method and a diamond shape or proportion giving an increased brightness and different brilliant colors to the cut jewel. A piece of diamond having a crown or bezel and a pavilion converging up and down from its girdle is prepared; the table of the crown is cut into a regular polygon having straight sides of an integer multiple of three; star facets, upper-main facets and paired upper-girdle facets are formed on the oblique annular surface between the polygonal table and the girdle; and lower-girdle facets and lower-main facets are cut on the pavilion. The height of the diamond piece is approximately 64% of the diameter of the girdle; the height of the crown is approximately 15.7%; the height of the pavilion is approximately 48.3%; and the largest width of the girdle is approximately 1.2 to 1.4%. The angle formed between the ridge of the crown and the ridge of the pavilion is approximately 77 degrees.

Abstract: A superabrasive tool such as a superabrasive grindstone (101; 102), a superabrasive dresser (103; 104; 105) or a superabrasive lap surface plate (106) includes a base (20) of steel and a superabrasive layer (10) formed on the base (20). The superabrasive layer (10) includes superabrasive grains (11) consisting of diamond grains, cubic boron nitride grains or the like and a holding layer consisting of a nickel plating layer (16) and a bond layer (17), or a brazing filler metal layer (18), holding the superabrasive grains (11) and fixing the same onto the base (20). Grooves (12) or holes (14) are formed on flat surfaces (19) of the superabrasive grains (11) exposed from the holding layer (16, 17; 18). The holding layer (16, 17; 18) holding and fixing the superabrasive grains (11) so that the surfaces of the grains are partially exposed is formed on the base (20).

Abstract: The invention applies to a diamond dresser consisting of a rotary symmetric body on whose circumference and/or face is applied randomly distributed diamond particles. It is the task of the invention to use simple means to reduce the abrasion on the circumference of the dresser, and thus to achieve a substantial increase in the operational life of the dresser. The invention holds that closely-spaced radial running grooves that stretch to the circumferential edge of one face of the dresser in which oblong diamonds are inserted and fastened, or that in the circumferential edge tightly-spaced radial recesses are formed into which oblong diamonds are inserted and fastened. These oblong diamonds are radially arranged and their ends protrude beyond the circumference of the rotary symmetric body. The oblong diamonds substantially reduce abrasion to the circumference of the rotary symmetric body.

Abstract: A composite cutting tool for use in the abrasive processing of hard substrates comprising cutting elements wherein diamond particles in a predominantly metallic binder material are agglomerated and sintered during an individual molding process of each of said cutting elements.

Abstract: A drilling assisting device for a drill used for diamond drilling, has a supporting element, a unit for mounting on a drill arranged on the supporting element at a machine side, a support part for supporting the drill on a surface to be treated and also mounted on the supporting element at a tool side, the unit for mounting on the drill having a carriage, a dove-tail unit for setting the carriage on the drill, and a bolt unit mounting the carriage on the drill.

Abstract: A diamond dresser having a long life and excellent wear resistance includes at least one diamond tip. An end surface of the diamond tip perpendicular to its longitudinal direction is formed by a {211} crystal plane. Two opposite side surfaces of the diamond tip extending along the longitudinal direction are formed by {111} crystal planes. The present crystal orientation of surfaces of the tip allows each tip to be embedded in a tip holder body on a flat plane while maintaining optimum alignment with respect to the most wear-resistant direction.

Abstract: In a plating process for constructing a nickel/embedded abrading particle saw blade on a saw blade substrate, the step of plating abrading particles onto and within the supporting copper substrate is disclosed. The beveled edge of a circular aluminum saw blade blank is first coated with a thin zinc layer. Thereafter, copper and abrading particles are plated followed by conventional abrading particle and nickel plating. Conventional material removal thereafter follows at the saw blade side adjacent the circular saw blade blank, saw blade edge, and copper layer. With removal of the copper layer, abrading particles originally partially embedded in the copper layer are exposed for cutting. The need for electro-polishing and garnating is eliminated in so far as exposure of abrading particles is concerned. The final saw blade product produced has uniform cutting edges on both sides with less likelihood of producing edge fractures, chips, or cracks in silicon wafers during separation.

Abstract: A compact blank for use in operations that require improved thermal stability, impact strength, and abrasion resistance is disclosed. The compact includes a substrate formed of tungsten carbide or other hard material with multiple abrasive diamond crystal layers bonded to the substrate. The abrasive diamond crystals are provided in successive layers of different size particles with the coarsest size particles being farthest away from the substrate. A catalyst is premixed with the diamond crystals in a weight percent which progressively decreases from the layer closest to the substrate through succeeding layers.

Abstract: A diamond-set insert carrier tool for dressing, chamfering, smoothing or polishing machines which comprises a body or support of thermoplastic material, in the active surface of which there are provided cavities able to receive diamond-set abrasive inserts or bodies and retain them substantially flush with said active surface by interference, said interference being between 0.1 and 0.3 min.

Abstract: Polycrystalline diamond has non-uniform impurity concentration along the direction of thickness. The diamond near the rake surface has a lower impurity concentration. The diamond near the fixation surface has a higher impurity concentration. The diamond with the higher impurity concentration near the fixation surface alleviates strong stress or absorbs external shock. Owing to the higher impurity concentration of diamond near the fixation surface, the diamond tool excels in chip resistance or toughness. The diamond with a lower impurity concentration near the rake surface heightens abrasion resistance, adhesion resistance and strength.

Abstract: Tool (10) with diamonds (35) (35') (36) for dressing grinders (90) having a roller (11) rotating on a supporting shank (20) round an axis that intersects the axis of the shank (20) at an angle of 45.degree., with operative areas (30) (31) having one or more diamonds (35) (35') (36) placed at equal angular distances or continuously over a conical geometrical surface (16) with a taper of 90.degree. so as to be intersected by the geometrical plane passing along the axis of rotation and the axis of the shank according to a straight line orthogonal to the latter. Ref. FIGS. 1 and 3.

Abstract: The present invention provides a method for forming uniform CVD diamond coatings on a substrate wherein diamond is deposited on a plurality of substrates which are rotated in unison during the coating process to provide for more uniform radial growth. An advantageous substrate is a wire which can be coated with a layer of CVD diamond for making components in water-jet cutting apparatus, wire-drawing dies, or other tubular articles when the wire is separated from the resulting diamond tube. Identical tubes with higher uniformity in wall thickness are among the products which can be obtained. In addition, tubes having a uniform particle size distribution along their wall thickness which supports columnar diamond growth are also provided.

Abstract: A method of forming a substantially hemispherically shaped diamond cutting element for use in a rotary drill bit is provided. A natural diamond is obtained and then cleaved to form a planar surface. A portion of the diamond is trimmed in the shape of a first truncated cone by directing a laser toward the planar surface from a predetermined angle and rotating the diamond in a circle about the central axis. The excess diamond produced by the trimming step is removed by directing the laser toward the diamond, from a direction substantially parallel to the planar surface, and rotating the diamond in a circle about the central axis. Then, a second truncated cone is created by directing a laser toward a lower portion of the first truncated cone from a predetermined angle and rotating the diamond in a circle about the central axis. If desired, the trimming and removing steps are alternately repeated, and the predetermined angle of the laser is successively adjusted.

Abstract: In order to brute a gemstone, the gemstone 6 is rotated about an axis and is ground with a small bruting crown 1 rotating about a parallel axis. In the peripheral working face of the bruting crown 1 are set grinding diamonds or stones 4 each of which subtends an angle .alpha. of at least about 10.degree. at the axis of the bruting crown 1. During working, reciprocatory axial motion is used between the bruting crown 1 and the gemstone 6. In order to set the end position of the bruting crown feed, the image 6' of the gemstone 6 and the image 1' of the bruting crown 1 are projected onto a screen 16. The screen 16 has indicia AB, BC, GH, IC representing the polished stone so that this polished stone can be fitted within the stone image 6'. The magnification of the optical system is changed and the stone is centered so that indicia in the form of bruted girdle diameter lines AB, GH represent the eventual bruted gridle diameter.

Abstract: A diamond tool, e.g., cutting tool, dresser, wire drawing die, etc., having excellent wear resistance, heat resistance and oxidation resistance and with an improved tool life is provided, which is mainly composed of a synthetic diamond single crystal containing boron or boron and nitrogen.

Abstract: The invention teaches a deep boiling process for refining diamonds, be they raw or cut and polished. The process provides for initially precleaning the diamonds with solvents including alcohol, acetone, sulfuric acid, hydrogen peroxide, and/or water, to remove surface oils, hydrocarbons and other common surface impurities therefrom. The process then provides the use of separate sealed vessels wherein the diamonds are respectively submerged in strong caustic and acid solvents, and heated to between 220.degree. and 500.degree. C. with associated high vaporous pressures, for durations of possibly more than a day.

Abstract: A dressing tool for form dressing of a grinding wheel comprising a cylindrical body 22 having an open groove 32 formed at one end; said open groove 32 adapted for insertion, seating, and clamping of a chisel-edge diamond 36; said chisel-edge diamond being clamped in said open groove in a substantially centered alignment with an axis of said cylindrical body 22, and said chisel-edge diamond simultaneously clamped in said open groove at a negative angle B by a clamping means 42; said centering alignment and negative angle adjustment provided by an associated matching and removable centering gage.

Abstract: An abrasive compact is provided which has a plurality of recesses which may take the form of grooves or holes formed in a major surface thereof. The recesses contain no solid material and serve as crack arrester formations.

Abstract: An improved temperature stable synthetic polycrystalline diamond (PCD) product includes at least one temperature stable PCD integrally and chemically bonded to a matrix carrier support through a carbide forming layer which is of a thickness of at least about 1 micron, the layer on at least one surface of the PCD is in turn bonded to the matrix carrier. A wide variety of shapes, sizes and configurations of such products is achieved through relatively low temperature and relatively low pressure processing. Various products of various geometries are described as well as the details of the processing to achieve chemical bonding of the PCD elements in a variety of support matrix carrier materials to form a unitary structure having a temperature stability up to about 1,200 degrees C.