Abstract: A protective disk is disposed between a spin base and a substrate W and is capable of being raised and lowered between a separated position which is separated downward from the substrate W and a near position which is nearer to the substrate than the separated position. An upper surface of the protective disk has an inner surface which is provided on an inner side of a plurality of holding pins in a radial direction and a flat surface which is provided on an outer side of the inner surface in the radial direction and is provided above the inner surface. The flat surface faces a lower surface of a part on an inner side of an outer circumferential end in the radial direction, in a circumferential edge portion of the substrate.

Abstract: Intelligent railway station platform enhancement includes acquiring contextual information informing of a context in which movement of passengers through an area of a railway station is to occur. The area includes railway station platforms spaced apart by track(s). A decision model is applied to the acquired contextual information, and a determining is made whether to temporarily bridge together platforms using a bridge component between edges of the platforms. The bridging extends across track(s) to provide a route for passengers to traverse the track(s) and move between the platforms. The temporarily bridging is then initiated if it is determined to bridge the platforms together in this manner.

Abstract: A substrate processing apparatus includes a holding device that holds a substrate horizontally, a rotation device that rotates the holding device such that the substrate held by the holding device is rotated, a supply device that includes a nozzle and supplies etching liquid from the nozzle to the substrate held by the holding device, a movement device that moves the nozzle with respect to the substrate held by the holding device, and a control device including circuitry that executes a scan process in which the circuitry controls the rotation, movement and supply devices such that while the liquid is supplied from the nozzle to the substrate, the nozzle is moved back and forth over the substrate between first and second positions on outer peripheral side of the substrate relative to the first position. The circuit of the control device executes the scan process multiple times while changing the first position.

Abstract: A device for processing wafer-shaped articles includes a spin chuck for holding and rotating a wafer-shaped article about a rotation axis and at least one dispenser for dispensing liquid onto at least one surface of a wafer-shaped article. A liquid collector surrounds the spin chuck for collecting liquid spun off the substrate during rotation, with at least two collector levels for separately collecting liquids in different collector levels. At least one lifting device moves the spin chuck relative to the liquid collector. At least two exhaust levels are provided for separately collecting gas from an interior of the liquid collector. Each of the exhaust levels includes at least one opening communicating with an ambient exterior of the liquid collector and a door that closes and opens the opening. Each door on one of the exhaust levels can be opened and closed separately from each door on another exhaust level.

Abstract: A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.

Abstract: An improved apparatus for cleaning a paint roller by scraping or by submersion during rotation, comprising an attachment member connection to a base, said base further connected to a cylinder with an outer diameter approximately equal to the inner diameter of a paint roller frame, wherein said cylinder comprises a substantially solid surface interrupted by one or more longitudinal voids.

Abstract: A liquid processing apparatus includes a substrate holding unit and an elevating member provided to ascend/descend with respect to the substrate holding unit. The substrate holding unit includes a holding base, and a first engagement member and a second engagement member which are provided to be movable in the holding base, and moved between an engaging position where the member is engaged with the peripheral edge of the substrate and a releasing position where the member releases the substrate. When the first contact unit connected to the first engagement member is in contact with a first portion to be contacted, the first engagement member is located at the engaging position. When the second contact unit connected to the second engagement member is in contact with a second portion to be contacted at a lower position than the first portion, the second engagement member is located at the engaging position.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.

Abstract: A substrate processing apparatus has an indexer block and a processing block. One side of the processing block has a vertical stack of a plurality of top surface cleaning units and the other side of the processing block has a vertical stack of a plurality of back surface cleaning units. Reversing units for reversing the substrate W are provided one above the other between the indexer block and the processing block. For example, one reversing unit is used for reversing the substrate before a back surface cleaning processing by the back surface cleaning unit or for other purposes, and the other reversing unit is used for placing the substrate W after a top surface cleaning processing by the top surface cleaning unit or for other purposes.

Abstract: An apparatus is provided for cleaning paint rollers and/or brushes. It comprises a roller cover/brush holder that may be coupled to a drill or other power tool, and a container and cap assembly. Advantageously, the container accommodates the holder and a roller cover or paintbrush with a minimal effective volume of cleanser. The cap closes and substantially seals the container to contain spray or spillage during high-speed rotation of the holder within the container. In use, the container is filled with cleanser, such as soapy water, and the roller is spun for several minutes. The container is drained, then refilled with rinse water and the process is repeated as needed. The roller or brush may be spun dry after cleaning, or between wash and rinse cycles. The apparatus provides effective cleaning with a reduced volume of water or cleanser and requires minimal clean-up.

Abstract: A device for processing wafer-shaped articles, comprises a chuck adapted to receive a wafer shaped article, and a collector surrounding the chuck. The collector comprises a base and a plurality of divider walls, as well as a plurality of nested partitions surrounding the chuck. Each of the plurality of nested partitions is positioned on a corresponding one of the plurality of divider walls, and each of the plurality of nested partitions is vertically movable so as to define a plurality of separate process regions within the collector depending on the vertical position of each of the plurality of nested partitions. At least one of the divider walls comprises an internal exhaust conduit communicating with an exhaust duct underlying the divider wall.

Abstract: Disclosed is a liquid processing apparatus which performs a liquid processing by supplying a chemical liquid from a chemical liquid supplying unit to substrate rotating around a vertical axis, and includes a cover member arranged at an upper surface of substrate to oppose the substrate and have a space therebetween is provided with a gas supplying port, and gas is supplied from gas supplying port toward the space. The gas is discharged from the space through a gap between protrusion at the circumferential edge of cover member protruding downward and the substrate. In addition, lamp heater heating the circumferential edge of substrate is arranged in the space along the circumferential direction of substrate, the chemical liquid supplied from a chemical liquid supplying unit is supplied to a position closer to the circumferential edge side than a position at which lamp heater is provided.

Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.

Abstract: Disclosed is a liquid processing apparatus including first and second cups installed so as to surround a rotation holding unit of a substrate and guide a processing liquid scattered from the rotating substrate downwards. A first driving unit and a second driving unit elevate the first cup and the second cup between a position receiving the processing liquid and the lower position thereof. A controller controls that the first cup and the second cup are ascended at the same time by transferring the driving force of the first driving unit while the first cup or a first elevating member thereof is overlapped with the second cup or a second elevating member thereof from the lower side by setting the ascending speed of the first cup to be higher than the ascending speed of the second cup when the first and second cups are ascended at the same time.

Abstract: An apparatus for cleaning flip chip assemblies is provided. The apparatus comprises: a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding flip chips; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor. Apparatus of the invention further provides a method for cleaning flip chip assemblies. The method comprises: loading at least one flip chip to the flip chip carriers; rotating the chuck assembly at a rotation speed; flowing DIW for rinsing the flip chips; flowing a cleaning solution for removing the contaminants; applying ultrasonic/megasonic energy to the flip chips; blowing a gas or a vapor via the spray nozzles for drying the flip chips; bringing the flip chips out of the flip chip carriers.

Abstract: In a processing block, a plurality of back surface cleaning units and a main robot are provided. The main robot is provided between the back surface cleaning units provided on one side of the processing block and the back surface cleaning units provided on the other side of the processing block. A reversing unit used to reverse a substrate and a substrate platform used to transfer and receive substrates between an indexer robot and the main robot are provided adjacent to each other in the vertical direction between the indexer robot and the processing block. The main robot transports substrates among the plurality of back surface cleaning units, the substrate platform, and the reversing unit.

Abstract: Provided is a spin head supporting a substrate and rotating the substrate. The spin head includes a body, chuck pins installed on the body and moving between supporting positions where a substrate is supported and waiting positions providing space for loading/unloading of the substrate, and a chuck pin moving unit configured to move the chuck pins. The chuck pin moving unit includes a rotation rod coupled with each of the chuck pins, a pivot pin fixing the rotation rod to the body, and a driving member rotating the rotation rod about the pivot pin as a rotation shaft to move the chuck pin from the supporting position to the waiting position. When the body rotates, the rotation rod uses reverse centrifugal force to apply force to the chuck pin from the waiting position to the supporting position. The chuck pins include first pins and second pins that alternately chuck a substrate during a process.

Abstract: A substrate cleaning apparatus for cleaning a substrate back surface includes a first substrate supporting portion supporting the substrate at a first area of the substrate back surface, the back surface facing down; a second substrate supporting portion supporting the substrate at a second area of the substrate back surface, the second area being separated from the first area; a cleaning liquid supplying portion supplying cleaning liquid to the substrate back surface; a drying portion drying the second area of the substrate back surface; and a cleaning portion cleaning a third area of the substrate back surface when the substrate is supported by the first substrate supporting portion, the third area including the second area, and cleaning a fourth area of the substrate back surface when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area.

Abstract: A cleaning chamber is provided. The cleaning chamber includes a base portion housing a chuck and a lid affixed to the base portion. A support assembly is linked to the lid and the support assembly includes a top plate spaced apart from a bottom plate, the top plate has a plurality of openings defined therethrough and the bottom plate has a plurality of openings defined therethrough. The cleaning chamber includes a plurality of cups extending through corresponding pairs of the plurality of openings of the top plate and the bottom plate. The plurality of cups is configured to seal against a surface of a substrate, wherein each cup of the plurality of cups is independently supported by the bottom plate.

Abstract: Improved resistance to temperature-related degradation or deformation in a wafer-supporting chuck is provided by at least one shielding member that physically and/or thermally shields chuck components from effects of elevated temperature processing fluids.

Abstract: A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: An apparatus and method for processing wafer-shaped articles comprises an array of nozzles that are stationary in use, and are individually controlled to simulate the action of a moving boom arm without the actual need for such an arm. Preferably three such arrays are provided, for dispensing three different types of liquid at various process stages. The computer control of the nozzle valves may cause only one nozzle of each array to be open at any given time, or may cause a pair of adjacent nozzles to be open simultaneously.

Abstract: Provided is a liquid processing apparatus in which a target substrate is horizontally held on a substrate holding unit and rotated around a vertical shaft, and the chemicals are supplied from a chemical supplying unit to the bottom surface of the target substrate that is rotating. In particular, the liquid processing apparatus performs a first step in which the chemicals are supplied to the target substrate while rotating the target substrate at a first rotation speed, a second step in which the supply of the chemicals is halted and the chemicals are thrown off by rotating the target substrate at a second rotation speed higher than the first rotation speed, and a third step in which the rinse liquid is supplied to the target substrate while rotating the target substrate at a third rotation speed equal to or lower than the first rotation speed.

Abstract: A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounting table for mounting the target substrate thereon; and a laser irradiation unit for irradiating ring-shaped laser light at once to the whole polymer annularly adhered to the target substrate. The polymer removing apparatus further includes an ozone gas supply unit for supplying an ozone gas to the polymer annularly adhered to the target substrate and a gas exhaust unit for exhausting the ozone gas.

Abstract: A hands-free cleaning apparatus enabling a user to clean various roller pads and/or paintbrushes using a single apparatus. The apparatus includes a main housing and a lid. The housing has a bottom drain hole and legs. An attachment mechanism is provided to receive and retain a roller pad or paintbrush in a desired position within the apparatus. A spraying mechanism is provided within the housing having one or more spray nozzles arranged to spray water (or other cleaning solution) on the pad or brush in a desired spray pattern for spinning and cleaning the pad or brush. In one configuration, each spray nozzle has a spray direction that is slightly offset from other nozzles in relation to the surface of the roller pad or brush being cleaned, helping to force rotation. The spraying mechanism receives water from a hose through a hose attachment.

Abstract: In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal-containing surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula in which R1, R2 and R3 are each independently selected from hydrogen and C1-4 alkyl. The base has a boiling point less than 100° C., and the rinse liquid has a pH in the range of 8 to 10.

Abstract: In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula in which R1, R2 and R3 are each independently selected from hydrogen and C1-4 alkyl. The base has a boiling point less than 100° C., and the rinse liquid has a pH in the range of 8 to 10.

Abstract: A lead wire implanting apparatus is provided that can fabricate high-quality brushes that are without variations in implanting height and implanting strength and free from cracks and that can make the reproducibility of set values better and improve the workability in setup changing. The lead wire implanting apparatus has a tamping member and a storing cup for storing conductive metal powder, for implanting and fixing a lead wire to a brush main body by performing a tamping action of the tamping member a predetermined number of times. The apparatus has a linear-type servo motor serving as a drive source for driving the tamping member in vertical directions, a first position detector for detecting a shift position of the tamping member, and a controller device for controlling the linear-type servo motor based on detected information by the first position detector to cause the tamping member to perform a predetermined tamping action.

Abstract: In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding a wafer-shaped article in a predetermined orientation wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A heating assembly comprising at least one infrared heater is mounted above the upper surface of the spin chuck and below a wafer-shaped article when mounted on the spin chuck. The heating assembly is stationary in relation to rotation of the spin chuck.

Abstract: A method includes providing a wafer and providing a first spray bar spaced a distance from the wafer. A first spray is dispensed from the first spray bar onto a first portion (e.g., half) of the wafer. Thereafter, the wafer is rotated. A second spray is dispensed from the first spray bar onto a second portion (e.g., half) of the rotated wafer. In embodiments, a plurality of spray bars are positioned above the wafer. One or more of the spray bars may be tunable in separation distance and/or angle of dispensing.

Abstract: A protruding portion (13), which has a central axis coincident with a rotational axis of a table (10), is formed at a center portion of a surface of the table (10). At the time of the surface processing, the table (10) is rotated under a state in which the processing target surface of the substrate (12) is supported horizontally at each of a plurality of parts on the table (10) spaced apart from a base end of the protruding portion (13) toward an outer peripheral end portion of the table (10) by a predetermined distance and at the same distance from a top end of the protruding portion (13). Then, a processing liquid is supplied toward the top end of the protruding portion (13). The processing liquid that has reached the processing target surface of each substrate (12) is then removed outside the table (10) by centrifugal force.

Abstract: A rotary chuck adapted to hold a substrate. The rotary chuck has a rotatable chuck portion and an edge grip having a movable grip member movably mounted to the rotatable chuck portion, the moveable grip member being substantially free moving so that rotation of the rotating chuck portion causes the moveable grip member to move in a plane substantially aligned with a surface of the substrate to engage the substrate in a engaged position. A resilient element is coupled to the moveable grip member, the resilient member biasing the grip member to a disengaged position.

Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

Abstract: A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also an apparatus to perform the inventive method.

Abstract: A wafer spin chuck and an etcher using the same are provided. According to an aspect of the present invention, there is provide a wafer spin chuck device comprising: a spin body which spins a wafer; and a stationary body which holds the spin body and is under the spin body with a space between the spin body and the stationary body, wherein the stationary body includes a blocking unit which blocks the space with a fluid.

Abstract: A device and system for thin wafer cleaning is disclosed. A preferred embodiment comprises a spin chuck having at least three holding clamps. A thin wafer with a wafer frame is mounted on the spin chuck through a tape layer. When the holding clamps are unlocked, there is no interference with the removal and placement of the wafer frame. On the other hand, when the holding clamps are locked, the holding clamps are brought into contact with the outer edge of the wafer frame so as to prevent the wafer frame from moving laterally. Furthermore, the shape of the holding clamps in a locked position is capable of preventing the wafer frame from moving vertically.

Abstract: Provided are an apparatus for and a method of removing foreign materials from a substrate which reliably remove the foreign materials, eliminate a chance of redeposition of the foreign materials, and are applicable even to large-size substrates. The apparatus for removing foreign materials includes electrostatic chucks (2, 3) forming a substrate chucking surface (4) to which the substrate (1) is attracted; a resin sheet supplying means (9) for supplying a resin sheet (5) to the substrate chucking surface (4); resin sheet collecting means (13) for collecting the supplied resin sheet (5); and a substrate transfer means for transferring the substrate (1). The substrate (1) supplied to the electrostatic chucks (2, 3) by the substrate transfer means is attracted to the substrate chucking surface (4) through the resin sheet (5), and a foreign material (22) deposited on a side of the substrate chucking surface (4) of the substrate (1) is transferred onto the resin sheet (5) and removed.

Abstract: When a substrate is subjected to bevel cleaning processing, a first magnet plate is arranged at a lower position, and a second magnet plate is arranged at an upper position. In this case, each of chuck pins enters a closed state in a region outside the first magnet plate, while entering an opened state in a region outside the second magnet plate. That is, a holder in each of the chuck pins is maintained in contact with an outer edge of the substrate when it passes through the region outside the first magnet plate, while being spaced apart from the outer edge of the substrate when it passes through the region outside the second magnet plate.

Abstract: A protruding portion (13), which has a central axis coincident with a rotational axis of a table (10), is formed at a center portion of a surface of the table (10). At the time of the surface processing, the table (10) is rotated under a state in which the processing target surface of the substrate (12) is supported horizontally at each of a plurality of parts on the table (10) spaced apart from a base end of the protruding portion (13) toward an outer peripheral end portion of the table (10) by a predetermined distance and at the same distance from a top end of the protruding portion (13). Then, a processing liquid is supplied toward the top end of the protruding portion (13). The processing liquid that has reached the processing target surface of each substrate (12) is then removed outside the table (10) by centrifugal force.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: After a rinse process on a wafer W is performed by feeding pure water to the surface of the wafer W at a predetermined flow rate while rotating the wafer W in an approximately horizontal state, a feed amount of the pure water to the wafer W is reduced, and a pure-water feed point is moved outward from the center of the wafer W. In this manner, the wafer W is subjected to a spin dry process while forming a liquid film in a substantially outer region of the pure-water feed point.

Abstract: A part of the opening of the nozzle insertion hole located in the liquid discharging direction relative to the nozzle inserted in the nozzle insertion hole is enlarged in the liquid discharging direction. Therefore, the droplets which have migrated to the nozzle insertion hole adheres to the internal surface in the liquid discharging direction relative to the nozzle, that is, to the slanted part via the enlarged part. Moreover, the slanted part is provided slanted from the central portion of the nozzle insertion hole toward the enlarged part and separated away from the central portion of the substrate top surface. Hence, the adhering droplets flow in the liquid discharging direction along the slanted part to be discharged from the opening of the nozzle insertion hole.

Abstract: A wafer spin chuck and an etcher using the same are provided. According to an aspect of the present invention, there is provide a wafer spin chuck device comprising: a spin body which spins a wafer; and a stationary body which holds the spin body and is under the spin body with a space between the spin body and the stationary body, wherein the stationary body includes a blocking unit which blocks the space with a fluid.

Abstract: The present invention relates to a system and method for cleaning a paint roller. The system according to the present invention includes: a roller holder; an attachment shaft, where the attachment shaft securely attaches to the roller holder; and a means to rotate the attachment shaft and spindle holder assembly at variable speeds. The means to rotate includes a hand held power tool.

Abstract: Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.

Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.

Abstract: A frame for supporting a paint roller during a cleaning function includes a first support for preventing migration of the paint roller in an axial direction, which first support is fixedly mounted on a shaft engagable with a chuck of an electric drill or crank to impart rotation to the frame and a second support axially displaced from the first support to serve as a mounting supporting an interior surface of the paint roller.