Abstract: A cleaning apparatus for cleaning a hair-cutting portion of an electric hair-cutting device includes a cleaning-liquid basin for receiving the hair-cutting portion of the electric hair-cutting device in a central area such that the hair-cutting portion is at least partially immersed in the cleaning liquid. The electric hair-cutting device is cleaned by generating a cleaning-liquid flow revolving within the basin around the central area of the basin, the hair-cutting portion being at least partially immersed in the cleaning liquid. The liquid flow effectively entrains debris away from the hair-cutting portion.

Abstract: A cleaning apparatus (4) for cleaning a hair-cutting portion (2) of an electric hair-cutting device (1) includes a cleaning-liquid basin (5) for receiving the hair-cutting portion of the electric hair-cutting device in a central area such that the hair-cutting portion is at least partially immersed in the cleaning liquid (13). The electric hair-cutting device is cleaned by generating a cleaning-liquid flow revolving within the basin (5) around the central area of the basin, the hair-cutting portion being at least partially immersed in the cleaning liquid. The liquid flow effectively entrains debris away from the hair-cutting portion.

Abstract: A kitchenware washing assembly includes a tank for holding fluid for washing kitchenware, and at least one pump. The kitchenware washing assembly can also include at least one outlet chamber for dispensing fluid into the tank, and at least one intake chamber for receiving fluid from the tank. The kitchenware washing assembly may also include at least one intake cover for separating the intake chamber from the tank. The intake cover can include a plurality of inlets and at least one projection that extends into the tank. In addition, either or both of the outlet chamber and/or intake chamber can be configured to have positive drainage from the chamber into the tank. Further, the kitchenware washing assembly may include one or more detachable outlet covers configured to cover the outlet chamber. The detachable outlet cover can include a plurality of outlets for directing fluid into the tank.

Abstract: Dispensing device of washing agents for a dishwashing machine, of the type comprises a body (2) to be fastened to a surface or wall delimiting a washing tub, having at least a portion of said body (2) protruding inside the washing tub; said dispenser (1) has at least a tank (11) for containing a liquid washing agent, means for dosing and/or dispensing a dose of liquid washing agent, a filling port (10) through which the liquid washing agent can be introduced into the tank (11), and closing means (15) of the filling port (10). According to the invention, the closing means (15) are capable of at least two different operating positions, where in one position they are apt to receive the liquid washing agent and direct it or convey it to the filling port (10), in order to fill the tank (11).

Abstract: The present invention provides a method and an apparatus for cleaning substrates. The cleaning chamber defines a processing cavity adapted to accommodate a substrate therein. In one embodiment, the cleaning chamber includes a chamber body having a processing cavity defined therein. A substrate is disposed in the processing cavity without contacting other chamber components by a Bernoulli effect and/or by a fluid cushion above and/or below the substrate. Fluid is flowed into the processing cavity at an angle relative to a radial line of the substrate to induce and/or control rotation of the substrate during a cleaning and drying process.

Abstract: A system for recycling reusable resin mold products recovered from discarded apparatuses is disclosed. This recycling system includes a crushing system for crushing resin mold products one kind by one kind into crushed resinous pieces and packing the same in a bag, a classification system for irradiating a light beam to the resin in the bag and classifying the bags into respective kinds of resins based on a reflected beam therefrom, a cleaning system for separately cleaning the respective kind of crushed resinous pieces taken out of the bag to remove foreign matters adhered onto the surfaces of the crushed resinous pieces therefrom, and a recovery system for recovering the cleaned crushed resinous pieces.

Abstract: A method for cleaning a semiconductor substrate is provided. The method initiates with introducing a liquid onto the top surface of the semiconductor substrate. Then, a bottom surface of a resonator is coupled to a top surface of a semiconductor substrate through the liquid. Next, sonic energy is transmitted through the resonator to the liquid. Then, the liquid is heated through the bottom surface of the resonator. A method for applying localized heating to a cleaning chemistry during a cleaning operation of a semiconductor substrate is also provided. The method initiates with positioning a resonator to contact a surface of a cleaning chemistry applied to a semiconductor substrate. Then, heat energy is simultaneously applied with the sonic energy through the resonator to clean the semiconductor substrate. A device for cleaning a semiconductor substrate and system for cleaning a semiconductor substrate are also provided.

Abstract: The invention provides an apparatus and method for cleaning or etching wafers. The invention further provides a megasonic transducer designed to apply mechanical vibrations to a layer of fluid in contact with a wafer. The electromechanical transducer is housed in a quartz or sapphire lens which is chemically compatible with the layer of fluid, and sealed to protect the housing interior from fluids and chemical fumes. An electrical power source produces a signal that is sent to the transducer to generate a megasonic wave. The wave travels between the lens and the wafer, through the layer of fluid, dislodging small particles from the wafer which are then removed in the fluid stream. In one embodiment of the present invention, a wafer to be cleaned is placed on a rotatable support below a transducer assembly. A fluid is introduced through the transducer assembly to provide a layer of fluid between the lens and wafer.

Abstract: An eyewear cleaning apparatus for removing particles from the lenses of eyewear includes a housing having a bottom wall, and an outer wall including a first end wall, a second end wall, a first side wall and a second side wall. A compartment is positioned in the housing adjacent to the first end wall. A pump is positioned in the compartment. A container is positioned in the compartment and is fluidly coupled to the pump. A delivery pipe is fluidly coupled, to the pump and extends around the interior of the housing. A first pair of nozzles is in communication with the delivery pipe and extend toward the second end wall. A second pair of nozzles is in communication with the delivery pipe and extend toward the first end wall. A first mount is positioned in the housing and is adapted for receiving a bridge portion of eyewear.

Abstract: The invention is directed to a cleaning device for cleaning a shaving head of a dry shaving apparatus, having a housing, a holding device, a cleaning liquid container, a filter, a feed device adapted to be driven by a motor and including a supply pipe leading to a cleaning basin and a liquid drain from the cleaning basin to the cleaning liquid container, so that the cleaning liquid container with an integrated filter is arranged underneath the cleaning basin, the feed device is adapted to be coupled with the inner chamber of the filter, and a backflow of cleaning liquid can be effected from the supply pipe through the filter to the cleaning liquid container.