Abstract: A tonometer tip disinfection apparatus for disinfecting and rinsing a tonometer tip includes a first basin configured to hold a disinfecting solution, a second basin configured to hold a rinsing solution, a holding platform configured to receive at least one tonometer tip, a tonometer tip support arm configured to support a tonometer tip having a tip end in an orientation allowing the tip end to reside at least in part within the first and second basins, and a transportation assembly configured to automatically move the tonometer tip support arm between the first and second basins and the holding platform.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates in a treating position inside the treating tank, first and second treating liquid supply devices, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid is supplied, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid. Then the second treating liquid supply device may be controlled to replace the first treating liquid with the second treating liquid, while controlling the temperature control device to maintain the second treating liquid in the same temperature range.

Abstract: A liquid processing apparatus includes a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; an annular rotary cup configured to surround the substrate held on the substrate holding member and to rotate along with the substrate; a rotation mechanism configured to integrally rotate the rotary cup and the substrate holding member; and a liquid supply mechanism configured to supply a process liquid onto the substrate. The apparatus further includes an annular drain cup configured to receive the process liquid discharged from the rotary cup, and provided with a drain port; and a circular flow generation element configured to generate a circular flow within the drain cup when the rotary cup and the substrate holding member are rotated, such that the circular flow serves to lead the process liquid within the drain cup to the drain port.

Abstract: A liquid processing apparatus of the present disclosure includes a rotatable substrate holder that holds a wafer from above, and a top plate nozzle that supplies at least rinse liquid to the wafer and is provided in the rotation center of the substrate holder. The top plate nozzle is movably configured with the substrate holder in the top-bottom direction, and the rinse liquid is supplied to the wafer from the top plate nozzle while the top plate nozzle is spaced from the substrate holder. When the top plate nozzle approaches to the substrate holder, the rinse liquid is supplied to the lower surface of the substrate holder from the top plate nozzle to clean the lower surface of the substrate holder.

Abstract: A cleaning assembly for containers, particularly for bottles, having a conveying device on which the containers are arranged by means of a receptacle means. To economically and ecologically improve the cleaning assembly, the receptacle means contains a liquid-tight tubular for an individual cleaning of the containers.

Abstract: A substrate treatment apparatus includes a container holder which holds a container for containing multiple substrates vertically stacked in horizontal postures, a substrate treatment section which collectively applies treatment to multiple substrates horizontally stacked in vertical postures, a main conveyance mechanism which conveys multiple substrates horizontally stacked in vertical postures between a substrate delivery position and the substrate treatment section, a carrying in/out mechanism which carries in/out the multiple substrates with respect to the container and changes postures of the multiple substrates between the horizontal postures and the vertical postures, and a sub conveyance mechanism which receives and delivers multiple substrates in vertical postures from and to the carrying in/out mechanism at a transfer position, receives and delivers multiple substrates in vertical postures from and to the main conveyance mechanism at the substrate delivery position, and conveys multiple substrates i

Abstract: A photomask cleaner includes a clamp assembly using clamping plates with an elastic buffer device for clamping a photomask to be cleaned positively, a displacement mechanism for moving the clamp assembly among workstations subject to a predetermined track, a cleaning unit installed in one workstation for cleaning the photomask carried by the clamp assembly, and an air dryer installed in one workstation for drying the well-cleaned photomask carried.

Abstract: Impurities can be eluted simultaneously from a plurality of local areas of a surface layer of a semiconductor substrate. A supporting unit supports the substrate, and a sample plate is disposed on the surface of the substrate. The sample plate has a plurality of holes that expose the local areas of the surface of the substrate. Eluant is provided onto the local areas of the surface layer of the substrate through the holes in the sample plate. The impurities are thus dissolved by the eluant to produce a sample. A nozzle transfers the sample from the local areas of the surface of the substrate to a plurality of sample cups. Therefore, samples from the surface layer of the substrate may be produced in a short amount of time.

Abstract: The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a processing liquid supply unit for supplying a processing liquid onto a peripheral portion of the substrate which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate.

Abstract: A substrate treating apparatus for treating substrates includes a treating tank for receiving and treating the substrates, a holding device movable, while holding the substrates in a cantilever mode, between a treating position in the treating tank and a transfer position above the treating tank, a transport device for supporting the substrates and transferring the substrates to and from the holding device in the transfer position, a detecting device for detecting a posture variation of the holding device, and a correcting device for correcting a position of the holding device or the transport device. The correcting device performs a correction according to the posture variation of the holding device detected by the detecting device in time of transfer of the substrates between the holding device and the transport device.

Abstract: A semiconductor processing system for wafers or other semiconductor articles. The system uses an interface section at an end of the machine accessible from the clean room. A plurality of processing stations are arranged away from the clean room interface. A transfer subsystem removes wafers from supporting carriers, and positions both the wafers and carriers onto a carrousel which is used as an inventory storage. Wafers are shuttled between the inventory and processing stations by a robotic conveyor which is oriented to move toward and away from the interface end. The system processes the wafers without wafer carriers.

Abstract: A machine for treating objects having a series of stations (12) whereof each includes a system for gripping (16) a container (11) in a loading point of the path, wherein, between the loading and unloading points, the container (11) is displaced from an initial loading position to at least a treating position then to a final unloading position following the circular path. Each station is provided with a gripping unit (14) comprising at least two grip systems (16), and the gripping unit (14) is mobile relative to the station between at least two positions and, between the loading and unloading of an object, the path followed by the latter has a number of cycles of the circuit ranging between the number of grip systems (16) of each grip unit (14) and the next lower integer.

Abstract: A semiconductor processing system for wafers or other semiconductor articles. The system uses an interface section at an end of the machine accessible from the clean room. A plurality of processing stations are arranged away from the clean room interface. A transfer subsystem removes wafers from supporting carriers, and positions both the wafers and carriers onto a carrousel which is used as an inventory storage. Wafers are shuttled between the inventory and processing stations by a robotic conveyor which is oriented to move toward and away from the interface end. The system processes the wafers without wafer carriers.

Abstract: A system for cleaning grates includes a first power wash portion for applying a pressurized wash fluid to a first side of a grate, and a second power wash portion for applying a further pressurized wash fluid to a second side of the grate. A receiving portion, which is detachable from the first power wash portion, receives the grate, and a transport arrangement transports the grate along a grate path through the first and second power wash portions. A grate delivery portion, which is detachable from the second power wash portion to enhance portability and facilitate maneuverability, delivers the grate after it has been transported through the second power wash portion. A grate drive arrangement engages mechanically with the grate and urges same along the grate path from the receiving portion to the first power wash portion.

Abstract: A wet cleaning or wet etch facility for semiconductor wafers includes a plurality of chemical baths into which wafers are dipped, a drying unit for drying the wafers, a robot arm that transports the wafers to the plurality of the chemical baths and the drying unit in sequence, and a bubble-detecting sensor for detecting the amount of bubbles generated by the chemicals. A central control unit stops the wet cleaning or wet etch process for a while when the amount of bubbles produced by the chemical exceeds a predetermined amount.

Abstract: The present invention is related to a method and apparatus for liquid treating and drying a substrate, such as a semiconductor wafer, the method comprising the step of immersing a substrate or a batch of substrates in a tank filled with a liquid, and removing the substrate(s) through an opening so that a flow of the liquid takes place through the opening during removal of the substrate. Simultaneously with the removal, a reduction of the surface tension of the liquid is caused to take place near the intersection line between the liquid and the substrate. For acquiring such a tensio-active effect, a uniform flow of a gas or vapor is used, or/and a local application of heat. The invention is equally related to an apparatus for performing the method of the invention.

Abstract: This invention is to provide a processing system suitable for manufacturing, e.g., an SOI substrate. A processing system includes a turntable on which holding mechanisms for holding bonded substrate stacks are mounted at a substantially equal angular interval, a driving mechanism for pivoting the turntable through a predetermined angle to move the bonded substrate stacks or separated substrates held by said holding mechanisms to operation positions and a centering apparatus, separating apparatus, and cleaning/drying apparatus for processing the bonded substrate stacks or separated substrates at the operation positions.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: The present invention comprises a conveyor assembly for carrying an item that has been painted by over-spray or dipping to a cleaning chamber where a cleaning means, typically a high pressure water cleaning device, is used to remove paint layers from an inadvertently painted item. The cleaning chamber further comprises a pool having an elongated drainage element such that water may be drained off from the top of the surface of the pool while the paint layers are deposited into the pool. The paint layers may subsequently be removed from the pool and disposed of properly. The invention further comprises a method of using the cleaning chamber, high pressure water cleaning device, pool and drainage device to clean items used to hold items to be painted.

Abstract: A substrate processing method of the present invention prevents the reattachment of particles to substrates, such as semiconductor wafers, when processing and cleaning the substrates by immersing the substrates held in a vertical attitude in a processing liquid and a cleaning liquid. After processing the substrates in the processing liquid, they are drawn out from the processing liquid. Then, lower parts of the processed substrates are immersed in the cleaning liquid and temporarily kept stationary in the cleaning liquid. Alternatively, the cleaning liquid is sprayed onto the lower parts of the processed substrates. After a predetermined time, the substrates are immersed entirely in the cleaning liquid.

Abstract: A method and apparatus is provided for removing material from the edge of a disk. In one embodiment, the edge of the disk is contacted with etchant via an etchant containing swab or trough (which may contain one or more transducers) and is rotated such that successive portions of the disk edge are scanned through the trough or past the swab. To prevent etchant from contacting the major surface of the substrate, and/or to prevent excessive etching, the edge of the disk is contacted with a rinsing fluid (e.g., a rinsing fluid nozzle or a trough filled with rinsing fluid). In a further embodiment material such as residue or particles may be removed via a trough containing sonically energized rinsing fluid.

Abstract: In this substrate transport apparatus, portions connecting a transport chamber (101) with a first load-lock chamber (109) and a second load-lock chamber (110) are provided to linearly align with each other. A processing station (120, 121) for processing a substrate (400) is provided on a position not interfering with rotational motion and telescopic motion of a robot arm (106). A substrate transport apparatus capable of improving the degree of integration of the apparatus while suppressing enlargement of a foot print and implementing common load-lock chambers can be provided by employing this structure.

Abstract: Chambers each include an inlet port for supplying N2 gas and an outlet port for discharging an inner atmosphere, and therefore the chambers have different amounts of supply of N2 gas in a unit of time and different amounts of discharge of inner atmosphere in a unit of time. With this structure, the first to fourth processing chambers are controlled to have the lowest inner pressure(p3), a transfer module is controlled to have an inner pressure (p2) higher than the inner pressure (p3) and a loader and an unloader are controlled to have the highest inner pressure (p1). That eliminates the necessity for keeping the whole substrate processing apparatus at the highest inner pressure (p1) and supplying a large amount of N2 gas, and therefore it is possible to achieve processings of substrate at lower cost, with shorter purge time and less contamination of substrate.

Abstract: A grit washer is disclosed having a bearing assembly which supports a conveyor and which is removably mounted to the exterior of the grit washer tank. With the bearing assembly being mounted to the exterior of the tank, the bearing assembly is easily accessible without the need to drain the tank or lift the screw conveyor out of the tank. The bearing assembly can therefore be easily inspected, repaired and/or replaced as necessary. The external placement of the bearing assembly also isolates the bearing assembly from the abrasive grit in the tank thereby minimizing the damage to the bearing assembly caused by the grit.

Abstract: A method and apparatus are provided for the fine cleaning of a thin substrate. The apparatus has a transporter capable of moving the substrate through the apparatus by non-fluid contact with the edges of the substrate alone. In a typical embodiment, the transporter is a series of centrally-tapered rollers. As the substrate is moved through the apparatus by the transporter, its central section is supported by a fluid. Thus, the substrate moves through the apparatus without contact with any solid material except on its edges. As the substrate is moved through the apparatus by the transporter, fluid ejectors wash the substrate by spraying a cleaning fluid against the substrate. After being washed, the substrate is rinsed and then dried. Anti-dragout devices are positioned upstream and downstream of the washing and rinsing sections so as to minimize liquid dragout.

Abstract: A wafer processing apparatus prevents the reattachment of particles to wafers, such as semiconductor wafers, when processing the wafers by immersing the same held in a vertical attitude in a processing liquid and a cleaning liquid. When immersing the wafers processed by the processing liquid in the cleaning liquid contained in and overflowing a cleaning tank, a wafer holding device holding the wafers in a vertical attitude is stopped temporarily upon the immersion of lower parts of the wafers in the cleaning liquid. Consequently, particles contained in the processing liquid remaining on the wafers are dispersed in the overflowing cleaning liquid, so that the particles can be removed from the wafers and the reattachment of the particles to the wafers does not occur.

Abstract: A process and machine for cleaning ophthalmic lenses and blocks heats a washing solution in a wash tank and a rinsing solution in a rinse tank to approximately l40.degree. F. Ultrasonic wave agitation is then initiated in the solutions. A set of lenses or blocks is immersed in the ultrasonically agitated washing solution for approximately one-half the predetermined time of the wash cycle. Mechanical agitation of the immersed set of lenses or blocks is initiated in the ultrasonically agitated washing solution for the remainder of the predetermined time of the wash cycle. The set of lenses or blocks is then raised above the washing solution for a predetermined drip period. The set of lenses or blocks is then immersed in the ultrasonically agitated rinsing solution for approximately one-half the predetermined time of the rinse cycle.

Abstract: A method and apparatus are provided for the fine cleaning of a thin substrate. The apparatus has a transporter capable of moving the substrate through the apparatus by non-fluid contact with the edges of the substrate alone. In a typical embodiment, the transporter is a series of centrally-tapered rollers. As the substrate is moved through the apparatus by the transporter, its central section is supported by a fluid. Thus, the substrate moves through the apparatus without contact with any solid material except on its edges. As the substrate is moved through the apparatus by the transporter, fluid ejectors wash the substrate by spraying a cleaning fluid against the substrate. After being washed, the substrate is rinsed and then dried. Anti-dragout devices are positioned upstream and downstream of the washing and rinsing sections so as to minimize liquid dragout.

Abstract: In a dish washing unit for trays loaded with dishes having a separating stage with a turning device, a delivery and removal stage and a washing stage, the supply conveyor is a transverse conveyor belt with a right-angle deflector. Additionally, the inner conveyor belt of the turning conveyor is a lattice belt which in the discharge direction has a substantially pear-shaped eccentric rotating path and is guided at its outer edge. The outer belt is a double-chain conveyor belt, the outer and inner strands of which are spaced and guided substantially parallel to one another and to the turning semicircle. Removing belts are present in the same number as the items to be washed of different dimensions. Finally, washing transport belts are provided in vertical superimposed parallel arrangement in the washing station such that they respectively cooperate with one of the removing belts and further convey the flatly lying items to be washed through the washing, rinsing and drying zones.

Abstract: A handling mechanism for workpiece fastening pallets (1), comprising fastening means (4') for fixing a pallet (1) to the handling mechanism and a wash basin (8) as well as a wash liquid circulating system (9-12). The fastening means (4') is a part of a rotary table (4) which is journalled to a turntable 3, having its horizontal turning axis (6) positioned such that a rotation axis (B--B) of said rotary table (4) can be pivoted from a vertical position to a horizontal position. In the latter position, the pallet (1) together with its workpieces (2) is located above the wash basin (8) and is rotatable around horizontal axis (B--B). The wash basin (8) is provided with an openable and closeable cover (16). Adjacent the wash basin (8) is positioned a robot (24) having a workhead (25) which is pivotable to a position above pallet (1) lying over the wash basin for burring said workpieces (2 ) and/or for replacing finished and washed workpieces (2) with others to be worked on.

Abstract: A film cleaning apparatus and method is disclosed where apparatus includes a feed reel and a take-up reel, and a film path created by a number of particle transfer rollers. Also in the film path is a region of high humidity followed by two buffing rollers for polishing the film to be cleaned. Two of the rollers are connected to a vibration generator mechanism. Vibration of the rollers is caused by a rotating disk having two embedded magnetic elements which pass closely adjacent to magnetic elements at the end of rollers' shafts. As the rotating magnets pass by the two shafts, a repulsion force causes the shafts to move away. Connected to each of the shafts is an O-ring which acts as a compression spring that biases its respective shaft back to its starting position after the magnetic elements have moved away from each other. By rotating the disk with the magnetic elements at 3600 rpm a vibration is set up in the shafts at a rate of 7200 times per minute.

Abstract: An automated disc washing machine having, in sequence, a loading station for loading a disc into the disc washing machine, at least one cleaning station for cleaning a disc, and an unloading station for unloading a cleaned disc from the disc washing machine. The disc washing machine also has a pivoted transfer arm connected adjacent the sequence of loading, cleaning and unloading stations for sequentially transferring a disc from the loading station to the cleaning station in one complete transfer cycle of the arm and from the cleaning station to the unloading station in another complete transfer cycle of the arm.

Abstract: Described herein is a disk washing apparatus for cleaning substrate disks of memory medium, which comprises in combination: a loader section having a magazine for holding a number of disks to be washed; a working section including a washing stage arranged to wash the front and rear faces of a disk simultaneously with inner and outer peripheral surfaces thereof, a rinsing stage arranged to rinse the front and rear faces of a disk simultaneously with inner and outer peripheral surfaces thereof, and a drying stage adapted to dry a washed and rinsed disk by high speed spin drying; an unloader section having a magazine for accommodating cleaned disks; and disk transfer chucks adapted to transfer disks one after another stepwise from the loader section to the unloader section, passing the disks successively to the washing, rinsing and drying stages of the working section, the washing, rinsing, and drying stages being located in series between the loader and unloader sections.

Abstract: A garbage truck for handling large trash bins has a system incorporated therein for cleaning and deodorizing the bins after they have been emptied. Immediately after a bin has been emptied into the garbage truck trash compactor and while it is in an inverted position, the bin is sprayed with hot water ejected from nozzles mounted on the truck to the rear of the compactor. This spraying operation is controlled from the cab of the truck and is continued long enough with a large enough volume of water to insure thorough cleaning of the bin. After the bin has been washed it is returned to its original position on the ground and sprayed with deodorant from jet nozzles mounted on the top of the truck cab, this operation also being controlled by an operator in the cab.

Abstract: The present invention comprises a contact lens sterilizing device (10,54,118) which chemically disinfects contact lenses (L) in a cell (20,64,134) containing antimicrobial solution (42,104,144) and which subsequently transfers the lenses (L) to a storage cell (22,66,136) containing storage solution (44,106,146). Momentum generated as the striker arm (6) of a mechanical timer (2) snaps from a first position to a second position is utilized to propel a cage (C,70,140) holding the contact lenses (L) from the sterilizing cell (20,64,134) to the storage cell (22,66,136), thereby effecting the transfer operation. In one embodiment (10) of the present invention, the striker arm momentum is indirectly imparted to the contact lens cage (C) via a flipper (28). In other embodiments (54,118) of the present invention, the striker arm momentum is directly imparted to the contact lens cage (70,140) via a hook (72,142) integrally formed on the cage (70,140).