Abstract: Disclosed herein is a sink incorporating dishwasher functionalities. The sink is mounted, or otherwise installed, on a kitchen countertop and includes a basin and a cover allowing to fluidly seal the basin from above. According to some embodiments of the sink, at least one portion of the walls of the basin, extending along two peripheral directions, is double walled, having an outer wall and an inner wall, such as to define an inner chamber there between. The inner chamber is controllably fluidly coupled to a pressurized fluid source and has apertures on the inner wall for ejecting fluid jets into the basin. In some embodiments of the sink, the cover is a shutter.

Abstract: A washing machine and/or a fluid flow structure for a washing machine wash tank is provided. The wash tank is generally rectangular and includes a bottom wall, two side walls and two end walls extending upward from said bottom wall. The wash tank further includes at least one flow directional opening in at least one of the walls. In a preferred embodiment, the wash tank includes plurality of flow directional openings positioned along one of the side walls of the wash tank. A fluid flow structure is located within said wash tank, which includes a fluid flow guide surface, and a support for said guide surface. The guide surface includes an expansion structure that is designed to counteract expansion of the guide surface that occurs during operation of the washing machine. In one embodiment the expansion structure is an expansion slot that engages a portion of the guide surface.

Abstract: In a spin-chuck with plural collector levels, a separate exhaust controller is provided for each level. This permits selectively varying gas flow conditions among the collector levels, so that the ambient pressure at one level does not adversely affect device performance in an adjacent level.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates in a treating position inside the treating tank, first and second treating liquid supply devices, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid is supplied, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid. Then the second treating liquid supply device may be controlled to replace the first treating liquid with the second treating liquid, while controlling the temperature control device to maintain the second treating liquid in the same temperature range.

Abstract: Provided is a liquid processing apparatus in which a target substrate is horizontally held on a substrate holding unit and rotated around a vertical shaft, and the chemicals are supplied from a chemical supplying unit to the bottom surface of the target substrate that is rotating. In particular, the liquid processing apparatus performs a first step in which the chemicals are supplied to the target substrate while rotating the target substrate at a first rotation speed, a second step in which the supply of the chemicals is halted and the chemicals are thrown off by rotating the target substrate at a second rotation speed higher than the first rotation speed, and a third step in which the rinse liquid is supplied to the target substrate while rotating the target substrate at a third rotation speed equal to or lower than the first rotation speed.

Abstract: A processing system 1 comprises: a processing vessel 30 configured to accommodate an object to be processed W in a processing space 83; a process-fluid generating part 41 configured to generate a process fluid of a predetermined temperature; and a main duct 56 arranged between the process-fluid generating part 41 and the processing vessel 30, the main duct 56 being configured to guide the process fluid supplied from the process-fluid generating part 41. A process-fluid supply duct 171 is arranged on a downstream side of the main duct 56 via a switching valve 70, the process-fluid supply duct 171 being configured to introduce the process fluid into the processing space 83 of the processing vessel 30. A process-fluid bypass duct 172 is arranged on the downstream side of the main duct 56 via the switching valve 70, the process-fluid bypass duct 172 being configured to guide a process fluid, which is not introduced to the process-fluid supply duct 171, so as to bypass the processing space 83.

Abstract: Disclosed herein is a printed circuit board assembly of an electronic appliance including a plurality of boards on which electrical parts to perform functions necessary for the electronic appliance are separately arranged according to the specification of the electronic appliance. The printed circuit board assembly is divided into a plurality of boards, such that electrical parts having a common specification and electrical parts having different specifications are arranged on different boards, thereby optimizing the printed circuit board assembly and configuring the boards according to the specification of the electronic appliance without loss. Microprocessors are arranged on the boards, and the boards are connected to each other in a serial communication, thereby reducing the number of wiring harnesses (W/H) and thus configuring the printed circuit board assembly with high reliability.

Abstract: There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.

Abstract: An exhaust foreline for purging fluids from a semiconductor fabrication chamber is described. The foreline may include a first, second and third ports independently coupled to the chamber. A semiconductor fabrication system is also described that includes a substrate chamber that has a first, second and third interface port. The system may also include a multi-port foreline that has a first, second and third port, where the first foreline port is coupled to the first interface port, the second foreline port is coupled to the second interface port, and the third foreline port is coupled to the third interface port. The system may further include an exhaust vacuum coupled to the multi-port foreline.

Abstract: A ventilation device for the discharge pipe for removing a flow medium pumped to a household appliance. A pipe ventilation valve is connected to the discharge pipe by a channel and comprises a valve body disposed in a float chamber filled with a working medium which is separated from the flow medium and actuates the valve body. The valve body is actuated by transmitting a pneumatic force between the flowing medium and the working medium of the float chamber or between the flowing medium and a sealing surface adjacent to the valve body by means of a pressure medium which is separated from the flowing medium and is enclosed in the channel. The inventive pipe ventilation device makes it possible to avoid a direct contact between the valve body of the pipe ventilation valve and the flowing medium, thereby preventing the valve body from being soiled.

Abstract: A dishwasher includes a washing container with a washing chamber, a water feed line for filling the washing chamber with liquid, and a water inlet device connected on an inlet side to the water feed line and ends in the washing chamber on an outlet side. The water inlet device includes a steam outlet opening that ducts water vapor out of the washing container, and a steam duct that guides steam to the steam outlet opening.

Abstract: Provided is an apparatus for controlling a washing flow of a dishwasher that can perform an upper washing, a lower washing, an alternate washing of upper and lower sides, and a concurrent washing of upper and lower sides for effective washing.

Abstract: A spray fill device for delivering water to a washing machine is provided. The spray fill device includes a body defining an inlet, an outlet port, a mounting port, and a plurality of outlet apertures in flow communication with the inlet. The spray fill device also includes a first valve coupled to the inlet, the valve configured to control a flow rate of water into the inlet. The spray fill device also includes a pressure relief mechanism coupled to the mounting port, the pressure relief mechanism inhibiting flow through the outlet port when a pressure within the body is less than a predetermined pressure.

Abstract: A wafer processing system has a moveable drain assembly having multiple drain rings. The drain rings may be spaced apart sufficiently to allow a process fluid applicator to move between them. Each drain ring provides a separate drain path, optionally in a separate recirculation loop carrying a single process fluid. The drain rings may be sequentially moved into position to collect process fluid moving off of the workpiece. As a result, process fluids may be more uniformly applied and used process fluids can be separately removed, collected, and either recycled or processed for disposal. Mixing of used process fluids is largely avoided. A lower process fluid outlet allows for processing the back side of the wafer as well, without flipping the wafer.

Abstract: A device for cleaning an ostomy pouch is provided. The device comprises a waste collector having a wide mouth and a circular aperture in its base, a waste tube, a pedestal and, first and second water sprayers connected to a high pressure water source. An ostomy pouch is hung from the mouth of the waste collector so that its contents are drained out into the waste collector from its closable drain end, while the other distant end of the pouch is attached to a user's stoma. One end of the waste tube is coupled to the aperture in the base of the waste collector while the other end is coupled to the pedestal. The pedestal is fitted onto a waste dispenser. The first water sprayer cleans the waste collector by washing away the contents of the waste collector into the waste dispenser, through the waste tube.

Abstract: A substrate cleaning apparatus is provided that includes a cleaning cup for receiving a to-be-cleaned substrate, a table in the cleaning cup, a first, second, and third nozzles, a pure water heating mechanism configured to supply hot pure water, a branch line, a control mechanism, and an open/close valve, provided between the branch line and the pipe, wherein the open/close valve is configured to interrupt emission of hot water from the third nozzle by opening the open/close valve to lower the pressure in the pipe.

Abstract: A reprocessing unit for the reprocessing of a device having internal passageways by applying a fluid at a plurality of pressures to the internal passageways of the device to permit reuse of the device in a clean environment, the reprocessing unit including a pressure differentiation device for receiving a fluid having a single input pressure, the pressure differentiation device having first and second pressure control fittings for providing first and second differing pressure outputs in accordance with the single input pressure. Also included are tubing for transmitting the fluid at the first and second differing pressures from the pressure differentiation device to the internal passageways whereby the internal passageways are reprocessed with the transmitted fluid at the first and second differing pressures and the internal passageways are reprocessed at differing pressures in accordance with the single input pressure.

Abstract: A method for the reprocessing of a device having internal passageways by applying a fluid at a plurality of pressures to the internal passageways of the device to permit reuse of the device in a clean environment includes applying a fluid having a single input pressure to a pressure differentiation device having first and second pressure control fittings for providing first and second differing pressure outputs in accordance with the single input pressure and transmitting the fluid at the first and second differing pressures from the pressure differentiation device to the internal passageways. The internal passageways are reprocessed with the transmitted fluid at the first and second differing pressures, whereby the internal passageways are reprocessed at differing pressures in accordance with the single input pressure.

Abstract: The inventive device for cleaning substrates, especially semiconductor wafers, comprises a treatment basin for receiving at least one substrate, a cover for sealing said treatment basin, a first feeding device for controllably feeding in a reactive gas, a second feeding device for controllably feeding in at least one moist fluid for promoting a reaction between the reactive gas and a deposit to be removed from the substrate and a control device for controlling the concentration of moisture in the treatment basin.

Abstract: Disclosed is a dishwasher having an improved inlet valve assembly. The present invention includes a housing, a tub in the housing to hold tableware, an injector assembly for injecting water on the tableware in the tub, and an inlet valve assembly. And, the inlet valve assembly includes a case installed at an inlet passage for supplying the water to the tub, the case having an inlet opening via which the water flows in and an outlet opening via which the water is discharged, a first valve provided to the case to selectively open/close a passage in the case, and a second valve closing the passage in the case in case that the water leaks.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.

Abstract: A cleaning unit (A) includes a movable cart (20) which carries a cleaning system for cleaning baked-on residues from walls (10) of a sterilizer chamber (12). Alkaline and acid cleaning solutions (180, 182), for removing organic and inorganic residues, respectively, from the chamber, are stored in a multi-compartment container carried by the cart and having two storage compartments (52, 54). The alkaline and acid solutions are sequentially sprayed over the chamber walls and returned to their respective compartments. After cleaning is complete, a wall (200) which separates the two compartments is punctured. The two cleaning fluids are thereby mixed together to form a neutral or near neutral solution which is disposable in a sanitary sewer system without further treatment.

Abstract: A parts washing system comprises a wash liquid holding tank having a return opening, a rinse liquid holding tank also having a return opening, a wash chamber with drain port situated above both the wash liquid holding tank and the rinse liquid holding tank, a parts carrier movable from a loading position outside the wash chamber to a position inside the wash chamber, a nozzle adapted to direct liquid from one of the holding tanks into the wash chamber, at least one pump for transferring wash liquid and rinse liquid from the wash liquid holding tank and the rinse liquid holding tank to the spray nozzle, and a substantially L-shaped liquid diverter. The L-shaped liquid diverter is rotatably mounted at the drain port of the wash chamber for rotation in a substantially vertical plane. The L-shaped liquid diverter has an outlet end for dispensing liquid from the wash chamber to one of the wash liquid holding tank and the rinse liquid holding tank.

Abstract: In a single wafer cleaning system of a single tank type in which wafers are one by one sprayed with chemical liquid and rinse water used in a successive order, not only can waste water is recovered while being classified into chemical liquid waste water and rinse waste water, but also the rinse waste water is recovered while being classified into cloudy rinse waste water and clean rinse waste water.