Abstract: Systems, methods, and devices of the various embodiments provide for microfabrication of devices, such as semiconductors, thermoelectric devices, etc. Various embodiments may include a method for fabricating a device, such as a semiconductor (e.g., a silicon (Si)-based complementary metal-oxide-semiconductor (CMOS), etc.), thermoelectric device, etc., using a mask. In some embodiments, the mask may be configured to allow molecules in a deposition plume to pass through one or more holes in the mask. In some embodiments, molecules in a deposition plume may pass around the mask. Various embodiments may provide thermoelectric devices having metallic junctions. Various embodiments may provide thermoelectric devices having metallic junctions rather than junctions formed from semiconductors.

Abstract: A heat flow sensor (HFS) and use thereof, which heat flow sensor should have the lowest possible invasiveness and nevertheless is robust enough to satisfy the requirements of individual applications. For this purpose, the heat flow sensor includes an active sensor element, which is provided with a highly thermally conductive heat-conducting element (8, 9) on the cold side and on the hot side, wherein the sensor element is covered or encased by an extremely thin, electrically strongly insulating, chemically inert, and strongly adhering protective layer (6).

Abstract: A melt temperature sensing kit includes a housing and a cup. The housing defines a cavity and has an outer periphery configured to be received by a platen of an injection molding machine. The cup has a proximate end and a distal end and is configured to be received within at least a portion of the cavity. The cup includes a base enclosing the distal end of the cup and a sidewall extending from the base, the sidewall defining a first aperture at the proximate end of the cup, a second aperture disposed between the proximate end and the distal end of the cup, and an internal volume. The first aperture, the second aperture, and the internal volume cooperate to define a flow path. At least one of the housing and the cup facilitate measurement of a shot flow temperature as part of a melt temperature measurement process.

Abstract: A connector for a thermoelectric conversion element free of a continuity failure and that is high in electrical reliability. In a thermoelectric conversion module, each thermoelectric conversion element has first and second electrode faces, and the thermoelectric conversion elements adjacent to each other are electrically connected thereto via connectors formed in a predetermined shape. Further, the connectors include a pair of fitted portions that are engagingly mounted to a first electrode face and another second electrode of the thermal electric conversion elements that are adjacent thereto, and a connection portions for connecting one pair of these fitted portions.

Abstract: The thermoelectric structure is formed by a network of wires oriented substantially in a weft direction of the structure. It comprises first and second conducting wires of different kinds, interwoven to form cold and hot junctions distributed respectively in a top plane and a bottom plane. The junctions are alternately cold and hot along any one conducting wire. The thermoelectric structure comprises at least one high dielectric wire in the top plane, and at least one low dielectric wire in the bottom plane. The dielectric wires are interwoven with the first and second conducting wires so as to keep the top and bottom planes at a distance from one another.

Abstract: There is provided a high-sensitivity organic semiconductor radiation/light sensor and a radiation/light detector which can detect rays in real time. In the high-sensitivity organic semiconductor radiation/light sensor, a signal amplification wire 2 is embedded in an organic semiconductor 1. Carriers created by passage of radiation or light are avalanche-amplified by a high electric field generated near the signal amplification wire 2 by means of applying a high voltage to the signal amplification wire 2, thus dramatically improving detection efficiency of rays. Hence, even rays exhibiting low energy loss capability can be detected in real time with high sensitivity.

Abstract: The present invention provides thermoelectric elements, each of which can transfer heat efficiently to a heat source with a curved surface, such as a columnar heat source.

Abstract: The invention relates to a thermopile wire (1), a winding support for such a thermopile wire, as well as a method and a machine (11) for producing a thermoelectric generator including a thermopile wire (1). The invention takes into account that the effective winding diameter changes from one winding layer of the thermopile wire (1) to the next when the thermopile wire (1) is wound.

Abstract: A thermopile construction adapted for use as an electric generator capable of producing multiple EMF outputs in response to heat as from a pilot flame. A cluster of hot and cold thermocouple junctions are arrayed within a housing. The hot junction of one of the thermocouples, located at the beginning of the array, extends beyond the other hot junctions for greater sensitivity to changes in temperature as from a pilot flame and surrounding radiating surfaces. While being a part of the array, the longer thermocouple also has extension wires at the cold junction thereof to deliver the EMF of that couple alone to a control device requiring a small EMF. One such wire serves also as one of two leads for delivering the EMF of the entire array to an electromechanical device that requires a larger EMF. Additional extension wires can be added to obtain intermediate EMF values.

Abstract: A combined thermocouple and thermopile capable of producing multiple EMF signals. The combined thermocouple and thermopile construction is particularly adapted for use as an electric generator capable of producing multiple EMF signals and able to respond faster to changes to the presence or absence of a pilot or gas burner flame. The conductors of the thermopile are comprised of dissimilar metals joined at each end to form hot and cold thermocouple junctions. The thermopile may provide multiple EMF signals when a third wire lead is affixed to a cold junction between either end of the array. The array of thermocouples is formed in a circle and enclosed in a metal sleeve or jacket.

Abstract: A sensor has a series circuit, which includes first and second end terminals, a set of thermocouples electrically connected in series between the first end terminal and the second end terminal, and electrical inspection terminals, which extend from corresponding intermediate points in the series circuit between the first end terminal and the second end terminal to divide the set of thermocouples into smaller groups of thermocouples. A resistance value of each group of thermocouples is measured through adjacent two of the first and second end terminals and the electrical inspection terminals while the sensor is in a wafer state. Whether the thermopile infrared sensor is normal is determined based on the measured resistance value of each group of thermocouples.

Abstract: A thermocouple assembly includes a thermocouple; a plurality of lead wires extending from the thermocouple; an insulating jacket extending along and enclosing the plurality of leads; and at least one internally sealed area within the insulating jacket to prevent fluid leakage along and within the insulating jacket. The invention also provides a method of preventing leakage of a fluid along and through an insulating jacket of a thermocouple including the steps of a) attaching a plurality of lead wires to a thermocouple; b) adding a heat sensitive pseudo-wire to extend along the plurality of lead wires; c) enclosing the lead wires and pseudo-wire inside an insulating jacket; d) locally heating axially spaced portions of the insulating jacket to a temperature which melts the pseudo-wire and fuses it with an interior surface of the jacket.

Abstract: A thermocouple assembly includes a thermocouple; a plurality of lead wires extending from the thermocouple; an insulating jacket extending along and enclosing the plurality of leads; and at least one internally sealed area within the insulating jacket to prevent fluid leakage along and within the insulating jacket. The invention also provides a method of preventing leakage of a fluid along and through an insulating jacket of a thermocouple including the steps of a) attaching a plurality of lead wires to a thermocouple; b) adding a heat sensitive pseudo-wire to extend along the plurality of lead wires; c) enclosing the lead wires and pseudo-wire inside an insulating jacket; d) locally heating axially spaced portions of the insulating jacket to a temperature which melts the pseudo-wire and fuses it with an interior surface of the jacket.

Abstract: An immersion measuring probe for measurement in liquids, in particular in molten metals, has a carrier tube, a measuring head mounted on one end of the carrier tube, and measuring elements as well as signal lines for the measuring signals generated by the measuring elements arranged on the measuring head. The signal lines are longer than the carrier tube and run from the end of the measuring head facing the inside of the carrier tube. In order to improve the handling of the immersion measuring probe, the signal lines are guided through the inside of the carrier tube and are wound up there around its longitudinal axis.

Abstract: A thermopile 30 comprises a stacked assembly of bimetallic layers in which there is full conductor interface contact over the distance separating hot and cold surfaces 31, 32. The assembly may include dielectric layers forming a capacitor stack. A.C. current through the stack is matched in strength to the Seebeck-generated thermoelectric current circulating in each bimetallic layer. The resulting current snakes through the stack to cause Peltier cooling at one heat surface and heating at the other. A.C. operation at a kilocycle frequency enhances the energy conversion efficiency as does heat flow parallel with the junction interface.

Abstract: A thermopile detector is disclosed consisting of a semiconductor supporting rim which is doped across all of the rim. The rim supports a series of polycrystalline silicon and metal thermocouples. The fully doped semiconductor area serves as an etch stop for a single-sided etch which eliminates the need for front-to-back alignment of the device. The semiconductor doped rim also serves as a good thermal conductor for supporting the cold junctions. The hot junctions of the thermocouples may be supported by a thin dielectric membrane spanning the device and the cold junctions are formed on the doped rim. The thin dielectric window provides thermal isolation between the semiconductor rim and the center of the window where the hot junctions are located. The thermocouple material layers may be stacked to enable greater thermocouple density on the device. Refractory metals may be employed as the thermocouple metal, to increase sensitivity.

Abstract: Thermocouple apparatus is disclosed, utilizing interlocked loops of dissimilar wire. Base means, spring mounted, are provided for tensioning the loops whereby their point of interlock, in compression, forms a non-metallurgically bonded thermocouple junction. The end of each loop opposite its interlocked end is electrically connected by similar-metal means to a meter unit.

Abstract: A thermoelement which rapidly determines temperature and which is protected from disturbing signals during the measurement of temperature in a vacuum furnace composed of a thermocouple which is protectively sheathed by a transparent quartz glass portective tubing pipe which has wrapped around it a continuous conductive metal element which is grounded.

Abstract: A thermocouple cable reinforced with high strength, low creep fatigue resistant aramid fibers. The aramid fibers are pultruded over a central core of thermocouple wires. A water impervious, abrasion resistant, strippable cover is extruded over the fibers and wires to hold them firmly in place.

Abstract: A heat-to-electricity converter is disclosed which includes a radioactive heat source and a thermoelectric element of relatively short overall length capable of delivering a low voltage of the order of a few tenths of a volt. Such a thermoelectric element operates at a higher efficiency than longer higher-voltage elements; for example, elements producing 6 volts. In the generation of required power, thermoelectric element drives a solid-state converter which is controlled by input current rather than input voltage and operates efficiently for a high signal-plus-noise to signal ratio of current. The solid-state converter has the voltage gain necessary to deliver the required voltage at the low input of the thermoelectric element.

Abstract: A clinical thermometer having a probe with a thermopile mounted thereon. The probe is inserted into a connector housing which includes a resistance thermometer for measuring the temperature of the cold junctions of the thermopile. The connector housing includes a portion of an electrical circuit mounted on a circuit board which is electrically connected to the resistance thermometer. The circuit board is electrically connected to a meter box having the remaining portion of the electrical circuit contained therein. The meter box includes a dial which is calibrated in degrees of temperature for visually indicating the temperature sensed by the hot junctions of the thermopile. The probe is releasably secured within the connector housing so that probes can be easily inserted and removed. The clinical thermometer provides a mechanism whereby the body temperature of a patient can be measured quickly and easily and without maintaining the cold junctions of the thermopile at a constant reference temperature.