Abstract: A heat dissipation composite for a display device includes: a heat absorber; an electricity generator disposed on the heat absorber to convert heat from the heat absorber into electricity; and a vibrator disposed on the electricity generator to convert the electricity provided from the electricity generator into vibration.

Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.

Abstract: A thermoelectric module includes a substrate, a plurality of electrodes arranged on a surface of the substrate, a plurality of thermoelectric elements respectively connected to the plurality of electrodes, and at least three terminals respectively connected to the different electrodes and connected to one or both of a first load and a second load.

Abstract: An input module includes a terminal block and a removable printed circuit board (PCB). The terminal block includes first and second connector assemblies for electrically coupling first and second electrical wires of an external thermocouple to the PCB. At least one of the first or second connector assemblies includes an internal thermocouple. The internal thermocouple has two conductive legs which are formed of different materials and are separated at an end to form a jaw connector for connecting or disconnecting an edge of the printed circuit board to or from the terminal block respectively. The PCB includes a sensor for measuring a temperature on the PCB, and a processing circuit configured to perform cold junction compensation using a cold junction temperature which is determined based on temperature measurement from the sensor and a temperature or voltage measurement from the internal thermocouple, when measuring hot junction temperature of the external thermocouple.

Abstract: This application discloses a thermoelectric power generation structure and a temperature measuring sensor. The thermoelectric power generation structure includes: a semiconductor power generation element, a first thermal-conductive element arranged in a first environment and connected to an inner side face of the semiconductor power generation element, and a second thermal-conductive element connected to an outer side face of the semiconductor power generation element. When there is a temperature difference between the first environment and the second environment, the semiconductor power generation element generates electric power. This application solves the technical problem that the thermoelectric power generation structure cannot match a sensor probe and fails to create a thermoelectric power generation environment, and accordingly cannot effectively generate electric power to the sensor probe in an enclosed high-temperature food heating scene.

Abstract: A heater for use in fluid immersion heating includes a plurality of resistive heating elements, and a plurality sets of power pins electrically connected to the plurality of heating elements. Each set of power pins includes a first power pin made of a first conductive material, and a second power pin made of a second conductive material that is dissimilar from the first conductive material of the first power pin. The first power pin is electrically connected to the second power pin to form a junction. The second power pin is electrically connected to the corresponding resistive heating element. The junctions between the first power pins and the second power pins are disposed at different heights in order to sense a level of the fluid.

Abstract: An embodiment method for controlling heat dissipation of an LED lamp includes applying power to a first light source element to light the first light source element, generating a current using heat dissipation of the first light source element, supplying the current to a fan to drive the fan, and removing a residual heat of the first light source element using cold air generated by the fan.

Abstract: A thermoelectric module includes an N-type thermoelectric material and a P-type thermoelectric material disposed so as to be spaced apart from the N-type thermoelectric material. A flexible electrode is electrically connected to the N-type thermoelectric material and the P-type thermoelectric material. The flexible electrode is configured to bend to match a curvature of an object, e.g., a steering wheel of a vehicle.

Abstract: A method may be provided of manufacturing a thermoelectric leg. The method may include preparing a first metal substrate including a first metal, and forming a first plated layer including a second metal on the first metal substrate. The method may also include disposing a layer including tellurium (Te) on the first plated layer, and forming a portion of the first plated layer as a first bonding layer by reacting the second metal and the Te. The method also includes disposing a thermoelectric material layer including bismuth (Bi) and Te on an upper surface of the first bonding layer, and disposing a second metal substrate, on which a second bonding layer and a second plated layer are formed, on the thermoelectric material layer, and sintering.

Abstract: A thermoelectric module, a frame for the thermoelectric module, and a vehicle including the thermoelectric module is provided. The thermoelectric module includes a frame alternately bent toward a hot side on which a heat source is located and a cool side on which a cooling medium is located, to have a plurality of hot-side end portions in contact with the heat source, a plurality of cool-side end portions in contact with the cooling medium, and a plurality of thermoelectric element installation portions connecting the plurality of hot-side end portions and the plurality of cool-side end portions, a plurality of n-type and p-type thermoelectric elements arranged on the thermoelectric element installation portions, and a plurality of first electrodes and second electrodes that electrically connect, in series, the plurality of n-type and p-type thermoelectric elements arranged on each of the thermoelectric element installation portions.

Abstract: A high speed parallel manufacturing line for manufacturing insulated glass units, the manufacturing line including a gas filling topping press that mates a spacer applied lite supplied to the topping press and a topping lite supplied to the topping press to create an insulated glass unit and fills the insulated glass unit with a non-air gas. A heating station applies localized heat to adhesive of the spacer material. A sealing press applies pressure to the insulated glass unit and facilitates further sealing of the spacer material to the spacer applied lite and the topping lite. The line may include a fourth corner sealer that completes sealing of the airspace of the IGU prior to finishing of the IGU.

Abstract: A temperature controllable textile illustrated by the present disclosure has a first conductive cloth and a second conductive cloth. The first conductive cloth has a first metal while the second conductive cloth has a second metal different from the first metal. The first conductive cloth and the second conductive cloth have a thickness. A side surface of the first conductive cloth is in contact with a side surface of the second conductive cloth, and the first conductive cloth electrically connects to the second conductive cloth, to form two junction portions. When a negative end and a positive end of a direct current power electrically connects respectively with a top surface and a bottom surface of the first conductive cloth, the two junction portions form a cooling end and a heating end, respectively.

Abstract: The present disclosure relates to a thermoelectric module sheet that includes a base substrate, a plurality of thermoelectric elements laminated on a surface of the base substrate, and a plurality of electrodes, each of which is laminated on at least one surface of at least one of the plurality of thermoelectric elements to electrically connect the plurality of thermoelectric elements by a predetermined connecting method.

Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.

Abstract: A sensor insert for positioning a temperature sensor within a glycol bottle. The sensor insert may be transparent and in the general shape of a tube, and is adapted for insertion in a bottle having an upper opening and a bottom. The sensor insert can also comprise an insert body having a first end, a second end and an inner surface. The insert body may be tapered from the first end toward the second end, for easy insertion into the bottle. The sensor insert can hold a temperature sensor away from the bottom and sides of the bottle to enable more accurate temperature readings. The insert also allows fluid within the bottle to be in contact with the temperature sensor due to fluid openings in the insert body.

Abstract: A heat radiation device includes a semiconductor substrate. A first electrode is disposed on the semiconductor substrate. A second electrode is disposed on the semiconductor substrate and is spaced apart from the first electrode. A first through electrode is disposed in the semiconductor substrate. The first through electrode is electrically connected to the first electrode.

Abstract: An apparatus for communicating signals across a wellbore barrier defined by a first flow completion system component positioned at an upper end of the wellbore and a second flow completion system component mounted within the first flow completion system component includes a first wireless node which is mounted on the first flow completion system component on a first side of the wellbore barrier, the first wireless node being configured to be connected to an external device, and a second wireless node which is mounted on the second flow completion system component on a second side of the wellbore barrier, the second wireless node being located generally opposite the first wireless node and being configured to be connected to a downhole device. The first and second wireless nodes are configured to communicate wirelessly through the wellbore barrier using near field magnetic induction (NFMI) communications.

Abstract: A differential thermal mass flow meter assembly (1) for measuring a mass flow of a gas or liquid is disclosed, wherein it comprises: a flow channel (2), in which the gas or liquid is flowing, at least two heating elements (4, 4?, 4?) arranged in the flow direction on the inside wall (3) of said flow channel (2), at least one thermal sensor (5) arranged in the flow direction up-stream said heating elements (4, 4?, 4?) on the inside wall (3) of said flow channel (2), at least one thermal sensor (6?) arranged in the flow direction down-stream said heating elements (4, 4?, 4?) on the inside wall (3) of said flow channel (2), as well as a method of measuring the mass flow of a gas or liquid using said differential thermal mass flow meter assembly.

Abstract: A thermoelectric module comprising a central thermoelectric assembly of cylindrical tubular shape inside which a first cold fluid flows and outside which a hot fluid flows. This module is characterized in that it also comprises at least one peripheral thermoelectric assembly having: an outer face in contact with a second cold fluid; an inner face positioned on a peripheral boundary surrounding the central thermoelectric assembly, said boundary defining a channel between said central and peripheral thermoelectric assemblies where the hot fluid flows.

Abstract: The disclosure is directed to an energy efficient thermal protection assembly. The thermal protection assembly can comprise three or more thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present disclosure further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. The transport or storage device can be configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

Abstract: A temperature probe and method for determining a temperature in a gas flow are disclosed. The probe includes a probe body. A free flow temperature sensor a free flow temperature of the gas flow and a total temperature sensor measures a total temperature of the gas flow. The method includes measuring a flow temperature in a free gas flow, providing a static gas volume in which essentially all kinetic energy of the flowing gas is recovered and converted into thermal energy, and measuring a total temperature in the static gas volume. An accurate determination of the total temperature of a gas flow, which is representative of a specific total enthalpy, can thereby be achieved while detecting fast and transient temperature changes.

Abstract: The invention relates to a method for determining a load current, which is based on conducting a calibration current in a particular manner and on particular calculation methods.

Abstract: In at least one embodiment, a thermoelectric generator is provided. The thermoelectric generator includes a substrate, a cap, a thermoelectric detector, and an insulation layer. The cap is attached to the substrate and includes an extending portion. The cap is configured to receive thermal energy from a heat generating device. The thermoelectric detector is in thermal communication with the cap to generate an electrical output in response to the thermal energy. The insulation layer is positioned between the cap and the substrate and the insulation layer is substantially co-planar with the extending portion of the cap.

Abstract: A substrate processing apparatus includes: a reaction tube configured to accommodate a substrate holder holding a plurality of substrates and process a substrate held on the substrate holder; a heating unit installed outside the reaction tube and configured to heat an inside of the reaction tube; a protection tube installed to extend in a vertical direction in contact with an outer wall of the reaction tube; an insulating tube disposed inside the protection tube and having through-holes extending in a vertical direction; a thermocouple having a thermocouple junction provided at an upper end thereof, and thermocouple wires joined at the thermocouple junction and inserted into the through-holes of the insulating tube; a gas supply unit configured to supply a gas, for processing a substrate accommodated in the reaction tube, into the reaction tube; and an exhaust unit configured to exhaust a gas from the reaction tube.

Abstract: Metal interconnect layers on a top surface connected through holes to interconnect layers of the same or interconnect layers of a thermoelectrically different material on a bottom surface material on the bottom surface. Through hole connection provided by a material of the same or similar thermoelectric material as interconnects. A second metal of a thermoelectrically different material than the first interconnect layer is connected through a second hole from the top side interconnect to the bottom side interconnect. A second through hole connection provided by a metal of the same or similar thermoelectric material as the interconnect layer on the bottom side. Layers are connected in an alternating fashion to form a differential thermocouple. The pattern is created by printing conductive metallic inks on the surfaces and through holes, or by a combination of plating and etching processes and printing conductive metallic inks on the surfaces and through holes.

Abstract: A temperature sensing probe assembly includes a temperature sensing probe having a tip and a first thermocouple junction located nearer the tip and a second thermocouple junction located nearer an attachment point for the temperature sensing probe assembly, and a housing positioned around at least a portion of the temperature sensing probe.

Abstract: The present invention provides an optical detector device, including: a metal absorber layer; and a dielectric cover layer coupled to the metal absorber layer, wherein the dielectric cover layer includes one or more antireflective structured surfaces. The optical detector device further includes one or more of a passive substrate layer and an active thermoelectric element layer coupled to the metal absorber layer opposite the dielectric cover layer. The one or more antireflective structured surfaces each utilize a random pattern.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer that are connected in series while alternating between the p-type and the n-type thermoelectric elements. The integrated circuit may include first and second substrates each having formed thereon a plurality of thermoelectric legs of a respective type of thermoelectric material. The first and second thermoelectric substrates also may have respective conductors, each coupled to a base of an associated thermoelectric leg and forming a mounting pad for coupling to a thermoelectric leg of the counterpart substrate.

Abstract: A temperature sensing assembly includes a temperature sensing probe having a tip and a thermocouple junction located near the tip and a housing positioned around at least a portion of the temperature sensing probe and having an inlet opening between the thermocouple junction and an attachment point, and having a set of exhaust openings.

Abstract: A temperature sensing probe having a tip and a first thermocouple junction located nearer the tip and a second thermocouple junction located nearer an attachment point for the temperature sensing probe assembly, and a housing positioned around at least a portion of the temperature sensing probe and having a set of inlet openings and having a set of exhaust openings, wherein a stream of air flows through the housing.

Abstract: The disclosure is directed to an energy efficient thermal protection assembly. The thermal protection assembly can comprise three or more thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present disclosure further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. The transport or storage device can be configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

Abstract: The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.

Abstract: Provided are a thermoelectric conversion element and a thermoelectric conversion module using the thermoelectric conversion element. The thermoelectric conversion element has a first substrate having a high thermal conduction portion which has a thermal conductivity higher than a thermal conductivity of other regions, a thermoelectric conversion layer formed on the first substrate, a pressure sensitive adhesive layer formed on the thermoelectric conversion layer, a second substrate formed on the pressure sensitive adhesive layer, having a concave portion, which at least partially overlaps the high thermal conduction portion of the first substrate in a plane direction and is on the pressure sensitive adhesive layer side, and made of a metal material, and an electrode pair connected to the thermoelectric conversion layer.

Abstract: A thermal radiation microsensor can comprise thermoelectric micro pillars, in which multiple vertically standing thermoelectric micro pillars can act as thermoelectric pairs and mechanical support of an absorption layer. Radiation absorbed by the absorption layer can produce a temperature difference, which drives the thermocouple comprising p-type and n-type micro pillars to output a voltage. Multiple thermocouples can be connected in series to improve the signal output.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: An exemplary thermoelectric generator unit according to the present disclosure includes a plurality of tubular thermoelectric generators. Each generator generates electromotive force in an axial direction based on a difference in temperature between its inner and outer peripheral surfaces. The unit further includes a container housing the generators inside and a plurality of electrically conductive members providing electrical interconnection among the generators. The container has fluid inlet and outlet ports through which a fluid flows inside the container, and a plurality of openings into which the respective generators are inserted. In one implementation, the unit includes a baffle, which is provided between the fluid inlet port and the generators and changes the flow direction of the fluid that has flowed into the container through the fluid inlet port.

Abstract: A method for positioning sensors about a sensor ring includes the steps of assigning each sensor in a plurality of sensors a sensor number selected from a set of sensor numbers, where the set of sensor numbers is a whole number in the range of 0 to N, and where N is the total number of sensors in said plurality of sensors minus one, disposing a first sensor at a circumferential angular position zero on the sensor ring, and disposing each sensor in the plurality of sensors at a circumferential angular position about the sensor ring, wherein the circumferential angular position is defined by an offset from a circumferential angular position zero and the offset is equal to a base arc length between sensors multiplied by the sensor number of the sensor plus a base offset arc length multiplied by the sensor number of the sensor.

Abstract: A sensor assembly includes a tubular housing having an inner surface defining an axial chamber and a temperature sensor disposed in the axial chamber and moveable along an axial direction of the tubular housing. The sensor assembly further includes a seal carrier movable with the temperature sensor, and a sealing member disposed around the seal carrier. The sealing member is in sliding contact with the inner surface of the tubular housing and hermetically seals an interface between the sealing member and the inner surface of the tubular housing.

Abstract: An interposer includes an interconnection structure and a redistribution layer. The interconnection structure includes a metal layer, at least one metal via and an isolation material. The metal layer defines at least one through hole having a side wall. The at least one metal via is disposed in the through hole. A space is defined between the at least one metal via and the side wall of the through hole, and the isolation material fills the space. The redistribution layer is disposed on a surface of the interconnection structure and is electrically connected to the metal via.

Abstract: A triboelectric generator includes a first contact charging member, a second contact charging member and an electrical load. The first contact charging member has a contact side and an opposite back side. The first contact charging member includes a material that has a first rating on a triboelectric series and also has a conductive aspect. The second contact charging member has a second rating on the triboelectric series, different from the first rating, and is configured to come into contact with the first contact layer and go out of contact with the first contact layer. The electrical load electrically is coupled to the first contact charging member and to a common voltage so that current will flow through the load after the second contact charging member comes into contact with the first contact charging member and then goes out of contact with the first contact charging member.

Abstract: A semiconductor device package and method for manufacturing the same, includes a semiconductor substrate including a plurality of embedded thermoelectric couples. The embedded thermoelectric couples can be in trenches and extend partially into the substrate from the handle side of the substrate. An n-type pillar and a p-type pillar are electrically connected using a conducting contact plate to form each of the partially embedded thermoelectric couples. A series connection layer electrically connects the plurality of thermoelectric couples on the handle side. A power source provides electrical current to the series connection layer allowing current to flow through the plurality of the series connected thermoelectric couples. A heat sink is positioned adjacent to the connected thermoelectric couples for transferring heat away from the device side to the heat sink using the thermoelectric couples.

Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.

Abstract: The present invention relates to a device for the vaporization of a liquid, said device comprising: a reservoir capable of containing a liquid to be vaporized, a heating element capable of heating the liquid in order to vaporize the liquid, a capillary pump capable of pumping the liquid contained in said reservoir to said heating element by capillary pumping, and a capillary barrier arranged along a capillary pumping direction of the liquid to be vaporized downstream from the capillary pump, said capillary barrier being capable of preventing the non-vaporized liquid from escaping from the device.

Abstract: A cooling device of a component includes at least one channel in which a first cooling fluid flows designed to cool a hot area of the component. It further includes a thermoelectric module configured to measure a temperature difference between the hot area of the component and the channel, and a control circuit configured to modulate the flowrate of the first cooling fluid in the channel according to the temperature difference.

Abstract: A thermoelectric material includes powders having a surface coated with an inorganic material. The thermoelectric material includes a thermoelectric semiconductor powder and a coating layer on an outer surface of the thermoelectric semiconductor powders.

Abstract: A thermoelectric assembly and method are provided. The thermoelectric assembly can extend at least partially around a perimeter of a first fluid conduit. The thermoelectric assembly can include a plurality of thermoelectric sub-assemblies aligned with one another along the perimeter of the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of thermoelectric elements in parallel electrical communication with one another, and at least one shunt a plurality of electrically insulating elements to prevent current flow in a plane perpendicular to the first direction between adjacent thermoelectric sub-assemblies.

Abstract: A conductive paste includes a conductive powder, a metallic glass, and an organic vehicle. The metallic glass includes a first element, a second element having a higher absolute value of Gibbs free energy of oxide formation than the first element, and a third element having an absolute value of Gibbs free energy of oxide formation of about 1000 kJ/mol or less at a baking temperature and a eutectic temperature with the conductive powder of less than about 1000° C. An electronic device and a solar cell may include an electrode formed using the conductive paste.

Abstract: A thermoelectric module includes a low temperature-side wiring line, a high temperature-side wiring line, a low temperature-side member, a plurality of low temperature-side thermoelectric conversion elements made of a BiTe-based material, a high temperature-side member, a plurality of high temperature-side thermoelectric conversion elements made of a material different from the BiTe-based material, an insulating member, a radiant heat blocking plate, a low temperature-side electrode, and a high temperature-side electrode. The radiant heat blocking plate is arranged on the side of the high temperature-side member with respect to the low temperature-side wiring line and the high temperature-side wiring line. A thermoelectric module that can restrain burning of wiring lines, as well as a thermoelectric power generating apparatus and a thermoelectric generator including the same can thereby be obtained.

Abstract: The disclosure provides a thermoelectric module and a method for fabricating the same. The thermoelectric module includes a plurality of p-type and n-type segmented thermoelectric elements disposed in a planar array, wherein the p-type and n-type segmented thermoelectric elements are coupled in series via a plurality of first electrodes and second electrodes. Each segmented thermoelectric element includes at least two vertically homogeneous thermoelectric segments, and at least two adjacent thermoelectric segments have a fusion-bonding layer therebetween. The fusion-bonding layer includes a tin-containing material and a plurality of spacers disposed among the tin-containing material, wherein the melting point of the spacers is higher than the liquidus temperature of the tin-containing material.