Abstract: A superconducting magnet which provides a barrier to current flow transverse to the length of the superconductor at operational temperature and voltages, while also providing a magnetic quench protection mechanism for the superconducting magnet. The superconducting magnet comprising a plurality of winding turns of superconductive material wound into a coil and a variable electrically resistive layer varying with either temperature or voltage positioned between at least of portion of the plurality of winding turns of the superconductive material, wherein the variable electrically resistive layer has a negative temperature coefficient of resistance or is a semiconductor with a threshold voltage greater than operational voltages.

Abstract: A terminal fitting (1) includes a rectangular tubular body (10). A resilient contact piece (16) is arranged inside the body (10) and a pressure receiving piece (18) faces the resilient contact piece (16) inside the body (10). The resilient contact piece (16) has a base end (16Eb) curved inward of the body (10) from an end of the body (10). The pressure receiving piece (18) has one end including a base end (18Eb) curved inwardly of the body (10) from an end of the body (10). An area of a first facing surface (16F) of the resilient contact piece (16) to be contacted by a tab (41) serves as a first plating area (16M) having Ag plating applied thereto. Areas of a second facing surface (18F) of the pressure receiving piece (18) to be contacted by the tab (41) serves as second plating areas (18M) having Ag plating applied thereto.

Abstract: A method of making a corrosion resistant brass component that includes the steps: forming a gaseous atmosphere containing labile sulfur by combustion of potassium bisulfate or hydrogen sulfide; and contacting surfaces of a finished brass component with the gaseous atmosphere containing labile sulfur. The surfaces of the brass component are contacted with the gaseous atmosphere at an elevated temperature for a time sufficient to form a metal-sulfide rich layer of at least 5 microns in thickness. Further, the brass component is corrosion resistant after the contacting step as determined by standardized testing that yields dezincification penetration of less than 200 microns in depth.

Abstract: Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns.

Abstract: We describe herein biocompatible single crystal Cu-based shape memory alloys (SMAs). In particular, we show biocompatibility based on MEM elution cell cytotoxicity, ISO intramuscular implant, and hemo-compatibility tests producing negative cytotoxic results. This biocompatibility may be attributed to the formation of a durable oxide surface layer analogous to the titanium oxide layer that inhibits body fluid reaction to titanium nickel alloys, and/or the non-existence of crystal domain boundaries may inhibit corrosive chemical attack. Methods for controlling the formation of the protective aluminum oxide layer are also described, as are devices including such biocompatible single crystal copper-based SMAs.

Abstract: A non-chromate conversion coating for copper or other alloys. The conversion coating is composed of hydrotalcite-like compound (HTlcs). The conversion coating adheres well with the alloys, and provides excellent corrosion protection. In addition, corrosion inhibitive species were incorporated into the coating. The coating with inhibitors incorporated showed damage-responsive properties. The corrosion protection property of the conversion coating was further enhanced through applying a surface sealer. The coating has applicability in industrial heat exchangers that use reclaimed water.

Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.

Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.

Abstract: Exemplary embodiments described herein relate to methods and apparatus for forming a coating layer at least partially on surface of a BMG article formed of bulk solidifying amorphous alloys. In embodiments, the coating layer may be formed in situ during formation of a BMG article and/or post formation of a BMG article. The coating layer may provide the BMG article with surface hardness, wear resistance, surface activity, corrosion resistance, etc.

Abstract: Disclosed herein are copper powder, a copper paste and a method for preparing a copper powder. The copper powder is provided with a cuprous oxide film having a loose structure on a surface of the copper powder, thereby preventing the copper particles from being naturally oxidized, making it possible to being subjected to a low temperature firing process and having improved conductivity.

Abstract: A method of providing sulfidation corrosion resistance and corrosion induced fouling resistance to a heat transfer component surface includes providing a silicon containing steel composition including an alloy and a Si-partitioned non-metallic film formed on a surface of the alloy. The alloy is formed from the composition ?, ?, and t, in which ? is a metal selected from the group consisting of Fe, Ni, Co, and mixtures thereof, ? is Si, and t is at least one alloying element selected from the group consisting of Cr, Al, Mn, Ti, Zr, Hf, V, Nb, Ta, Mo, W, Sc, La, Y, Ce, Ru, Rh, Ir, Pd, Pt, Cu, Ag, Au, Ga, Ge, As, In, Sn, Sb, Pb, B, C, N, P, O, S and mixtures thereof. The Si-partitioned non-metallic film comprises at least one of sulfide, oxysulfide and mixtures thereof.

Abstract: The invention relates to an austenitic stainless steel strip having an elastic limit Rp0.2 which is greater than or equal to 600 MPa, a breaking load Rm which is greater than or equal to 800 MPa, an elongation A80 which is greater than or equal to 40% and a bright surface finish of the bright annealed type. The invention also relates to a method for the continuous production of said austenitic stainless steel strip.

Abstract: An example method for manufacturing a magneto-resistance effect element having a magnetic layer, a free magnetization layer, and a spacer layer includes forming a first metallic layer and forming, on the first metallic layer, a second metallic layer. A first conversion treatment is performed to convert the second metallic layer into a first insulating layer and to form a first metallic portion penetrating through the first insulating layer. A third metallic layer is formed on the first insulating layer and the first metallic portion. A second conversion treatment is performed to convert the third metallic layer into a second insulating layer and to form a second metallic portion penetrating through the second insulating layer.

Abstract: According to one embodiment, a magnetoresistive element includes a first ferromagnetic layer a magnetization direction of which is pinned, a second ferromagnetic layer a magnetization direction of which is changed depending on an external magnetic field, an intermediate layer arranged between the first ferromagnetic layer and the second ferromagnetic layer and including an insulating layer and a magnetic conductive column, an alloy layer formed between the magnetic conductive column in the intermediate layer and the second ferromagnetic layer and including at least one of FeCoAl and FeCoAlCu, and a pair of electrodes configured to supply a current perpendicularly to a film plane of a stacked film including the first ferromagnetic layer, the intermediate layer, the alloy layer and the second ferromagnetic layer.

Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.

Abstract: A method of creating a plasma-resistant thermal oxide coating on a surface of an article, where the article is comprised of a metal or metal alloy which is typically selected from the group consisting of yttrium, neodymium, samarium, terbium, dysprosium, erbium, ytterbium, scandium, hafnium, niobium or combinations thereof. The oxide coating is formed using a time-temperature profile which includes an initial rapid heating rage, followed by a gradual decrease in heating rate, to produce an oxide coating structure which is columnar in nature. The grain size of the crystals which make up the oxide coating is larger at the surface of the oxide coating than at the interface between the oxide coating and the metal or metal alloy substrate, and the oxide coating is in compression at the interface between the oxide coating and the metal or metal alloy substrate.

Abstract: A method for bonding a first copper element onto a second copper element including forming a crystalline copper layer enriched in oxygen on each of surfaces of each of the first and second elements through which the elements will be in contact, the total thickness of both layers being less than 6 nm, which includes: a) polishing the surfaces so as to obtain a roughness of less than 1 nm RMS, and hydrophilic surfaces, b) cleaning the surfaces to suppress presence of particles due to the polishing and the major portion of corrosion inhibitors, and c) putting both crystalline copper layer enriched in oxygen in contact with each other.

Abstract: In this method, the inner surface of a metal pipe containing, by mass percent, 20 to 55% of Cr and 20 to 70% of Ni is subjected to mechanical treatment, the metal pipe is subjected to heat treatment such as to be held in a temperature range of 1050 to 1270° C. for 0.5 to 60 minutes, and thereby an oxide scale layer consisting mainly of Cr is formed on at least the inner surface of the metal pipe. A metal pipe excellent in carburization resistance and coking resistance in a carburizing gas environment can be obtained by the method.

Abstract: The present invention provides strategies for making high quality CIGS photoabsorbing compositions from sputtered precursor film(s). The precursors are converted into CIGS photoabsorbing material via a chalcogenizing treatment (also referred to as “post-chalcogenization,” including, e.g., “post-selenization” when Se is used and/or “post-sulfurization” when S is used) using techniques that allow the post-chalcogenizing treatment to occur under atypically low pressure conditions. Consequently, the strategies of the invention are readily incorporated into batch processes or continuous processes such as roll-to-roll process occurring under vacuum. The present invention is useful at lab, pilot plant, and industrial scales.

Abstract: A method of manufacturing a ceramic/metal composite structure includes the steps of: performing a multi-stage pre-oxidizing process on the copper sheet; placing the copper sheet on a ceramic substrate; and heating the copper sheet and the ceramic substrate to a joining temperature to join the copper sheet and the ceramic substrate together to enhance interface strength between the copper sheet and the ceramic substrate according to the multi-stage pre-oxidizing process. The multi-stage pre-oxidizing process includes a first stage of pre-oxidizing process and a second stage of pre-oxidizing process, and the first and second stages of pre-oxidizing processes are performed in atmospheres with different oxygen partial pressures and at different temperatures.

Abstract: An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.

Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Abstract: A method for manufacturing a Ni-based alloy article which elutes little Ni even when used in a high-temperature water environment for a long period comprises heating the Ni-based alloy in a carbon dioxide-containing atmosphere for a set period of time at an elevated temperature to form an oxide film comprising chromium oxide on a surface thereof. Using carbon dioxide as an oxidizing gas produces an oxide film of generally uniform thickness along a length of the article being treated so that resistance to nickel elution is more uniform over the entire article.

Abstract: The invention relates to an austenitic stainless steel strip having an elastic limit Rp0.2 which is greater than or equal to 600 MPa, a breaking load Rm which is greater than or equal to 800 MPa, an elongation A80 which is greater than or equal to 40% and a bright surface finish of the bright annealed type. The invention also relates to a method for the continuous production of said austenitic stainless steel strip.

Abstract: An apparatus and process for protecting metal from oxidation during metal forming operations. A salt is deposited onto at least a portion of a surface of the metal. The salt is heated in a protective environment until the salt melts on the metal to form a coated metal. The protective environment may then be removed and the coated metal may be exposed to an active environment. The coated metal may then be formed using standard metal forming processes. In alternative embodiments salts are selected for particular melting and vaporizing temperatures. An automated apparatus for coating a metal object with a salt may be provided. An applicator is configured to deposit the salt onto a surface of the metal object to form a salted metal object. A furnace is configured to receive the salted metal object and to melt at least a portion of the salt on the surface of the salted metal object.

Abstract: Disclosed is a composite black oxide particle which is composed of oxide of cobalt, copper and manganese. The copper/cobalt molar ratio is 0.1-0.5, and the manganese/cobalt molar ratio is 0.2-1.0. The composite black oxide particle further contains silicon, and the silicon content to the total oxide particle is 0.1-3 mass %. The surface of the composite black oxide particle is coated with aluminum oxide. The Al content in the surface coating to the entire particle is 0.05-3 mass %.

Abstract: The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.

Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Abstract: A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, an unsaturated alkyl substituted with an aromatic or non-aromatic cyclic groups, and optionally but preferably a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing, an organic nitro compound, and a source of halide ions in order to increase the adhesion of polymeric materials to the metal surface.

Abstract: A metal material whose surface is modified by bonding of aromatic groups, optionally substituted by functional groups.

Abstract: The invention features and methods and compositions for oxide production on a Copper substrate, e.g., a Copper or Copper alloy substrate, to provide for improved adhesion of Copper substrate to polymeric material, e.g., such as used in manufacture of printed circuit boards. The oxide-producing compositions of the invention, which may be either acidic or ammoniacal, comprise 1) a source of Cu++ (Cupric) ions; 2) a source of a primary electrolyte that is non-interactive with Copper ions; 3) a Cuprous ligand, e.g., a halide ion, preferably chloride, which also serves as a secondary electrolyte; and 4) an optional organic. Acidic oxide-producing compositions comprise a strong acid as the primary electrolyte. The primary electrolyte of ammoniacal oxide-producing compositions is a non-interactive, ammonium salt of acid, which provides a highly soluble Cupric ammonium salt. The secondary electrolyte of the oxide-producing compositions is selected so as to be compatible with the primary electrolyte.

Abstract: A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous organo-silicon wetting composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. Suitable organo-silicons include organosilanes, organosiloxanes, organosilizanes and the like. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.

Abstract: A method for improving the electrical conductivity of a substrate of metal, metal alloy or metal oxide comprising depositing a small or minor amount of metal or metals from Group VIIIA metals (Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt) or from Group IA metals (Cu, Ag, Au) on a substrate of metal, metal alloys and/or metal oxide from Group IVA metals (Ti, Zr, Hf), Group VA metals (V, Nb, Ta), Group VIA metals (Cr, Mo, W) and Al, Mn, Ni and Cu and then directing a high energy beam onto the substrate to cause an intermixing of the deposited material with the native oxide of the substrate metal or metal alloy. The native oxide layer is changed from electrically insulating to electrically conductive. The step of depositing can be carried out, for example, by ion beam assisted deposition, electron beam deposition, chemical vapor deposition, physical vapor deposition, plasma assisted, low pressure plasma and plasma spray deposition and the like.

Abstract: The invention relates generally to the prevention of copper oxidation during copper anneal processes. In one aspect of the invention, copper oxidation is prevented by carrying out the anneal in the presence of one or more organic reducing agents.

Abstract: It is an object of the present invention to provide a processing method for preventing elution of lead in a lead-containing copper alloy to prevent lead from eluting from a faucet metal, etc. made of a lead-containing copper alloy, and a drinking water service fitting made of a lead-containing copper alloy in which elution of lead has been prevented. By forming a chromate film on the surface of a lead-containing copper alloy material, it is possible to reduce elution of the lead left in a limited amount on the surface. A drinking water service fitting made of a lead-containing copper alloy is immersed in an alkaline etching solution in a pre-processing step for a nickel chromium plating step to selectively remove lead on the surface of the lead-containing copper alloy material and is then activated in a solution such as sulfuric acid and hydrochloric acid.

Abstract: The present invention relates to structures within an x-ray device including an x-ray can, an x-ray can window frame insert, a rotor sleeve, and a bearing support assembly for a rotor structure. The various structures are fabricated from a chromium alloy of copper that is essentially oxygen free copper having a minor amount of chromium, the combination of which imparts desirable qualities to the x-ray device structures, including efficient heat sink and emissivity qualities that are beneficial in an x-ray device environment. In one preferred embodiment of the present invention, oxygen free high conductivity (OFHC) copper is melted in an RF furnace in the presence of a minor amount of chromium and is either ingot cast or powder metallurgically cast into a desired article and further fabricated into a finished article.

Abstract: The invention concerns processes and solutions for the preliminary treatment of copper surfaces which are subsequently to be firmly bonded to organic substrates. The solution is used, in particular, for firmly bonding laminated multilayered printed circuit boards and for firmly bonding resists to the copper surfaces of printed circuit boards.

Abstract: The present invention pertains to systems and methods for passivating the copper seed layer deposited in Damascene integrated circuit manufacturing. More specifically, the invention pertains to systems and methods for depositing the copper seed layer by physical vapor deposition, while passivating the copper during or immediately after the deposition in order to prevent excessive oxidation of the copper. The invention is applicable to dual Damascene processing.

Abstract: A method is provided for the selective deposition of an organic solderability preservative (OSP) coating on copper surfaces of articles such as electronic components, e.g., printed wiring boards, to serve as a protective coating and preserve the solderability of the copper surface while substantially excluding gold surfaces from attracting the same OSP coating which coating causes cosmetic defects in the form of staining and may reduce the conductivity of the gold contact surface. The method improves the conventional OSP process and utilizes a pre-treatment of the copper surface before applying the OSP coating comprising treating the cleaned and preferably micro-etched copper with an aqueous solution of benzimidazole or derivative thereof to form a precoat on the copper surface. After the pre-treatment step, the precoated copper surface is conventionally treated with a suitable OSP solution such as an aqueous solution of a substituted benzimidazole compound, preferably at the 2-position.

Abstract: A simple surface treatment process is provided which offers a high performance surface for a variety of applications at low cost. This novel surface treatment, which is particularly useful for Ti-6Al-4V alloys, is achieved by forming oxides on the surface with a two-step chemical process and without mechanical abrasion. First, after solvent degreasing, sulfuric acid is used to generate a fresh titanium surface. Next, an alkaline perborate solution is used to form an oxide on the surface. This acid-followed-by-base treatment is cost effective and relatively safe to use in commercial applications. In addition, it is chromium-free, and has been successfully used with a sol-gel coating to afford a strong adhesive bond that exhibits excellent durability after the bonded specimens have been subjected to a harsh 72 hour water boil immersion. Phenylethynyl containing adhesives were used to evaluate this surface treatment with a novel coupling agent containing both trialkoxysilane and phenylethynyl groups.

Abstract: From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze metallic surface, creating lumps on the propeller, which adversely affect its balance and cause impedance and vibration of the propeller and its boat in the water. Anti-fouling paints are either too toxic for the marine environment or lack smoothness on the surface. These problems have been overcome by polishing the propeller to prepare it for electroplating, cleansing to remove dirt and grease, electroplating with copper, followed by spraying with a standard solution (5%) of sodium hypochlorite and sodium chloride and allowing sufficient time for a reaction of the hypochlorite solution with the copper to form a firmly adhering conversion coating of basic cupric chloride. The coating is blue-green in color.

Abstract: A composition and process are described which are useful in treating metal surfaces, which composition comprises an oxidizer, an acid, a corrosion inhibitor, an organic nitro compound and, optionally, a benzotriazole with an electron withdrawing group in the 1-position which electron withdrawing group is a stronger electron withdrawer than a hydrogen group, optionally, a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing and optionally but preferably a source of halide ions. The composition and process are useful in increasing the adhesion of metal surfaces to polymeric substances and in preserving said adhesion through temperature variation.

Abstract: Non-halogen substituted, nitrogen containing, aromatic compounds are disclosed which are effective copper corrosion inhibitors in aqueous systems being treated with a halogen biocide. The materials of the present invention exhibit copper corrosion inhibition comparable to tolyltriazole in the absence of halogen, copper corrosion rates of less than about 2.5 mills per year in aqueous systems where halogen is present; and do not exhibit a detrimental effect on halogen demand in an aqueous system being treated.

Abstract: A fabrication process provides for achieving high adhesion of CVD copper thin films on metal nitride substrates, and in particular, on substrates having an outermost TaN layer. The method comprises introducing a certain amount of water vapor to the initial copper thin film deposition stage and reducing the amount of fluorine in the interface of the copper and metal nitride substrate. These two process steps result in a copper thin film having improved adhesion to metal nitride substrates, including TaN substrates.

Abstract: In accordance with the present invention, an apparatus and method for application of a chemical process on a component surface is provided. In an embodiment for an apparatus for preparing a component surface for application of a chemical process, the apparatus includes a base, an o-ring retainer, an o-ring, a boot, and a retention ring. The component is mounted on the base. The o-ring is positioned on the o-ring retainer and the o-ring retainer is inserted through an aperture in the component and mated with the base. The assembled component, base, o-ring retainer, and o-ring are positioned within the boot. The retention ring is positioned around the boot.

Abstract: The invention relates generally to the prevention of copper oxidation during copper anneal processes. In one aspect of the invention, copper oxidation is prevented by carrying out the anneal in the presence of one or more organic reducing agents.

Abstract: The adhesion between a metal surface, e.g., a copper circuit trace, and a polymeric material, e.g.

Abstract: Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.

Abstract: Wear resistant copper or a wear resistant copper base alloy having formed on the outermost surface thereof an oxide layer having a thickness of 10-1000 nm and a layer of an intermetallic compound primarily comprising Cu—Sn having a thickness of 0.1-10 &mgr;m under the oxide film layer is provided; a method of preparing the above-described wear resistant copper or copper base alloy by coating base material copper or a copper base alloy with Sn, preferably performing reflow treatment and then conducting heat treatment is provided; and an electrical part comprising the above-described wear resistant copper or copper base alloy is provided. A terminal made of the alloy according to the present invention which has an appropriate oxide film layer by performing heat treatment can greatly decrease a terminal-insertion force compared with that made of an ordinary copper base alloy which is not subjected to the heat treatment.

Abstract: A method of artificially forming patina on a copper product surface comprising the steps of blowing granular sodium hydrogen carbonate powder onto the copper product surface to clean and roughen it; wetting the surface with water; and depositing granular sodium hydrogen carbonate powder onto the wet copper surface; thereby forming patina on the copper surface. The step of wetting the copper surface and the step of depositing granular sodium hydrogen carbonate powder onto the wet copper surface are preferably repeated several times. The copper surface is preferably covered with porous sheets during or after the above steps.