Multiple Working Steps Patents (Class 148/681)
  • Patent number: 9303914
    Abstract: A vertical support rigidly mounted to a planar base positions and supports a cryocooler expander unit off axis and away from a sample to be examined. The sample support is likewise rigidly mounted to the planar base with a rigidly mounted sample housing therein. The cryocooler expander unit is suspended in the vertical support by spring dampening bearings. A pair of opposing flexible vacuum bellows connects the cryocooler expander unit to the sample housing and vertical support. This configuration isolates the sample from vibration. Flexible thermal links associated with a predictive electronic closed loop control sequence maintains sample temperature.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: April 5, 2016
    Assignee: Montana Instruments Corporation
    Inventors: Luke R. Mauritsen, Michael B. Simmonds, Dan Griffing
  • Patent number: 9217191
    Abstract: An improved brass alloy providing improved ability for machining is detailed that is free of lead and is at the same time environmental friendly. The alloy comprises added alloying elements in an amount that is identified through an iterative process during manufacturing of the alloy.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: December 22, 2015
    Assignee: Raufoss Water & Gas AS
    Inventors: Sverre Gulbrandsen Dahl, Jon Ivar Moe
  • Patent number: 9181606
    Abstract: A composition for a low lead ingot containing primarily copper and including tin, zinc, sulfur, phosphorus, nickel. The composition may contain carbon. The low lead ingot, when solidified, includes sulfur or sulfur containing compounds such as sulfides distributed through the ingot. The presence and a substantially uniform distribution of these sulfur compounds imparts improved machinability and better mechanical properties.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: November 10, 2015
    Assignee: Sloan Valve Company
    Inventors: Michael Murray, Mahi Sahoo
  • Publication number: 20150122380
    Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.
    Type: Application
    Filed: October 17, 2014
    Publication date: May 7, 2015
    Inventors: Keiichiro Oishi, Takashi HOKAZONO, Michio TAKASAKI, Yosuke NAKASATO
  • Patent number: 8992706
    Abstract: One aspect of this method of producing a copper alloy sheet includes: a hot rolling process; a cold rolling process; a recrystallization heat treatment process; and a finish cold rolling process in this order, wherein a hot rolling initiation temperature is 800° C. to 940° C., a cooling rate from a temperature after final rolling or 650° C. to 350° C. is 1° C./second or more, and a cold working rate is 55% or more. In the recrystallization heat treatment process, 550?Tmax?790, 0.04?tm?2, and 460?{Tmax?40×tm?1/2?50×(1?RE/100)1/2}?580 are fulfilled, in which Tmax is the highest arrival temperature, tm (min) is a retention time in a temperature range from a temperature lower than the highest arrival temperature by 50° C. to the highest arrival temperature, and RE (%) is a cold working rate.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: March 31, 2015
    Assignees: Mitsubishi Shindoh Co., Ltd., Mitsubishi Materials Corporation
    Inventor: Keiichiro Oishi
  • Patent number: 8845829
    Abstract: A method of manufacturing a Cu alloy conductor includes the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: September 30, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Seigi Aoyama, Takaaki Ichikawa, Hiroyoshi Hiruta, Hiromitsu Kuroda
  • Publication number: 20140261923
    Abstract: Processes for producing a uniform grain hot worked spinodal alloy are disclosed. The processes generate a uniform grain spinodal alloy without cracking and without the need for a homogenization step. The processes include providing an as-cast spinodal alloy, heating the as-cast spinodal alloy between 1200 and 1300° F. for approximately 12 hours and hot working, allowing the spinodal alloy to cool, performing a second hot work on the as-cast spinodal alloy after it has been heated to 1700° F. for a defined time period, exposing the alloy to a third temperature, performing a second hot work reduction, and cooling the alloy again.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicant: Materion Corporation
    Inventor: Edward Longenberger
  • Publication number: 20140209221
    Abstract: The fatigue resistance characteristics, particularly, fatigue resistance characteristics after retention at 150° C. for 1000 hours are improved while maintaining the characteristics in the related art. Provided is a copper alloy sheet having a composition containing 0.2% by mass to 1.2% by mass of Mg, and 0.001% by mass to 0.2% by mass of P, the balance being Cu and unavoidable impurities. When X-ray diffraction intensity of a {110} crystal plane is set as I{110}, and X-ray diffraction intensity of {110} crystal plane of a pure copper standard powder is set as I0{110}, a surface crystal orientation of the copper alloy sheet satisfies a relation of 4.0?I{110}/I0{110}?6.0.
    Type: Application
    Filed: April 4, 2012
    Publication date: July 31, 2014
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Jun-Ichi Kumagai, Yoshio Abe, Shunroku Sukumoda
  • Publication number: 20140202602
    Abstract: An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfied a relationship of 20?[Zn]+7×[Sn]+15×[P]+4.5×[Ni]?32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 ?m to 5.0 ?m, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 24, 2014
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Keiichiro Oishi, Kouichi Suzaki
  • Publication number: 20140174611
    Abstract: One aspect of this method of producing a copper alloy sheet includes: a hot rolling process; a cold rolling process; a recrystallization heat treatment process; and a finish cold rolling process in this order, wherein a hot rolling initiation temperature is 800° C. to 940° C., a cooling rate from a temperature after final rolling or 650° C. to 350° C. is 1° C./second or more, and a cold working rate is 55% or more. In the recrystallization heat treatment process, 550?Tmax?790, 0.04?tm?2, and 460?{Tmax?40×tm?1/2?50×(1?RE/100)1/2}?580 are fulfilled, in which Tmax is the highest arrival temperature, tm (min) is a retention time in a temperature range from a temperature lower than the highest arrival temperature by 50° C. to the highest arrival temperature, and RE (%) is a cold working rate.
    Type: Application
    Filed: December 5, 2013
    Publication date: June 26, 2014
    Applicants: MITSUBISHI MATERIALS CORPORATION, Mitsubishi Shindoh Co., Ltd.
    Inventor: Keiichiro Oishi
  • Publication number: 20140166164
    Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.
    Type: Application
    Filed: February 10, 2014
    Publication date: June 19, 2014
    Applicants: MITSUBISHI MATERIALS CORPORATION, Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Takashi Hokazono, Michio Takasaki, Yosuke Nakasato
  • Patent number: 8444779
    Abstract: The invention provides Cu—Ni—Si—Co alloys having excellent strength, electrical conductivity, and press-punching properties. In one aspect, the invention is a copper alloy for electronic materials, containing 1.0 to 2.5 mass % of Ni, 0.5 to 2.5 mass % of Co, and 0.30 to 1.2 mass % of Si, the balance being Cu and unavoidable impurities, wherein the copper alloy for electronic material has a [Ni+Co+Si] content in which the median value ? (mass %) satisfies the formula 20 (mass %)???60 (mass %), the standard deviation ? (Ni+Co+Si) satisfies the formula ? (Ni+Co+Si)?30 (mass %), and the surface area ratio S (%) satisfies the formula 1%?S?10%, in relation to the compositional variation and the surface area ratio of second-phase particles size of 0.1 ?m or greater and 1 ?m or less when observed in a cross section parallel to a rolling direction.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: May 21, 2013
    Assignee: JX Nippon Mining & Metals Co., Ltd.
    Inventors: Naohiko Era, Hiroshi Kuwagaki
  • Patent number: 8409375
    Abstract: A method of producing a copper alloy wire rod, containing: a casting step for obtaining an ingot by pouring molten copper of a precipitation strengthening copper alloy into a belt-&-wheel-type or twin-belt-type movable mold; and a rolling step for rolling the ingot obtained by the casting step, which steps are continuously performed, wherein an intermediate material of the copper alloy wire rod in the mid course of the rolling step or immediately after the rolling step is quenched.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: April 2, 2013
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hirokazu Yoshida, Tsukasa Takazawa
  • Patent number: 8361255
    Abstract: A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: January 29, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hiroaki Takano, Yoshiki Yamamoto, Koichi Kotoku, Chingping Tong
  • Patent number: 8317948
    Abstract: The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5?Ni/Co?about 2.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: November 27, 2012
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Naohiko Era, Kazuhiko Fukamachi, Hiroshi Kuwagaki
  • Publication number: 20120273097
    Abstract: The invention encompasses a method of forming a metallic article. An ingot of metallic material is provided, and such ingot has an initial thickness. The ingot is subjected to hot forging. The product of the hot forging is quenched to fix an average grain size of less than 250 microns within the metallic material. The quenched material can be formed into a three dimensional physical vapor deposition target. The invention also includes a method of forming a cast ingot. In particular aspects, the cast ingot is a high-purity copper material. The invention also includes physical vapor deposition targets, and magnetron plasma sputter reactor assemblies.
    Type: Application
    Filed: July 11, 2012
    Publication date: November 1, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Chi tse Wu, Wuwen Yi, Frederick B. Hidden, Susan D. Strothers
  • Patent number: 8241442
    Abstract: A method of making a hypereutectoid, head-hardened steel rail is provided that includes a step of head hardening a steel rail having a composition containing 0.86-1.00 wt % carbon, 0.40-0.75 wt % manganese, 0.40-1.00 wt % silicon, 0.05-0.15 wt % vanadium, 0.015-0.030 wt % titanium, and sufficient nitrogen to react with the titanium to form titanium nitride. Head hardening is conducted at a cooling rate that, if plotted on a graph with xy-coordinates with the x-axis representing cooling time in seconds, and the y-axis representing temperature in Celsius of the surface of the head of the steel rail, is maintained in a region between an upper cooling rate boundary plot defined by an upper line connecting xy-coordinates (0 s, 775° C.), (20 s, 670° C.), and (110 s, 550° C.) and a lower cooling rate boundary plot defined by a lower line connecting xy-coordinates (0 s, 750° C.), (20 s, 610° C.), and (110 s, 500° C.).
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: August 14, 2012
    Assignee: Arcelormittal Investigacion y Desarrollo, S.L.
    Inventors: Bruce L. Bramfitt, Fred B. Fletcher, John A. Davis, Jr.
  • Patent number: 8211249
    Abstract: A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) where I(hkl) is the X-ray diffraction intensity from (hkl)plane measured with respect to a rolled surface is 2.0 or more.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: July 3, 2012
    Assignees: NGK Insulators, Ltd., Osaka University
    Inventors: Tetsuo Sakai, Naokuni Muramatsu, Koki Chiba, Naoki Yamagami
  • Patent number: 8070893
    Abstract: The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5?Ni/Co?about 2, and wherein Pc is equal to or less than about 15/1000 ?m2, or Pc/P is equal to or less than about 0.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: December 6, 2011
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Naohiko Era, Kazuhiko Fukamachi, Hiroshi Kuwagaki
  • Patent number: 8025749
    Abstract: The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at least about 10 percent each of (111), (200), (220) and (311). In addition, the sputter target has a grain size of less than about 10 ?m for improving sputter uniformity and reducing sputter target arcing.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: September 27, 2011
    Assignee: Praxair S. T. Technology, Inc.
    Inventors: Andrew C. Perry, Paul S. Gilman
  • Patent number: 7776166
    Abstract: The present invention relates to methods for improving deposited film uniformity and controlling the erosion of sputter targets. Improved methods for achieving predetermined microstructure orientation in copper hollow cathode magnetron (HCM) sputter targets and targets prepared by such methods are disclosed.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: August 17, 2010
    Assignee: Praxair Technology, Inc.
    Inventors: Bjoern Pigur, Alfred Snowman
  • Patent number: 7628872
    Abstract: A lead-free free-cutting copper-antimony alloy comprises in percentage by weight: 55 to 65% Cu, 0.3 to 2.0% Sb, 0.2 to 1.0% Mn, at least two elements selected from the group of Ti, Ni, B, Fe, Se, Mg, Si, Sn, P and rare-earth metal in amount of 0.1-1.0%, as well as balance Zn and unavoidable impurities. The brass alloys according to the present invention possess superior cutting property, weldability, corrosion resistance, dezincification resistance and high-temperature-oxidation resistance, and are suitable for use in drinking-water installations, domestic appliances, toy for children, fastener, etc. The process for producing such alloys is also proposed.
    Type: Grant
    Filed: June 11, 2004
    Date of Patent: December 8, 2009
    Assignee: Ningbo Powerway Alloy Material Co., Ltd.
    Inventors: Ming Zhang, Siqi Zhang, Jihua Cai, Haorong Lou, Xiao Xie
  • Patent number: 7544259
    Abstract: An element such as Cr is caused to dissolve sufficiently in a base-material metal (Cu) in a solid solution state at a high temperature and a material in a supersaturated condition is obtained by performing quenching. After that, a strain is applied to this material and this material is subjected to aging treatment at a low temperature simultaneously with or after the application of this strain. As a result of this, it is possible to obtain a copper alloy having properties desirable as an electrode material, for example, a hardness of not less than 30 HRB, an electrical conductivity of not less than 85 IACS %, and a thermal conductivity of not less than 350 W/(m·K).
    Type: Grant
    Filed: July 17, 2003
    Date of Patent: June 9, 2009
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Mitsuhiro Funaki, Hiroki Baba, Shinya Ohyama, Toshiyuki Horimukai
  • Patent number: 7485200
    Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: February 3, 2009
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Masahiko Ishida, Junichi Kumagai, Takeshi Suzuki
  • Patent number: 7285174
    Abstract: A method for producing metallic strips having a high-grade cube texture based on nickel, copper, aluminum, silver or alloys of these metals including austenitic iron-nickel alloys makes it possible to obtain, during a subsequent annealing process and with lower total degrees of forming, a recrystallization cube layer of a quality equal to that of one obtained using customary roll forming and produces a better quality cube texture with comparable total degrees of forming. To this end, a forming method is provided during which the materials are formed by cold drawing before their recrystallization annealing thereby rendering them high-grade. The tools used for this include: a) non-driven roll devices with an axially parallel flat pair of rolls or turk's head arrangements with two pairs of rolls or; b) fixed drawing jaws that are slanted toward one another. The strips produced according to the invention can be used, for example, as a coating support for producing strip-shaped high-temperature superconductors.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: October 23, 2007
    Assignee: Leibniz-Institut fuer Festkoerper-und Werkstoffforschung Dresden e.V.
    Inventors: Joerg Eickemeyer, Dietmar Selbmann, Ralph Opitz
  • Patent number: 7204893
    Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.
    Type: Grant
    Filed: August 8, 2003
    Date of Patent: April 17, 2007
    Assignee: Ishikawajima-Harima Heavy Industries, Co., Ltd.
    Inventor: Kazuaki Mino
  • Patent number: 7172665
    Abstract: A melt of a Cu-based alloy containing 2 to 6% (% by weight, the same shall apply hereinafter) of Ag and 0.5 to 0.9% of Cr are solidified by casting, and the solidified article after subjecting to a homogenizing heat treatment is subjected to hot-working. The hot-worked article is subjected to a solution treatment, the article is subjected to cold-working or warm-working by forging or rolling, and then the formed article is subjected to an aging treatment to obtain a metallic material capable of manufacturing a high strength and high thermal conductive metal formed article at a low price, regardless of the geometry, and a method of manufacturing the metal formed article using the same.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: February 6, 2007
    Assignee: Ishikawajima-Harima Heavy Industries Co., Ltd.
    Inventor: Kazuaki Mino
  • Publication number: 20040211494
    Abstract: The invention relates to a partition (1) or a method for producing a partition (1) for a multilayer pressed packet (3), wherein the partition (1) can be placed as a pressing sheet in the composite of a multilayer pressed packet (3) to be produced, especially between two multilayers (2).
    Type: Application
    Filed: December 31, 2003
    Publication date: October 28, 2004
    Inventor: Dieter Backhaus
  • Publication number: 20040166017
    Abstract: An age-hardening copper-base alloy and processing method to make a commercially useful strip product for applications requiring high yield strength and moderately high electrical conductivity, in a strip, plate, wire, foil, tube, powder or cast form. The alloys are particularly suited for use in electrical connectors and interconnections. The alloys contain Cu—Ti—X where X is selected from Ni, Fe, Sn, P, Al, Zn, Si, Pb, Be, Mn, Mg, Ag, As, Sb, Zr, B, Cr and Co. and combinations thereof. The alloys offer excellent combinations of yield strength, and electrical conductivity, with excellent stress relaxation resistance. The yield strength is at least of 105 ksi and the electrical conductivity is at least 50% IACS.
    Type: Application
    Filed: September 5, 2003
    Publication date: August 26, 2004
    Applicants: Olin Corporation, Wieland-Werke AG
    Inventors: Ronald N. Caron, Peter W. Robinson, Derek E. Tyler, Andreas Boegel, Doris Humpenoder-Bogel, Hans-Achim Kuhn, Joerg Seeger
  • Patent number: 6689235
    Abstract: A method of manufacturing the rolled copper foil by a process which comprises hot rolling an ingot repeating cold rolling and annealing alternately, and finally cold rolling the work to a foil, the annealing immediately preceding the final cold rolling being performed under conditions that enable the annealed recrystallized grains to have a mean grain diameter of not greater than 20 &mgr;m, the reduction ration of the final cold rolling being beyond 90.0%, whereby excellent flex fatigue property and adequate softening property are achieved.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: February 10, 2004
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Takaaki Hatano, Yoshio Kurosawa
  • Patent number: 6689232
    Abstract: The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, silver in an amount from about 0.001 to about 0.1% by weight, iron in an amount from about 0.01 to about 0.25% by weight, and the balance copper and inevitable impurities. Preferably, the magnesium to phosphorous ratio is greater than 1.0. In a second embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, optionally silver in an amount from about 0.001 to about 0.1% by weight, at least one element selected from the group consisting of nickel, cobalt, and mixtures thereof in an amount from about 0.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: February 10, 2004
    Inventor: Ashok K. Bhargava
  • Patent number: 6679956
    Abstract: A process for making a copper base alloy comprises the steps of casting a copper base alloy containing tin, zinc, iron and phosphorous and forming phosphide particles uniformly distributed throughout the matrix. The forming step comprises homogenizing the alloy at least once for at least one hour at a temperature from 1000 to 1450° F., rolling to final gauge including at least one process anneal for at least one hour at 650 to 1200° F. followed by slow cooling, and stress relief annealing at final gauge for at lest one hour at 300 to 600° F.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: January 20, 2004
    Assignee: Waterbury Rolling Mills, Inc.
    Inventor: Ashok K. Bhargava
  • Publication number: 20030183311
    Abstract: Firstly, a heat transfer tube, in which grooves are formed on its inside surface in groove working step (1) and then its forming is applied in forming step (2), is softened in annealing step (3). Then, the tube is coiled in line in coiling in-line step (4). Here, while supplied in the length direction, the heat transfer tube is heated and cooled in the annealing step (3). Further, in the coiling in-line step (4), the heat transfer tube is coiled in line on a body of bobbin, so that works of installing the heat transfer tube to the bobbin can be simplified.
    Type: Application
    Filed: December 6, 2002
    Publication date: October 2, 2003
    Inventors: Noriaki Okamoto, Hideki Jou, Noriaki Nakao
  • Patent number: 6627055
    Abstract: A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal/solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than possible in the past. The billet is especially useful for making electroplating anodes used in the damascene process for making copper interconnects in silicon wafers.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: September 30, 2003
    Assignee: Brush Wellman, Inc.
    Inventors: William J. Bishop, David Krus, Jr.
  • Patent number: 6478902
    Abstract: The method is used to fabricate pure copper sputter targets. It includes first heating a copper billet to a temperature of at least 500° C. The copper billet has a purity of at least 99.99 percent. Then warm working the copper billet applies at least 40 percent strain. Cold rolling the warm worked copper billet then applies at least 40 percent strain and forms a copper plate. Finally, annealing the copper plate at a temperature above about 250° C. forms a target blank. The target blank has equiaxed grains having an average grain size of less than 40 &mgr;m. The grains of the target blank have (111), (200), (220) and (311) orientations with the amount of the grains having each of the orientations being less than 50 percent.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: November 12, 2002
    Assignee: Praxair S.T. Technology, Inc.
    Inventors: Holger Koenigsmann, Alfred Snowman, Shailesh Kulkarni
  • Patent number: 6458222
    Abstract: A brass for forging which has an apparent Zn content of 37 to 50 wt % and contains 0.5 to 7 wt % Sn. The brass has a microstructure of at least an &agr; phase and a &ggr; phase at a temperature of 300 to 550° C. and has crystal grain sizes which are made fine. A process for preparing brass involving making the crystal grain size of brass material fine and plastic working the brass material at 300 to 550° C.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: October 1, 2002
    Assignee: Toto Ltd.
    Inventors: Ryuji Matsubara, Nobuyuki Ashie, Katsuaki Nakamura
  • Patent number: 6436206
    Abstract: The present invention relates to copper base alloys containing tin, phosphorous, iron, and zinc and having phosphide particles uniformly distributed through the alloy matrix, which phosphide particles include fine and coarse phosphide particles. The alloy is produced using a process which comprises casting a copper base alloy consisting essentially of tin in an amount greater than about 1.5 wt. % up to 4.0 wt. %, phosphorous from 0.01 to 0.20 wt. %, iron from 0.01 to 0.80 wt. %, zinc in an amount greater than 1.0 wt. % up to 8.0 wt. %, and the balance essentially copper; homogenizing at least once for at least one hour at from 1000° F. to 1450° F.; rolling to final gauge including at least one process anneal for at least one hour at 650° F. to 1200° F. followed by slow cooling, preferably at a rate in the range of 20° F. to 200° F. per hour; and stress relief annealing at final gauge for at least one hour at 300° F. to 600° F.
    Type: Grant
    Filed: April 1, 1999
    Date of Patent: August 20, 2002
    Assignee: Waterbury Rolling Mills, Inc.
    Inventor: Ashok K. Bhargava
  • Patent number: 6395110
    Abstract: The present invention provides a copper-based alloy characterized by: having a composition of 58.0 to 63.0% by weight of Cu, 0.5 to 4.5% by weight of Pb, 0.05 to 0.25% by weight of P, 0.5 to 3.0% by weight of Sn, 0.05 to 0.30% by weight of Ni, and the balance of Zn and inevitable impurities; having a texture uniformly fragmented to acquire excellent corrosion resistance and hot working property; having undergone a given drawing work and heat treatment to acquire excellent mechanical properties including tensile strength, proof strength and elongation; and having internal stress thoroughly removed to excel in stress-corrosion cracking resistance.
    Type: Grant
    Filed: October 7, 1999
    Date of Patent: May 28, 2002
    Assignee: Kitz Corporation
    Inventors: Tadao Mizoguchi, Kozo Itoh, Kazuaki Yajima
  • Publication number: 20010023726
    Abstract: The method is used to fabricate pure copper sputter targets. It includes first heating a copper billet to a temperature of at least 500° C. The copper billet has a purity of at least 99.99 percent. Then warm working the copper billet applies at least 40 percent strain. Cold rolling the warm worked copper billet then applies at least 40 percent strain and forms a copper plate. Finally, annealing the copper plate at a temperature above about 250° C. forms a target blank. The target blank has equiaxed grains having an average grain size of less than 40 &mgr;m. The grains of the target blank have (111), (200), (220) and (311) orientations with the amount of the grains having each of the orientations being less than 50 percent.
    Type: Application
    Filed: December 5, 2000
    Publication date: September 27, 2001
    Inventors: Holger Koenigsmann, Alfred Snowman, Shailesh Kulkarni
  • Patent number: 6258187
    Abstract: Copper trolley wire consisting essentially of at least 99.90% copper and at most 0.10% of a metal selected from the group consisting of silver, cadmium, tellurium, titanium, magnesium, manganese, chromium, zirconium, tin and combinations thereof, has a minimum tensile strength well exceeding that listed in ASTM Standard B47-95a for copper trolley wire. The copper trolley wire has a uniform fine grain size. The copper trolley wire is manufactured using a process of casting a copper rod of the appropriate composition, hot working or “conforming” the cast rod to reduce its diameter, and then cold working it to form the desired wire by drawing it through one or more dies. Preferably, no annealing step is used.
    Type: Grant
    Filed: August 17, 1998
    Date of Patent: July 10, 2001
    Assignee: Phelps Dodge Industries, Inc.
    Inventors: Thomas J. Chandler, John Corrado
  • Patent number: 6197433
    Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).
    Type: Grant
    Filed: January 12, 2000
    Date of Patent: March 6, 2001
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventor: Takaaki Hatano
  • Patent number: 5916386
    Abstract: A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: June 29, 1999
    Assignee: Waterbury Rolling Mills, Inc.
    Inventor: Ashok K. Bhargava
  • Patent number: 5322575
    Abstract: A copper base alloy for terminals that is superior in all aspects of tensile strength, spring limits, conductivity, and stress relaxation characteristics can be produced by a process repeating the cycles consisting of hot-rolling, cold-rolling and annealing, in which process an ingot is prepared by melting and casting an alloy containing 1.0-3.0 wt % Ni, 0.02-0.15 wt % P. 0.5-2.0 wt. % Sn and, as an optional component, 0.01-2.0 wt % Zn, with the balance being Cu and incidental impurities, and with the ratio of weight percentages of Ni to P being within the range of 10-50%.
    Type: Grant
    Filed: March 24, 1993
    Date of Patent: June 21, 1994
    Assignees: Dowa Mining Co., Ltd., Yazaki Corporation, Nihon Bell Parts Co., Ltd.
    Inventors: Takayoshi Endo, Kenji Takenouchi, Mikio Nishihata, Toshio Asano, Akira Sugawara
  • Patent number: 5149499
    Abstract: A cooper base alloy and process having high electrical conductivity. An alloy consists of from 0.005 to 0.15% by weight Niobium, about 0.005 to 0.15% by weight Iron, 0.01 to 0.05% by weight phosphorus, and the balance copper.
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: September 22, 1992
    Assignee: Poongsam Corporation
    Inventors: Young G. Kim, Han I. Yoo, Sang K. Han, Deung Y. Lee