Abstract: In accordance with the present invention, a copper alloy wire having high strength and high conductivity is provided. The copper alloy wire is formed from a copper base alloy containing from 0.05 to 0.9 wt % magnesium and more than 15 ppm impurities in total. The wire has a single end diameter no greater than 0.10 inches, a tensile strength of at least 100 ksi, and an electrical conductivity greater than 60% IACS. A process for producing the copper wire of the present invention is also described.

Abstract: The present invention provides a method of modifying conductivity- and strength-related properties of a Cu—Ag alloy plate produced by predetermined annealing and cold rolling, composed of 4 to 32% by atom of Ag and Cu accounting for the balance, wherein the plate rolled at any reduction ratio is heated at different temperature levels, and strength and conductivity of the plate after the annealing are measured for each annealing temperature so as to establish the conductivity-annealing temperature curve and strength-annealing temperature curve as the correlations between annealing temperature and strength and between annealing temperature and conductivity, then, an optimum annealing temperature required to provide a desired conductivity or strength is determined by extrapolating the above-described conductivity-annealing temperature curve or strength-annealing temperature curve at the desired conductivity or strength, and the plate prepared at any reduction ratio is annealed at the optimum annealing temp

Abstract: The metallic material consists of an alloy including mainly Cu, Mo in an amount of 0.1 to 3.0% by weight and one or a plurality of elements selected from a group consisting of Al, Au, Ag, Ti, Ni Co and Si in a total amount of 0.1 to 3.0% by weight. In the metallic material, Mo is added to Cu so that Mo will be homogeneously mixed in a grain boundary of Cu, resulting in improvement of atmospheric corrosion resistance.

Abstract: The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing percentage of at least 5% and a processing rate of at least 100%/second. In particular applications the metallic material comprises one or more of aluminum, copper and titanium.

Abstract: In accordance with the invention, nanostructured metallic materials having high tensile strength and increased ductility are prepared by providing a metallic material, deforming the metallic material to form a plurality of dislocation cell structures, annealing the material at a temperature from about 0.3 to about 0.7 of its absolute melting temperature, and cooling the annealed metallic material. The result is a nanostructured metal or alloy having increased tensile strength as compared with the corresponding coarse-grained material and substantially greater ductility as compared with nanostructured material made by conventional processes. Using this process applicants have made nanostructured alloys with tensile strengths in excess of 1.5 Gpa and ductility greater than 1 per cent strain-to-failure. They have also made nanostructured metals with tensile strength in excess of 400 MPa and ductility in excess of 50% strain-to-failure.

Abstract: An ingot of a copper-base alloy containing a total of 0.

Abstract: The present invention relates to a cooling plate for use in the inner lining of metallurgical furnaces, especially smelting furnaces or shaft furnaces, and relates to a method for manufacturing a cooling plate. The cooling plate has a plate member, which is made of a copper material, and has integrated coolant channels. To manufacture the cooling plate, a raw ingot is provided, which is equipped with channels, and has a starting thickness that is greater than the final thickness of the plate member. The raw ingot is then deformed in a rolling step to reduce the starting thickness to the final thickness of the plate member and to deform the cross-sections of the channels. In this connection, the coolant channels obtain circularly oblong, final cross-sections.

Abstract: The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, silver in an amount from about 0.001 to about 0.1% by weight, iron in an amount from about 0.01 to about 0.25% by weight, and the balance copper and inevitable impurities. Preferably, the magnesium to phosphorous ratio is greater than 1.0. In a second embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, optionally silver in an amount from about 0.001 to about 0.1% by weight, at least one element selected from the group consisting of nickel, cobalt, and mixtures thereof in an amount from about 0.

Abstract: A process for making a copper base alloy comprises the steps of casting a copper base alloy containing tin, zinc, iron and phosphorous and forming phosphide particles uniformly distributed throughout the matrix. The forming step comprises homogenizing the alloy at least once for at least one hour at a temperature from 1000 to 1450° F., rolling to final gauge including at least one process anneal for at least one hour at 650 to 1200° F. followed by slow cooling, and stress relief annealing at final gauge for at lest one hour at 300 to 600° F.

Abstract: A method is provided for producing metallic platelets. By determining the ratio of the diameter of the metal source to the thickness of the metallic platelet and the workability of the metal source, a high quality metallic platelet can be developed. According to this method, the platelets that are produced can be used in such applications as building and construction materials for improved weather-resistance, heat-reflection/management, anti-fouling resistance and architectural appearance.

Abstract: The present invention provides a copper alloy, that includes an Sn content of 3 wt % to less than 4 wt %; a Ni content of 0.5 wt % to less than or equal to 1.0 wt %; a Zn content of 0.05 wt % to less than or equal to 5.0 wt %; and Cu and unavoidable impurities combined as the balance; wherein a total content of insolubles is less than or equal to 0.02 wt %. The present invention also relates to a method for producing the above-described copper alloy, which includes holding a copper alloy at a temperature ranging from 550 to 700° C. for a time period ranging from 5 sec to less than or equal to 5 min in the course of cold working; subsequently heat treating the copper alloy to cool the copper alloy to room temperature at a cooling speed of 5° C./sec or higher; subsequently cold working the copper alloy to a target dimension; and stabilizing annealing the copper alloy at a temperature ranging from 325 to 450° C. and a time period ranging from 5 sec to less than or equal to 180 min.

Abstract: The invention aims at providing high-strength copper alloy, especially phosphor bronze, with excellent bending workability. The excellently bendable high-strength copper alloy is obtained through grain size control whereby a finally cold rolled copper alloy with a tensile strength and 0.2% yield strength different by not more than 80 MPa is allowed to have characteristics such that its mean grain size (mGS) after annealing at 425° C. for 10,000 seconds is not more than 5 &mgr;m and the standard deviation of the mean grain size (&sgr;GS) is not more than ⅓XmGS. Improvements in characteristics presumably attributable to the synergistic effect of grain-boundary strengthening and dislocation strengthening are stably achieved by the adjustments of cold rolling and annealing conditions and by the study of the correlation between pertinent characteristic values after the final rolling.

Abstract: A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal/solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than possible in the past. The billet is especially useful for making electroplating anodes used in the damascene process for making copper interconnects in silicon wafers.

Abstract: The present invention provides a copper alloy, that includes an Sn content of 3 wt % to less than 4 wt %; a Ni content of 0.5 wt % to less than or equal to 1.0 wt %; a Zn content of 0.05 wt % to less than or equal to 5.0 wt %; and Cu and unavoidable impurities combined as the balance; wherein a total content of insolubles is less than or equal to 0.02 wt %. The present invention also relates to a method for producing the above-described copper alloy, which includes holding a copper alloy at a temperature ranging from 550 to 700° C. for a time period ranging from 5 sec to less than or equal to 5 min in the course of cold working; subsequently heat treating the copper alloy to cool the copper alloy to room temperature at a cooling speed of 5 ° C./sec or higher; subsequently cold working the copper alloy to a target dimension; and stabilizing annealing the copper alloy at a temperature ranging from 325 to 450° C. and a time period ranging from 5 sec to less than or equal to 180 min.

Abstract: An anode for use in electroplating semiconductor wafers, comprising a metal plate formed from a generally continuous casting process that is essentially free of voids or cracks, the casting being thermo-mechanically worked until the anode has an average grain size of less than 100 &mgr;m.

Abstract: Sputtering targets and methods of making sputtering targets are described. The method includes the steps of: providing a sputtering metal workpiece made of a valve metal; transverse cold-rolling the sputtering metal workpiece to obtain a rolled workpiece; and cold-working the rolled workpiece to obtain a shaped workpiece. The sputtering targets exhibits a substantially consistent grain structure and/or texture on at least the sidewalls.

Abstract: Improved targets for use in DC magnetron sputtering of nickel or like ferromagnetic face-centered cubic (FCC) metals are disclosed for forming metallization films having effective edge-to-edge deposition uniformity of 5%(3&sgr;) or better. Such targets may be characterized as having: (a) a homogeneous texture mix that is at least 20% of a <200> texture content and less than 50% of a <111> texture content, (b) an initial pass-through flux factor (LPTF) of about 30% or greater; and (c) a homogeneous grain size of about 200 &mgr;m or less.

Abstract: Copper and copper alloy comprises: a structure having fine crystal grains with grain size of 1 &mgr;m or less after a final cold rolling with a reduction &eegr;, wherein &eegr; is expressed in the following formula and satisfying &eegr;≧3; and an elongation of 2% or more in a tensile test.

Abstract: The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing percentage of at least 5% and a processing rate of at least 100%/second. In particular applications the metallic material comprises one or more of aluminum, copper and titanium.

Abstract: The invention includes a physical vapor deposition target composed of a face centered cubic unit cell metal or alloy and having a uniform grain size less than 30 microns, preferably less than 1 micron; and a uniform axial or planar <220> texture. Also described is a method for making sputtering targets. The method can comprise billet preparation; equal channel angular extrusion with a prescribed route and number of passes; and cross-rolling or forging subsequent to the equal channel angular extrusion.

Abstract: Processes for producing articles with stress-free edges which comprise slitting a copper or copper alloy sheet to provide strips of the copper material, heating the strips in a furnace at a temperature of 200-250° C. under a protective atmosphere, and cooling the strips to room temperature, the strips so produced being useful to make stamped articles.

Abstract: An object is to improve machinability and polishability of a brass material prepared through cold working, particularly in a brass pipe material. Before cold working, by having an &agr; phase making heat treatment step for increasing an area ratio of an &agr; phase, cold ductility can be ensured at the time of cold working. Also, after cold working, by having a &bgr; phase making heat treatment step for increasing an area ratio of a &bgr; phase, a brass material excellent in machinability and polishability can be provided.

Abstract: An ingot of a copper-base alloy containing a total of 0.

Abstract: The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing percentage of at least 5% and a processing rate of at least 100%/second. In particular applications the metallic material comprises one or more of aluminum, copper and titanium.

Abstract: Processes for producing articles with stress-free edges which comprise slitting a copper or copper alloy sheet to provide strips of the copper material, heating the strips in a furnace at a temperature of 200-250° C. under a protective atmosphere, and cooling the strips to room temperature, the strips so produced being useful to make stamped articles.

Abstract: Processes for preparing copper-INVAR-copper (CIC) for use in making chip packaging and the CIC created. One process comprises annealing a CIC section at a temperature in a range of 1475° F. to 1625° F. for a time in a range of 40 to 120 seconds. Another process includes heat treating a CIC section at a temperature in a range of 1275° F. to 1425° F. for a time in a range of 40 to 120 seconds. The above processes can be combined. The CIC section created exhibits unique electrical, physical, and mechanical properties.

Abstract: A heat sink substrate comprises a Cu—Mo composite substrate composed of a molybdenum (Mo) green compact with which Copper (Cu) of 20-60 wt % is impregnated. It is preferable that the heat sink substrate is a rolled plate obtained by repeatedly warm rolling or cold rolling the Cu—Mo composite substrate and that the rolled plate does not include any fine void and unevenly impregnated copper, that is, copper and molybdenum are uniformly distributed therein.

Abstract: Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.

Abstract: Copper trolley wire consisting essentially of at least 99.90% copper and at most 0.10% of a metal selected from the group consisting of silver, cadmium, tellurium, titanium, magnesium, manganese, chromium, zirconium, tin and combinations thereof, has a minimum tensile strength well exceeding that listed in ASTM Standard B47-95a for copper trolley wire. The copper trolley wire has a uniform fine grain size. The copper trolley wire is manufactured using a process of casting a copper rod of the appropriate composition, hot working or “conforming” the cast rod to reduce its diameter, and then cold working it to form the desired wire by drawing it through one or more dies. Preferably, no annealing step is used.

Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).

Abstract: A process for producing a fcc metal consisting of copper having random orientations comprising cross rolling which is performed to achieve a total draft of at least 20% with the rolling axis being offset at 15° or more in each pass to a total offset of at least 90°, and subsequent full annealing which is accompanied by recrystallization, the fcc metal satisfying the following relationships: I(200)/I(111)≦2.3 and I(220)/I(111)≦1.0, where I(111), I(200) and I(220) are the integral intensities of the (111), (200) and (220) faces, respectively, of crystal faces as measured by X-ray diffractiometry.

Abstract: This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

Abstract: A high-temperature, nickel-free alloy, in particular for spectacle frames, jewelry, etc. With the following composition in percentages by weight:Zn 3.0-7.0%Mn 8.0-13.0%Fe 0.5-3.5%Al 4.5-8.00Cu the remainder.

Abstract: High-strength, high-electroconductivity copper alloys are produced by preparing an ingot of a copper alloy containing 0.05-0.40 wt % Fe, 0.05-0.40 wt % Ni, 0.01-0.30 wt % P, and optionally a total of 0.03-0.50 wt % of either Sn or Zn or both and a total of 0.05-0.50 wt % of at least one element of Ag, B, Mn, Cr, Si, Ti or Zr, with the balance being Cu and incidental impurities, heating the ingot to 800.degree. to 950.degree. C. and hot working it by a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above to 300.degree. C. or below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched material at 380.degree. to 520.degree. C. for 60 to 600 minutes without performing cold working, and cold working and heat treating it at 450.degree. C. or below, to precipitate an Fe--Ni--P system intermetallic compound in the Cu matrix as uniform and fine grains not larger than 50 nanometers.

Abstract: The present invention provides a method of producing high-strength and high-conductance copper and silver materials comprising the steps of combining a predetermined ratio of the copper with the silver to produce a composite material, and melt spinning the composite material to produce a ribbon of copper and silver. The ribbon of copper and silver is heated in a hydrogen atmosphere, and thereafter die pressed into a slug. The slug then is placed into a high-purity copper vessel and the vessel is sealed with an electron beam. The vessel and slug then are extruded into wire form using a cold hydrostatic extrusion process.

Abstract: A method for producing copper alloy materials for molds for continuous steel casting and molds as produced by the method. The molds are highly resistant to thermal fatigue and are hardly cracked. To produce the materials, cast ingots of a copper-based chromium-zirconium alloy comprising from 0.2 to 1.5% by weight of Cr and from 0.02 to 0.2% by weight of Zr are heated at between 900.degree. C. and 1000.degree. C. for 30 minutes or longer and then rolled, while hot, at a reduction ratio of 60% or more to be at 850.degree. C. or higher at which the hot rolling is finished , and immediately after the hot rolling, these are rapidly cooled to 400.degree. C. or lower at a cooling rate of 10.degree.C./sec or more, and then aged at between 400.degree. C. and 520.degree. C. for from 1 hour to 5 hours.

Abstract: A method of enhancing the appearance of a polished surface of an artifact is provided in which the artifact is formed from a non-ferrous alloy, in particular, but not exclusively, a precious metal alloy, chosen to exhibit a martensitic and a parent phase structure. The surface, or relevant part thereof, is polished in one of the phases, usually the parent phase, followed by heat treatment to effect a phase transformation, generally to the martensitic phase. This phase change causes a visible surface effect to the polished surface which may be described as a spangle effect.

Abstract: The invention concerns a process and an apparatus for manufacturing soldering rods with a copper percentage of at least 60 weight-%. An extruder serves to convert a block of the alloy at a temperature between 540.degree. and 680.degree. C. into an individual wire of a maximum diameter of 10 mm. Upon emerging from the extruder, the wire is chilled to a temperature below 250.degree. C. and either intermediately stored or directly further processed. Immediately following a conductive heating to temperature between 200.degree. and 280.degree. C., the wire is fed to a multi-stage reducing mill where it is reduced by rolling in each stage by a maximum of 25% until it has reached its final cross section.

Abstract: A method of manufacturing an improved conductor wire, especially for use as wiring in audio/video devices is disclosed. The conductor consists of copper having a high purity of at least 99.9 wt. %. High purity copper starting material is formed as a rod which is then heat treated at a temperature in the range of 400.degree. C. to 700.degree. C. for 1 minute to 24 hours. The heat treated rod is then cold worked with a reduction in area of at least 65%. This method provides an electrical conductor wire which avoids irregularities of electron density and thereby eliminates phase differences in a high frequency signal, such as an audio or video signal, passing through the wire to obtain clear transmission and reproduction of an audio sound or video image. The method of the invention increases the residual resistance ratio of the conductor wire to at least 179 or by at least 20% as compared to a conventional conductor which is not heat treated according to the invention.

Abstract: A high-strength and high-conductivity copper alloy sheet is provided, which consists of a composition of from 6 to 24 wt. % Ag, and Cu and impurities as the balance, and has a sheet structure in which Cu solid solution and Ag solid solution are streched into a fiber shape.

Abstract: The present invention provides a new copper alloy containing silver from 4 to 32 at. %, which is useful for a magnet conductor, an IC lead frame, etc., having simultaneously a high strength and a high conductivity, manufactured by blending from 4 to 32 at. % silver into copper, casting, rapidly cooling and cold-working wherein the cold-working step includes a hot working treatment at a reduction rate of 40% to 70% at temperatures of from 300.degree. to 500.degree. C.

Abstract: Electric and electronic parts, including leadframes made of a copper-based alloy having high strength and high electric conductivity said copper-based alloy is produced by a process which comprises the steps of preparing a copper-based alloy consisting essentially of 0.01-3.0 wt % Co and 0.01-0.5 wt % P with the balance being Cu and incidental impurities, quenching said alloy from a temperature not lower than 750.degree. C. down to 450.degree. C. and below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched alloy at a temperature of 480.degree.-600.degree. C. for 30-600 minutes, cold working said alloy for a working ratio of 20-80%, further heat treating the alloy at a temperature of 440.degree.-470.degree. C. for 30-600 minutes, and subsequently performing cold working for a working ratio of at least 50% and heat treatment at 380.degree. C. and below. The electric and electronic parts preferably contain a plurality of conductive leads.

Abstract: Lead inclusion in copper-containing wrought alloys is coming into disfavor due to health and environmental considerations. Machinability, as well as retention of workability properties, associated with lead inclusion are assured by bismuth together with a modifying element, phosphorous, indium or tin, with such modifying element minimizes the workability-precluding embrittlement otherwise associated with bismuth. Fabrication of product dependent upon properties of the large variety of lead-containing alloys is so permitted by use of lead-free material.

Abstract: Copper-based alloys suitable for use as materials in fabricating electric and electronic parts as typified by leadframes and having high strength and high electric conductivity can be produced by a process which comprises the steps of preparing a copper-based alloy consisting essentially of 0.01- 3.0 wt % Co and 0.01- 0.5 wt % P with the balance being Cu and incidental impurities, quenching said alloy from a temperature not lower than 750.degree. C. down to 450.degree. C. and below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched alloy at a temperature of 480.degree.-600.degree. C. for 30-600 minutes, cold working said alloy for a working ratio of 20-80%, further heat treating the alloy at a temperature of 440.degree.-470.degree. C. for 30-600 minutes, and subsequently performing cold working for a working ratio of at least 50% and heat treatment at 380.degree. C. and below.

Abstract: A method of producing an electrical conductor is described. The electrical conductor is made of an oxygen-free copper material having an oxygen content of not more than 50 ppm, wherein copper crystals constituting the copper material are giant crystals. These giant copper crystals are formed by heating the copper material in an inert atmosphere maintained at a temperature exceeding 800.degree. C., but below the melting point of copper for at least 15 minutes.