Abstract: A system for buffing a cathode including a lifting assembly, a carriage assembly, and a buffing assembly. The lifting assembly is configured to transport the cathode in a substantially vertical direction while the carriage assembly secures the cathode. The buffing assembly is configured to buff the cathode as the cathode is transported in the substantially vertical direction. The buffing system provides for buffing both sides of a cathode simultaneously.

Abstract: A substrate cleaning device that includes a rotation holder and a cleaner. The rotation holder includes a rotator provided to be rotatable about a rotation axis, and a holder provided at the rotator to be capable of holding a substrate. The cleaner includes a cleaning tool provided to be capable of removing foreign matter on a back surface of the substrate by polishing, a mover that moves the cleaning tool while pressing the cleaning tool against the back surface of the substrate held by the holder, and a cleaning brush that further cleans the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning tool.

Abstract: Techniques for joining dissimilar materials in microelectronics are provided. Example techniques direct-bond dissimilar materials at an ambient room temperature, using a thin oxide, carbide, nitride, carbonitride, or oxynitride intermediary with a thickness between 100-1000 nanometers. The intermediary may comprise silicon. The dissimilar materials may have significantly different coefficients of thermal expansion (CTEs) and/or significantly different crystal-lattice unit cell geometries or dimensions, conventionally resulting in too much strain to make direct-bonding feasible. A curing period at ambient room temperature after the direct bonding of dissimilar materials allows direct bonds to strengthen by over 200%. A relatively low temperature anneal applied slowly at a rate of 1° C. temperature increase per minute, or less, further strengthens and consolidates the direct bonds.

Abstract: There is provided a substrate processing apparatus, including: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configured to supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.

Abstract: A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (107,207), and an ultra or mega sonic device (206,306). The chuck assembly is configured to receive and clamp a substrate. The at least one first nozzle (107,207) is configured to spray liquid onto the top surface of the substrate. The ultra or mega sonic device (206,306) is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate. A gap is formed between the ultra or mega sonic device (206,306) and the top surface of the substrate, and the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device (206,306) is filled with the liquid all the time during the cleaning process.

Abstract: A substrate cleaning apparatus for cleaning a substrate while rotating the substrate and placing a cleaning member in contact with the rotating substrate is disclosed. The substrate cleaning apparatus comprises: a self-cleaning member mounted to an arm supporting the cleaning member, the self-cleaning member being configured to come into contact with the cleaning member to perform self-cleaning of the cleaning member; and a moving mechanism mounted to the arm supporting the cleaning member, the moving mechanism being configured to move the self-cleaning member between a position where the self-cleaning member is in contact with the cleaning member and a position where the self-cleaning member is separated from the cleaning member.

Abstract: A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.

Abstract: An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.

Abstract: An outer peripheral end of a substrate is held with a plurality of chuck pins provided at a spin plate abutting against a plurality of portions of the outer peripheral end of the substrate, and the spin plate is rotated about a rotation axis. A cleaning head is moved by a head moving mechanism while being pressed against a back surface of the substrate held by the plurality of chuck pins by the head moving mechanism, and foreign matter on the back surface of the substrate is removed by polishing with the cleaning head. A reaction force against a load applied to the back surface of the substrate by the cleaning head is generated in the substrate by auxiliary pins. Alternatively, the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning head, is further cleaned by a cleaning brush.

Abstract: In a substrate processing method, a liquid film 30 of a processing liquid is formed on an upper surface of a substrate W, a gas which comprising vapor of a low surface tension liquid is sprayed to the liquid film 30 to form a liquid film-removed region 31. The liquid film-removed region 31 is expanded. A coolant 29 is supplied to a lower surface of the substrate W, while the liquid film 30 is cooled to a temperature lower than the boiling point of the low surface tension liquid, a heated gas is sprayed to selectively remove the coolant 29, and a range 33 in which the coolant 29 is removed is heated by a heated gas, by which the liquid film-removed region 31 on the upper surface of the substrate W is selectively heated to a temperature not less than the boiling point of the low surface tension liquid, and also a range which heats the liquid film-removed region 31 is expanded in synchronization with expansion of the liquid film-removed region 31.

Abstract: A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane.

Abstract: A substrate cleaning apparatus and related apparatuses/methods are disclosed. In one embodiment, a substrate cleaning apparatus includes: a first spindle group including a first driving spindle having a first driving roller configured to rotate a substrate and an idler spindle having a driven roller rotated by the substrate; a second spindle group including a plurality of second driving spindles each having a second driving roller configured to rotate the substrate; a cleaning mechanism configured to clean the substrate rotated by the first driving roller and the plurality of second driving rollers; and a rotation detector configured to detect the rotational speed of the driven roller. The driven roller is positioned on the opposite side to a direction in which the substrate receives a force from the cleaning mechanism.

Abstract: Disclosed is a liquid processing apparatus including: a plurality of substrate placement regions; a nozzle that supplies a processing liquid to a substrate from each processing position; a nozzle placement region provided behind a row of the substrate placement regions; an arm that detachably holds the nozzle at one end side; a driving unit that horizontally pivots the arm around a pivot axis; and a controller that outputs a control signal to convey the nozzle from the nozzle placement region to a standby position corresponding to a processing position of a conveyance destination, cause the nozzle to stand by at the standby position, and then, convey the nozzle to the processing position. The standby position is outside the substrate placement regions and is located between the processing position and the nozzle placement region when viewed in a front-and-rear direction.

Abstract: Various examples of a substrate cleaning apparatus and a substrate processing apparatus are described in the present disclosure. One example of the present invention is a substrate cleaning apparatus including a roll cleaning member cleaning a substrate, an inclination sensor detecting an inclination of the roll cleaning member, and an output device outputting a detection result of the inclination sensor.

Abstract: A substrate cleaning apparatus comprises: a cleaning member 11,21 that comes into contact with a substrate W and cleans the substrate W; a member rotating unit 15, 25 that rotates the cleaning member 11, 21; a pressing drive unit 19, 29 that presses the cleaning member 11, 21 against the substrate W; a torque detecting unit 16, 26 for detecting torque applied to the member rotating unit 15, 25; and a control unit 50 that controls pressing force on the basis of a result of detection by the torque detecting unit 16, 26.

Abstract: A pruner cleaning machine scrubs gummy sap and foreign matter from pruner blades inserted into its cleaning chamber. The machine includes a motor turning a drive shaft having scrubbers coupled thereon. The scrubbers have scrubbing surfaces facing each other and a scrubber barrel resides between the scrubbers. The motor is electronically controlled to provide adjustable regimens of duty cycles of scrubbing in forward and reverse directions and various speeds, and status lights may indicate power available, selected options, and in-process phases and completion of a cleaning regimen.

Abstract: A method for forming a beverage can end (34a) having ink jet markings (50a) on its tab (36a) comprises a step of applying ink via an ink jet to a surface of tab stock, wherein the tab stock surface is unlubricated and substantially free of factory lubricant. The method further includes a step of lubricating the tab stock after the step of applying ink, a step of forming the tab stock into tabs, and a step of combining the tabs with an end shell to from the beverage can end.

Abstract: A substrate cleaning device includes a rotation holder and a cleaner. The rotation holder includes a rotator provided to be rotatable about a rotation axis, and a plurality of holders provided at the rotator to be capable of abutting against a plurality of portions of an outer peripheral end of a substrate and holding the substrate. The cleaner includes a cleaning tool provided to be capable of removing foreign matter on a back surface of the substrate by polishing, a mover that moves the cleaning tool while pressing the cleaning tool against the back surface of the substrate held by the plurality of holders, and a reaction force generator that generates a reaction force in the substrate against a load applied to the back surface of the substrate by the cleaning tool.

Abstract: A method for the refinement of a panel and an apparatus for the refinement of a panel according to a method of this type. The method for the refinement of a panel includes: unpacking of a panel having a core made from wood material from a transport-safe packaging, a grounding in the form of at least one synthetic resin layer pressed together with the core and, if appropriate, a primer being arranged on a top side of the core, and a coating being arranged on a core underside lying opposite the top side of the core, and connection and locking means being attached to at least two mutually opposite side faces; application of a decorative layer having a decoration to the grounding or primer; and application of at least one wear layer to the decorative layer.

Abstract: A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.

Abstract: Apparatuses and methods for performing a post-CMP cleaning are provided. The apparatus includes a chamber configured to receive a wafer in need of having CMP residue removed. The apparatus also includes a spray unit configured to apply a first cleaning solution to at least one surface of the wafer. The apparatus further includes a brush cleaner configured to scrub the at least one surface of the wafer. In addition, the apparatus includes at least one inner tank disposed in the chamber for storing a second cleaning solution that is used to clean the brush cleaner.

Abstract: A solar panel cleaning brush assembly including a trolley frame having parallel first and second side frame members. A first guide member is connected to the first side frame member. A second guide member is connected to the second side frame member. A first belt rotatably disposed about a perimeter of the first guide member directly contacts a first array edge of a solar panel array. A second belt rotatably disposed about a perimeter of the second guide member directly contacts a second array edge of the solar panel array. At least one brush set is connected to the trolley frame, the at least one brush set having multiple fixed, non-rotating brushes each frictionally contacting and spanning across a module face of individual ones of multiple solar panel modules defining a solar panel array.

Abstract: A process and apparatus for cleaning a wafer, the wafer having a front side and a back side, are provided. The process begins with placing the wafer on a platform, and a first gas stream delivering in a direction from a center to an edge of the front side of the wafer. The first gas stream prevents liquid drops entering a work piece region on the front side of the wafer and protects the integrity of the integrated circuits. A cleaning brush is rinsed by a first liquid stream and contacting the edge of the wafer for cleaning the wafer. The cleaning brush scrubs unwanted residual materials from the edge of the wafer, and the first liquid stream flushes the cleaning brush to recover the cleaning ability.

Abstract: The present disclosure provides a method of cleaning a semiconductor wafer during a process of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side, wherein alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system. The disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface thereof. The predetermined region of the wafer at least partially overlaps with one or more alignment marks.

Abstract: A substrate cleaning apparatus 1 includes a cleaning member 2 that abuts on a substrate W to scrub and clean the substrate W, a holding member 6 that holds the cleaning member 2, an air cylinder 8 that generates force to press the cleaning member 2 against the substrate W, a displacement sensor 9 that measures a position of the holding member 6, and a control device 11 that determines the replacement time of the cleaning member 2 based on the position of the holding member 6. The position of the holding member 6 includes a cleaning position and a non-cleaning position. The control device 11 determines the replacement time of the cleaning member 2 from change in the cleaning position while a plurality of substrates W are continuously scrubbed and cleaned.

Abstract: A method and device for cleaning and pretreating solar panels is provided. The device comprises a brush having cleaning elements made from silicone foam rubber material. The cleaning elements can be flaps of silicone foam rubber material. A sheet of silicone foam rubber material having two free ends can be attached to a core member such that the two free ends extend away from the core member to form flaps. The solar panels can be cleaned by brushing the solar panel surfaces with the flaps of silicone foam rubber material. The solar panels can also be pretreated by brushing the solar panel surfaces with silicone foam rubber material.

Abstract: The present invention relates to a substrate cleaning apparatus for performing scrub cleaning of a surface of a substrate by rotating both of the substrate and a roll cleaning member while keeping the roll cleaning member in contact with the surface of the substrate.

Abstract: Embodiments of the present invention relate to roll polishers that may be utilized with rollers in rolling stands that have restrictive space requirements. The roll polisher of the present invention comprises a tube with pivot actuators used to engage and disengage a rolling pad on the surface of a roller. Transverse actuators may be located at least partially within the tube, or in other embodiments located outside of the tube, and used to move the tube, and thus, the rolling pad, transversely back and forth across the surface of the roller. The roll polisher may operate apply a force to the pad engaging the rolling surface to remove defects and smooth the surface of the polisher.

Abstract: A waste recycling mechanism is disposed on a film cutting machine and includes a fixing plate fixed to a cutting template of the film cutting machine, a pressing-head device disposed on the fixing plate, a tape, a tape reel and a collection device disposed on a platform of the film cutting machine. The tape is wound on the tape reel and is connected to the collection device after being wound on the pressing-head device. When the fixing plate moves downward with a cutting motion of the cutting template, the pressing-head device presses a film waste to make the tape attached to the film waste. When the fixing plate moves upward, the collection device reels in the tape to make a portion of the tape having the film waste separate from the pressing-head device and make a portion of the tape without any film waste wound on the pressing-head device.

Abstract: A polishing apparatus is provided with a machining head that is supported to freely move in two horizontal directions; driving devices that enables the machining head to move; a polishing jig that is supported by the machining head to freely move in a vertical direction; a polishing member that is mounted on a lower end portion of the polishing jig; an air cylinder polishing jig moving device that moves the polishing jig and is capable of pressing the polishing member against a tube support plate; and a drive motor that is capable of rotating the polishing jig, thus, simplification of the structure is made possible.

Abstract: A method of removing ink from a film includes unrolling the film from a first roll, exposing the film to a cleaning composition, and scraping the cleaning composition from the film. The film and the cleaning composition pass adjacent a first nonabrasive cloth to spread the cleaning composition over a width of the film, and adjacent at least one additional nonabrasive cloth to scrub the ink from the film. The film may be polymeric, metallic, or a metalized polymer. A system includes a means for unrolling a film, at least one nozzle configured to expose the film to a cleaning composition, and a blade configured to scrape the cleaning composition from the film. The system also includes a first nonabrasive cloth configured to spread the cleaning composition over a width of the film, and at least one additional nonabrasive cloth configured to scrub the ink from the film.

Abstract: A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer and dries the substrate. The substrate cleaning apparatus includes a process chamber having a substrate conveying unit configured to hold a substrate horizontally with its upper surface facing upwardly and to convey the substrate in one direction, and a cleaning unit configured to clean the surface of the substrate in non-contact state by supplying a cleaning liquid to the surface of the substrate which is moving in the process chamber. The substrate apparatus has an inert gas blowing unit configured to blow an inert gas toward the front and reverse surfaces of the substrate which has been cleaned in the cleaning unit to produce an inert gas atmosphere in the process chamber while drying the substrate with the inert gas.

Abstract: A power-brush apparatus has a housing and a brush rotatable on the housing about a brush axis and having bristles extending generally radially of the axis and having tips defining on rotation of the brush a circular orbit centered on the axis. The tips are engageable at a location with a workpiece surface. In accordance with the invention a blocking element is positioned radially inside the orbit immediately upstream from the location in a normal rotation direction of the brush. A drive rotates the brush in a working direction about the axis relative to the housing at a predetermined angular speed in the direction and thereby orbits the tips of the bristles about the axis such that the bristles engage the blocking element, are slowed thereby, and when released thereby snap back to accelerate forward and strike the workpiece at an augmented speed.

Abstract: Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.

Abstract: Provided is a buffer unit, which includes a frame including a base plate, a first vertical plate, and a second vertical plate, wherein the first and second vertical plates are spaced apart from each other on the base plate, a first buffer on which a photomask is placed, the first buffer being allowed to be reversed between the first and second vertical plates; and a plurality of driving parts disposed at outsides of the first and second vertical plates, and driving the first buffer to grip and reverse the photomask placed on the first buffer.

Abstract: A workpiece handling module including a first housing member and a second housing member pivotally movable relative to the first member forming a housing having an access side and a second side opposite the access side and side walls, a first portion of the side walls is carried by the first member and a second portion of the side walls is carried by the second member, and at least one of the first and second housing members includes at least one sealable opening for allowing ingress and egress of workpieces to and from an interior chamber formed by the first and second housing members in a closed configuration, and the second portion of the side walls adjacent the access side and carried by the second member is greater than the first portion of the side walls adjacent the access side and carried by the first member.

Abstract: A substrate processing apparatus is composed of an indexer block, a first processing block and a second processing block that are provided in parallel with one another. The indexer block is provided with an indexer robot. The first processing block is provided with a plurality of back surface cleaning units and a first main robot. The second processing block is provided with a plurality of end surface cleaning units, a plurality of top surface cleaning units and a second main robot.

Abstract: The present disclosure provides a cleaning unit for a chemical mechanical polishing (CMP) process. The cleaning unit comprises a cleaning solution; a brush configured to scrub a wafer during the CMP process; and a spray nozzle configured to apply the cleaning solution to the wafer when the brush scrubs the wafer during the CMP process. In some embodiments, the spray nozzle includes an inlet where the cleaning solution enters the spray nozzle and an outlet where the cleaning solution exits the spray nozzle. In some embodiments, an inlet area (A0) is different from an outlet area (A1).

Abstract: Among other things, one or more techniques or systems for particle removal from a semiconductor wafer are provided. Particles, contaminating a semiconductor wafer, have the potential to cause defects, such as scratches into a surface of the semiconductor wafer during chemical mechanical polishing or defocusing during a subsequent lithography stage, for the semiconductor wafer. Accordingly, a mechanic particle cleaner component, such as at least one of a sliver brush roller, a pencil brush, a tape polish, a sonic jet, or a liquid spray component, is configured to apply a mechanical force to an edge region of the semiconductor wafer to detach particles. A chemical particle cleaner component is configured to apply a chemical force to the edge region to detach particles. In this way, particles are removed from the semiconductor wafer before or after chemical mechanical polishing.

Abstract: A brush-cleaning apparatus is disclosed for use in cleaning a semiconductor wafer after polishing. Embodiments of the brush-cleaning apparatus implemented with a multi-branch chemical dispensing unit are applied beneficially to clean semiconductor wafers, post-polish, using a hybrid cleaning method. An exemplary hybrid cleaning method employs a two-chemical sequence in which first and second chemical treatment modules are separate from one another, and are followed by a pH-neutralizing-rinse that occurs in a treatment module separate from the first and second chemical treatment modules. Implementation of such hybrid methods is facilitated by the multi-branch chemical dispensing unit, which provides separate chemical lines to different chemical treatment modules, and dispenses chemical to at least four different areas of each wafer during single-wafer processing in an upright orientation.

Abstract: A device for removing a protective film off a sheet such as tickets or the like is described. The device has at least one removal or scraping roll of the protective film and at least one drawing or pulling roll of the sheet opposite the scraping roll and between which the sheet passes. The device also has a base and a roll unit mobile or removable with respect to the base and including the scraping roll and the drawing roll.

Abstract: In a semiconductor wafer manufacturing apparatus, a rotation module is provided to hold the semiconductor wafer at a plane. The semiconductor wafer is revolved by the rotation module around a first axis. The first axis is substantially perpendicular to the plane. A cleaning module is configured to revolve around a second axis when the cleaning module contacts the surface of the semiconductor wafer. A mechanism is further provided to enable the rotation module and/or the cleaning module to move along a direction substantially perpendicular to the first axis. Consequently, the relative velocities at the contact points between the semiconductor wafer and the cleaning module are changed. Moreover, no relative velocity at any contact point between the semiconductor wafer and the cleaning module is zero or close to zero.

Abstract: A vehicle for cleaning collector mirrors in solar thermal energy installations, includes an operating cab (2), a body (3) for housing and holding the different items, a rolling system for moving the vehicle, a clean water tank, an assembly for discharging the clean water, at least one structure for spraying clean water (100)) onto the surfaces of the mirrors (22) and a tray (46) for collecting the water used in cleaning the mirrors; a set of lifting columns (5, 6); and supports (53, 63) for the cleaning and/or drying assemblies able to slide along the lifting columns, and in which the cleaning assembly includes a structure fitted with a rigid bar (91), which assumes the profile of the mirror to be cleaned, the bar being provided with an external rotation assembly for a brush.

Abstract: A photomask cleaning device includes a stage, a fluid dispenser, a scrubbing unit, a cover and a fixing unit. The fluid dispenser includes a direct dispensing unit disposed correspondingly to the scrubbing unit, and an oblique dispensing unit obliquely spraying water onto a photomask. Majority of the particles can be removed with the combined application of the oblique dispensing unit and the scrubbing unit.

Abstract: An erasing device of one embodiment includes a conveyance unit that conveys a sheet; a pair of rotating brushes is provided corresponding to both side portions in a width direction perpendicular to a sheet conveyance direction of the sheet conveyed by the conveyance unit, the rotating brushes being provided to oppose to each other, nipping the conveyed sheet, the rotating brushes rotating in the same direction as the sheet conveyance direction such that a circumferential speed of the brush tip has a higher speed than a conveyance speed of the sheet, the rotating brushes rolling and correcting a corner fold portion which occurs on the sheet conveyed by the brush tip portion while rotating; and an erasing unit is provided downstream in the sheet conveyance direction than the rotating brush, the erasing unit erasing an image which is formed on the sheet.

Abstract: A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.

Abstract: A substrate cleaning method is used for performing scrub cleaning of a surface of a substrate. The substrate cleaning method includes rotating a roll cleaning member and a substrate respectively in one direction while keeping the roll cleaning member in contact with the substrate in a cleaning area, and supplying a cleaning liquid to a surface of the substrate to scrub-clean the surface of the substrate in the presence of the cleaning liquid in the cleaning area. The cleaning liquid is supplied initially to an inverse-direction cleaning area of the cleaning area where the relative rotational velocity between the roll cleaning member and the substrate is relatively high, and thereafter to a forward-direction cleaning area of the cleaning area where the relative rotational velocity between the roll cleaning member and the substrate is relatively low while the substrate makes one revolution on a central axis thereof.

Abstract: Among other things, one or more techniques and systems for cleaning a scrub brush of a scrubber utilized in semiconductor fabrication are provided. In particular, a charge modification element, such as a base pH material or ammonia, is applied to the scrub brush to modify a charge of a particle on the scrub brush to a modified charge. The modified charge of the particle is similar to a charge of the scrub brush, such that the particle and the scrub brush repel one another. The particle can be detached from the scrub brush utilizing various techniques such as a de-ionized water technique or a mechanical cleaning bar technique. In this way, one or more particles can be detached from the scrub brush to clean the scrub brush of particles so that the scrub brush can be used to clean a semiconductor wafer.

Abstract: The present invention relates to an apparatus and a method of fabricating a thin film transistor array substrate. The apparatus includes a dip strip part for stripping a photo-resist pattern and a thin film formed on a substrate by using a stripper; a removing part for removing residual photo-resist and thin film from the substrate; and a jet strip part for jetting the stripper to remove residual particles of photo-resist and thin film left on the substrate. The method of fabricating includes dipping a substrate in a stripper, wherein the substrate has a photo-resist pattern and a thin film, the thin film being formed on an entire surface of the substrate so as to cover the photo-resist pattern; removing residual photo-resist and thin film using the stripper; and removing particles of residual photo-resist and thin film left on the substrate.

Abstract: A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.