With Destruction Of Solid Transitory Material; E.g., Dissolving, Melting, Etc. Patents (Class 156/155)
  • Publication number: 20120298289
    Abstract: The present disclosure relates to a method for making a graphene/carbon nanotube composite structure. In the method, at least one graphene film is located on a substrate. At least one carbon nanotube layer is combined with the at least one graphene film located on the substrate to form a substrate/graphene/carbon nanotube composite structure. The at least one graphene film is in contact with the at least one carbon nanotube layer in the substrate/graphene/carbon nanotube composite structure. The substrate is removed from the substrate/graphene/carbon nanotube composite structure, thereby forming a graphene/carbon nanotube composite structure.
    Type: Application
    Filed: November 23, 2011
    Publication date: November 29, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., TSINGHUA UNIVERSITY
    Inventors: KAI-LI JIANG, XIAO-YANG LIN, LIN XIAO, SHOU-SHAN FAN
  • Publication number: 20120261296
    Abstract: A kit and method is disclosed to facilitate the transferring of a prosthetic appliance to the skin of a wearer. The kit includes first and second transfer portions, which may be provided in combined form. The first transfer portion includes a prosthetic appliance and a release film. The second transfer portion includes a transfer substrate, an adhesive layer and a release coat therebetween. The second transfer portion may include a seal layer disposed between the adhesive layer and the release coat. The kit may include a package portion which may non-adhesively restrain the other components so as to protect and display the prosthetic while enabling the package portion to be opened without causing damage to the remainder of the kit. A method for producing the kit is disclosed and involves the use of a cavity mold and respective retainer plate to produce the requisite transfer portions.
    Type: Application
    Filed: June 22, 2012
    Publication date: October 18, 2012
    Applicant: Tinsley Transfers, Inc.
    Inventor: Christien Tinsley
  • Patent number: 8282866
    Abstract: Three-dimensional models are produced using a sheet material made of water-soluble paper. Each layer of the sheet material is made severable along the contour lines of the three-dimensional model by discharging water onto each layer of the sheet material. A coloring solution is discharged when each layer is deposited to color the sheet material. After the deposition is completed, the unnecessary parts of the sheet material can be pulled away to complete the three-dimensional model. Alternatively, by discharging a setting solution onto each layer of the sheet material, each layer of the sheet material in the section of the three-dimensional model can be insolubilized, and a color setting solution can be discharged to color and set the colored parts. After the deposition is completed, the deposition can be immersed in water to remove the sheet material that was not insolubilized and complete the three-dimensional model.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: October 9, 2012
    Assignee: Seiko Epson Corporation
    Inventor: Noriaki Hiraide
  • Patent number: 8277588
    Abstract: Dissolving paper (22) covers pressure sensitive adhesive (20) on a mounting face (18) of an object (16) to be mounted on an exterior surface of a body panel (10) of a motor vehicle by a mechanical fastening system (24). The mounting is exposed to a water wash. Water begins to be absorbed by the dissolving paper through the edge of the paper's outer perimeter. As the paper increasingly absorbs water, it dissolves in the water exposing the adhesive which then adheres to the panel.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: October 2, 2012
    Assignee: International Truck Intellectual Property Company, LLC
    Inventors: Gayle Goodrich, Scott Watkins
  • Patent number: 8246888
    Abstract: A support material feedstock comprising a first copolymer and a polymeric impact modifier, where the first copolymer includes a first monomer unit comprising a carboxyl group and a second monomer unit comprising a phenyl group.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: August 21, 2012
    Assignee: Stratasys, Inc.
    Inventors: Paul E. Hopkins, William R. Priedeman, Jr., Jeffrey F. Bye
  • Patent number: 8241452
    Abstract: A reinforcement fibrous cord having excellent adhesive strength produced by impregnating a meshed cord fabric formed from warp yarns for reinforcement cords and weft yarns having a softening temperature or a melting temperature lower than any of the softening temperature, the melting temperature and the thermal decomposition-initiating temperature of the warp yarns, with adhesive agent, and heat-treating the fabric at the temperature equal to or higher than the softening or melting temperature of the weft yarn and lower than any of the softening temperature, the melting temperature and the thermal decomposition-initiating temperature of the warp yarns so that the weft yarns are self-broken while being fuse-adhered to the adhesive agent-impregnated warp yarns whereby projections caused by the broken residues of the weft yarns are formed on the warp yarns.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: August 14, 2012
    Assignee: Teijin Fibers Limited
    Inventors: Kenji Obora, Masashi Furukawa
  • Patent number: 8241456
    Abstract: A method for producing an electric-wave-transmissible transferring member capable of expressing a metallic luster pattern having a sharp outline. A peel layer (3) is formed on a base sheet (2) throughout the entire surface of the sheet. Next, a water-soluble pattern layer (4) is partially formed thereon. Next, an electric-wave-transmissible metallic luster layer (5) is formed thereon and throughout the entire surface thereof. Next, a protective layer (6) is formed thereon and throughout the entire surface thereof, or is formed thereon and, partially, in the region where the water-soluble pattern layer (4) is not formed. Next, the workpiece is subjected to a heating treatment and then a water-washing treatment to peel and remove the water-soluble pattern layer (4), and the electric-wave-transmissible metallic luster layer (5) and the protective layer (6) formed over the layer (4). Next, an adhesive layer (7) is wholly or partially formed on the workpiece.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: August 14, 2012
    Assignee: Nissha Printing Co., Ltd.
    Inventors: Hiromitsu Muko, Susumu Innan, Akihiro Maeda
  • Publication number: 20120193285
    Abstract: The present invention provides a resin porous membrane with an adhesive layer that exhibits excellent bonding precision and can be bonded to an adherend while maintaining the gas permeability of the porous membrane even when the porous membrane is small, and a method for producing the resin porous membrane with the adhesive layer. The present invention also provides the filter member including the resin porous membrane with the adhesive layer.
    Type: Application
    Filed: April 9, 2012
    Publication date: August 2, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yozo NAGAI, Kouji FURUUCHI, Miho YAMAGUCHI
  • Patent number: 8221825
    Abstract: A method for the local initial application of a thermal barrier coating layer (3), or for the local repair of coating defects and/or deteriorations of components (1) in the hot gas path of a gas turbine engine, which components are coated with a thermal barrier coating layer, includes at least the following steps: (I) in the case of repair, normally overall inspection of the whole component (1) for the determination of the location of defect/deterioration, as well as of corresponding type of defect/deterioration of each place for a multitude of locations of the component (1); (II) if needed, preparation of the surface in at least one location; (III) local application of a ceramic tissue together with a wet chemical thermal barrier coating layer deposition material for the formation of a patch (5) of ceramic matrix composite; (IV)a intermediate inspection of the patch and/or the surface; (IV)b in the case of a repetitive and/or multi-step repair method, subsequent layer application of a ceramic tissue togethe
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: July 17, 2012
    Assignee: ALSTOM Technology Ltd.
    Inventors: Daniel Reitz, Sophie Duval, Piero-Daniele Grasso, Alexander Stankowski, Fernando Manuel Santos Silverio
  • Patent number: 8221571
    Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: July 17, 2012
    Assignee: Brewer Science Inc.
    Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
  • Patent number: 8206546
    Abstract: A heat shield having a honeycomb core. The honeycomb core has a plurality of intersecting wall portions forming a plurality of cells. A strain compliant material is applied to the wall portions of the honeycomb core prior to filling of the cells with an ablative material. An ablative material at least substantially fills the cells of the honeycomb core.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: June 26, 2012
    Assignee: The Boening Company
    Inventors: James V. Tompkins, Chad M. Franks
  • Patent number: 8202934
    Abstract: Packaged viscoelastic compositions comprising viscoelastic copolymers and a packaging material are disclosed. The viscoelastic copolymers are urea copolymers, which are the reaction product of polyisocyanates and polyamines. The packaged viscoelastic compositions are hot melt processable.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: June 19, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Audrey A. Sherman, Craig E. Hamer, Donald H. Lucast, Thomas E. Augustine, Wendi J. Winkler
  • Patent number: 8202382
    Abstract: A method for manufacturing a micro movable element includes: forming a movable section, a frame, and a connecting section connecting the movable section with the frame on a substrate; bonding a film to a surface of the substrate in forming the movable section, the frame, and the connecting section; and patterning the film to form a support structure being bridged between the movable section and the frame.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: June 19, 2012
    Assignee: Fujitsu Limited
    Inventors: Norinao Kouma, Osamu Tsuboi, Yoshihiro Mizuno, Hiromitsu Soneda, Hisao Okuda, Tsuyoshi Matsumoto, Ippei Sawaki
  • Patent number: 8192571
    Abstract: Provided in some embodiments is a method that includes coupling portions of one or more members using at least one impact driven fastener. At least one impact driven fastener includes at least one penetrating portion formed of plastic, and at least one head portion having a heat deformation temperature less than about 250° F. Plastic of the penetrating portion provides the penetrating portion with a flexural strength greater than about 9500 psi. The method also includes applying heat to at least partially deform the head portion of at least one fastener.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: June 5, 2012
    Assignee: Utility Composites, Inc.
    Inventors: Pamela S. Tucker, Nancy Showers
  • Publication number: 20120048626
    Abstract: A cutting table includes a cutting surface, an opposing surface, a cutting table outer wall, and one or more fins. The cutting table outer wall extends from the circumference of the opposing surface to the circumference of the cutting surface. The fins extend from a portion of the cutting surface to a portion of the cutting table outer wall. The cutting table is optionally leached prior to forming the fins. One or more fins are positioned in parallel with at least another fin in some embodiments. In some embodiments, the fins are positioned circumferentially around the cutting surface. In some embodiments, the cutting table is coupled to a substrate to form a cutter. The fins are formed either after or during the formation of the cutting table.
    Type: Application
    Filed: August 24, 2010
    Publication date: March 1, 2012
    Applicant: Varel Europe S.A.S.
    Inventor: Federico Bellin
  • Patent number: 8101037
    Abstract: A microchip with capillaries and method for making same is described. A sacrificial material fills microchannels formed in a polymeric substrate, the filled microchannels are covered by a top cover to form filed capillaries, and the sacrificial material is removed to form the microcapillaries. The sacrificial material fills the microchannels as a liquid whereupon it becomes solid in the microchannels, and is liquefied after the top cover is applied and affixed to remove the sacrificial material. The top cover may be solvent sealed on the substrate and of the same or different material as the substrate. The top cover may also be an in situ applied semipermeable membrane.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: January 24, 2012
    Inventors: Adam T. Woolley, Ryan T. Kelly, Melissa Draper Fisk
  • Patent number: 8092628
    Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: January 10, 2012
    Assignee: Brewer Science Inc.
    Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
  • Publication number: 20110308707
    Abstract: A method of forming hollow fiber bundles includes the step of providing a mat having a plurality of hollow fibers forming a weft and a plurality of soluble fibers forming a warp. Each hollow fiber extends between a first side and an opposed second side of the mat. The mat is bundled so as to form a bundle with the first side of the mat defining a first end of the bundle and the second side of the mat defining a second end of the bundle. At least a portion of the bundle is potted so as to substantially fix a position of the hollow fibers relative to each other. The soluble fibers are at least partially dissolved so as to remove the soluble fibers from the bundle.
    Type: Application
    Filed: June 21, 2011
    Publication date: December 22, 2011
    Applicant: MedArray, Inc.
    Inventor: Jean Patrick Montoya
  • Patent number: 8080117
    Abstract: Asphalt cylinders or thermoplastic polymer modified asphalt cylinders or particulate forms are induction melted by magnetic field susceptor for a controlled distribution with felt paper to accomplish the construction of an industry standard BUR roofing system. These forms are similarly melted for highway crack sealing in an additional embodiment of the invention.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: December 20, 2011
    Inventor: Bernard Lasko
  • Patent number: 8080121
    Abstract: An adhesive agent layer for bonding a support plate (1) and a wafer (5) is in a three-layer configuration in which a hard layer (31) is sandwiched between soft layers (32) and (33) from above and below. Both the top and bottom surfaces of the adhesive agent layer are soft adhesive agent layers, which results in an excellent bonding affinity with the wafer 5 and the support plate (1). Accordingly, the peripheral portion of the wafer (5) can be prevented from being lifted before a dicing process. Further, because the sandwiched adhesive agent layer is the hard adhesive agent layer (31), even when the non-adhesive surface of the support plate (1) is vacuum suctioned, or when a pressure is applied from a grinder, the hard adhesive agent layer (31) is not deformed according to the soft adhesive agent layer (33) being drawn or pushed into through holes (2).
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: December 20, 2011
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventor: Yoshihiro Inao
  • Publication number: 20110290406
    Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
  • Publication number: 20110284152
    Abstract: A method of forming a temporary carrier structure is disclosed which includes forming a plurality of recesses in a carrier structure, the recesses extending to a depth that is less than a thickness of the carrier structure, forming a dissolvable material in the recesses and above a first surface of the carrier structure, securing a thin substrate above the first surface of the carrier structure using the dissolvable material to secure the thin substrate in place, performing at least one process operation on a second surface of the carrier structure to expose the dissolvable material in the recesses and contacting the exposed dissolvable material with a release agent so as to dissolve at least a portion of the dissolvable material.
    Type: Application
    Filed: April 25, 2011
    Publication date: November 24, 2011
    Inventor: Kyle Kirby
  • Publication number: 20110272086
    Abstract: A shaped body and a method for producing fibre composite components, wherein the shaped body is formed using a paper and/or cardboard material, at least in part. This makes possible cost-effective manufacture of hollow profiles of any desired length from fibre composite materials, in particular from prepreg materials and/or reinforcing fibre arrangements which are subsequently impregnated with a curable plastics material. The paper and/or cardboard material can be provided with further properties, such as gas-tightness and non-stick properties, by applying suitable functional layers. Moreover, the material makes it possible to produce highly dimensionally stable shaped bodies or support cores, in such a way that fibre composite components having highly reproducible spatial dimensions can be produced. In addition, after curing, the shaped bodies can be collapsed in a simple manner by applying a vacuum and thus removed from the fibre composite component without residues.
    Type: Application
    Filed: May 16, 2011
    Publication date: November 10, 2011
    Inventors: Ralf-Peter Dittman, Sebastian Kaschel, Lothar Engler
  • Publication number: 20110232832
    Abstract: Provided is a microfluidic valve, a method of manufacturing the microfluidic valve, and a microfluidic device that employs the microfluidic valve. The microfluidic valve includes a platform that includes two substrates combined facing each other; a channel having a first depth allowing a fluid to flow between the two substrates; a valve gap that is disposed on at least a region of the channel and has a second depth which is smaller than the first depth; and a valve plug that is disposed to fill the valve gap and is formed of a valve material made by mixing a phase change material, which is solid at room temperature, with a plurality of exothermic particles that emit an amount of heat sufficient to melt the phase change material by absorbing electromagnetic waves.
    Type: Application
    Filed: June 10, 2011
    Publication date: September 29, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-myeon PARK, Yoon-kyoung CHO, Beom-seok LEE, Jeong-gun LEE
  • Patent number: 8025752
    Abstract: A method of fabricating a conductive composite wherein at least one predetermined electrical access area of a conductive material is coated with a maskant. The conductive material is included in a composite ply lay-up which is cured and then the maskant is removed from the conductive material.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: September 27, 2011
    Assignee: Raytheon Company
    Inventors: William H. Fossey, Jr., Laura A. Cuthbert, Joseph A. Sarcione
  • Patent number: 8012594
    Abstract: A method of manufacturing a functional film by which the functional film formed on a film formation substrate can be easily peeled from the film formation substrate. The method includes the steps of: (a) forming a separation layer by using an inorganic material on a substrate containing a material having heat tolerance to a predetermined temperature; (b) forming a layer to be peeled containing a functional film, which is formed by using a functional material, on the separation layer; and (c) performing heat treatment on a structure containing the substrate, the separation layer and the layer to be peeled at the predetermined temperature so as to peel the layer to be peeled from the substrate or reducing bonding strength between the layer to be peeled and the substrate.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: September 6, 2011
    Assignee: Fujifilm Corporation
    Inventor: Yukio Sakashita
  • Publication number: 20110209816
    Abstract: A method for removing a carbonization catalyst from a graphene sheet, the method includes contacting the carbonization catalyst with a salt solution, which is capable of oxidizing the carbonization catalyst.
    Type: Application
    Filed: May 16, 2011
    Publication date: September 1, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaeyoung CHOI, Keun Soo KIM, Byung Hee HONG
  • Publication number: 20110206828
    Abstract: A resorbable tissue scaffold fabricated from bioactive glass fiber forms a rigid three-dimensional porous matrix having a bioactive composition. Porosity in the form of interconnected pore space is provided by the space between the bioactive glass fiber in the porous matrix. Strength of the bioresorbable matrix is provided by bioactive glass that fuses and bonds the bioactive glass fiber into the rigid three-dimensional matrix. The resorbable tissue scaffold supports tissue in-growth to provide osteoconductivity as a resorbable tissue scaffold, used for the repair of damaged and/or diseased bone tissue.
    Type: Application
    Filed: March 11, 2011
    Publication date: August 25, 2011
    Applicant: BIO2 Technologies, Inc.
    Inventors: James Jeng Liu, Janet L. Krevolin
  • Publication number: 20110198019
    Abstract: Inflatable medical devices and methods for making and using the same are disclosed. The inflatable medical devices can be medical balloons. The balloons can be configured to have a through-lumen or no through-lumen and a wide variety of geometries. The device can have a high-strength, non-compliant, fiber-reinforced, multi-layered wall. The inflatable medical device can be used for angioplasty, kyphoplasty, percutaneous aortic valve replacement, or other procedures described herein.
    Type: Application
    Filed: November 24, 2010
    Publication date: August 18, 2011
    Applicant: LOMA VISTA MEDICAL, INC.
    Inventors: Alexander Quillin TILSON, Mark Christopher SCHEEFF
  • Patent number: 7988807
    Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: August 2, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Kazuki Noda, Masaru Iwasawa
  • Patent number: 7972466
    Abstract: A process for manufacturing stiffened structures (11) in composite materials formed by an outer coating (13) and a plurality of stiffeners (15) the cross-section of which has a closed form delimiting an inner opening (23), comprising the following steps: a) Providing a shaping tool (31); b) Providing auxiliary male tools (37) with an inert material inside them coated with membranes suitable for curing c) Providing stiffeners (15) in fresh or cured condition; d) Arranging the stiffeners (15) in the tool (31) and the auxiliary male tools (37) in their inner openings (23); e) Laminating the outer coating (13); f) Curing the stiffened structure (11) with high temperature and pressure; g) Removing the auxiliary male tools (37) after reducing their volume by withdrawing the inert material thereof; h) Separating the cured stiffened structure (11) from the tool (31). The invention also relates to the auxiliary male tools.
    Type: Grant
    Filed: March 21, 2007
    Date of Patent: July 5, 2011
    Assignee: Airbus España, S.L.
    Inventors: Alberto Ramón Martínez Cerezo, Aquilino García García, Yolanda Miguez Charines, Patricia Tabares Fernandez
  • Publication number: 20110144766
    Abstract: The present invention provides a system, device, instruments and methods for inserting and/or improving the holding strength and purchase of a bone screw, bone pin, or bone dowel in bone. Embodiments include monolithic allograft tissue forms, multi-piece allograft tissue forms, distally expandable portions, partially and fully demineralized portions, and flexible connecting portions. Advantages of the allograft tissue forms of the present invention include improved pedicle screw blackout strength and improved filling of bone voids. Methods for making and instruments and techniques for inserting the augmentation device, system and screws or pins are also disclosed.
    Type: Application
    Filed: November 12, 2010
    Publication date: June 16, 2011
    Inventors: Shreedhar Kale, Dennis Chien, Robert Delurio, Curtis Compton
  • Patent number: 7955678
    Abstract: A linerless pressure-sensitive label uses a heat-activated, non-tacky dead coat to cover a pressure sensitive substratum. Upon heat activation, the dead coat melts and admixes with an underlying pressure-sensitive adhesive substratum thereby resulting in an exposed pressure-sensitive adhesive. The label can then be applied to packaging or an end product by pressing the adhesive side of the label to the packaging or end product similar to a conventional pressure-sensitive label, however, no silicone-coated release liner is required. The elimination of the silicone-coated release liner results in lower material costs, lower shipping costs and less waste.
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 7, 2011
    Assignee: Wausau Coated Products, Inc.
    Inventors: Christopher Paul Stogbauer, William Myles Reif
  • Publication number: 20110130844
    Abstract: The invention relates to an articular resurfacing implant which is characterized in that it is composed of a sheet (1) of pyrolytic carbon deposited on a graphite substrate and a layer (8) composed of an adhesive elastomer or polymer material adherent to the inner surface of the sheet (1) on the substrate side. The adhesive elastomer or polymer material layer (8) allows the implant to be adherent to bone (3) and acts as a shock absorber layer. In one embodiment the implant further comprises a hard material, e.g. metallic, sheet (4).
    Type: Application
    Filed: March 23, 2009
    Publication date: June 2, 2011
    Inventors: Yves-Alain Ratron, Michel Hassler
  • Publication number: 20110127581
    Abstract: The present invention relates to a support for the epitaxy of a layer of a material of composition AlxInyGa(1-x-y)N, where 0?x?1, 0?y?1 and x+y?1, having successively from its base to its surface; a support substrate, a bonding layer, a monocrystalline seed layer for the epitaxial growth of the layer of material AlxInyGa(1-x-y)N. The support substrate is made of a material that presents an electrical resistivity of less than 10?3 ohm·cm and a thermal conductivity of greater than 100 W·m?1·K?1. The seed layer is in a material of the composition AlxInyGa(1-x-y)N, where 0?x?1, 0?y?1 and x+y?1. The seed and bonding layers provide a specific contact resistance that is less than or equal to 0.1 ohm·cm?2, and the materials of the support substrate, the bonding layer and the seed layer are refractory at a temperature of greater than 750° C. or even greater than 1000° C. The invention also relates to methods for manufacturing the support.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 2, 2011
    Inventors: Jean-Marc Bethoux, Fabrice Letertre, Chris Werkhoven, Ionut Radu, Oleg Kononchuk
  • Patent number: 7942993
    Abstract: In a method, multilayer tailored fiber placement (TFP) preforms of any desired thickness may be easily produced without fixing threads or intermediate layers interfering. Reinforcing fibers are sewn onto a substrate using a chemically or thermally meltable fixing thread thus resulting in the formation of a reinforcing fiber structure. The fixing thread firstly serves to fix the reinforcing fibers on the substrate and is subsequently melted so that the fixing thread disintegrates while pre-fixing the reinforcing fibers and may not influence the mechanical properties of the reinforcing fiber structure.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: May 17, 2011
    Assignee: EADS Deutschland GmbH
    Inventors: Andreas Gessler, Juergen Filsinger
  • Patent number: 7931769
    Abstract: A method of forming a temporary carrier structure is disclosed which includes forming a plurality of recesses in a carrier structure, the recesses extending to a depth that is less than a thickness of the carrier structure, forming a dissolvable material in the recesses and above a first surface of the carrier structure, securing a thin substrate above the first surface of the carrier structure using the dissolvable material to secure the thin substrate in place, performing at least one process operation on a second surface of the carrier structure to expose the dissolvable material in the recesses and contacting the exposed dissolvable material with a release agent so as to dissolve at least a portion of the dissolvable material.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: April 26, 2011
    Assignee: Micron Technology, Inc.
    Inventor: Kyle Kirby
  • Publication number: 20110086222
    Abstract: In one embodiment, a selectively-releasable adhesive includes a copolymer formed from a multifunctional alcohol, a multifunctional carboxylic acid, and a glycosaminoglycan (GAG). In one embodiment, an adhesive article includes a backing material having a surface and a layer of adhesive provided on the surface, the adhesive layer having an outer surface opposite to a surface that contacts the backing material, the outer surface being at least partly composed of a copolymer formed from a multifunctional alcohol, a multifunctional carboxylic acid, and a glycosaminoglycan (GAG).
    Type: Application
    Filed: October 12, 2009
    Publication date: April 14, 2011
    Inventors: Howard S. Rosing, Yadong Wang
  • Patent number: 7896997
    Abstract: A composite sheet used for artificial leather with low elongation and excellent softness which includes a non-woven fabric layer, a woven or knitted fabric layer and a polyurethane resin, wherein the non-woven fabric layer and the woven or knitted fabric layer are entangled with each other.
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: March 1, 2011
    Assignee: Kolon Industries Inc.
    Inventors: Young-Nam Hwang, Won-Jun Kim, Jae-Hoon Chung
  • Publication number: 20110005663
    Abstract: A meted of durably grafting a decorated fabrics to a cotton cloth such as jeans or denim is comprised of; 1) first step of printing a pattern with first stencil on a clothes that covers a supporting plate of an automatic printing machine, 2) second step of pasting an alkali solution along the outer line of the pattern on the clothes with second stencil, 3) third step of pasting a grafting glue along the outer line of the pattern that is printed on the clothes, 4) fourth step of pasting a water-soluble glue on one side a fabric, 5) fifth step of pasting a burn out gel on the fourth stencil that is overlapped over the fabric attached clothes, 6) sixth step of taking out the fabric attached clothes from the supporting plate of the automatic printing machine and drying the fabric attached clothes on a dryer at 160° C. over 2 minutes, 7) seventh step of heating and pressing the fabric attached clothes between a heating press and press longer than 5 seconds at 160° C.
    Type: Application
    Filed: November 25, 2008
    Publication date: January 13, 2011
    Inventor: Inkyun Kim
  • Patent number: 7833368
    Abstract: In a method for making a window covering the user selects a first segment of cellular material in which there is a top cell having a top surface, at least one glue line on the top surface and a strip of fabric on the at least one glue line. The strip of fabric and at least a portion of the glue line are removed from the top surface of the top cell. and a second glue line is applied to that top surface. A second segment of cellular material is place over the second glue line on the top surface of the top cell of the first segment. The glue line cures and bonds the second segment of cellular material to the first segment of cellular material. If the cellular material has tabbed cells the processes can be used to join the tabs of the two segments together.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: November 16, 2010
    Inventors: Ren Judkins, John D. Rupel
  • Patent number: 7803241
    Abstract: A pressure vessel and method for producing a pressure vessel is disclosed. The pressure vessel comprises a liner shell fabricated from composite material applied to a soluble mandrel having a body shaped to pattern an interior of the pressure vessel, the liner shell having an opening, a boss having an aperture therethrough, the boss sealingly bonded to the liner shell with the aperture adjacent the opening, and an outer shell fabricated from plies of composite material filament impregnated with matrix material wound over the liner shell and the boss, but not over the aperture.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: September 28, 2010
    Assignee: Microcosm, Inc.
    Inventors: Roy S. Cundiff, Aaron S. Leichner
  • Publication number: 20100206623
    Abstract: To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substantially comprising a heat-curable epoxy resin, a latent curing agent, and organic elastic fine particles of an average particle size of approximately 1 ?m or less, a film being formed by aggregation of the organic elastic fine particles, is provided.
    Type: Application
    Filed: October 6, 2008
    Publication date: August 19, 2010
    Inventors: Kohichiro Kawate, Hiroko Arita, Hideaki Yasui, Yoshiaki Sato
  • Publication number: 20100206465
    Abstract: A method of fabricating a conductive composite wherein at least one predetermined electrical access area of a conductive material is coated with a maskant. The conductive material is included in a composite ply lay-up which is cured and then the maskant is removed from the conductive material.
    Type: Application
    Filed: February 18, 2009
    Publication date: August 19, 2010
    Inventors: William H. Fossey, JR., Laura A. Cuthbert, Joseph A. Sarcione
  • Publication number: 20100163161
    Abstract: A process for making an absorbent garment comprises providing one or more panels that comprise an elastomeric film laminate. A region of the laminate panel is deactivated to create a deactivated region. An absorbent insert comprising an absorbent member is provided. The absorbent insert is attached to the panel, such that a portion of the absorbent member overlaps at least a portion of the deactivated region. Front and back laminate regions can be part of a single integral panel, or can be comprised of separate and longitudinally spaced-apart laminate panels.
    Type: Application
    Filed: December 30, 2008
    Publication date: July 1, 2010
    Inventors: Eric-John Raoul Gilgenbach, Stephen Carl Baumgartner, Suzanne M. Schmoker, Sara J. Stabelfeldt, Frederique Vignali
  • Publication number: 20100154734
    Abstract: In one aspect, the present disclosure is directed to a method of making a coated article. The method may include forming a sacrificial substrate in a predetermined shape corresponding with the shape of a final substrate. The method may also include applying a thermal spray coating to the sacrificial substrate. In addition, the method may include separating the thermal spray coating from the sacrificial substrate to obtain a formed sheet of coating material and affixing the formed sheet of coating material to a surface of the final substrate using an adhesive.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 24, 2010
    Inventors: Jason L. Sebright, M. Brad Beardsley, Ondrej Racek
  • Publication number: 20100145380
    Abstract: A method is provided for applying a cover layer (9) to a net structure (4) to be used for medical purposes, in particular a thrombosis filter. The net structure (4) is applied to a planar substrate (1) that covers openings (5) of the net structure on one side, wherein the openings (5) across the uncovered side are filled with a sacrificial material (7), in particular copper. The net structure (4) is lifted from the substrate (1). A cover layer (9) is deposited on the surface previously covered by the substrate, and the sacrificial material (7) is removed.
    Type: Application
    Filed: August 24, 2007
    Publication date: June 10, 2010
    Applicant: ACANDIS GMBH & CO. KG
    Inventors: Eckhard Quandt, Christiane Zamponi, Clemens Schmutz
  • Publication number: 20100133419
    Abstract: A method for manufacturing an electronic element wafer module is provided, the method comprising: a protective resin film forming step of forming a protective resin film on only light openings of the plurality of wafer-shaped optical elements; a light shielding film forming step of filming a light shielding film on an area except for the light openings or an entire area including the light openings; and an optical aperture forming step of removing the protective resin film, or removing the protective resin film and a light shielding film material on the protective resin film, to form an optical aperture structure by the light shielding film at the light openings.
    Type: Application
    Filed: December 1, 2009
    Publication date: June 3, 2010
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Aiji SUETAKE
  • Publication number: 20100116417
    Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
    Type: Application
    Filed: January 22, 2010
    Publication date: May 13, 2010
    Inventor: William S. Cheung
  • Publication number: 20100104878
    Abstract: A bonding method includes forming a bonding film on a surface of a base member by plasma polymerization, the bonding film including an Si skeleton of a random atomic structure including a siloxane (Si—O) bond and leaving groups binding to the Si skeleton; applying UV light to the bonding film to eliminate the leaving groups at the surface of the bonding film from the Si skeleton so as to provide adhesion properties to the bonding film, an accumulated amount of the UV light being adjusted to control a refractive index of the bonding film; and bonding the base member and an object together via the bonding film to obtain a bonded structure.
    Type: Application
    Filed: October 26, 2009
    Publication date: April 29, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yasuhide MATSUO, Kenji OTSUKA, Takenori SAWAI