Plural Superimposed Laminae Transferred Patents (Class 156/239)
  • Patent number: 10319890
    Abstract: In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: June 11, 2019
    Assignee: COOLEDGE LIGHTING INC.
    Inventors: Michael A. Tischler, Alborz Amini
  • Patent number: 10252499
    Abstract: A process includes forming a transfer film without a release layer in which the transfer film includes a substrate layer to be peeled off during a transfer process, and a transfer layer to be transferred to an article to be decorated. The transfer layer has a protective layer, a printed or vapor-deposited decorative layer, and an adhering layer, which are laminated in this order. The substrate layer is a base film of a synthetic resin formed by extruding a molten synthetic resin. The substrate layer is so laminated and thermally compressed in direct contact with the protective layer such that the substrate layer does not peel off the protective layer before the transfer process and peels off the protective layer from a peeled end portion of the substrate layer as a trigger during the transfer process, by thermally pressing the substrate layer and the protective layer between rolls.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: April 9, 2019
    Assignee: YOSHINO KOGYOSHO CO., LTD.
    Inventors: Eiichi Takahashi, Nobuhiro Koga, Yasuyuki Imaizumi
  • Patent number: 10228086
    Abstract: A portable assembly for securing a plastic fitting to a plastic pipe by employing fusion or thermal sealing is disclosed. The assembly is secured to the outer circumference of a plastic pipe at a desired location. The assembly can be secured at any longitudinal and lateral position along a plastic pipe. A heater heats both the pipe and the fitting to the point where they begin to melt. The heater is then removed and the fitting is pressed onto the surface of the pipe, thus fusing the fitting to the pipe. After cooling, the assembly is removed and the surface of the pipe within the interior of the fitting is drilled or removed. This now enables fluid within the pipe to be sent to the fitting and onto distribution lines which are connected to the fitting.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: March 12, 2019
    Assignee: HDPE Solutions, LLC
    Inventor: Christopher A. Menno
  • Patent number: 10154665
    Abstract: A test tube, suitable to be immersed in a cryogenic fluid, comprises a containing body having a perimeter wall that defines a containing compartment, a bottom wall, disposed inside the latter to close it at the lower part, and a housing seating, inside the perimeter wall and outside the containing compartment. A support element for an identification code is suitable to be inserted into the housing seating, with at least a free surface facing toward the outside of the housing seating on the opposite side with respect to the bottom wall. In correspondence to said housing seating, mechanical constraint means are provided in cooperation with said perimeter wall of the containing body and with a peripheral portion of the free surface of the support element, in order to constrain the latter in a defined axial position with respect to the containing body.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: December 18, 2018
    Assignee: BIOSIGMA SRL
    Inventors: Dominique Charles Joseph Dutscher, Martino Marcolin, Francesco Tamiazzo, Valter Veronese
  • Patent number: 9945070
    Abstract: A process of manufacturing an artificial leather in one embodiment includes adhering a substrate onto a release cloth; flocking the substrate to form fur thereon; applying a synthetic resin to the substrate and drying same to form a half-finished artificial leather; foaming the half-finished artificial leather to fill interstices of the fur with the synthetic resin; sanding the half-finished artificial leather to remove excessive synthetic resin from the half-finished artificial leather; coloring the half-finished artificial leather to form a velvet-like surface; and removing the release cloth from the half-finished artificial leather to produce a finished artificial leather.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: April 17, 2018
    Inventors: Mao-Yen Wang, Tzu-Te Liu
  • Patent number: 9688060
    Abstract: A composite is produced by providing a first and a second joining partner, a connecting means, a sealing means, a reactor having a pressure chamber, and a heating element. The two joining partners and the connecting means are arranged in the pressure chamber such that the connecting means is situated between the first joining partner and the second joining partner. A gas-tight region is then produced, in which the connecting means is arranged. Afterward, a gas pressure of at least 20 bar is produced in the pressure chamber outside the gas-tight region. The gas pressure acts on the gas-tight region and presses the first joining partner, the second joining partner and the connecting means together. The joining partners and the connecting means are then heated by means of the heating element to a predefined maximum temperature of at least 210° C. and then cooled.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: June 27, 2017
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Bayerer, Olaf Hohlfeld
  • Patent number: 9613928
    Abstract: An apparatus and a method for chip-to-wafer integration is provided. The apparatus includes a coating module, a bonding module and a cleaning module. The method includes the steps of placing at least one chip on a wafer to form an integrated product, forming a film on the integrated product, such that the integrated product is substantially fluid-tight, and exerting a predetermined positive pressure on the film during permanent bonding of the at least one chip to the wafer. The method further includes the step of removing the film from the integrated product after permanent bonding of the at least one chip to the wafer.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: April 4, 2017
    Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventor: Sunil Wickramanayaka
  • Patent number: 9592693
    Abstract: The process for decorating the surface of a substrate comprises the stages of printing a three-dimensional decorative pattern on one surface of a polymer film using resin, placing the decorated surface of the film and at least one surface of the substrate in contact and providing thermal energy thereto, and detaching the film from the substrate onto the surface of which the three-dimensional decorative pattern has been transferred.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: March 14, 2017
    Assignee: MIROGLIO TEXTILE S.r.l.
    Inventor: Simone Priante
  • Patent number: 9266315
    Abstract: A separating apparatus for separating a composite substrate into a first substrate and a second substrate previously bonded to each other. The separating apparatus includes a support base having a supporting surface for supporting the composite substrate, a pair of side surface supporting rollers for supporting the peripheral side surface of the composite substrate placed on the supporting surface, and a separating unit for applying a separating force to the boundary between the first substrate and the second substrate constituting the composite substrate supported to the supporting surface of the support base and the side surface supporting rollers, thereby separating the composite substrate into the first substrate and the second substrate.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: February 23, 2016
    Assignee: Disco Corporation
    Inventor: Kentaro Iizuka
  • Patent number: 9023167
    Abstract: A process for coating a substrate comprising the sequential steps of (a) providing a transfer sheet provided with a printed powder coating, (b) applying the transfer sheet onto the substrate with the powder coating in contact with the substrate, (c) removing the transfer sheet from the powder coating and (d) curing the powder coating on the substrate.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: May 5, 2015
    Assignee: Akzo Nobel Coatings International B.V.
    Inventor: Kevin Jeffrey Kittle
  • Publication number: 20150090395
    Abstract: A touch panel is formed by firstly forming a film layer on a first plate, and next, sequentially forming a buffer layer on the film layer, forming a sensing layer on the buffer layer, forming a second plate on the sensing layer. After the foregoing formation procedures, the first substrate layer is removed from the film layer. Next, a cover is attached to the film layer. In this way, the film layer is located between the cover and the buffer layer. Finally, the second substrate layer is removed from the sensing layer, so as to form a touch panel with the features of light weight, thin thickness and low costs.
    Type: Application
    Filed: September 12, 2014
    Publication date: April 2, 2015
    Inventors: Ching-Shan Lin, Chunyan Wu, Lianjie Ji, Fang Fang
  • Patent number: 8974879
    Abstract: There is provided an image transfer sheet, including: an image receiving layer; a bonding layer; a transparent support; and a substrate, in this order, wherein a peeling strength between the transparent support and the substrate is lower than a peeling strength between the image receiving layer and the bonding layer, and between the bonding layer and the transparent support.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: March 10, 2015
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Tomoo Kobayashi, Naoyuki Egusa, Tetsuro Kodera, Kaoru Torikoshi
  • Publication number: 20150047085
    Abstract: A method for fabricating organic photovoltaic-based electricity-generating military pilot equipment, including flight suits, helmets, helmet visors, and related equipment is described. In particular, a method for fabricating such equipment utilizing lamination of highly flexible organic photovoltaic films is described. High-throughput and low-cost fabrication options also allow for economical production.
    Type: Application
    Filed: June 27, 2014
    Publication date: February 19, 2015
    Applicant: NEW ENERGY TECHNOLOGIES, INC.
    Inventors: John Anthony CONKLIN, Scott Ryan HAMMOND
  • Patent number: 8945328
    Abstract: Methods of forming garments having one or more stretchable conductive ink patterns. Described herein are method of making garments (including compression garments) having one or more highly stretchable conductive ink pattern formed of a composite of an insulative adhesive, a conductive ink, and an intermediate gradient zone between the adhesive and conductive ink. The conductive ink typically includes between about 40-60% conductive particles, between about 30-50% binder; between about 3-7% solvent; and between about 3-7% thickener. The stretchable conductive ink patterns may be stretched more than twice their length without breaking or rupturing.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: February 3, 2015
    Assignee: L.I.F.E. Corporation S.A.
    Inventors: Gianluigi Longinotti-Buitoni, Andrea Aliverti
  • Patent number: 8932425
    Abstract: The invention relates to a method and a transfer strip for decorating surfaces, in particular for decorating outer packagings. A transfer strip comprising a strip-like backing film (11), a decorative layer (13) and a release layer (12) arranged between the decorative layer (13) and the backing film is provided. The decorative layer (13) has a multiplicity of identical optically variable decorative elements, which are arranged in first area regions, which are separate from one another and spaced apart from one another in the longitudinal direction of the transfer strip. The decorative layer (13) has second area regions, which are separate from one another and spaced apart from one another in the longitudinal direction of the transfer strip and in which the decorative layer (13) has one or more individualizable layers for providing respectively different machine-readable optical markings.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: January 13, 2015
    Assignee: Leonhard Kurz Stiftung & Co. KG
    Inventors: Norbert Lutz, Walter Kurz, Ludwig Brehm, Hans Peter Bezold
  • Patent number: 8916013
    Abstract: The present invention relates to a method for transferring graphene using a hot press, comprising: a step of contacting graphene, having a thermal-releasable sheet attached thereto, with a target substrate; and a step of pressing and heating the graphene having the thermal-releasable sheet attached thereto and the target substrate using the upper press and lower press of a hot press so as to separate the thermal-releasable sheet and the graphene and transfer the separated graphene to the target substrate. The present invention also relates to a graphene-transfer hot press apparatus for said transfer process.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: December 23, 2014
    Assignee: Graphene Square, Inc.
    Inventors: Byung Hee Hong, Jae Boong Choi, Youngjin Kim, Keun Soo Kim, Junmo Kang, Hyeongkeun Kim
  • Patent number: 8911581
    Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: December 16, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Ju-Chen Chiu, Chien-Min Chang, Po-An Lin, Chih-Hua Liu, Hao-Ying Chang
  • Publication number: 20140345794
    Abstract: Disclosed herein is a transfer printing technology. A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. In situ alignment of a transfer layer is performed by the pillar structures and a structural confinement by a concave structure formed on a bottom surface of the transfer layer corresponding to the pillar structures, or a chemical bond of the pillar structure and the transfer layer. In the in situ alignment by the structural confinement, the remaining sacrificial layer after being removed may serve as an adhesive component. The transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemic bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate.
    Type: Application
    Filed: December 30, 2013
    Publication date: November 27, 2014
    Applicant: GWANGJU INSTITUTE OF SICENCE AND TECHNOLOGY
    Inventors: Heung Cho KO, Su Ok YUN, Jeong Pil PARK, Suk Ho KIM, Young Kyu HWANG, Yujun HYUN, Hun Soo JANG, Yun Kyung JEONG
  • Publication number: 20140332148
    Abstract: A laminate donor element can be used to transfer a composite of a metal grid and an electronically conductive polymer to a receiver sheet for use in various devices. The laminate donor element has a donor substrate, a metal grid that is disposed over only portions of the donor substrate, leaving portions of the substrate uncovered by the metal grid, and an electronically conductive polymer that covers the portions of the donor substrate that are uncovered by the metal grid. The composite of metal grid and electronically conductive polymer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature. The resulting article has a substrate on which a reverse composite of the metal grid and electronically conductive polymer is disposed, which article can be incorporated into various devices.
    Type: Application
    Filed: July 14, 2014
    Publication date: November 13, 2014
    Inventors: Debasis Majumdar, Roger Lee Klaus, Michael J. Corrigan
  • Patent number: 8790482
    Abstract: An exterior film for a home appliance includes a cut portion formed by half-cutting corresponding to a see-through portion formed at an exterior part of the home appliance. After the exterior film is adhered, the cut portion is removed along with removal of a sub adhesive protection film. Accordingly, operability and productivity during manufacturing of the exterior film are improved.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: July 29, 2014
    Assignee: LG Electronics Inc.
    Inventors: Hyungi Jung, Minju Son, Kyungdo Kim, Hyunwoo Jun
  • Patent number: 8778112
    Abstract: A method for bonding a thin film piece includes: forming a support layer on each upper face of a plurality of thin film pieces; fixing the plurality of thin film pieces to a first substrate through a temporary fixing layer provided on a lower face of the first substrate so that the temporary fixing layer contacts with the upper face and at least a part of a side face of each support layer; bonding a lower face of the plurality of thin film pieces to a second substrate; and removing the first substrate from the plurality of thin film pieces by removing at least one of the support layer and the temporary fixing layer.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: July 15, 2014
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Akira Furuya
  • Patent number: 8741087
    Abstract: A method and apparatus are provided which include providing a rotatable roller with a cylindrical surface adapted to wrap the donor element on the surface. A donor element is secured to the roller and a first portion of the donor element is wrapped onto the cylindrical surface while applying tension to the media. The tension is then decreased to alter a region of contact between the first portion of the donor element and the cylindrical surface. An additional portion of the donor element is then wrapped onto the cylindrical surface. The donor element is then transferred from the roller to a substrate.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: June 3, 2014
    Assignee: Kodak Graphic Communications Canada Company
    Inventors: Jeremias Rarama, Yuri Zavorotny, Darcy T. Montgomery
  • Publication number: 20140116607
    Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.
    Type: Application
    Filed: June 11, 2013
    Publication date: May 1, 2014
    Inventors: Ju-Chen CHIU, Chien-Min CHANG, Po-An LIN, Chih-Hua LIU, Hao-Ying CHANG
  • Patent number: 8709192
    Abstract: The invention relates to a protective cover sheet comprising a low birefringence protective polymer film and a layer that promotes adhesion to poly(vinyl alcohol), the protective cover sheet comprising at least one functional layer containing a UV-absorbing polymer.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: April 29, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yongcai Wang, Hwei-Ling Yau, Timothy J. Hubert, Alain E. Gros, Timothy C. Schunk, Paul M. Hoderlein
  • Patent number: 8679277
    Abstract: A method is provided that includes peeling at least one carrier strip away from an adhesive layer of an adhesive article. The adhesive article includes a flexible substrate with the adhesive layer thereon, wherein the adhesive layer remains mounted to the flexible substrate of the adhesive article after the carrier strip is peeled away, wherein the adhesive article is operative to disintegrate when submerged in water. The method also includes using the adhesive article to adhesively mount a cloth or paper napkin to clothing being worn by a person. The carrier strip or adhesive article may include advertising and/or a coupon printed thereon, which may be taken away by the person after the meal.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: March 25, 2014
    Inventors: Dennis F. Reese, Mitchell V. Holden
  • Publication number: 20140065344
    Abstract: In one aspect, an encapsulation sheet, a method of manufacturing an organic light emitting display device using the encapsulation sheet, and an organic light emitting display device is provided. The encapsulation sheet includes a carrier film; and a first sheet formed on the carrier film, wherein the first sheet comprises at least one of tin fluorophosphates glass, chalcogenide glass, tellurite glass, borate glass, and phosphate glass.
    Type: Application
    Filed: February 27, 2013
    Publication date: March 6, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventors: Min-Soo Kim, Jin-Woo Park, Won-Sik Hyun
  • Patent number: 8657982
    Abstract: The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: February 25, 2014
    Assignee: Quanta Computer, Inc.
    Inventors: Yuan-Chen Liang, Chia-Hui Wu, Hung-Ta Lee, Yi-Chun Lin, Li-Chuan Chien, Kuo-Hsiang Hsu
  • Patent number: 8597765
    Abstract: A manufacturing method of functional film comprising the steps of: a first step of feeding a lengthy substrate with self-support including a first laminate film on a back side, forming an organic film on a front side of the substrate while transferring the substrate, providing a second laminate film on a surface of the organic film, and taking up the substrate into a film roll; and a second step of loading the film roll on a vacuum deposition apparatus, continuously feeding the substrate including the first laminate film and the second laminate film from the film roll, removing the second laminate film while transferring the substrate, forming an inorganic film over the organic film of the substrate, and taking up the substrate into a film roll.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: December 3, 2013
    Assignee: FUJIFILM Corporation
    Inventor: Eijirou Iwase
  • Patent number: 8535108
    Abstract: A formation method of an organic layer (13) includes a transfer process of forming the organic layer (13) by superposing a donor substrate (30) having a light heat converting layer (32) and a transfer layer (34) formed sequentially to cover at least regions corresponding to organic layer formation regions on a support plate (31) and a transfer mask (40) having openings corresponding to the organic layer formation regions, on each other so that the transfer layer-side surface of the donor substrate (30) comes into contact with the transfer mask (40), and, with the resultant structure placed above a transfer target substrate (20) so that the transfer mask (40) is on the lower side, transferring the transfer layer (34) onto the transfer target substrate (20) via the openings of the transfer mask (40).
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: September 17, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Tokiyoshi Umeda, Tohru Sonoda, Hideki Uchida
  • Publication number: 20130168011
    Abstract: A decorative molding film includes a base film provided with a protective layer, a coloring layer containing a polyolefin based hot melt adhesive and pigment, and an adhesive layer containing a polyolefin based hot melt adhesive, stacked in that order on one side of the base film.
    Type: Application
    Filed: August 26, 2011
    Publication date: July 4, 2013
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Kentaro Mori, Katsuhiro Minomo
  • Publication number: 20130156989
    Abstract: A method for manufacturing a flexible structure including implanting ionic species in first and second source substrates so as to form first and second embrittlement regions respectively, delimiting first and second thin films, providing a flexible substrate, the stiffness R of which is less than or equal to 107 GPa·?m3, securing the first and second thin films to the first and second faces of the flexible substrate respectively so as to form a stack including the flexible structure delimited by the first and second embrittlement regions, the flexible structure having a stiffening effect suitable for allowing transfers of the first and second thin films, and applying a thermal budget so as to transfer the first and second thin films onto the flexible substrate.
    Type: Application
    Filed: December 18, 2012
    Publication date: June 20, 2013
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • Publication number: 20130149514
    Abstract: An insulating sheet includes a resin sheet, and an insulating layer disposed on the resin sheet, wherein the insulating layer includes an inorganic insulating layer, and the inorganic insulating layer includes first inorganic insulating particles which have a particle size of not less than 3 nm and not greater than 110 nm and which are bonded to each other.
    Type: Application
    Filed: July 26, 2011
    Publication date: June 13, 2013
    Applicant: KYOCERA CORPORATION
    Inventor: Katsura Hayashi
  • Patent number: 8460489
    Abstract: A film application system having multiple foil application stations. Each foil application station has a support for an elongated plastic component (typically vinyl) having an input and an output side. A drive moves successive elongated components along a path through the application station from the input side to the output side as decorative foil is applied to a surface of the component. A properly positioned and oriented transfer head applies heat and pressure to the elongated film as the component moves through the application station. The disclosed system must accommodate different style and shape components corresponding to different style windows, doors, or sashes. A backing fixture that is configured to support a given configuration component is positioned to support the component as the component moves through the application station in a region of the transfer head.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: June 11, 2013
    Assignee: GED Integrated Solutions, Inc.
    Inventors: James B. Williams, II, Scott M. Azzarello, Timothy B. McGlinchy, Roger J. Eberwein
  • Patent number: 8460499
    Abstract: A labeling machine for the dispensing of labels, such as self-adhesive labels, on objects, such as containers or bottles. The labeling machine has an arrangement for the generation of a defined strip tension of the labeling material over its strip length between a looper and a dispensing edge, and for the generation of a defined strip tension of the backing material over at least a part of its strip length between the dispensing edge and a receptacle for the backing material.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: June 11, 2013
    Assignee: KHS GmbH
    Inventors: Holger Stenner, Frank Putzer
  • Patent number: 8430985
    Abstract: One embodiment includes a process including coating a first microporous layer onto a first decal and curing the first microporous layer and the first decal.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: April 30, 2013
    Assignee: GM Global Technology Operations LLC
    Inventors: Jeanette E. Owejan, Hubert A. Gasteiger
  • Patent number: 8425709
    Abstract: A thermal transfer sheet having a subbing layer and a dye layer in this order on a substrate film, wherein the subbing layer contains colloidal silica or colloidal alumina, and the dye layer contains a polyvinyl acetal resin having an acetacetal group in an amount of from 3.0 to 30.0 molar times the butyral group therein, and a dye of the following formula (1): wherein A represents a phenylene group; R1 and R2 represent a hydrogen atom, an alkyl group, or an aryl group; R3 represents an amino group, an alkoxy group, or an aryloxy group; and R4 represents an alkyl group, or an aryl group.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: April 23, 2013
    Assignee: FUJIFILM Corporation
    Inventor: Naotsugu Muro
  • Publication number: 20130089184
    Abstract: A radiation window foil for an X-ray radiation window comprises a mesh that defines a number of openings (902), said mesh having a first side surface (903) and a second side surface (904). A layer (906) spans said openings. Said layer (906) is on the first side of the mesh but spans said openings at a level closer to the second side surface (904) of the mesh than the first side surface (903) of the mesh.
    Type: Application
    Filed: February 4, 2011
    Publication date: April 11, 2013
    Applicant: HS Foils OY
    Inventor: Heikki Johannes Sipilä
  • Patent number: 8404308
    Abstract: An improved process for manufacture of polymer coated composite substrates is described. a coated composite substrate is prepared in the press by applying a layer of a primer coating composition to the surface of a compressible mat comprising fibers and/or particles and a resin binder. The primer coating composition is formulated preferably as a fast setting polymer latex capable of forming a chemically crosslinked polymer matrix when applied to the surface of a compressible mat. a thermosetting top coat composition can be applied directly over the wet primer coating composition before heat-processing the mat to improve surface quality and release characteristics. Compressing and heating the coated mat produces a primed composite substrate directly out of the press.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: March 26, 2013
    Assignee: Valspar Sourcing, Inc.
    Inventors: Frank Chen, Greg Muselman, Travis W. Idol, David H. Nowack
  • Patent number: 8398806
    Abstract: The invention is to provide a method for manufacturing a joined sheet product. The method comprising a first joining step including opposing a transverse end face of a first sheet product(1) to a transverse end face of a second sheet product(2) and joining release films of the first and second sheet products with a first joining member(30); a removing step including removing a portion of an intended member including at least a surface protecting member so as to leave at least the release film and a pressure-sensitive adhesive provided on the release film among the constituent members of both or any one of the first and second sheet products(1, 2), wherein the portion has a predetermined length from the transverse end face of the intended member; and a second joining step including providing a second joining member(40) on at least an exposed portion(40b) resulting from the removal of the intended member to join the surface protecting member sides of the first and second sheet products(1, 2).
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: March 19, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tadashi Yokouchi, Takaichi Amano, Tomokazu Yura, Kazuo Kitada
  • Patent number: 8388790
    Abstract: There is described a process for the production of a multilayer body (4) having an electrically conductive layer (421) arranged on a carrier layer (41), in which there is provided a transfer film (5) having a transfer layer (52) of an electrically conductive polymer. The electrically conductive layer is transferred from the transfer film (5) on to the multilayer body (4). There are also provided a transfer film and a multilayer body produced in accordance with the process.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: March 5, 2013
    Assignee: Leonhard Kurz Stiftung & Co. KG
    Inventors: Ulrich Schindler, Walter Lehnberger
  • Patent number: 8372233
    Abstract: A heat transfer material kit is disclosed that includes a first image transfer material that includes a printable non-porous surface, and a second image transfer material that includes an outer layer having a film forming binder and thermoplastic particles. The film forming binder is polar. A method of using the kit is disclosed that includes the steps of a) imaging the substantially non-porous printable surface to form an imaged surface having printed and un-printed areas; b) positioning the outer layer adjacent the imaged surface; c) transferring a portion of the outer layer to the printed area while transferring a lesser portion of the outer layer to the non-printed area to form a coated imaged surface having a non-printed area with less coating than the printed area; and d) thereafter transferring the coated image to a substrate. Alternate methods of using the kit and applying images to substrates that provide good image appearance and durability are also disclosed.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: February 12, 2013
    Assignee: Neenah Paper, Inc.
    Inventor: Francis J. Kronzer
  • Patent number: 8372232
    Abstract: A heat transfer material kit is disclosed that includes a first image transfer material that includes a printable non-porous surface, and a second image transfer material that includes an outer layer having a film forming binder and thermoplastic particles. A method of using the kit is disclosed that includes the steps of a) imaging the substantially non-porous printable surface to form an imaged surface having printed and un-printed areas; b) positioning the outer layer adjacent the imaged surface; c) transferring a portion of the outer layer to the printed area while transferring a lesser portion of the outer layer to the non-printed area to form a coated imaged surface having a non-printed area with less coating than the printed area; and d) thereafter transferring the coated image to a substrate. Alternate methods of using the kit and applying images to substrates that provide good image appearance and durability are also disclosed.
    Type: Grant
    Filed: July 20, 2004
    Date of Patent: February 12, 2013
    Assignee: Neenah Paper, Inc.
    Inventor: Francis Joseph Kronzer
  • Patent number: 8323439
    Abstract: To deposit carbon nanotubes onto a substrate, an at least partially porous film is prepared so that a surface of the film has a layer of carbon nanotubes thereon. The film is positioned in relation to a surface of the substrate such that the surface of the film having the layer of carbon nanotubes is brought into contact with the surface of the substrate. Pressure is applied to the film to attach the film, including the layer of carbon nanotubes, to the surface of the substrate.
    Type: Grant
    Filed: March 8, 2009
    Date of Patent: December 4, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin Dooley, Ratnesh Kumar Sharma, Lynn Sheehan, Sergio Escobar-Vargas, Anna Fenelon
  • Publication number: 20120228008
    Abstract: Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.
    Type: Application
    Filed: March 9, 2012
    Publication date: September 13, 2012
    Applicant: TAIYO YUDEN CO., LTD
    Inventors: Ryuichi KONDOU, Kenichi Ota
  • Patent number: 8252136
    Abstract: The invention is to provide a process for production of a connected sheet product, which makes it possible to connect opposed end faces of two or more sheet products. A process for production of a connected sheet product including sheet products that are connected to one another and each have at least an optical member and a release film provided on one side of the optical member with a pressure-sensitive adhesive interposed therebetween, comprising: opposing a transverse end face of a first sheet product to a transverse end face of a second sheet product; connecting release films of the first and second sheet products with a connecting member (30a); and connecting surface members of the first and second sheet products with a connecting member (30b) on the opposite side from the release films.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: August 28, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Kazuo Kitada, Tadashi Yokouchi, Takaichi Amano, Tomokazu Yura
  • Patent number: 8236126
    Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: August 7, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Kuang-Jung Chen, Shu-Tang Yeh, Ping-I Shih, Kung-Yu Cheng, Jian-Lin Wu
  • Patent number: 8195323
    Abstract: Described herein is a system for controlling advance of a web material having characteristics of extensibility and comprising successive stretches of web for the production of respective articles, such as sanitary articles. In the passage from a delivery assembly to a treatment station functioning cyclically, the web material is subjected to extension. In order to ensure proper alignment of the individual articles with patterns or decorations provided thereon, the web must be fed to the treatment station in phase with the position reached by the treatment station within its operating cycle. A position sensor enables detection, for each stretch of web, of a real position of operation of the treatment station used for feeding the stretch of web itself to the treatment station with the aforesaid given phase relationship.
    Type: Grant
    Filed: August 13, 2008
    Date of Patent: June 5, 2012
    Assignee: Fameccanica. Data S.p.A.
    Inventor: Giambattista Simone
  • Publication number: 20120128983
    Abstract: A method of fabricating multi-layered graphene includes disposing a first graphene layer on a carrier; disposing at least one second graphene layer on the first graphene layer to form a graphene sheet disposed on the carrier; and transferring the graphene sheet disposed on the carrier onto a substrate, wherein each of the graphene layers which constitute the graphene sheet has at least one damaged region, and the at least one damaged region of each of the graphene layers contacts at least one of non-damaged regions of a graphene layer or graphene layers, of the graphene layers, contacting the each of the graphene layers.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 24, 2012
    Applicants: SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION, SAMSUNG TECHWIN CO., LTD.
    Inventors: Jong-hyuk YOON, Duk-hwa NA, Young-il SONG, Dong-kwan WON, Byung-hee HONG, Na-young KIM
  • Patent number: 8172974
    Abstract: Methods and products for forming a coated image on a substrate are generally disclosed. The methods can include forming an image on a printable surface of a transfer coating layer of a printable transfer sheet. In a separate step, the negative mirror image of that same image is printed with toners on a toner printable sheet. After registering the sheets together, a portion of the transfer coating layer of the printable transfer sheet is transferred to the toner printable sheet, such that the portion of the transfer coating layer transferred to the toner printable sheet corresponds to the imaged areas on the toner printable sheet. However, the image formed on the printable surface of the transfer coating layer and the underlying transfer coating substantially remain on the printable transfer sheet. Thereafter, the image and the transfer coating layer remaining on the printable transfer sheet are transferred to a substrate.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: May 8, 2012
    Assignee: Neenah Paper, Inc.
    Inventor: Frank J. Kronzer
  • Patent number: 8168513
    Abstract: A method for fabricating a packaging substrate includes: providing a base having a release film with two opposite surfaces, two first auxiliary dielectric layers enclosing the release film, and two metal layers disposed on the two first auxiliary dielectric layers, therewith an effective area defined on the two metal layers; forming an inner wiring layer from the two metal layers; forming on each of the two first auxiliary dielectric layers and the inner wiring layers a built-up structure having first conductive pads so as for two initial substrates to be formed on the opposite surfaces of the release film; removing whatever is otherwise lying outside the effective area; removing the release film; and forming dielectric layer openings in the two first auxiliary dielectric layers so as for two substrate bodies to be formed from the initial substrates, wherein a portion of the inner wiring layers are exposed to thereby function as second conductive pads.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: May 1, 2012
    Assignee: Unimicron Technology Corporation
    Inventor: Chin-Ming Liu