Abstract: An electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with IPO leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.

Abstract: A lateral flow device includes a porous medium layer having a two-dimensional shape in plan view defined by one or more peripheral edges wherein the two dimensional shape includes a plurality of testing regions separated from one another by spaces between portions of the one or more peripheral edges. The porous medium layer further includes a fluid-receiving region in capillary flow communication through the porous medium layer to the testing regions.

Abstract: The present invention relates to a laminated product comprising a first and a second substrate that adhere to each other only by means of a cured and crosslinked layer of a polymeric adhesive containing no organic solvent, characterized in that: a) the polymeric material of either or both of the first or second substrates is a polyether block copolymer; and b) the polymeric adhesive is a moisture-crosslinkable hot-melt adhesive based on a polyurethane prepolymer or on a blend of polyurethane prepolymers containing free isocyanate (—N?C?O) functional groups. The present invention also relates to a process for manufacturing such a laminate and to its use in the shoe industry, especially for the manufacture of soles and most particularly sports shoe soles.

Abstract: An organic light emitting diode (OLED) display device and a method of fabricating the same are disclosed. In one embodiment, the method includes: i) preparing a support and a flexible layer, ii) forming a first metal layers on one side of a support and a second metal layer on one side of a flexible layer, iii) performing a cleaning process to the first metal layer and the second metal layer, iv) forming a first radical layer on the first metal layer and a second radical layer on the second metal layer and v) joining the first and second radial layers to each other. At least one embodiment of the invention enhances process convenience and manufacturing yield, and reduces manufacturing costs and time for a flat panel display device having a flexible substrate.

Abstract: An all-solid-state lithium-ion secondary battery has an anode, a cathode, a solid electrolyte layer disposed between the anode and the cathode, and at least one of a first intermediate layer disposed between the anode and the solid electrolyte layer, and a second intermediate layer disposed between the cathode and the solid electrolyte layer.

Abstract: In an illustrative embodiment, two panels of different materials may be bonded with a structural adhesive composition comprising microcapsules containing corrosion inhibiting materials for protecting the panels from corrosion. For example, a steel vehicle door outer panel may be bonded to an aluminum alloy or magnesium alloy inner panel using an epoxy adhesive. Dispersed within the uncured adhesive are an abundance of microcapsules filled with a fluid or mobile material for reacting with the iron and/or aluminum or magnesium to inhibit corrosion arising from the facing surfaces of the mixed metal panels. The protective material is released from the microcapsules for diffusion through the cured or uncured interfacial adhesive to react with one or both panel surfaces and form a protective coating on the surfaces.

Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.

Abstract: An electromagnetic wave shielding sheet having a high shielding effect for electromagnetic waves and capable of suppressing secondary emission causing noises without using GND connection, in which the electromagnetic shielding sheet includes a laminate film on a paper substrate, the laminate film has a laminate structure where an adhesive layer having adhesion property, a resistor layer and an insulator are laminated, the resistivity of the insulator is set to about 106 ?/cm or higher and the resistance value of the resistor layer is set to about 10? to 300?, so that secondary emission can be decreased while keeping a high shielding effect.

Abstract: Carbon nanotube interlayer assemblies, methods of manufacturing carbon nanotube interlayer assemblies, and methods of manufacturing composite parts with carbon nanotube interlayer assemblies are disclosed herein. In one embodiment, a method of manufacturing a composite structure in accordance with an embodiment of the invention includes producing a plurality of carbon nanotubes on one or both sides of a substrate, and attaching the substrate to a first fiber layer. The method can further include positioning a second fiber layer adjacent to the first fiber layer to position the plurality of carbon nanotubes between the first and second fiber layers. The method can additionally include infusing the first and second fiber layers with resin, and curing the resin. In one embodiment, the carbon nanotube substrate can be attached to the first fiber layer by melt-bonding. In another embodiment, the carbon nanotube substrate can be attached to the first fiber layer with stitches.

Abstract: Disclosed is a method for reducing stringiness during hot plate welding of an article comprising a resinous composition which comprises at least one step of contacting with water a surface of the article to be welded. The method also results in improved cycle time for preparation of the final article.

Abstract: A power transmission belt having a body made at least in part from ethylene-?-olefin rubber. At least one load carrying member is embedded in the ethylene-?-olefin rubber. First, second and third films are formed on the load carrying member. The first film is made from at least one of an isocyanate compound and an epoxy compound, the second film from polybutadiene rubber, and the third film from an ethylene-propylene-diene terpolymer.

Abstract: A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lower plate and adhered to the lower plate so that surfaces formed with the recessed part are opposite to each other; a heat circulation medium injected into an internal space formed by the recessed parts of the lower and upper plates.

Abstract: A method for achieving a substantially defect free SGOI substrate which includes a SiGe layer that has a high Ge content of greater than about 25 atomic % using a low temperature wafer bonding technique is described.

Abstract: An organic EL device of top emission type having a structure of a transparent conductive layer on a metal reflecting layer, and particularly an organic EL device having a high luminance with the stability capable of maintaining the high luminance over the long period of time is provided. The organic EL device includes a metal electrode layer serving as a metal reflecting film, a transparent conductive layer, an organic functional layer having an organic EL layer, and a transparent electrode layer which are successively laminated on a substrate, and a formation area of the metal electrode layer resides inside a protection area where the transparent conductive layer is formed on the substrate.

Abstract: A method of forming an optical element forming metal mold to form an optical element, having steps of: laminating a heat insulation layer 13 on a surface of the base member 11 where the optical element is formed; laminating an intermediate metal layer 14 on a surface of the heat insulation layer 13 by thermal spraying; laminating a surface forming layer 15, on which a surface shape to be transferred to the optical element is formed, on the intermediate metal layer 14; wherein the intermediate metal layer 14 is laminated in a way that parts of the heat insulation layer 13 are exposed substantially evenly from the intermediate layer 14.

Abstract: A honeycomb structure including a ceramic block having two ends. The ceramic block is formed of a plurality of honeycomb units having cell walls, which define a plurality of cells that extend from one end to the other end. The honeycomb units are bonded together by interposing bonding layers therebetween. A coat layer is provided on an outer peripheral surface of the ceramic block. At least one heat absorbing material is provided to at least one part selected from among the cell walls, the coat layer, and the bonding layer.

Abstract: To improve the joining (adhesion) force of a polybutadiene formed article and a polar resin formed article, and to further improve the joining force by selecting (combining) a solvent(s) for these formed articles. A method for adhering a polybutadiene formed article, which comprises (1) the step of reducing the water contact angle of a surface of the polybutadiene formed article by ozone treatment, electron beam treatment, corona discharge treatment, plasma discharge treatment, ultraviolet laser treatment or chemical treatment, and (2) the step of adhering the polybutadiene formed article reduced in the water contact angle to a polar resin formed article.

Abstract: A capacitor is provided. The capacitor includes opposing electrodes fabricated from a non-woven carbon nanotube sheet bonded to opposing noble metal foils. The capacitor also includes a non-porous casing within which the opposing electrodes are placed. The capacitor further includes electrically conductive contacts extending from the noble metal foils through an opening in the casing. The capacitor can be a portable capacitor. A method of manufacturing the capacitor is also provided.

Abstract: In a method of joining two workpieces (10, 16) without extraneous materials to produce a workpiece 25 which is joined over a joining area (24) which is formed by two fully adjoining surfaces (13, 13?) of the two workpieces (10, 16), with the first workpiece (16) being of plastic and the second workpiece (10) being of a material different from plastic, a strong bond is achieved even when the coefficients of thermal expansion of the workpieces are different by activating at least the surface (13?) of the first workpiece (16) by irradiation with high-energy radiation in a first step, bringing the surfaces (13, 13?) of the workpieces (10, 16) into contact in a second step and pressing the two workpieces (10, 16) against one another at room temperature, in particular at a temperature of from 15° C. to 30° C., to join them at the surfaces (13, 13?).

Abstract: A production method of an electronic apparatus includes: a step of making a thermosetting adhesive adhere to a face of a base where an antenna pattern is formed on a film made of a resin material, the face being a face which the antenna pattern is formed on; a step of mounting a circuit chip connected to the antenna pattern, on the base through the thermosetting adhesive; a preheating step of heating the thermosetting adhesive on a first heating condition by which the thermosetting adhesive becomes a first cured state; and a main heating step of fixing the circuit chip to the antenna pattern by heating and curing the thermosetting adhesive on a second heating condition by which the thermosetting adhesive becomes a second cured state harder than the first cured state, with the base being clamped and pressurized from both of the circuit chip side and the film side.

Abstract: The invention relates to self adhesive material (SAM) using water soluble film incorporated with surfactants and/or fillers as a protective layer, eliminating the release liner (backing liner). The water soluble film incorporated with surfactants and/or fillers, used as a protective liner, provides easy breakage, faster dissolution as well as easy application to an object. The invention also relates to a process for the preparation of self adhesive material (SAM) without release liner and an apparatus and a method for applying the self adhesive material (SAM) on an object.

Abstract: The invention relates to improvements in a method for molecularly bonding first and second substrates together by placing them in surface to surface contact. The improvement includes, prior to placing the substrates in contact, cleaning the surface of one or both of the substrates in a manner to provide a cleaned surface that is slightly roughened compared to a conventionally polished surface, and heating at least one or both of the substrates prior to placing the substrates in contact while retaining the heating at least until the substrates are in surface to surface contact.

Abstract: A method of forming electronic components in which a thermoplastic substrate is embossed to create a recess for electronic components; the electronic component is placed in the recess; electrical connections and circuitry are deposited over the components on the thermoplastic substrate; and a cover sheet of thermoplastic material is bonded over the circuitry. The process may also be carried out in reverse order. The apparatus used consists of a hot embossing machine having a former shaped for each particular circuit to be assembled; a pick and place machine with standard reel loading of components; and a screen printer for printing the conductive ink circuitry or a station for adhering conductive tape or preprinted film.

Abstract: A process for the production of a printing form, especially within a printing press, where a permanent and erasable image is provided on the rewritable surface of a printing form by means of the following steps: (a) the preparation of a printing form with a rewritable surface; (b) the all-over application of a rubber coating to the rewritable surface of the printing form; (c) the image data-oriented removal of the previously applied rubber coating; (d) the image data-oriented application of an imaging polymer to the surface in the areas from which the rubber coating was previously removed; and (e) the all-over fixation of the imaged surface.

Abstract: The invention relates to a method and a device (12, 13) for producing a multi-layered three-dimensional component (14). In a first step, a layered geometrical structure is formed, said structure consisting of at least two webs (16) of an at least high temperatures-resistant material. In a second step, an at least partly material connection is produced between the individual webs of the entire layered structure by means of at least one thermal treatment.

Abstract: Disclosed is a thermal-release double-coated pressure-sensitive adhesive tape or sheet which includes a substrate, a foaming agent-free pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a foaming agent-containing pressure-sensitive adhesive layer (B) arranged on the other side. The pressure-sensitive adhesive layer (A) contains 5 to 30 parts by weight of a plasticizer and 100 parts by weight of a base polymer and has a tensile adhesive strength of 1 N/20 mm in width or less with respect to a poly(ethylene terephthalate) film as determined at a peel angle of 180 degrees, a rate of pulling of 300 mm/minute, a temperature of 23±° C., and a relative humidity of 65±5%. The weight loss of plasticizer is 2 percent by weight or less when the tape or sheet is heated at a temperature of 165° C. and a pressure of one atmosphere for one hour.

Abstract: With a hybrid fan blade, the supporting structure (1) in fiber-composite material is enclosed by an enveloping structure (2) only in an area of the airfoil, with a suction-side sheet-metal cover of the enveloping structure being pre-stressed in tension and a pressure-side sheet-metal cover of the enveloping structure being pre-stressed in compression. This reduces the hazard of delamination between the enveloping structure and the supporting structure.

Abstract: Methods of attaching optical fibers to actuator tubes in the manufacture of scanning fiber devices are disclosed. In one aspect, a method may include applying a bead to an optical fiber of a scanning fiber device near a proximal end of a free end portion of the optical fiber. Then, the bead may be adhered at least partially within an actuator tube of the scanning fiber device by applying and curing an adhesive. Scanning fiber devices manufactured by such methods are also disclosed.

Abstract: A method and system for preparing mail pieces that include RFID enabled cards. The improvement provides enhanced tracking and control capabilities for such mail pieces. In an inserter control system, individual RFID signals of the RFID enabled cards are related to particular mail pieces in a mail piece production database. The corresponding RFID enabled cards are fed into the inserter system from a card feeder. An attaching device attaches the cards to a carrier sheet. The inserter system transports the cards and carrier sheets to different stations where other documents are joined with the carrier sheets. The assembled mail pieces are then inserted into envelopes to form finished mail pieces. Sensors are located within the system to detect the RFID signals of the individual cards. The sensed individual RFID numbers are compared with stored mail piece data. The system is programmed to process the mail piece based on instructions in the database corresponding to the sensed number.

Abstract: The invention relates to: a method of adhering a flexible film to a substrate, in which a sufficient quantity of a liquid is disposed between the film and the substrate such that no bubbles are trapped therebetween once the film has been applied to the substrate with the aid of a scraper, said method being characterised in that the liquid does not freeze at a substrate temperature of less than 0° C.; the mutually-adhered substrate and flexible film which is characterised by the continued absence of frost in the event of the substrate and film being moved into an atmosphere in which the temperature thereof is less than 0° C., from an atmosphere having a temperature that is at least equal to 0° C. and residual moisture of at least 25%; glazing comprising same; and the applications of said glazing, including for example exposure to temperatures of less than 0° C.

Abstract: An interface system and device for interfacing a microfluidic chip system is disclosed comprising an adapter having channels and ports connecting to the microfluidic chip system and an external fluidic system. An interface, device and method are provided herein, that disclose the connection of larger volumes of an external fluidic system to smaller volumes of a microfluidic chip system and the ability to effectively purge microfluidic channels without contamination.

Abstract: Introduction guides 12 are provided above and below a sheet-introduction opening portion of a pressure-reduced chamber 10, and heating means 17 is provided between the introduction guides. Each resin sheet 3 is attracted and attached respectively to the circumferential surface of a corresponding emboss roller 11 by reducing pressure. Pins 112 of the emboss roller 11 are truncated cone-shaped. The ratio of the total area of the lower bases of the pins 112 to the area of the circumferential surface of the emboss roller is 0.5 or more. The rising angle ? of the pin side face, in the vertical plane including the central axis of the pins 112, is in the range from 50 degrees to 70 degrees. Furthermore, a multilayered hollow structure plate 140 is formed by attaching non-air-permeable sheets 130 onto both the front and back of a core member obtained by fusing together hollow protrusions 112 in two thermoplastic resin sheets.

Abstract: A method of placing a logo on an article or substrate by placing a contrast sheet behind the logo and a blocking sheet therebetween to prevent a shadow effect. The contrast sheet and blocking sheet may be hidden within the hem of an article.

Abstract: A system and method for sensing and reporting atmospheric analyte levels in a workspace. The system includes (i) a remotely located gas analyte sensor, (ii) a tube attached to the sensor and defining a lumen through which the sensor is placed in fluid communication with a workspace, and (iii) a fan in sealed fluid communication with the lumen of the tube for continuously moving gaseous content from the workspace through the lumen and into operative engagement with the sensor. The method includes the steps of (a) placing the distal end of the tube within a workspace, (b) activating the fan so as to continuously move gaseous content from the workspace through the tube and into operative engagement with the sensor, and (c) sensing and reporting analyte levels in the workspace with the sensor.

Abstract: A counter electrode and a dye-sensitized photovoltaic cell having the counter electrode are provided. The counter electrode includes a conductive substrate, an adhesive layer formed on the conductive substrate, and a porous carbon material layer formed on the adhesive layer.

Abstract: A profile of recycled plastic agglutinated with natural fibers and reinforced with rigid rods in conjunction with a process producing the said profile. The profile composed of a geometric shape predetermined by its applied use which could be as a profile for a signpost, for a utility pole crossarm, for a beam, for civil construction use, for a fence post or for a marine piling. The profile is manufactured from a thermoplastic mass and a natural fiber by an extrusion process, where the recycled thermoplastic is agglutinated with the natural fiber and then is coupled in predetermined points, preferably close to its borders, with rigid rods distributed in parallel alignment to the longitudinal axis of the profile. The process to manufacture the profiles incorporates an important device of counter weight in the extrusion process precluding the formation of air bubbles in the mass.

Abstract: A woven article having strands of polyetherimide (PEI) fiber or organic fibers (cyclic polyolefin) and strands of inextensible, heat resistant fiber is disclosed. Preferably warp and weft fibers of PEI are provided wherein said fibers bond together when heated. By using a multiplicity of PEI fibers, heating and compressing the woven article will produce a sheet-like surface on at least one side thereof.

Abstract: Adhesive is applied to an inner surface of a sleeve housing, and a sleeve is inserted from a lower end part thereof into the sleeve housing. An outer edge of the lower end part of the sleeve is provided with an adhesive holding portion in a chamfered shape, and a part of the adhesive is held between the adhesive holding portion and the inner surface of the sleeve housing.

Abstract: Multilayered composite material comprised of at least one flexible backing film and a nonwoven fabric or paper, characterized in that the composite material comprises at least two lacquer layers disposed between the flexible backing film and the nonwoven fabric or paper and spaced apart from one another by one or several intermediate layers.

Abstract: A method of treating a glass substrate for bonding. The method includes providing a glass substrate having a fritted portion of a ceramic frit material and a non-fritted portion. At least a portion of the fritted portion includes a bondable surface. The method further includes cleaning and activating the bondable surface for subsequent bonding. The cleaning and bonding steps are carried out by applying an air plasma to the bondable surface.

Abstract: Disclosed is a pipe cleaner apparatus that is attached to a pipe fusion machine. The pipe cleaner removes dirt, snow, mud, and other debris from the outer surface of pipe sections prior to the butt fusion process. The pipe cleaner may be a wiper through which the pipe slides, or may be a multi-piece scraper with spring loaded flaps that clean the outside surface of the pipe.

Abstract: A method includes blasting the interior surfaces of the fitting to stator bar strand joint with CO2 pellets to remove loose copper oxide which otherwise would interfere with proper sealing between an epoxy and the copper surfaces of the joint. After cleaning the surfaces and applying air under pressure to remove particulate material, epoxy is applied to the brazed joints followed by an evacuation of the fitting to strand joint. Subsequent release of the vacuum ensures that the epoxy fills in all crevices or cracks at the joint surfaces and minimizes or eliminates any tendency of the epoxy to delaminate.

Abstract: A method for substantially lifting dry-erasable marked images (4) from a whiteboard surface (2) includes providing a rolled transparent adhesive film sheet (6) for lifting the image, a rolled paper sheet (8) having a shade or color that is contrasting to the image (4) allowing for clearer viewing and easy handling of the lifted image when the sheets (6,8) are adhered together. The sheet rolls (24,26) are positioned, utilizing an elongated handling unit (12,36) that enables dispensing and joining of the sheets (6,8). An urging slit (16) is provided on the unit to urge consistent adherence together of the two sheets (6,8) when pulled through. At least one suction cup (30) is provided on at least one side of the handling unit (12,36) that is provided, in order to mount the unit (10,34) on or near the whiteboard surface (2). Permanent mounting and motorized operation alternatives and a surface cleaning method are provided.

Abstract: Process for producing a sealed water-soluble package of improved aesthetic appearance by treating at least part of the outer surfaces of the sealed package with a plasticizer composition and applying heat thereto, a package obtainable thereby and a specified use of such package.

Abstract: A core plate 1, which has been punched in a core plate punching step 20, is conducted a surface roughing step 30 and a cleaning step 40. After coating both surfaces of the core plate 1 with adhesive in an adhesive coating step 50, the core plate 1 is put on a friction member 2, which has been punched in a friction member punching step 60, in a piling step 70, and a piled body 3 is conveyed to a drying and curing step 80. The core plate 1 is heated by high-frequency heating to dry and cure the adhesive. The core plate 1 and the friction member 2 are heated and pressured by the hot press 91, and the friction plate 4 is completed. Since high-frequency heating is adopted, an apparatus can be downsized, working time can be reduced and production efficiency can be enhanced.

Abstract: Disclosed is a process for producing a rubber-based composite material, including the steps of forming, by sputtering, an adhesion film on a substrate to be mated with a rubber for constituting the composite material, laminating a rubber composition on the adhesion film, and vulcanizing the rubber composition, the sputtering is conducted by using a first target and a second target, composed of different metallic components and provided in a chamber, while moving the substrate in sputtering atmospheres formed by applying electric power simultaneously to the first and second targets.

Abstract: A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.

Abstract: A method of bonding substrates and devices having bonded substrates are disclosed. The method of bonding substrates includes depositing a layer of bonding substrate material onto a bonding surface of a first substrate. A bonding site density of at least one of the layer of bonding substrate material or a bonding surface of a second substrate is increased, and the bonding surface of the first substrate having the layer of bonding substrate material is bonded to the bonding surface of the second substrate.

Abstract: An apparatus for manufacturing a laminated steel sheet by treating surfaces of a base steel sheet so that the adhesive strength between a base steel sheet and lamination sheets is increased. The apparatus comprises an uncoiler for unwinding a coiled base steel sheet followed by a cleaner for cleaning the surfaces of the base steel sheet. The cleaner comprises an acid pickling unit for pickling the surfaces of a hot rolled steel sheet with acid pickling water when the base steel sheet is the hot rolled steel sheet, an alkali cleaning unit for cleaning the surfaces of a galvanized steel sheet with alkali cleaning water when the base steel sheet is the galvanized steel sheet, and a rinsing unit. The acid pickling unit and the alkali cleaning unit are selectively used on the basis of kinds of the base steel sheet supplied from the uncoiler.

Abstract: A method for manufacturing membrane electrode assembly of fuel cell includes positioning an ion exchange membrane that is cleaned and trimmed to a predetermined size in advance to a base plate, mounting the base plate to a printing platform, attaching a printing plate to the platform, coating a catalyst solution on the printing plate with a scraper, printing the catalyst solution onto the ion exchange membrane with the scraper, heating the ion exchange with a heating board to a temperature of 70–80° C., and waiting for the ion exchange membrane to return flat to complete the coating of the catalyst solution on the ion exchange membrane. The printing and heating steps are repeated for both anode and cathode of the ion exchange membrane. The ion exchange membrane is further subject to hot pressing and then a piece of carbon cloth is positioned on the catalyst coating to serve as a diffusion layer. This completes the manufacturing of the membrane electrode assembly.