Simultaneous Pressure Application To At Least Two Separate Sandwiches Patents (Class 156/288)
  • Patent number: 11632063
    Abstract: An actuator assembly includes (i) a first actuator stack having a first primary electrode, a first secondary electrode overlapping at least a portion of the first primary electrode, and a first electroactive layer disposed between and abutting the first primary electrode and the first secondary electrode, (ii) a second actuator stack having a second primary electrode, a second secondary electrode overlapping at least a portion of the second primary electrode, and a second electroactive layer disposed between and abutting the second primary electrode and the second secondary electrode; and (iii) a bonding layer disposed between the first actuator stack and the second actuator stack.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: April 18, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Andrew John Ouderkirk, Renate Eva Klementine Landig, Kenneth Diest, Sheng Ye
  • Patent number: 11014264
    Abstract: A cross-laminated timber processing equipment comprises a longitudinal board loading mechanism, a transverse board loading mechanism, an adhesive spraying mechanism, laying cars, presses, a transfer car, and an unloading car. The longitudinal board loading mechanism lays longitudinal boards on a laying car at an assembly station, and the transverse board loading mechanism lays transverse boards on the laying car. The longitudinal boards and the transverse boards are perpendicularly and alternately laid layer by layer. The adhesive spraying mechanism is provided above the assembly station, and sprays an adhesive on the upper surfaces of assembled boards. The transfer car moves back and forth between a conveying station and an idle press through the assembly station, carries the laying cars and the assembled boards, and feeds the laying cars and the assembled boards into the presses for compaction.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: May 25, 2021
    Inventor: Guoliang Dong
  • Patent number: 10556387
    Abstract: A method for joining two carpet segments, each carpet segment having an underside and at least one edge, comprises abutting one edge of one carpet segment with one edge of the other carpet segment, positioning a length of seam tape under the abutting edges, and activating the adhesive to secure the seam tape to the undersides of both carpet segments. The seam tape comprises an elongated base layer being resilient in a longitudinal direction, an intervening layer applied to the base layer, and an adhesive applied to the intervening layer.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: February 11, 2020
    Inventors: Charles L. Bennett, Annette R. Bennett
  • Patent number: 10116181
    Abstract: A slot insulating paper (12) is arranged in a slot (18) of a core (10) of an electric motor or generator. In a state where the slot insulating paper (12) is spread in a sheet shape, a region (high stiffness portion (36)) that is part of the slot insulating paper (12) is a breakage resistance portion having a higher resistance against breakage than the other region (ordinary portion (38)). The slot insulating paper (12) may be formed by laminating a plurality of insulating layers. In the breakage resistance portion, for example, at least one of the laminated insulating layers is a high stiffness layer formed of a high stiffness material. Thus, the breakage resistance portion is formed to have a high stiffness. With a high stiffness, it is possible to improve breakage resistance.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: October 30, 2018
    Inventor: Hiroyuki Hattori
  • Patent number: 10065796
    Abstract: A barrier sheet for an LNG cargo tank includes a first barrier sheet so as to form a secondary barrier of the cargo tank and a second barrier sheet attached on the first barrier sheet. Each of the first and second sheets includes first and second metal layers and a glass cloth layer interposed between the first and second layers and bonded to the first and second metal layers.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: September 4, 2018
    Assignee: Samsung Heavy Ind. Co., Ltd.
    Inventors: Changseon Bang, Jihan Kim, Jong Gyu Lee
  • Patent number: 9818682
    Abstract: A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: November 14, 2017
    Assignee: International Business Machines Corporation
    Inventors: Edmund Blackshear, Shidong Li
  • Patent number: 9281120
    Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed in the ceramic body, having at least one of the dielectric layers interposed therebetween, wherein when a distance between a widthwise end of an internal electrode disposed at a central portion of the ceramic body in a thickness direction thereof and an adjacent side surface of the ceramic body is defined as D1 and a distance between a widthwise end of an internal electrode disposed at an upper or lower portion of the ceramic body in the thickness direction thereof and the adjacent side surface of the ceramic body is defined as D2, D1/D2 is in a range of 0.5 to 0.95 (0.5?D1/D2?0.95).
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: March 8, 2016
    Inventors: Min Gon Lee, Jong Han Kim, Seung Ho Lee, Yoon Hee Lee, Jang Ho Lee
  • Patent number: 8905106
    Abstract: End portions of a sheet-shaped rubber member are manually and firmly joined together. A pair of opening/closing members is arranged to sandwich and move along the end portions. An opening/closing mechanism opens/closes the pair of opening/closing members between an open position and a closed position where the end portions are joined together. A pair of guiding rollers is provided to one opening/closing member and guides each of the end portions to a joining position. A pressing roller is provided to the other opening/closing member and presses each of the end portions onto the guiding roller. A pair of joining rollers is provided to the pair of opening/closing members, respectively, and sandwiches each of the end portions guided by the pair of guiding rollers. The joining rollers roll on each of the opposing end portions and abut and join the end portions to each other.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: December 9, 2014
    Assignee: Bridgestone Corporation
    Inventor: Yuichiro Ogawa
  • Publication number: 20140246149
    Abstract: A method of manufacturing a composite core can include: wrapping a mandrel in a mandrel wrapping process by securing a mandrel with a winding jig; orienting the composite material at a wrap angle to the mandrel; and depositing the composite material around a circumference of the mandrel. The method can further include assembling the wrapped mandrels in a tool and applying a pressure to the composite material during a curing cycle.
    Type: Application
    Filed: March 1, 2013
    Publication date: September 4, 2014
    Inventors: Phillip A. Kendrick, Paul K. Oldroyd, Levi H. Armstrong, Elizabeth Oberle
  • Patent number: 8808481
    Abstract: Disclosed is a method for producing a web (2) comprising at least one protective layer (11, 11a), at least one functional layer (13), and at least one reinforcement layer (14). The reinforcement layer (14) is provided with greater tear strength than the protective layer (11, 11a) while the reinforcement layer (14) is glued to the functional layer (13) or the protective layer (11, 11a). According to the inventive method, the functional layer (13) is welded together with at least one protective layer (11, 11a) on at least one side by means of heat lamination in order to produce a prelaminate (20), and the obtained prelaminate (20) is then glued to the reinforcement layer (14).
    Type: Grant
    Filed: July 25, 2006
    Date of Patent: August 19, 2014
    Assignee: Ewald Dorken AG
    Inventors: Jörn Schröer, Rüdiger Laur, Gilles Schwaab
  • Patent number: 8663496
    Abstract: The invention relates to a double-layered compacted solid water-purification product, comprising at least one first layer and at least one second layer, characterized in that the first layer comprises at least one flocculating system and at least one dispersion system, the second layer comprises at least one disinfectant which liberates free chlorine on contact with water and at least one excipient for the disinfectant, whereby said excipient releases the disinfectant into the water at a controlled rate such that the combination of excipient and disinfectant releases 0.1 to 100 mg/l of free chlorine per hour. The invention further relates to the method for production of such a product.
    Type: Grant
    Filed: July 18, 2005
    Date of Patent: March 4, 2014
    Assignee: Eurotab
    Inventors: Paul Branlard, Philippe Desmarescaux, Murielle Moneron
  • Patent number: 8603290
    Abstract: A preforming device and method of use thereof, the device including a rack, a pinion, belt, belt tensioning feature, and mechanism for supporting a variably appliable enhanced pressure, such as may be applied using a bladder or bladders having one or more valves, the device capable of engaging a mandrel to form at least one ply and a binder against the exterior of the mandrel.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: December 10, 2013
    Assignee: GKN Aerospace Services Structures, Corp.
    Inventor: Christopher J. Feeney
  • Publication number: 20130255878
    Abstract: A printed circuit board manufacturing method includes: supporting a substrate on a support member; disposing a semiconductor chip on an opposite side of the substrate from the support member and pressing the semiconductor chip against the substrate with a pressing member; and employing as the support member a member formed with a cavity larger than an external profile of the semiconductor chip and formed with a sloping portion towards the center of a bottom face of the cavity.
    Type: Application
    Filed: March 12, 2013
    Publication date: October 3, 2013
    Applicant: FUJITSU LIMITED
    Inventors: Tetsuya TAKAHASHI, Yasuo Moriya, Kimio Nakamura
  • Patent number: 8361342
    Abstract: The present invention relates to a compacted solid product for water purification comprising:—at least a first layer comprising at least a coagulant/flocculant system comprising at least one polyvalent inorganic salt, at least one water-soluble cationic polymer and at least one high-molecular-weight anionic polymer,—at least a second layer comprising at least one disinfectant that releases active chlorine on contact with water, characterized in that said coagulant/flocculant system moreover comprises a sodium alginate. The invention also relates to the method for preparing such a product.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: January 29, 2013
    Assignee: Eurotab
    Inventors: Paul Branlard, Gilles Rubinstenn
  • Patent number: 8287266
    Abstract: A preforming device and method of use thereof, the device including a rack, a pinion, belt, belt tensioning feature, and mechanism for supporting a variably appliable enhanced pressure, such as may be applied using a bladder or bladders having one or more valves, the device capable of engaging a mandrel to form at least one ply and a binder against the exterior of the mandrel.
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: October 16, 2012
    Assignee: GKN Aerospace Services Structures, Corp.
    Inventor: Christopher John Feeney
  • Publication number: 20120080146
    Abstract: An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate.
    Type: Application
    Filed: April 4, 2011
    Publication date: April 5, 2012
    Inventor: Gregory George
  • Patent number: 8057624
    Abstract: A pair of laminated panels are simultaneously manufactured in a single panel press. A thermal band is stacked between two panel sets and then the two panel sets are simultaneously heated and compressed together in a common stack with the band, with the band being separately heated.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: November 15, 2011
    Assignee: The NORDAM Group, Inc.
    Inventor: Bryan Keith Martin
  • Publication number: 20100320281
    Abstract: A tie foundation (1) for a railway tie (2) having at least a first elastic, preferably elastomer layer (3) and at least a second elastic, preferably elastomer layer (4), with a reinforcement layer (5) being embedded between the first elastic layer (3) and the second elastic layer (4), with the second elastic layer (4) forming an outer surface (6) of the tie foundation (1) and the reinforcement layer (5) comprising a fibrous material.
    Type: Application
    Filed: August 31, 2010
    Publication date: December 23, 2010
    Applicant: Getzner Werkstoffe Holding GmbH
    Inventors: Stefan Potocan, Martin Dietrich
  • Patent number: 7820002
    Abstract: A methodology 10 which produces a reception assembly 101 which is biodegradable and which is adapted to selectively receive and support an item, such as a vehicular hood.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: October 26, 2010
    Inventor: Joseph S. Wycech
  • Publication number: 20100193428
    Abstract: A support for a separation membrane includes a long-fiber nonwoven fabric composed of thermoplastic continuous filaments.
    Type: Application
    Filed: July 28, 2008
    Publication date: August 5, 2010
    Inventors: Ryoichi Hane, Jun Ogihara, Hiroyuki Matsuura, Yohei Nakano, Naoki Shibusawa, Tatsuya Kajino, Yoshikazu Yakake
  • Patent number: 7615942
    Abstract: A linear accelerator having cast dielectric composite layers integrally formed with conductor electrodes in a solventless fabrication process, with the cast dielectric composite preferably having a nanoparticle filler in an organic polymer such as a thermosetting resin. By incorporating this cast dielectric composite the dielectric constant of critical insulating layers of the transmission lines of the accelerator are increased while simultaneously maintaining high dielectric strengths for the accelerator.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: November 10, 2009
    Assignees: Lawrence Livermore National Security, LLC, TPL, Inc.
    Inventors: David M. Sanders, Stephen Sampayan, Kirk Slenes, H. M. Stoller
  • Publication number: 20090223628
    Abstract: A method for bonding a plurality of single crystal semiconductor substrates to a large supporting substrate such as a glass substrate while effectively aligning the substrates, and a method for reducing contaminants attached to a bonding surface during the bonding process. A plurality of single crystal semiconductor substrates are arranged on corresponding trays so that the front surfaces of the substrates face vertically downward, and a large supporting substrate is arranged so that the front surface thereof faces vertically upward. Next, the single crystal semiconductor substrates are spaced from the trays, and pressure is applied to part of each of the single crystal semiconductor substrates while the edges thereof are supported, whereby the front surfaces of the single crystal semiconductor substrates are bonded to the front surface of the large supporting substrate.
    Type: Application
    Filed: February 6, 2009
    Publication date: September 10, 2009
    Inventors: Hideto OHNUMA, Tomoaki MORIWAKA
  • Publication number: 20090120573
    Abstract: A pair of laminated panels are simultaneously manufactured in a single panel press. A thermal band is stacked between two panel sets and then the two panel sets are simultaneously heated and compressed together in a common stack with the band, with the band being separately heated.
    Type: Application
    Filed: October 24, 2008
    Publication date: May 14, 2009
    Inventor: Bryan Keith Martin
  • Publication number: 20090000662
    Abstract: The present invention provides solar concentrators incorporating photovoltaic receiver assemblies with improved thermal dissipation, dielectric, encapsulation, and cell/wiring protection characteristics. The concentrators are particularly useful for photovoltaic power systems such as rooftop mounted systems. The present invention teaches that the geometry of the substrate used to support receiver assemblies can have a dramatic impact upon thermal/dielectric performance. In particular, the present invention teaches how contours incorporated into such substrates can improve thermal performance (i.e., dissipation of thermal energy from photovoltaic cells through the substrate) while still maintaining dielectric and encapsulation objectives. In the past, dielectric and encapsulation objectives have been obtained at the expense of such thermal dissipation. Also, material choice and form also impacts thermal, dielectric, and encapsulation performance.
    Type: Application
    Filed: March 10, 2008
    Publication date: January 1, 2009
    Inventors: Duncan W.J. Harwood, Tyler K. Williams, David T. Youmans
  • Patent number: 7452493
    Abstract: A method of manufacturing a protective cover (24) for a component of a vehicle includes assembling multiple layers to form a charge (22). The charge (22) is formed within a mold (50) of the component to form a multi-contoured laminate (58). The protective cover (24) is separated from the multi-contoured laminate (58). A method of forming a down stream part structure or mold (167) for a component includes assembling multiple layers to form a charge (78). The charge (78) is formed within an original mold of the component to form a multi-contoured laminate (76). A splash is separated from the multi-contoured laminate (76). A protective cover, such as the cover (24), is for a vehicle component and includes a contour holding layer (36) and a protective laminate layer (34). The contour holding layer (36) and the protective laminate layer (34) are formed within a mold of the vehicle component to form the protective cover.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: November 18, 2008
    Assignee: The Boeing Company
    Inventors: Jeffrey T. Wirrick, Michael J. Cloud
  • Patent number: 7325300
    Abstract: In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: February 5, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kiyohide Tatsumi, Toshihiro Nishii, Shinji Nakamura
  • Patent number: 7223318
    Abstract: A method for the production of a laminate consisting of metal layers as well as at least one fibre-reinforced bonding layer (5–7) that is located between the metal layers (1–4), which laminate has at least one region (9) that has a smaller number (3, 4, 7) of layers than the reminder of the laminate, comprises the following steps: forming a stack (8) consisting of metal layers (1–4) and at least one fibre layer (5–7) impregnated with a binder, which stack (8) has a first series (11) of successive layers (1, 2, 5, 6) with a different surface size to a second series (12) of successive layers (3, 4, 7), such that one (12) of the series of layers protrudes with respect to the other series (11) of layers, placing an auxiliary tool (14) at the protruding portion (19) of the protruding series (12) of layers alongside the other series (11) of layers, which auxiliary tool (14) has a make-up that is the same as that of said other series (11) of layers, activating the fibre-reinforced bonding layers (5, 6, 7) under e
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: May 29, 2007
    Assignee: Stork Fokker AESP B.V.
    Inventor: Abdoel Faziel Rajabali
  • Patent number: 7175980
    Abstract: Methods of producing liquid handling biosensor devices are provided. The liquid handling biosensor devices allow detection of biomolecular interactions in liquid. The use of labels is not required and the methods can be performed in a high-throughput manner.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: February 13, 2007
    Assignee: SRU Biosystems, Inc.
    Inventors: Jean Qiu, Peter Li, Brian Cunningham
  • Patent number: 6955740
    Abstract: A laminate to be used in the manufacture of printed circuit boards is formed by contacting one surface of a layer of a conductive foil (e.g. copper foil) with protective-carrier sheeting (e.g., aluminum foil) and the other surface of the conductive foil with a dielectric layer (e.g., prepreg). The contacted layers are stacked and cut to desired dimensions. The process is performed without use of adhesive or mechanical attachment. Consequently, contamination and the occurrence of imperfections in the conductive foil of a laminate to be used in a printed wiring board can be substantially reduced.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: October 18, 2005
    Assignee: Polyclad Laminates, Inc.
    Inventors: Joseph C. Rapuano, Peter L. Samevall, Ronny Varul
  • Patent number: 6929711
    Abstract: A method of making a vehicle interior trim part includes forming an air-permeable substrate into a desired shape; positioning the formed substrate and a cover material on a vacuum mold such that the substrate extends between the cover material and the mold; and vacuum forming the cover material over the substrate.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: August 16, 2005
    Assignee: Lear Corporation
    Inventor: Eric J. Benninger
  • Patent number: 6881464
    Abstract: An apparatus and method that produces recording media using at least two platens. A first platen is movable relative to a second platen, and each platen has respective first and second support surfaces onto which substrates are placed, the first and second substrates each having inner and outer longitudinal surfaces. A centering device aligns the respective substrates relative to a one or more reference positions, a positioning system provides a degree of parallelism between the outer longitudinal surfaces of each of the substrates and produces a desired gap between the inner longitudinal surfaces of the substrates, and a dispensing unit which emits a liquid medium within the gap between inner longitudinal surfaces of the substrates.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: April 19, 2005
    Assignee: Aprilis, Inc.
    Inventors: David A. Waldman, Rod Hopwood, Richard T. Ingwall, YajPaul Panchu
  • Patent number: 6797086
    Abstract: Method and apparatus for thermal transfer overcoat technology. Throughput conditions are anticipated. Multi-stage preheating of the fuser is performed such that active heating during thermal transfer overcoat is eliminated. Thermal waves create an accumulated fuser heat that is a sufficient energy to maintain a substantially constant fuser temperature needed for one whole thermal transfer overcoat cycle.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: September 28, 2004
    Assignee: Hewlett-Packard Development Company, LP.
    Inventors: Miquel Boleda, David J. Arcaro, John Havard
  • Patent number: 6789595
    Abstract: At least when an upper glass substrate 3 held by an upper retention head 10 and a lower glass substrate 4 held by a lower retention head 11 are abutted on each other through a sealing material 5, air cylinders 25, 25 apply a lifting force balancing with a dead weight of the upper retention head 10 to the upper retention head 10 to cancel its dead weight. In this state, the upper glass substrate 3 and the lower glass substrate 4 are abutted on each other through the sealing material 5.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: September 14, 2004
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Ikuo Hayafuji, Shinichi Ogimoto
  • Patent number: 6783624
    Abstract: A modular headliner assembly (10) includes a headliner (12) having an appearance surface (13) and a back surface (14). At least one component (19, 20, 22, 23) is disposed adjacent the back surface (14) of the headliner (12). Furthermore, an integration sheet (24) is attached to the back surface for securing the at least one component (19, 20, 22, 23) to the headliner (12). A method of manufacturing the headliner (12) assembly is also disclosed.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: August 31, 2004
    Assignee: Lear Corporation
    Inventors: Richard Muehlbacher, Thomas Greiner
  • Publication number: 20040129381
    Abstract: An optical film laminate which is less apt to have adhesive deficiencies or cause adhesive soils. The optical film laminate comprises an optical film layer 1 and a pressure-sensitive adhesive layer 3, wherein non-tacky powders 5 are adhered to edge surfaces of the pressure-sensitive adhesive layer.
    Type: Application
    Filed: November 10, 2003
    Publication date: July 8, 2004
    Inventors: Masayuki Satake, Yasushi Takahashi, Yuji Saiki, Tominari Araki, Tetsuo Kaneko
  • Publication number: 20040040651
    Abstract: To provide a simplified method of making a multi-layer circuit board capable of observing a high density surface mounting of electronic parts, a method is provided for making a multi-layer circuit board including a first film (A) and at least two more films, second and third films (B and C), each being made of thermoplastic polymer capable of forming an optically anisotropic melt phase. The first film (A) has a low melting point (Tm1), and the second and third films (B and C) have respective melting points (Tm2B and Tm2C) higher than the melting point (Tm1) of the first film (A). And at least one of the second and the third films have a circuit pattern thereon. The first to third films (A to C) are thermo compressed together with the first film (A) interposed between the second and third films (B and C).
    Type: Application
    Filed: August 13, 2003
    Publication date: March 4, 2004
    Applicant: Kuraray Co., Ltd.
    Inventors: Toshinori Tsugaru, Tatsuya Sunamoto, Tadao Yoshikawa
  • Publication number: 20040031568
    Abstract: A device for connecting inner boards of a multi-layer board includes a plurality of conduction pieces such as copper rings on each inner board and a plurality of prepregs are located between the inner boards of a pile of the inner board. A radio heater is enclosed by a pressing member and connected to a radio heater device, the pressing member presses the pile of the inner boards and the conduction pieces is heated to melt the prepregs which release resin to connect the overlapped inner boards within a short period of time.
    Type: Application
    Filed: November 12, 2002
    Publication date: February 19, 2004
    Inventor: Joseph Jui-Chin Lin
  • Publication number: 20030157850
    Abstract: A reinforced composite material includes a laminate panel, a strengthening panel that includes a reinforcement embedded therein, and a layer of adhesive disposed between the laminate panel and the strengthening panel to adhere the laminate panel and the strengthening panel together. Preferably, the reinforcement in the strengthening panel may be fiberglass fibers, randomly oriented, or it may be provided in the form of a mesh or the like. In either case, the strengthening panel is preferably a plastic (polymeric) material of the type known as fiberglass reinforced polyester. Also provided is a method for the production of such a material.
    Type: Application
    Filed: February 20, 2002
    Publication date: August 21, 2003
    Inventor: Steven J. Taylor
  • Patent number: 6568148
    Abstract: The present disclosure involves a covering element for building surfaces and a method for the production thereof. The covering element includes a decorative visible side generally having a support plate having top and bottom surfaces, an upper transparent face sheet bonded to the top surface of the support plate, and a lower face sheet bonded to the bottom surface of the support plate. The upper face sheet has a support layer having cellulose in which an abrasion-resistant material is embedded in the form of corundum particles. In the present configuration, a decorative layer is applied to the bottom of the support layer by a color printing process. The decorative layer, which is underneath the support layer, is visible after all the layers have been pressed together under the application of heat. This process causes it to become transparent. The support layer and the decorative layer are covered with bonding material having melamine resin.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: May 27, 2003
    Assignee: Akzenta Paneele + Profile GmbH
    Inventor: Ralf Eisermann
  • Patent number: 6537412
    Abstract: A process and an apparatus are provided for producing multilayers having on each of their two outer sides an outer metal foil and between them at least one additional layer. These foils and/or layer(s) are connected to each other by intermediate layers impregnated with adhesive, and the foils of several multilayers are stacked on top of each other, while a separation layer is inserted between them, and are then simultaneously pressed together. It is essential that the metal foil be placed around the separation layer on its underside, end side and upper side in a U-shape before the separation layer is supplied to the multilayer structure.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: March 25, 2003
    Assignee: Robert Burke GmbH
    Inventor: Hans Bohn
  • Patent number: 6500295
    Abstract: A hot-melt web has a buffer adhesive layer of a thermosetting resin on a light transmissive, heat resistant resin support. The hot-melt web has the advantages of light transparency, heat resistance, weather resistance, controlled entrainment of bubbles and easy removal of bubbles during thermocompression bonding, provides a sufficient bonding force, and effectively corrects random deformations of a module sheet. The hot-melt web is suitable for use in the bonding, joining and laminating steps in the manufacture of optical discs such as DVD and flat panel displays, is easy to eliminate bubbles, and is effective for improving the quality of an associated product. A laminate using the hot-melt web and a method for preparing the laminate are also provided.
    Type: Grant
    Filed: November 2, 2000
    Date of Patent: December 31, 2002
    Assignee: TDK Corporation
    Inventor: Yuichi Kubota
  • Patent number: 6449915
    Abstract: A wall panel structure for controlling humidity within a building having a panel assembly attachable to an inner wall surface of the building including: a first panel having a surface with a first predetermined porosity to moisture; and a second panel secured to said first panel with a space for accomodating airflow between the first and second panels, the second panel having a surface with a second predetermined porosity to moisture, the first perdetermined panel porosity being greater than the second predetermined porosity to thereby absorb moisture from air being circulated between the first and second panels; whereby humidity of an environment within the building is controllable.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: September 17, 2002
    Assignee: Time & Space Tech. Co., Ltd.
    Inventor: Ki-Seok Park
  • Patent number: 6436223
    Abstract: A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: August 20, 2002
    Assignee: International Business Machines Corporation
    Inventors: David L. Edwards, Enrique C. Abreu, Ronald L. Hering, David C. Olson
  • Patent number: 6375777
    Abstract: Process for the production of a thermosetting laminate made of a number of continuous paper webs impregnated with a thermosetting resin. The dry webs are fed continuously between an upper and a lower press belt (101 and 102 respectively) of a continuous double belt press (100). The continuous paper webs are divided into at least two groups (10) each consisting of at least two sheets of which at least one is impregnated with a thermosetting resin. One or more separation sheets (1) are placed between the groups (10) of paper webs.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: April 23, 2002
    Assignee: Perstorp AB
    Inventors: Hans Sjölin, Håkan Larsson
  • Publication number: 20020036061
    Abstract: In a method for simultaneously welding to one another the layers of several pairs of thermoplastic foils arranged in a stack, a primary heat energy source is positioned between two pairs of thermoplastic foils, and welding heat energy is supplied to the two pairs via the primary heat energy source. The press for performing this method has two pressing elements for applying pressure to the stack of n pairs of layers of thermoplastic foils. The two pressing elements are positioned at opposite ends of the stack and force the layers of the pairs of thermoplastic foils toward one another. A stacked arrangement of n−1 flat, bar-shaped heating elements is aligned with the two pressing elements. Between two adjacent heating elements a respective pair of thermoplastic foils is received such that the pairs of thermoplastic foils alternate with the heating elements. The stacked arrangement of the heating elements is arranged in a plane that is perpendicular to the planes of the thermoplastic foils.
    Type: Application
    Filed: November 29, 2001
    Publication date: March 28, 2002
    Inventor: Heinz Hinterseer
  • Patent number: 6350631
    Abstract: An electronic device such as a semiconductor device, a method of manufacturing the same, and an apparatus for manufacturing the same, wherein by placing a ceramic substrate provided with a metallic thin film integrated into at least one selected from an upper surface and a lower surface of the ceramic substrate in its peripheral portion so as to extend both inside and outside a cavity of a mold for transfer molding, and positioning the metallic thin film in a position with which an upper mold and a lower mold of the mold come into contact, occurrence of cracks or breakage in the ceramic substrate is prevented by buffering the pressure applied to the ceramic substrate so as to prevent a distortion force from being caused even when the ceramic substrate is sandwiched and compressed between the upper mold and the lower mold.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: February 26, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Kobayashi, Takashi Araki
  • Patent number: 6328201
    Abstract: A multilayer wiring substrate which can be produced by a simple method and has a high connection reliability is disclosed.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: December 11, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Yasushi Inoue, Masakazu Sugimoto
  • Publication number: 20010026866
    Abstract: An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (E′) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1).
    Type: Application
    Filed: March 16, 2001
    Publication date: October 4, 2001
    Inventors: Yasuhiro Suga, Motohide Takeichi
  • Publication number: 20010015264
    Abstract: The invention concerns a process and a press for manufacturing laminated plastic cards, such as check guarantee cards, credit cards and the like of several films to be pressed together with each other. Moreover, operations are conducted with two compression plates which are movable relative to each other which accommodate in the compression slot the films to be pressed together with their pressure plates with the interposition of at least one compression pad. It is essential that this compression pad is held rigidly or displaceably on the press.
    Type: Application
    Filed: December 20, 2000
    Publication date: August 23, 2001
    Inventors: Wolfgang Stein, Jan Cerajewski
  • Patent number: 6264786
    Abstract: A temporary tattoo formed from an image-bearing laminate for attachment to human skin. The laminate includes a printable release coating on a backing sheet and an image printed with ink on the printable release coating. A film that is impenetrable to the ink is attached to the image, and includes adhesive on an exposed face of the film. The coating, image and film may be attached to human skin by pressing the combination of the coating, image, film and adhesive on skin. A method of creating the temporary tattoo includes the steps of providing a coated release sheet, printing an image on the coated release sheet, providing a film, covering the image with the film so that the image is located between the film and the coating of the release sheet to create a film/image/coating laminate, attaching the film/image/coating laminate to skin, and removing a backing sheet of the release sheet from the film/image/coating laminate.
    Type: Grant
    Filed: May 28, 1998
    Date of Patent: July 24, 2001
    Assignee: Mattel, Inc.
    Inventor: John Cromett