Abstract: A flame resistant RFID tag comprises: a first flame resistant polymer film having a major surface; an RFID device secured to the major surface of the first flame resistant polymer film, the RFID device having proximal and distal surfaces and comprising an antenna electrically connected to an integrated circuit; and a first flame resistant pressure sensitive adhesive layer covering the distal surface of the RFID device. Methods of making the flame resistant RFID tags are also disclosed.

Abstract: A polarising optical element is produced by firstly forming a polarizing multilayer structure (30) on a support (31). The structure comprises an orienting layer and a polarizing layer having dichroic compounds, the dichroic compounds being oriented by the orienting layer The multilayer structure is then pressed against one surface of the optical element (40) through the support, with a portion of adhesive placed between the structure and the optical element. The support (31) for the structure is then removed, leaving the structure (30) bonded to the optical element (40).

Abstract: A method of manufacturing filling strips for placement between a surface and a corrugated member wherein the corrugation defines a profile. The method includes: providing a sheet of material having a longitudinal axis and first and second major surfaces; forming at least one cut generally through the sheet, the at least one cut extending generally in a longitudinal direction of the sheet to follow a path that corresponds to the profile, wherein the at least one cut divides this sheet into at least two filling strips each having a corrugated member contacting surface that extends between the first and second major surfaces; and separating the sheet into the at least two filling strips.

Abstract: A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

Abstract: In an embodiment, an image element having a thermally sensitive coating on at least a first side thereof is provided. The image element may further include an adhesive for attaching to an object such as a pharmaceutical container. Information about the object may be thermally printed on the image element.

Abstract: A method provides instructions for the butt seam application of a surface covering laminate material. A quantity of a surface covering laminate is provided. A portion of the quantity comprises a web material having a first side and a second side. The first side comprises an adhesive. The second side is releasably joined to a release liner material. The first side of a first portion of the surface covering laminate is disposed in contact with a target surface. The first side of a second portion is disposed in contact with the target surface. At least a part of the second portion overlaps a part of the release liner of the first portion. The release liner is removed from the second portion. The release liner is removed from the first portion of the surface covering laminate together with that part of the second portion which overlaps the first portion.

Abstract: The floor tile is a laminate of two layers of flexible plastic sheet material laminated together in offset relationship to define an offset marginal portion for each of the layers. Each of the offset marginal portions have oppositely facing adhesive coated surfaces. A foam layer and/or a fiberglass sheet can also be included in the laminate structure of the floor tile. The floor tile can conform to surface contours of a floor base. The bottom layer of the floor tile, whether it is plastic sheet or foam, is conformable to surface irregularities of the floor base. A one piece releasable packaging device covers the oppositely facing adhesive coated surfaces of the offset marginal portions.

Abstract: A method of producing an LTCC substrate having improved cavity bondability is disclosed that involves providing a stack of green ceramic tape sheets having a cavity, placing a template having an opening corresponding to the cavity over the stack, placing a stretchable sheet of material coated with graphite or zinc stearate over the template, isostatically laminating the stack to produce an LTCC substrate having a cavity, and removing the template and sheet of stretchable material from the stack.

Abstract: A composite structure is disclosed. The structure includes one or several polyurethane layers, a support layer, in particular a textile support layer, as well as an optional adhesive layer placed between these layers. The composite structure is characterized in that at least one of the polyurethane layers contains a polyurethane having the formula (I) wherein O—R1—O— is the radical of a polyole with primary and/or secondary hydroxyl functional end groups, R1 and R2 independently represent an organic radical which includes aliphatic, cyclo-aliphatic, aromatic and/or heterocyclic groups, and n is an integer number between 1 and 50,000. Also disclosed is a method of manufacturing the composite structure and its use as imitation leather.

Abstract: A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release sheet, wherein the protective film-forming layer includes a thermosetting component, an energy ray-curable component and a binder polymer component; adhering a protective film-forming layer of the sheet to form the protective film onto a back surface of a semiconductor wafer having circuits on its surface; curing the protective film-forming layer by irradiation with an energy ray, and thereafter, further conducting the additional steps of (in any order): detaching the release sheet from the protective film-forming layer; further curing the protective film-forming layer by heating; and dicing the semiconductor wafer together with the protective film-forming layer with respect to each circuit.

Abstract: An adhesive sheet 301A having a predetermined form is laminated onto a long release sheet 2A, and a protective member 5A which is thicker than the adhesive sheet 301A is provided in a position so as not to overlap the adhesive sheet 301A when a laminate sheet 1A is wound into a roll. According to this laminate sheet 1A, defects can be prevented from forming on the adhesive sheet 301A when the laminate sheet 1A is wound into a roll.

Abstract: A heat-shrinkable multilayer film comprises (A) a first layer, which is an outer layer, and which comprises polyolefin; (B) a second layer comprising at least one member selected from the group consisting of polyolefin, polystyrene, and polyurethane, wherein the second layer has a thickness of from about 10 to 50 percent, based on a total film thickness; (C) a third layer comprising a polyamide having a melting point of 160° C. and below; and (D) a fourth layer, which is an outer layer, the fourth layer comprising polyester. The first layer preferably serves as a seal layer in a heat-shrinkable bag. The third layer provides enhanced orientability of the tape from which the film is formed, thereby providing improved total free shrink and lower shrink temperature. The third layer also provides greater optical clarity and permits the presence of a thicker polyamide layer, thereby increasing impact strength and improving the O2-barrier of the film.

Abstract: The invention generally relates to double-sided labels and methods of manufacture and use. More specifically, the invention relates to labels that include printed information on their front and back sides. The labels also include a detachable portion, which includes printed traces on its back side and is located between two portions of the label that contain adhesive on their back sides that permanently attach those portions to a product.

Abstract: A fabricating method for a multi-layer printed circuit board is provided. The method may include attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal film to each of the releasing films and a resist layer to each of the first metal films to form a base member. A first connection portion may then be formed on each of the first metal films, and a second connection portion may be integrally formed on each of the first connection portions. A second metal film may then be formed on each of the second connection portions so as to be electrically connected to the connection portions, and, in turn, to the first metal films. Specific portions of the second metal films may be etched to form copper patterns. Upper and lower portions may then be separated by the releasing films to form separate multi-layer printed circuit boards.

Abstract: Slitters cut through a first layer of film immediately prior to lamination of the first layer to a second layer of film to form a strip therebetween. The degree of bonding between the first and second layers is adjusted so that the strip can be removed without harming the rest of the film or destroying any barrier properties. The lamination process can utilize extrusion lamination or adhesive lamination to provide a variety of uses: removable coupons, prize disclosures, stickers, and an adhesive re-close strip.

Abstract: The present invention provides a method to pattern a substrate which features creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions. Formed upon the patterned layer is a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.

Abstract: Disclosed herein is a technique for manufacturing a superconducting tape grown epitaxially by a replication process. According to the technique, a long superconducting tape can be manufactured using a loop-shaped base. Further disclosed is a method for manufacturing a metal oxide device which comprises the steps of forming a solvent-soluble separation layer on a base having a single crystal or textured surface, forming a superconducting layer on the separation layer, forming a support layer on the superconducting layer, and removing the separation layer by dissolution in a solvent. According to the method, it is possible to manufacture a superconducting tape consisting of the superconducting layer and the support layer separated from the bath, and having the same crystallinity as that of the base (replication).

Abstract: The present invention relates to a vacuum-laminating method for adhesive films where adhesive bleeding is reduced.

Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

Abstract: The present invention relates to a heat-setting label sheet that is a polymeric transfer sheet that can be marked and transferred by the consumer. Also encompassed by the present invention is a method of transferring the heat-setting label sheets. The heat-setting label sheets of the present invention comprise a support; an optional pressure sensitive adhesive layer; an Adhesion Layer comprising a thermoplastic polymer which melts in the range of 50–250° C., a wax which melts in the range of 50–250° C., or combinations thereof; an optional opaque layer comprising a styrene-butadiene latex, thermoplastic polymer, elastomer, and optional pigment; and a second optional opaque layer comprising vinyl acetate-ethylene copolymer, thermoplastic elastomer, elastomer and optional pigment. The heat-setting label sheet of the present invention can be imaged by an electrostatic printer or copier, ink jet printer, offset or screen printing, craft-type marking, and the like.

Abstract: A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.

Abstract: The invention presented is a method for applying heat spreaders to a plurality of plasma display panels, including (a) providing a plurality of heat spreader composites, each of which comprises a heat spreader material having an adhesive thereon and a release material positioned such that the adhesive is sandwiched between the heat spreader material and the release material; (b) removing the release material from a plurality of the composites; and (c) applying at least one of the composites to each of the plurality of plasma display panels each such that the adhesive adheres the heat spreader material to the plasma display panel.

Abstract: A bladder which is particularly useful for a sole assembly of a shoe is formed of multiple layers of barrier film to provide multiple pressurized layers of cushioning fluid or gas when the bladder is filled. A multiple gas layer bladder enhances cushioning response by relying more on the response characteristics of the gas and reducing the amount of foam and the dependence on foam as a cushioning material. The internal film layers provide a truss-like geometry in cross section and act as tensile members to impart a generally smooth surface contour to the bladder. The bladder is constructed to provide complex regionalized cushioning profiles which are coupled to the anatomy of the foot and expected loads at known points.

Abstract: An activatable material and articles incorporating the same is disclosed. The activatable material includes at least three of an epoxy resin; a thermoplastic polyether; a blowing agent; a curing agent; and a filler. The activatable material is preferably used for sealing, baffling or reinforcing an article of manufacture such as an automotive vehicle.

Abstract: A method for processing a film. The method impressing the whole surface or a selected surface of the film to form protuberant structures on the film by using a transfer and an impresser which has grain projections formed thereon, wherein the protuberant structures have a protuberant shape with an opening hole on the tip or without an opening hole on the tip.

Abstract: A removable protective thermoformable coating for the packaging of electronic equipment. The coating includes a thermoplastic film and a microencapsulated silicone attached to one side of the film. The coating is vacuum formed and/or melted onto a component, releasing a one- or two-component silicone that forms a silicone layer. The silicone layer cures or hardens, and, together with the thermoplastic film, forms a protective coating. The coating may be removed or peeled off, as the silicone will preferentially adhere to the film. Also, a method for applying a protective coating to a component. The component is contacted with a thermoplastic film having silicone microcapsules on the contacting side of the film. The film is heated and drawn down over the component by pressure or vacuum, breaking the silicone microcapsules and releasing liquid silicone. The silicone is allowed to cure and form a coating.

Abstract: The method of forming a radiation shielding structure includes a first adhesive layer, a resin layer, and a metal foil laminated sequentially on a release layer of a plastic film. A metal layer pattern is formed from the metal foil. The first adhesive layer, the resin layer, and the metal layer pattern are formed sequentially from the bottom on a transparent substrate by separating the release layer from the first adhesive layer along an interface and then adhering the first adhesive layer to the transparent substrate.

Abstract: The present invention relates to an adhesive transfer device for selectively making a repositionably adherable substrate from a selected substrate. The device comprises a base substrate, a layer of pressure-sensitive repositionable adhesive disposed on the base substrate, a layer of pressure-sensitive permanent adhesive disposed adjacent to the repositionable adhesive layer opposite the base substrate, and structure providing a release surface. The release surface is removably engaged with the permanent adhesive layer opposite the repositionable adhesive layer and the base substrate so as to cover the permanent adhesive layer.

Abstract: A method of applying an edge electrode pattern to a touch screen. The method includes depositing, on a first surface of a decal strip, conductive material in the form of an edge electrode pattern, placing the first surface of the decal strip on one edge of a touch screen, applying heat and pressure to an opposite surface of the decal strip until the edge electrode pattern is transferred from the first surface of the decal strip to the touch screen; and removing the decal strip.

Abstract: Process for the production of variously decorated artefacts, comprising the steps of: preliminary preparation of the surfaces of the artefact, possible application of preliminary painting cycles or other surface treatments; covering or tight-wrapping up of the artefact with a transfer support bearing the decorations desired, realized from gas-tight thermoformable plastic material such as polyvinyl alcohol; creation of a vacuum between said transfer support and the artefact covered by the same, so that the support adheres to the shape of the artefact; and heating for the transfer of the decoration and the polymerization of the colors.

Abstract: A method for preparing laminating materials and a composite prepared therefrom, the method including providing at least one layer of interleaf, extruding a thermoplastic adhesive with a die, forming a composite by applying the at least one layer of interleaf to the adhesive before cooling the adhesive, and pressing the composite with rolls to adhere the at least one layer of interleaf to the adhesive.

Abstract: An improved process for producing ceramic thick film array elements is provided. In this regard, ceramic elements are formed on a temporary, or printing, substrate by screen printing or other forming methods. The temporary, or printing, substrate is advantageously provided with a release layer. This makes it possible to release the printed and soft-baked ceramic elements from the temporary substrate and transfer the ceramic elements to the sintering substrate. The contemplated release technique takes advantage of the phase transition of a liquid, e.g. water, to transfer the elements to a sintering substrate. After sintering and electrode deposition, the ceramic element array is bonded to a target substrate. Then, the sintering substrate is removed to make the array available for implementation in a variety of suitable environments.

Abstract: A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching portion (3a) of the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other portion (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

Abstract: A transparent, protective overcoat for a printed medium achieved with a thermal transfer material on a carrier ribbon that is heated and pressed to transfer a segment of thermal transfer material from the carrier ribbon onto the printable surface of a medium.

Abstract: Three novel types of release agents comprising waste products of several useful product-making processes well known in the art are disclosed. The first type of release agent is comprised of desugared sugar beet molasses, which is a waste product in the process of removing sugar from sugar beet molasses. The second type of release agent is sugar cane molasses. The third type of agent is a class of compositions comprising steepwater, brewers condensed solubles and distillers solubles.

Abstract: High quality full color images are printed with sublimation inks on transfer paper. The images are applied to prepared surfaces on parts, especially surfaces such as anodized aluminum prepared according to specific processes but also to other materials. Image transfer is accomplished by heating the part and/or the transfer paper and image under pressure. Once the image transfer is complete the parts are processed to ensure longevity of the image. The process may be used to apply images to parts having any 3 dimensional shapes.

Abstract: A label includes a base label having upper and lower opposed surfaces and first and second opposed ends. A base adhesive coats the lower surface of the base label. A top panel overlies the upper surface of the base label and is joined to the base label adjacent the first end. The top panel has an upper surface. A tab having upper and lower opposed surfaces overlies the upper surface of the base label. An adhesive patch is interposed between the base label and the tab adjacent the second end. The adhesive patch secures the lower surface of the tab to the upper surface of the base label. A laminate cover overlies the top panel and the tab. A laminate adhesive secures the laminate cover to the upper surface of the top panel and releasably joins the laminate cover to the upper surface of the tab.

Abstract: An ultraviolet post cure heat transfer label for application to an item includes a carrier web, a release coat applied to the carrier web and a composition including a cationic ultraviolet curable ink applied to the release coat. The ink has a solvent in a concentration of at a least about 20 percent by weight of the ink. The ink is dried in a non-UV process to form a storable film on the carrier web. The composition is transferred to the item and the ink is cured, by application of ultraviolet energy, following transfer to the item. A method for making the label and a method for marking an item are also disclosed.

Abstract: Method for forming a dye sublimation image in a substrate, particularly a plastic substrate, and apparatus to perform the method. According to the method taught by the present invention, a substrate is disposed on a perforated platen and a dye carrier having an image formed thereon of a dye sublimation ink is disposed on the substrate such that the image is in contact with the substrate. The substrate, dye carrier and at least a portion of the perforated platen are then covered with a flexible membrane. A clamping pressure is then applied to the substrate and the dye carrier through the membrane. Once the clamping pressure is attained, the substrate and dye carrier are first heated, then cooled. The invention disclosed herein further teaches a number of novel apparatus to effect the method, resulting in significantly superior dye sublimation imaging than heretofore attainable in rigid plastic sheets.

Abstract: A method of using an overlay (310) to verify or form folding, embossing, or rule die (320) comprising the steps of: forming an overlay consisting of the steps of: creating an imaged receiver sheet (140) having an image (210), a first thermal print layer (224), and a support layer (145); laminating a plastic sheet (260) with the imaged receiver sheet thereby encapsulating the image; removing the support layer forming an overlay with an electrostatic charge; and using the overlay to verify or form a folding, embossing, or rule die.

Abstract: A covering system is designed as an elongated strip of covering material having a fibrous layer and an integral moldable layer for mounting on the upper surface of boards, such as deck planks. In a preferred embodiment, strips are preferably secured to the length of the boards solely by a layer of a hot melt pressure sensitive adhesive carried by the strip. The moldable material is applied in a volume of about at least 185 grams per square meter. A removable release sheet covers the adhesive surface of the moldable material. The release sheet can include a positioning mechanism and indicia such as the direction of the pile and measuring guides. The moldable material provides sufficient adhesion across the width of the strip for both initial application and sufficient thickness for subsequently molding to the board surface for long term adhesion.

Abstract: A method and system is provided for producing an image on one or more surfaces of a wood or wood composite substrate by applying a receptor coat to at least the one or more surfaces of the substrate, transferring the image to the receptor coat using a variety of image transfer processes and applying a topcoat to the image and receptor coat. The system implements the above method using a series of stations and includes a series of platens connected together by a chain and a set of rollers that allow the substrate to travel through the stations on the platens. The resulting wood or wood composite product includes a substrate, a receptor coat disposed on one or more surfaces of the substrate, an image disposed on or within the one or more surfaces of the receptor coat and a top coat disposed on the image and receptor coat.

Abstract: An apparatus and method of manufacturing a wire mesh laminate includes wrapping a central core with multiple layers of mesh screen and a barrier layer having a higher melting point than the mesh screen to form a spool assembly. The spool assembly is then surrounded by an outer cover and is heated to sinter or fuse together the layers of mesh screen.

Abstract: A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.

Abstract: A laminate to be used in the manufacture of printed circuit boards is formed by contacting one surface of a layer of a conductive foil (e.g. copper foil) with protective-carrier sheeting (e.g., aluminum foil) and the other surface of the conductive foil with a dielectric layer (e.g., prepreg). The contacted layers are stacked and cut to desired dimensions. The process is performed without use of adhesive or mechanical attachment. Consequently, contamination and the occurrence of imperfections in the conductive foil of a laminate to be used in a printed wiring board can be substantially reduced.

Abstract: A method is provided for protecting a head element of a computer disk drive during rework operations by applying thioropolymeric protective coating or film to the head element after the disk drive has been opened. Application of the protective coating is preferably performed utilizing a solvent-mediated deposition process. Further aspects of the invention include the application of the protective coating to the head element prior to storage of the head element or prior to shipping the head element in order to facilitate rework of the head element or other components of the disassembled disk drive.

Abstract: Methods for making magazines that incorporate pop-up structures formed from two facing pages of the magazine and a strategically placed pop-up piece that is adhesively affixed to both facing pages so as to open into an attention-attracting three-dimensional configuration when the magazine is opened to those two pages. The methods are efficient, economical and well adapted to high speed production using a novel integral continuous strip of pop-up pieces arranged end-to-end, and accordingly, the distribution of magazines incorporating three-dimensional pop-up structures becomes a reality.

Abstract: Valves and methods for manufacturing the valves are disclosed. The valves are formed from a plurality of flexible polymer layers. A radio frequency bonding process, or the like, is utilized to form welds between the various layers. In general, a sub-assembly is formed that includes a valve layer bonded to a substrate layer. The sub-assembly is bonded to a second element such that a channel is formed between the valve layer and the second element. The channel includes an inlet, an outlet, and a pair of weld beads located in the inlet that place the inlet in an open configuration.

Abstract: A method of forming an overlay (310) to form a rule die (320) comprising the steps of: forming an overlay using a method consisting of the steps of: creating an imaged receiver sheet (140) having an image (210), a first thermal print layer (224), and first support layer (150); laminating an imageless receiver sheet (160) having a second thermal print layer (228) and a second support layer (170) with the imaged receiver sheet, thereby encapsulating the image; removing the first support layer; and removing the second support layer. The overlay has an electrostatic charge to verify or form the rule die.

Abstract: A business form is provided which is particularly useful in shipping products where certain preprinted information can be provided and then individualized information is printed before the form is applied to a substrate. The form includes a face ply which has a pattern of adhesive applied to at least a portion of the inner face, and a release liner which includes a pattern of adhesive which exposes a portion of the release liner to direct adhesive contact to the face ply without intervening release coating to permanently adhere a part of the release liner to the face ply. The release liner has a surrounding protective border provided with release coating on the release face thereof and which is removed prior to application to the substrate, and a slip which remains with the form as applied to the substrate. The face ply includes lines of perforation defining a central portion.