Abstract: A manufacturing method of trademark label of the present invention comprises a process of making rubber sheet which produced by compounding the ingredients of natural rubber composite, a process of cutting the rubber sheet according to the design of trademark label, a process of spreading primer on adhesion side of cut trademark label and drying at normal temperature for about 5 minutes, a process of spreading binder on the primer-spread and dried part of trademark label, a process of inserting the glue-spread trademark label into the cavity of metallic mold and gluing (first gluing process) the trademark label on artificial leather, a process of removing unnecessary impurities of trademark label attached to artificial leather (by first gluing process), a process of inserting trademark label whose impurities are removed into the metallic mold and hot-pressing at the temperature of about 150°, and a process of refrigerating the trademark label hot-pressed on artificial leather to the temperature of about 5° C.

Abstract: An active layer wafer having a larger diameter is placed over a stationary supporting substrate wafer having a smaller diameter. A pusher plate is pressed against an orientation flat of the larger wafer to move the wafer substantially in the horizontal direction. In the course of the pressing operation, the pusher plate is also pressed against the orientation flat of the smaller wafer so as to move the two wafers together. Then, as a result of each of the cut sections for alignment of the wafer being pressed against an aligning plate, the larger wafer and the smaller wafer can be bonded to each other with their centerlines and orientation flats aligned with respect to each other.

Abstract: Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.

Abstract: A method of making a boxer-style pant having side seams, a contracted crotch region and hanging legs. A flat web is provided. Portions are removed from the flat web to define leg openings. The flat web is then contracted either elastically or inelastically in selected areas along the flat web between the leg openings. The flat web is cut into separate pieces, folded and side seams are formed. The pant may include an absorbent.

Abstract: A method for fabricating a piezoelectric macro-fiber composite actuator comprises making a piezoelectric fiber sheet by providing a plurality of wafers of piezoelectric material, bonding the wafers together with an adhesive material to form a stack of alternating layers of piezoelectric material and adhesive material, and cutting through the stack in a direction substantially parallel to the thickness of the stack and across the alternating layers of piezoelectric material and adhesive material to provide at least one piezoelectric fiber sheet having two sides comprising a plurality of piezoelectric fibers in juxtaposition to the adhesive material. The method further comprises bonding two electrically conductive films to the two sides of the piezoelectric fiber sheet. At least one conductive film has first and second conductive patterns formed thereon which are electrically isolated from one another and in electrical contact with the piezoelectric fiber sheet.

Abstract: Fabricating roll-good fuel cell material involves laminating first and second bonding material webs having spaced apart windows to first and second surfaces of a fuel cell membrane web. First and second active regions of the membrane web are positioned within the respective bonding material windows. Third and fourth gasket material webs having spaced apart windows are respectively laminated to the bonding material on the first and second membrane web surfaces. The bonding material windows align with the respective gasket material windows so that at least some of the bonding material extends within the respective gasket material windows. Fluid transport layer (FTL) material portions cut from fifth and sixth FTL material webs are laminated to the respective first and second active regions. The FTL material portions are positioned within respective gasket material windows and contact the bonding material extending within the respective gasket material windows.

Abstract: The present invention is a laminate comprising at least one layer of an polyallylamine-based coating that is and in direct contact with at least one other polymeric layer.

Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.

Abstract: The present invention is directed to a laminate having a layer construction of metal-insulating layer-metal or a layer construction of metal-insulating layer, which laminate meets conditions for developing large adhesive strength between the insulating layer and the metal, as well as to an insulating film and an electronic circuit using the laminate. The laminate has a layer construction of first metal layer/insulating layer/second metal layer or a layer construction of metal layer/insulating layer. The insulating layer 1 has a multilayer structure of two or more layers. The layers on the side of the adhesive interface with each metal layer (a copper foil 3 and an SUS foil 4), out of the layers constituting the insulating layer 1, each are a thermoplastic resin layer 2. The minimum value of the storage modulus at a temperature at or above Tg of the thermoplastic resin layer 2 is not more than 106 Pa.

Abstract: A system and method to control the head suspension assembly static attitude during the manufacturing process are disclosed. A loading fixture loads and supports a head suspension while a slider is attached. A pitch static attitude and roll static attitude (PSA/RSA) monitor takes a first measurement of the pitch static attitude and roll static attitude of the head suspension. A rotatable positioning tool holds the slider in a position relative to the head suspension for attachment and to adjust the position of the slider in response to the first measurement.

Abstract: By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.

Abstract: A method of forming a laminated beam includes assembling a plurality of individual wood laminations in a juxtaposed relationship, and joining the assembled laminations together to form a laminated beam. The assembled laminations define a tension zone of individual wood laminations, a core zone of individual wood laminations, and an compression zone of individual wood laminations. The average thickness of the laminations in the tension zone is less than the average thickness of the laminations in the core zone, and the average thickness of the laminations in the compression zone is less than the average thickness of the laminations in the core zone.

Abstract: A method is disclosed for providing electrical connections to electronic elements within a multilayer module. The method includes providing first and second active layers having first and second edges, respectively. Each active layer includes a flexible, polymer substrate and at least one electronic element formed within the substrate. Electrically-conductive traces provide electrical connections from the first and second edges to the electronic elements. An adhesive is applied to at least one of a top surface of the first active layer and a bottom surface of the second active layer and the top surface of the first active layer is adhered to the bottom surface of the second active layer. The first edge and the second edge are aligned with each other thereby forming a side of the multilayer module. Electrically-conductive lines are applied along the side of the multilayer module to provide electrical connections to the traces.

Abstract: A method for producing information carriers in the form of cards, in particular credit cards, passes, identification cards, admittance cards etc., the laminating process including placing at least one card template which is to be sized, preferably a laminate consisting of a plurality of sized card layers, into a hollow mold and subjecting it to a simultaneous action of pressure and heat for a predetermined time. The material placed into the hollow mold is heated over at least one large area, as known per se by the use of heating plates, and in the peripheral, narrow, outer boundary region of the inserted material quantities of heat flowing off per se there are retained, blocked in, reflected and concentrated back onto the laminate template.

Abstract: Disclosed is a process for making a ceramic armor plate. A backing element having a known two-dimensional size is provided. A plurality of ceramic armor tiles are placed side by side to form a layer of ceramic armor tiles on a front surface of the backing element, and the layer of ceramic armor tiles is affixed to the backing element. An abrasivejet cutter is used to cut continuously through at least two adjacent ceramic armor tiles of the affixed layer of ceramic armor tiles, and through a corresponding portion of the backing element affixed thereto, so as to delineate a portion of a ceramic armor plate.

Abstract: A method for bonding one surface to a gold surface comprises the following steps: (a) mixing a solution containing sulfur-containing alkoxysilane; (b) treating the gold surface with the solution; (c) adding sulfur-containing alkoxysilane to an adhesive material; (d) applying the adhesive material with additive on one of both surfaces; and (e) pressing the surfaces against each other while the adhesive material therebetween sets.

Abstract: A method of simultaneously making a plurality of composite cartons from two or more individual cartons on a common assembly surface. A plurality of first singular cartons is positioned in a predetermined array on an assembly surface. Adhesive is positioned at one or more locations on each first singular carton. A plurality of second singular cartons is positioned in a predetermined array adjacent to the array of first singular cartons on the assembly surface such that the adhesive bonds each first carton to a corresponding second carton. The method steps may be repeated. A detector may be used to detect the presence or absence of adhesive. A composite carton comprising three or more individual cartons may be constructed. The individual cartons in the composite cartons may be separable from each other. An object may be positioned between each of the bonded individual cartons in the composite cartons.

Abstract: The invention relates to polyester/polyolefin laminate materials having improved properties. The invention also relates to copolyester/polyolefin laminate materials having improved properties. The laminates herein exhibit improved results in flammability studies. The invention further relates to methods of making laminate structures.

Abstract: A composite product for use in a motor vehicle body and a method and apparatus for producing that product is disclosed. The product has a first blank with a predetermined thickness, a second blank with a predetermined thickness and dimensioned to provide the composite product with a combined thickness of the first and second blanks only in at least one required area of the composite product. A wire mesh layer is provided between the first and second blanks. An adhesive is selected to bond the first and second blanks together with the wire mesh layer interposed therebetween.

Abstract: Methods and apparatus for masking a planar surface and providing information at the point of use of an assembly including the planar surface are disclosed. In one advantageous method in accordance with the present invention, a masking material comprising a substrate and an adhesive disposed over a first face of the substrate is provided. One or more strips of masking material are applied to a planar surface, and an information bearing sheet is applied over the one or more strips of masking material.

Abstract: Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

Abstract: Methods of applying tape to a surface. An embodiment of the invention provides a method of applying a tape to a surface, comprising the steps of: providing a tape, wherein the tape includes a tape backing and an adhesive on the tape backing, and wherein the tape is on a liner; cutting the tape to provide a first length of tape, a second length of tape, and a removable portion of the tape located between the first length of tape and the second length of tape wherein a portion of the first end of the removable portion is cut at an angle oblique to the length of the tape; removing the removable portion of the tape from the liner; separating the first length of tape from the liner; and applying the first length of tape to a surface.

Abstract: Cards may be singly fed along a primary lane so that a batch of cards is fed along the primary lane. One or more cards may be selectively diverted from the primary lane to a secondary lane such that only some of the batch of cards are diverted. The cards from the batch in the primary lane and the secondary lane are then affixed to a carrier so that each card of the batch is affixed to the carrier. The diversion may be achieved by a reciprocating gate between the primary lane and the secondary lane and a conveyor running on a bias between the primary lane and the secondary lane at the downstream location of the gate.

Abstract: A process for the fabrication of a speaker enclosure for a set of drivers utilizing a series of templates including a base template having an external circumferential edge, corresponding to the preselected external shape of the enclosure, a preselected number of guide holes placed within said circumferential edge, a plurality of internal circumferential edges creating mounts for each driver and corresponding port. The process includes the step of calculating the volumes of cavities to enhance the sound reproduction ability of the drivers. Additional templates including the external circumferential edge and guide hole placement of the base template and further including internal circumferential edges to complete the fabrication of the cavity volume further incorporating internal supports within said cavity volumes placed whereby said supports do not inhibit the mounting of said drivers into said cavities.

Abstract: A method of manufacturing a disposable undergarment includes moving a web of body panel material in a longitudinal machine direction and cutting the web of body panel material along the longitudinal machine direction to thereby form a rear body panel web and a front body panel web each having a maximum rise and a minimum rise respectively. The maximum rise of each of the rear and front body panel webs is greater than the minimum rise of a corresponding one of the rear and front body panel webs. The method further includes shifting at least one of the rear and front body panel webs in the longitudinal machine direction and thereby aligning the maximum rises of the rear and front body panel webs. The method further includes separating the rear and front body panels in a lateral cross direction, such that the maximum rises of each of the rear and front body panel webs are spaced apart in the lateral cross direction and form a gap therebetween in a non-overlapping relationship.

Abstract: A composite, chemically integrated material structure bearing load around a close-loop structural configuration in cross-section, has a plurality of regions through the cross-sectional thickness imparting at selectively predetermined locations within the cross-section, high tensile strength and high compressive strength. A method for forming such an integrated, composite material structure onto and incorporating an established or pre-existing, but likely deteriorated, concrete or brick structure, while achieving precise, predetermined resulting interior diameter and other structural dimensions is described.

Abstract: An RFID webstock containing a relatively high pitch-density array of semiconductive chips is provided and joined to a web bearing relatively widely spaced antennas in a continuous process. The RFID webstock is separated or cut into individual chip sections, with the spacing of the chips being increased as the RFID webstock is die cut. The individual chips on the sections are then joined to corresponding antennas to form an RFID inlay stock. This process is conducive to high speed roll-to-roll production of RFID tag and label roll stock.

Abstract: A method of forming a reinforced polymer film structure is disclosed that includes the steps of slitting a biaxially oriented polymer film web having a top face and a bottom face into a first portion and a second portion, identifying the first portion and the second portion, and placing the first portion atop the second portion, such that the bottom face of the first portion is adjacent the top face of the second portion. This structure provides an impact and tear resistant laminate. Also disclosed is a method of forming a polymer film structure by identifying a molecular orientation direction profile of two portions of biaxially oriented polymer film and layering the two portions such that a molecular orientation direction profile of one does not coincide with a molecular orientation direction profile of the other.

Abstract: The present invention is used for setting and bonding fasteners to support surfaces. The fasteners are provided with connecting surfaces which are coated with a dry hot-melt-type adhesive on the bare side thereof. The adhesive can be reactivated by means of heat treatment. The setting device includes a housing (1) having a receiving component (2) that is displaceably guided therein and is used for the fastener (3) as well as means for quickly heating the hot-melt-type adhesive, lowering the receiving component (2) and pressing the adherent (25) after the adhesive has been melt on. Heating is carried out by means of hot air (H) which is supplied passing the housing (1) and in that the receiving component (2) is surrounded by a closed wall (7) that extends from the hot air discharge location in the housing (1) to the fastener (3). The hot air (H) can thus be conveyed to the adhering hot-melt-type adhesive before or while the fastener (3) rests on the support surface (25).

Abstract: A method for manufacturing a friction plate in which a plurality of frictional material segments are adhered to a substantially annular core plate. The method previously registers the frictional material segments to adhesion positions, and presses the core plate to which adhesive agent is applied and the frictional segments to perform temporary adhesion. Further, an apparatus for manufacturing a friction plate in which a plurality of frictional material segments are adhered to a substantially annular core plate. The apparatus comprises a member for registering the frictional material segments while holding the frictional material segments in a state arranged in the adhesion positions.

Abstract: In order to manufacture a friction plate for a wet clutch including a core plate and a friction member bonded to at least one of annular flat surfaces of the core plate, each friction member including friction member segments, an oil groove being provided between adjacent friction member segments, there is adopted a method including: a step of making a plurality of cuts in at least one band-shaped friction member material in a lengthwise direction to form a plurality of friction member strips; a step of retaining the friction member strips with distances corresponding to the oil grooves being formed between adjacent friction member strips; a step of cutting off a portion of a tip end of at least one of the friction member strips which are located at opposite ends to thereby secure the oil grooves between the friction member segments on the annular flat surface; and a step of superposing friction member segment correspondence portions forming the tip ends of the plurality of friction member strips to the annul

Abstract: Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

Abstract: The printed web of paper, from which label booklets are formed, is provided in a punching unit with punch cuts, which form at least one row of punched areas and non-punched areas, wherein the punched areas remain joined to the non-punched areas respectively along a line running in the transverse direction of the web of paper. In the folding unit each punched area is deflected out of the plane of the web of paper by a blast of compressed air, is folded over contrary to the running direction by means of a pressure roller and pressed onto the associated non-punched area. In the laminating unit a transparent web of plastic provided with a self-adhesive coating on its underside is laminated over the folded web of paper and pressed so that a multilayered web is formed, which on its underside lies on a support web, which is provided with an anti-adhesive coating on its side facing the web of paper.

Abstract: In a bonding method in which two display panels 7A, 7B are held by the two panel holding portions 31a, 31b provided on the panel support table 31 positioned by the XY? table 30 so as to position the first pressure bonding head 25A and the second pressure bonding head 25B for conducting pressure bonding individually, according to the result of positional detection of the camera 37 and the recognizing portion 65, the display panel 7A is positioned to the first pressure bonding head and an object of pressure bonding is bonded by pressure. In this pressure bonding step, under the condition that a state of holding the display panel 7A is released, the display panel 7B is positioned to the second pressure bonding head 25B.

Abstract: The apparatus of attaching a polarizing plate includes a base body, a first cutting out module, a first protection sheet strip module and a first polarizing plate attaching module. The first cutting out module cuts out a first polarizing plate from a first mother polarizing plate. The first cutting out module is disposed on the base body. The first protection sheet strip module strips a first protection sheet from the first polarizing plate. The first polarizing plate is stripped off the first protection sheet to be a first stripped polarizing plate. The first protection sheet strip module is disposed on the base body. The first polarizing plate attaching module attaches the first stripped polarizing plate to a first face of a liquid crystal display unit cell of an assembled substrate. The first polarizing plate attaching module is disposed on the base body.

Abstract: A tape applicator. A preferred embodiment of the invention provides a tape applicator having a tape head, a x-axis actuator for moving the tape head in the x-axis direction, and a y-axis actuator for moving the tape head in the y-axis direction. The tape head preferably includes: i) a base; ii) a tape roll holder attached to the base; iii) a tape application roller attached to the base for applying the tape to a surface; iv) a cutter attached to the base for cutting tape to form a removeable portion of a tape; and v) a remover attached to the base for removing the removeable portion of the tape. The present invention also relates to methods of applying tape to a surface.

Abstract: A process for placement of indicator elements in a disposable wearing article includes a step in which indication sheets each having a pair of indicator elements are placed on an outer web, a step in which the indication sheets are joined to the outer web, a step in which an inner web is placed upon and joined to the outer web to form a composite web, a step in which the composite web is divided into first and second composite webs and thereby the paired indicator elements are divided into the individual indicator elements, a step in which the first and second composite webs are separated from each other, a step in which a liquid-absorbent laminated panel is joined to respective upper surfaces of the first and second composite webs and a step in which the first and second composite webs and the panel are cut together to obtain individual articles.

Abstract: The invention relates generally to the bonding of one or more sliders in styrene and acrylate polymers. More particularly, the invention relates to planarized slider assemblies formed by using debondable solid encapsulants comprised of styrene and acrylate polymers. The invention also relates to methods that use such encapsulants in conjunction with resists to produce magnetic head sliders having patterned air-bearing surfaces.

Abstract: The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.

Abstract: The strength of wood composites, including hybrid composites comprising wood members bonded to reinforced polyester members, is improved by modifying the polyester components with a polyisocyanate. Wood composites adhesively bonded with polyester resins modified according to this invention are particularly desirable for use in applications where exterior exposure is contemplated.

Abstract: A method and apparatus for making a friction clutch plate includes cutting a supply of friction material into a plurality of individual shaped segments. The cut segments are moved in a first horizontal linear direction to a position adjacent a shuttle assembly. At least a first cut segment is engaged by the shuttle assembly which transfers the first cut segment in a second horizontal linear direction which is substantially perpendicular to the first horizontal linear direction. The first cut segment is deposited in a first indexing fixture. The remaining cut segments are sequentially moved in the first horizontal linear direction to the position adjacent the shuttle assembly. At least a second cut segment is engaged by the shuttle assembly and is transferred in a third horizontal linear direction which substantially perpendicular to the first horizontal linear direction.

Abstract: Method and apparatus for registering and bonding upper and lower substrate plates together through a sealer material and in such a way as to form a gap of a predetermined width between the two substrate plates. Registered substrate plates are provisionally pressed to form a joined substrate assembly, which is then pressed under heated conditions at a hot press station, thereby compressing the sealer material into a flattened form and at the same time thermally hardening the sealer material to form a predetermined gap space between the two substrate plates. In order to correct positional deviations which occur to the upper and lower substrate plates in the course of the hot pressing, on the basis detected positional deviations of upper and lower substrate plates of a hot-pressed substrate assembly, upper and lower substrates are set in offset positions instead of aligned positions when registering them at the provisional press station to cancel predicted positional deviations at the hot press station.

Abstract: The present invention provides thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. The thin-laminate panels of the present invention may be tested for manufacturing defects, such as short circuits, before further processing of the panels to produce PCBs. “Finishing” methods for shearing sheets of unfinished thin-laminate into the finished thin-laminate panels of the present invention in a manner that does not cause smearing of the conductive material onto the dielectric layer are also provided.

Abstract: An improved anisotropic bonding system and method connects two conductive surfaces together using an anisotropic material having elastic conductive particles dispersed in an insulating, heat-curable carrier. The system monitors bond resistance in real-time during the bonding process and controls the application of pressure to the bond based on a feedback signal corresponding to the bond resistance. When the bond resistance reaches a predetermined value, the applied pressure is reduced to a holding/clamping level to prevent over-compression as the curing schedule completes curing of the insulating carrier. By monitoring and responding to the bond resistance in real time during the bond compression process, the system prevents bond resistance increases caused by over-compression and conductor damage.

Abstract: A tape feed for a postage meter which uses the envelope transport system of the postage meter to feed a tape from a tape receptacle into the path of the envelope feed system. The tape receptacle is pivotally mounted adjacent one of the belts of the envelope transport system. A solenoid is connected to the tape receptacle through a cam pin and cam slot arrangement for providing the pivotal movement. When the solenoid is energized, the tape receptacle is pivoted into a position wherein the belt extends into a slot in the receptacle and grips a tape to discharge a tape from the receptacle and feed it into the envelope transport system. When the solenoid is de-energized, the solenoid pivots the receptacle into a position wherein the tapes in the receptacle are out of contact with the belt. A sensor is provided to de-energize the solenoid when the belt moves the leading edge of the tape into gripping relationship by the envelope transport system.

Abstract: Adhering apparatus for plate shaped matter includes absorbing-and-holding means 10, 20 serving also as electrodes for absorbing and holding respectively first optical disc substrate 1 and second optical disc substrate 2, optical disc substrate moving means 40 for moving second optical disc substrate 2 to be approached to first optical disc substrate, distance detecting means 50 for detecting the distance between optical disc substrates, velocity controlling means 60 for controlling a relative velocity of the second plate shaped matter to the first plate shaped matter and controlling the plate shaped matter moving means in such a manner that the relative velocity immediately after and at a time point at which the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter is slower than that immediately before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter; and voltage application means 71 for a

Abstract: A clutch plate consists of an annular support plate carrying friction liners adhesively bonded on at least one lateral fastening face of peripheral radial blades of the support plate, by a method including an adhesive applying step which consists in depositing a predetermined quantity of adhesive on, but only on, an adhesion zone located on the lateral fastening face of each successive radial blade. This deposition is performed by an adhesive applicator having an adhesive applying zone of a form corresponding to that of the adhesion zone on the blade. The method is performed in an apparatus having at least one applicator head.

Abstract: The method includes selecting two or more types of ceramic materials (202, 204), each having a distinct set of electrical properties different from the other of the types of ceramic materials. A substrate pattern can also be selected. The substrate pattern can comprise at least two types of distinct substrate areas having the distinct sets of electrical properties of the ceramic materials. Each distinct area can be selected so as to have dimensions much smaller than a wavelength at a frequency of interest. The ceramic materials (202, 204) can thereafter be fired and then cut into a size and shape consistent with the distinct areas to form dielectric pieces (206, 208). The process continues by selectively arranging the dielectric pieces on a base plate (302) in accordance with the pattern to form the textured ceramic dielectric substrate.

Abstract: The present disclosure relates that constraining a substrate into a convex arc prior to mounting and affixing of any chips, allows those chips to achieve exemplary final chip-to-chip abutment when the substrate is released and allowed to return to stasis. This is particularly of use where there are any intervening thermal cycles, and the thermal temperature coefficients of expansion for the chip/die and any substrate/mount are significantly different. This will allow the utilization of otherwise more desirable materials for the substrate in spite of some mismatch in thermal coefficients that may exist between the substrate and chips.

Abstract: A moistureproof multilayer film, including a composite film having a non-moisture absorbing resin layer and a vapor deposited film of an inorganic oxide or a metal formed on at least one side of the non-moisture absorbing resin layer, the multilayer film having such a layer structure where the vapor deposited film surface of the composite film is laminated through an adhesive layer on a vapor deposited film surface of another composite film or a surface of another non-moisture absorbing resin layer, wherein a total number (n) of the deposited films laminated adjacent to the adhesive layer is 2 to 8, and wherein a moisture permeabihty (W; unit: g/m2.day) as measured under conditions of a temperature of 40° C. and a relative humidity of 100% satisfies a relation represented by equation W≦(1/n)×0.20, and a method for producing the moistureproof multilayer film including heat-treating the multilayer film in a hot dry atmosphere having a temperature lower than 140° C. but not lower than 55° C.