Abstract: A method and apparatus are provided for separating a discrete element from a first substrate web, moving at a first speed, and placing the discrete element on a second substrate web, moving at a second speed. The apparatus includes a first station, wherein perforations are made in the first substrate web, and a second station, wherein the discrete element is separated from the first substrate web at a line of perforations and the discrete element is transferred to a positioned on the second substrate web. The first station includes a perforation cutter assembly and conveyer assembly. The perforation cutter assembly includes first and second rollers with a cutting blade, with a discontinuous edge, and an anvil surface, respectively, to make perforations in the first substrate web. The second station includes a separation and transfer mechanism having separation and transfer segments for separating and transferring the discrete element from the first substrate web to the second substrate web.

Abstract: The present application generally relates to adhesive transfer devices. One embodiment of the application discloses a hand-held actuatorless adhesive transfer device. Another embodiment of the application discloses an adhesive transfer device for applying adhesive to a side edge portion of a selected substrate.

Abstract: A process for fabricating a BGA flip chip package containing a stiffener or heat spreader monitors edges of the adhesive that attaches the stiffener or heat spreader. The monitoring ensures that the adhesive extends beyond the centers of the outermost solder balls in the BGA. Stress at the edge of the adhesive thus does not cause warping or variations within the BGA.

Abstract: The present application discloses a substrate processing apparatus having a pair of pressed together supply rolls for applying pressure to perform the processing operation. The present application also discloses a method for processing a substrate wherein a pair of supply rolls are pressed together.

Abstract: A laminated capillary array assembly having a plurality of capillaries substantially entirely enclosed by a first and a second substrate laminated together. Also disclosed is a capillary array electrophoresis system including the above capillary assembly attached to a sample intake block and an array fitting. Also described is a method for making a laminated capillary array assembly by placing a first substrate on a template having a desired shape, arranging capillaries on the first substrate, and laminating a second substrate on the first substrate to enclose the capillaries between the substrates.

Abstract: A method of producing a succession of self-adhesive labels carried on a backing of release material including the steps of; a) providing an elongate web comprising a self-adhesive support web having a backing of release material; b) die-cutting and removing from the backing of release material a succession of portions of the support web; c) adhering a succession of multilaminar label portions to the succession of intermediate parts of the support web; and d) adhering a succession of portions of a self-adhesive overlaminate to the upper surface of the succession of multilaminar label portions so that each portion of the overlaminate substantially covers the respective multilaminar label portion and a respective portion of the backing of release material which is adjacent to the respective multilaminar label portion, the second portion of the upper surface of each intermediate part of the support web being left substantially uncovered by the overlaminate.

Abstract: The present application discloses a substrate processing apparatus having a pair of pressed together supply rolls for applying pressure to perform the processing operation. The present application also discloses a method for processing a substrate wherein a pair of supply rolls are pressed together.

Abstract: Radio frequency identification labels are made in a high speed and effective manner in a variety of different ways utilizing a number of different sources of RFID inlets, each inlet including an antenna and a chip. A plurality of webs are matched together and RFID labels are die cut from the webs, to produce lined RFID labels. Alternatively linerless RFID labels are produced from a composite web with a release material on one face and pressure sensitive adhesive on the other, the labels formed by perforations in the web.

Abstract: Radio frequency identification labels are made in a high speed and effective manner in a variety of different ways utilizing a number of different sources of RFID inlets, each inlet including an antenna and a chip. A plurality of webs are matched together and RFID labels are die cut from the webs, to produce lined RFID labels. Alternatively linerless RFID labels are produced from a composite web with a release material on one face and pressure sensitive adhesive on the other, the labels formed by perforations in the web.

Abstract: This invention provides a method and apparatus for applying tape tabs to a traveling web, for example, for placement of fastening tabs on a running web of disposable diapers. The invention provides a cutting roll positioned to cut segments from a continuous infeeding web of tape material against a rotating anvil. The anvil, which is traveling at a speed equal to or very close to that of the infeeding tape web, carries the tape segments to a point on its tangency where a higher-speed traveling diaper web most nearly approaches, at which point the traveling diaper web is displaced slightly toward the anvil by means of a protuberance acting against the web. This movement causes it to come into contact with the next available tape segment, which becomes adhered to the higher-speed traveling web. This process provides for operation at higher speeds, higher efficiencies, greater flexibility and lower noise levels than previous processes.

Abstract: This disclosure relates to the manufacture of lites (glass sheets) which have at least a pair of thin spacers applied thereto which maintain the lites in spaced relationship when stacked upon pallets, wrapped and shipped. The spacers are preferably only partially adhered to the lites, either by weak bonding adhesive or electrostatically, and can be readily removed during end-use applications. The spacers are applied automatically during production runs of the lites, and the spacers are applied from above or from below relative to the path of travel of the lites.

Abstract: An adhesive lamination has patches of an adhesive layer which correspond to predetermined positions on a plurality of circuit boards, and the adhesive layer is applied across the plurality of circuit boards. This adhesive lamination is composed of a first separation sheet, a second separation sheet and the adhesive layer interposed between the first and second separation sheets. A number of patches of the adhesive layer are formed on the first separation sheet and arranged so that the length of the patch of the adhesive layer is approximately parallel to the short side of the first separation sheet.

Abstract: A process for applying a portion of a closed zipper inside a container of flexible material, in which a segment or portion of a closed zipper-strip is first applied by a fixing device upon the inner sides of a film of flexible material, prior to cutting of the zipper strip portion from the remainder of the zipper strip. The zipper portion is applied in such a position that it will not interfere with the subsequent sealing along transverse seal lines defining the opposite sides of the container.

Abstract: Radio frequency identification labels are made in a high speed and effective manner in a variety of different ways utilizing a number of different sources of RFID inlets, each inlet including an antenna and a chip. A plurality of webs are matched together and RFID labels are die cut from the webs, to produce lined RFID labels. Alternatively linerless RFID labels are produced from a composite web with a release material on one face and pressure sensitive adhesive on the other, the labels formed by perforations in the web.

Abstract: A heat spreader attachment method for making a cavity down plastic chip carrier devoid of warpage and twist is disclosed. A bonding sheet is used to bond a circuit substrate and a heat spreader. The bonding sheet is made of a single adhesive layer or a stacking of more adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or fiber-filled adhesive material, or a particle-filled adhesive material. The circuit substrate possesses an opening to receive an electrionic chip.

Abstract: A business form includes a carrier sheet having an upper surface and a lower surface, and defining a die cut opening there through, with a patch of liner material mounted on the lower surface of the carrier sheet. The patch extends over the opening. The liner material has an upper surface facing the die cut opening in the carrier sheet, and carries a release coating on the upper surface. A two ply label assembly is mounted on the patch of liner material in the die cut opening. The two ply label assembly includes a transparent ply mounted on the upper surface of the patch of liner material, and a label ply mounted on the transparent ply. The form is manufactured by: a.) die cutting an opening in a piece of carrier material; b.) adhesively affixing a patch of liner material to the piece of carrier material; c.) mounting a transparent ply on the patch of liner material within the die cut opening; and d.) mounting a label ply on the transparent ply. The form is used by: a.

Abstract: A production method of an absorbent body is provided. The method includes the steps of: supplying a first cover sheet on an outer surface of a rotating pattern drum, said pattern drum being provided with a concavity formed in a predetermined shape on the outer surface thereof; adapting the first cover sheet to the shape of the concavity and supplying an absorbent material into the concavity to form an absorbent material layer adapted to the shape of the concavity on the first cover sheet; supplying a second cover sheet toward the outer surface of the pattern drum; and separating the first cover sheet together with the absorbent material layer from the outer surface of the pattern drum and superposing the first cover sheet together with the absorbent material layer on the second cover sheet to produce an absorbent body comprised of the first cover sheet, the second cover sheet and the absorbent material layer interposed between the first cover sheet and the second cover sheet.

Abstract: The invention concerns a method for making smart cards by rolling. A first synthetic sheet (1) is first smoothed by hot pressing against a first smoothing plate (4). Likewise a second synthetic sheet (2) is smoothed against a second smoothing plate (5). Without being unstuck from their smoothing plates, these two sheets are rolled with other layers (3, 6, 7), said synthetic sheets (1, 2) serving as external layers. One of the smoothing plates may comprise a three-dimensional pattern to be relief printed on the synthetic sheet. The rolling is carried out by cold pressing the different layers (1, 6, 3, 7, 2) which the laminated card comprises between the two smoothing plates (4, 5). After being rolled, different cards with adapted dimensions can be cut out from the laminated sheets. The invention is advantageous in that the same plates (4, 5) are used for the hot pressing and the cold rolling.

Abstract: A system for aligning and attaching together a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate loading station where a coverplate that the tiles are to be attached to is arranged on a coverplate support. A coverplate bonding material dispensing station where a bonding material for bonding the tiles to the coverplate is applied to a surface of the coverplate. A tile placement station where the tiles are arranged on the coverplate. A tile aligning and securing station where the tiles are aligned relative to each other and the coverplate by the tile aligner and where the tiles are at least partially bonded to the coverplate. A tile assembly bonding material dispensing station where a bonding material is applied to a surface of the tiles opposite the side that the coverplate is bonded to. A backplate placement station where a backplate is arranged on the tiles.

Abstract: A method for making a unitary composite headliner adapted to be installed in a motor vehicle includes providing an inner layer and two reinforcing layers, each of which comprises polymeric material, the inner layer being configured to absorb sound and vibrations, and the reinforcing layers being configured to provide sufficient flexibility to the headliner to facilitate installation in the vehicle, while also providing sufficient rigidity to the headliner to enable the headliner to be self-supporting once installed in the vehicle; differentially heating the layers such that each reinforcing layer is heated to a respective predetermined reinforcing layer temperature, and the inner layer is heated to a predetermined inner layer temperature less than either respective reinforcing layer temperature; inserting the layers into a mold such that the inner layer is disposed between the reinforcing layers; and compressing the layers together to bond the layers and form the headliner.

Abstract: A fiber reinforced composite wood board is designed particularly for use in the flooring of truck trailers which experience adverse operating conditions such as from heavy loads of lift trucks on the top side and water spray during rainy periods on the bottom side. The composite wood board comprises an edge-glued laminated wood member composed of wood segments with end joints. The wood member is underlaid with a thin layer of fiber reinforced plastic. The top surface of the composite wood board is the same as that of the laminated wood. The fiber reinforced plastic underlay is composed of glass and/or carbon fibers embedded in a polymeric resin such as epoxy, phenolic, vinyl ester, polyester, polypropylene or polyamide resin. Further, the fiber reinforced plastic underlay is substantially bonded to the wood member with a reactive hotmelt adhesive.

Abstract: A data card includes a card body having at least one card top layer and at least one card bottom layer. The outer dimensions of the top and bottom card layers correspond to one another, and a module element is fitted in between the card top layer and card bottom layer. The module element has an integrated electronic circuit for processing and/or storing personal data. A levelling compensating layer has a levelling material and is disposed or formed between the module element and the card top layer and/or the card bottom layer for filling existing cavities in the module element or between the module element and the card top layer and/or card bottom layer. The levelling compensating layer also fills or levels existing protruding elevations on a surface of the module element.

Abstract: A photovoltaic module comprises a substrate, a semiconductor layer arranged on one of the principal surfaces of the substrate, divided into a plurality of sections and sealed by a encapsulation material, in that the encapsulation material is arranged on the principal surface of the substrate without its end face projecting outwardly beyond the end face of the substrate.

Abstract: A method and a system for producing a pressed-wood composite product from a prepared, pre-assembly mat having opposed facial expanses, and including, between such expanses, selected wood components, such as wood veneer, wood strands or other wood fibrous material, plywood sheets, lumber pieces, and further including between such wood components, inter-component heat-curable adhesive. The proposed method and system feature transporting such a pre-assembly through a processing zone, and, within that zone, creating within the pre-assembly both cyclic compression and cyclic heating. Compression is effected principally utilizing distributed pairs of opposing pinch rolls which act on transported material either through independent platens, or through surface materials which become incorporated in a final pressed-wood product. Cyclic heating is effected through use of microwave wave-guides interleaved effectively with the pressure-applying pinch rolls.

Abstract: The invention is an edge densified lumber product of improved strength and stiffness and the method of its manufacture. The method is based on the parallel lamination of multiple plies of wood veneer. Narrow longitudinal reinforcing strips are laid along each edge of the veneer assembly between at least some of the veneer plies. Additional spaced apart veneer strips, about twice the width of the edge strips, are laid up at preselected locations in the mid-portion of the veneer assembly. These strips in the mid-portion are preferably spaced so that the distance between their centerlines corresponds to standard lumber widths. Appropriate adhesives are used to bond the assembly. The assembly is pressed to a uniform thickness so that the areas along the narrow veneer strips are densified relative to the adjacent portions. Longitudinal saw cuts are then made along the centerlines of the interior veneer strips to separate the assembly into multiple units of lumber.

Abstract: Disclosed is an anisotropic conductive adhesive having an adhesive layer and conductive particles individually adhered to the adhesive layer, the conductive particles being arranged in an ordered array. The size of the conductive particles is at least somewhat smaller than the thickness of the adhesive layer. Also disclosed is an anisotropic conductive adhesive having an adhesive layer, conductive particles individually adhered to the adhesive layer, and a release liner having an ordered array of dimples. The conductive particles reside in a single layer in the dimples. The anisotropic conductive adhesive is made by placing the conductive particles in an ordered array of dimples on a low adhesion surface. An adhesive layer is then laminated on top such that the conductive particles individually adhere to the adhesive layer. The anisotropic conductive adhesive may be used to electrically connect fine pitch electrodes on opposing circuit layers.

Abstract: A machine which fabricates an undergarment assembly having an openable front panel. The assembly is made from two continuous half width webs. The first and second web paths are transversely spaced. It includes devices to add a V-folded reinforcing strip along the edge of one web. Devices are included to add elastic strands adjacent the central crotch section and a re-closable tape across the front panel opening. One of the webs is printed with adhesive at spaced longitudinal intervals to bond portions of the two overlapped webs in central areas to define a bonded full width rear panel. The machine cuts leg openings and pad securement flaps on the outer margins of each half web. After assembly, the web is severed into unit products for delivery and packaging. The delivery system includes vacuum rolls for transferring flat product or longitudinally and transversely folded product for package size reduction.

Abstract: Wireless communication devices and methods of forming the same are described. In one implementation, an integrated circuitry transceiver chip and an antenna are operably coupled and mounted within a housing member. A cover(s) is (are) disposed over the chip and antenna and effectively seals the chip and antenna therewithin. In a preferred implementation, the chip, antenna, and a power source are mounted on a printed circuit substrate which is nestedly received by the housing member and effectively sealed therewithin by the cover. The housing member preferably includes structure which receives at least one of the chip and/or power source to provide a nested, compact device which can be carried by or upon a person. In one aspect, the housing member is formed from a material which does not meaningfully, if at all, degrade the electrical performance of the device. The cover(s) is preferably formed from the same material as the housing member to facilitate assembly of the device through bonding therebetween.

Abstract: The apparatus, which serves to join flat supplementary products provided with an adhesive to printed products, has n holding elements which are driven on a circulating path about a first axis, by means of which supplementary products are gripped individually at at least one pick-up point and, after an appropriate rotation about the first axis, can be joined to a printed product at a discharge point.

Abstract: The machine of the present invention fabricates an undergarment assembly having an elasticized pad support panel secured to inner surfaces of the rear panel and the openable front panel. The machine makes the garment assembly from two half width webs, one of which has a reinforced edge. The machine arrangement includes first and second transversely spaced web paths and components to bond tensioned elastic strands to spaced dots of adhesive located on a third pad supporting web that is secured to adhesive areas applied adjacent, but not in, the garment crotch area with spaced adhesive applied to the innermost surfaces of the rear and front panels. The machine includes devices to add side margin and front panel connecting tapes, and die cutting rolls to cut leg openings in side margins. The machine includes components to divert cull product and deliver flat unfolded product, or longitudinal and transverse folded products for packaging.

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

Abstract: A skateboard deck and a method of making the same. The initial stage of making the skateboard deck comprises the step of stacking multiple veneer layers of wood upon each other and applying a coat of glue between each layer and then pressing the layers in a hydraulic press to form a first block of wood. Next the outline shape of the skateboard deck is formed on a CNC shaper machine. Following this two sets of four bore holes are machined in the first block of wood and they are counterbored on the initial top surface of the skateboard deck. Truck mounting inserts are then pressed into the bore holes in the initial top surface of the skateboard deck. One or more veneer layers of wood are then stacked onto the initial top surface of the skateboard deck and a coating of glue is applied between each layer and they are pressed together in a hydraulic press to form a second block of wood. The second block of wood is trimmed to the same shape programmed previously.

Abstract: A method for mass producing thin IC cards having beautiful surfaces using a non-polluting polyethylene telephthalate material in which a hot-melt type adhesive is applied and formed on a joint surface of a cover sheet formed from polyethylene telephthalate, and in which a hot-melt adhesive is used as a sealing adhesive at an opening of a core sheet that is held by the cover sheets. To improve the heat-resisting bonding strength of this hot-melt adhesive, a thermosetting resin may be mixed with the hot-melt adhesive.

Abstract: A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5° or less, can provide a high wiring density and signal transmission performance.

Abstract: A method of using a coversheet to remove a plurality of pieces of temporary tape from a laminated assembly. In particular, a method of using a coversheet to remove a plurality of pieces of pressure sensitive adhesive tape from a laminated veneer assembly. The coversheet and the pressure sensitive adhesive tape are selected such that after application of heat and pressure during the veneer lamination process, the back of the tape bonds to the surface of the coversheet. After lamination, the coversheet is removed with the pieces of tape bonded thereto. In this manner, the large number of pieces of tape do not have to be removed individually.

Abstract: Wireless communication devices and methods of forming the same are described. In one implementation, an integrated circuitry transceiver chip and an antenna are operably coupled and mounted within a housing member. A cover(s) is (are) disposed over the chip and antenna and effectively seals the chip and antenna therewithin. In a preferred implementation, the chip, antenna, and a power source are mounted on a printed circuit substrate which is nestedly received by the housing member and effectively sealed therewithin by the cover. The housing member preferably includes structure which receives at least one of the chip and/or power source to provide a nested, compact device which can be carried by or upon a person. In one aspect, the housing member is formed from a material which does not meaningfully, if at all, degrade the electrical performance of the device. The cover(s) is preferably formed from the same material as the housing member to facilitate assembly of the device through bonding therebetween.

Abstract: A laminate comprises:a first layer of thickness between 75 .mu.m and 150 .mu.m of a polyester material not being absorbent of xerographic toner and having an image deposited on a first surface thereof by an electrostatic deposition process,a second layer of optically transparent or translucent plastics material,a first surface of the first layer being bonded to the second layer by a layer of optically transparent adhesive material, in a lamination process involving heat and pressure to ensure that the relief of the deposited image is apparent in the laminate through the second layer,the arrangement being such that the image on the first layer can be viewed through the second layer and the layer of optically transparent adhesive material.

Abstract: A method of making composite strips for mouldings, frames and the like, including the steps of providing a first elongate panel of a first material and a second elongate panel of a second material, laminating the first and second panels onto one another to provide a laminated panel, making a plurality of parallel cuts or slots in the second panel, adhering a filler strip to the first and second panels in each of the cuts, and gang sawing the laminated panel into composite strips by cutting the laminated panel at each of the filler strips. The filler strips may be formed as single pieces and may be formed as a pair of pieces not joined together. A composite panel having first and second elongate panels of different materials laminated together, with a plurality of parallel cuts in the second panel, and with filler strips in the cuts and adhered to the first and second panels. Several alternative embodiments are also disclosed.

Abstract: A hybrid CMC laminate is comprised of alternating layers of dense ceramics and fiber reinforced CMCs. The strategy involves the use of strong and stiff ceramics in order to delay the onset of cracking within the CMC layers. To provide protection from mechanical abrasion, improve thermal conductivity and inhibit oxygen ingress into the CMC layer, ceramic layers are placed on the outer surfaces of laminate. The laminate is produced by stacking alternating layers of dense ceramic and binderless layers of fiber reinforced CMCs, and then hot-pressing them together. The volume fractions of the constituent layers and the fiber architecture can be readily varied through this process. Reinforcement architecture (unidirectional vs. crossply) and the relative volume fractions of the phases effects the tensile and flexural properties of the laminates.

Abstract: A system for aligning and attaching together a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate loading station where a coverplate that the tiles are to be attached to is arranged on a coverplate support. A coverplate bonding material dispensing station where a bonding material for bonding the tiles to the coverplate is applied to a surface of the coverplate. A tile placement station where the tiles are arranged on the coverplate. A tile aligning and securing station where the tiles are aligned relative to each other and the coverplate by the tile aligner and where the tiles are at least partially bonded to the coverplate. A tile assembly bonding material dispensing station where a bonding material is applied to a surface of the tiles opposite the side that the coverplate is bonded to. A backplate placement station where a backplate is arranged on the tiles.

Abstract: A combination of a preprinted pressure sensitive label and an electronic article security system target is provided, preferably as a supply of labels on a backing material web with the target between. The labels preferably extend about at least about 1/8th inch around the edge of the target to directly adhere to the products. Articles may be selectively marked with targets so concealed to deter theft with fewer targets. The combinations may be formed by applying first the target, then the label, to the article. Preferably, label and target combinations are supplied on a web and are then applied to the products. Combination label and target supplies may be formed by separating the preprinted labels from their backing material webs, applying the targets to either the label or the backing material, and then combining the label with either the same backing material web or a different one.

Abstract: An oxygen absorbent is provided which includes a multilayered body formed from a plurality of thin resin layers laminated over one another. At least one laminated side of this multilayered body is constructed as an oxygen-absorbing surface. The multilayered body includes an oxygen-absorbing layer of a resin composition in which an oxygen-absorbing component is dispersed and which is made porous; a non-porous oxygen-permeable layer which is permeable to oxygen; and a porous oxygen-permeable layer which serves as a protection layer for the non-porous oxygen-permeable layer. The layers are thermally bonded to one another and the resulting laminate is drawn to simultaneously enlarge the pores in the porous layers.

Abstract: In a method of manufacturing an ultrasonic transducer array a plurality of discrete transducer elements are formed on an initially flat flexible substrate together with electrically conductive tracks, through which the transducer elements will be energized in use, the flexible substrate with the discrete transducer elements and conductive tracks mounted thereon then being formed into a cylinder and mounted on the end of a catheter tube, the substrate being radially outwardly of the transducer elements so that it is in a position to act also as an acoustic matching layer between the material of the transducer elements and the human tissues or blood when in use.

Abstract: An image bearing composite optical material is formed as a laminated flexible sheet having an image bearing photographic quality film layer variously bonded between outer and inner translucent layers of paper, fabric, or synthetic materials. The composite optical material provides two sharply distinct appearances dependent upon being viewed under backlit or ambient illumination conditions. Full-colored and precisely detailed images are produced under backlighted conditions; a plain appearance is produced otherwise. Improved embodiments include a nonbilateral structure wherein a middle image bearing film layer is bonded over its entire adjacent surface with an outer translucent layer, and is bonded at widely separated points or along thin lines with an inner translucent layer to produce an air gap there between. The air gap embodiment negates image transmission under nonbacklit viewing conditions.

Abstract: A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.

Abstract: Disclosed is a process for fractionating cellulosic fibers that is effective to result in cellulosic fibers that exhibit desired properties such as fiber length and fiber coarseness values. The fractionating process is quite efficient and has been found to produce cellulosic fibers that are more homogeneous in their properties as compared to the starting mixture of cellulosic fibers. Also disclosed is a handsheet prepared from the fractionated cellulosic fibers for use in disposable absorbent products.

Abstract: A unitized discrete electronic component array being surface mountable as a unit on a printed circuit board comprising a plurality of discrete electronic components physically secured to one another by an adhesive. The adhesive is a non-conducting high temperature resistant epoxy, polyimide or glass. The electronic components are capacitors, resistors or inductors, or combinations thereof.

Abstract: Disclosed is a heat insulating structure in which the surrounding of a heat insulating material such as glass wool is covered with and glued to a casing material such as a poly-film, wherein hotmelts (4,5,6) are applied to the center part or all and an inner portion d and an outer portion e of both ends of a poly-film (3b), and a glass wool (2) is placed on the center to apply a hotmelt (7) to the surface, which is then covered with an aluminum deposition poly-film. In the lower reaches of the conveyer, both ends of the lower poly-film (3b) are folded at the divided line between the inner portion d and the outer portion e to form a three-ply structure, which is pressed to fix, is cooled to normal temperature, and is cured. This heat insulating structure is featured in that improvement in productivity and high adhesive strength can be attained.

Abstract: A method of manufacturing a rust-preventing cover in which sufficient strength during mounting is ensured and which can be easily removed when not needed. The method of manufacturing a rust-preventing cover is carried out by a WFM manufacturing method rather than a conventional DFM manufacturing method. A mixed aqueous solution having paper fibers as a main material thereof is stored in a water tank. A porous rust-preventing cover mold is immersed therein. Then, the mixed aqueous solution is sucked by a vacuum pump. In this way, a paper fiber surface layer, which later becomes a rust-preventing cover, is formed on a surface of a mold main body of the rust-preventing cover mold at portions to which masking has not been applied. By adjusting a suction time of the vacuum pump, a rust-preventing cover of an arbitrary thickness which corresponds to a thickness required during mounting can be obtained.

Abstract: Wireless communication devices and methods of forming the same are described. In one implementation, an integrated circuitry transceiver chip and an antenna are operably coupled and mounted within a housing member. A cover(s) is (are) disposed over the chip and antenna and effectively seals the chip and antenna therewithin. In a preferred implementation, the chip, antenna, and a power source are mounted on a printed circuit substrate which is nestedly received by the housing member and effectively sealed therewithin by the cover. The housing member preferably includes structure which receives at least one of the chip and/or power source to provide a nested, compact device which can be carried by or upon a person. In one aspect, the housing member is formed from a material which does not meaningfully, if at all, degrade the electrical performance of the device. The cover(s) is preferably formed from the same material as the housing member to facilitate assembly of the device through bonding therebetween.