Abstract: A process for picking up and moving a microelectronic package during card assembly operations. A clipping lid having a top surface and at least two sides attaches to a substrate via friction where the sides act as leaf springs gripping the substrate. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. In the preferred embodiment, the lid and sides are formed from an integral piece of stainless steel. Also provided are flares at the bottom of each side to aid in guiding the lid onto the substrate. Protrusions are provided in the sides to prevent the lid from slipping too far onto the substrate and contacting the components mounted to the substrate. Also provided is at least one hole in the top surface to allow the lid to be pried free from the substrate after completion of the steps where vacuum probe movement is required.

Abstract: A funnel-shaped chip tube and a tubular-shaped press frit are prepared. After the chip tube is disposed on a major surface of a substrate so that the center axis of an exhaust hole provided in the substrate of a sealed container body and the center axis of the chip tube may substantially coincide with each other, the press frit is so disposed as to be located on a surface of an opening portion. After that, by heating the whole device, the press frit is heated and melted, to provide a sealing member contiguously from an outer-rim outside portion of the flare-shaped opening portion of the chip tube to a portion of a tubular portion beyond a boundary.

Abstract: A method of manufacturing an ink jet head, characterized in having the steps of: bonding a nozzle plate and a support member by heating to make a composite member; forming nozzle holes in the nozzle plate of the composite member; and bonding the composite member having the nozzle holes formed to an actuator by heating with the use of a thermosetting adhesive, in such a manner that the support member side of the composite member comes to be in contact with the actuator.

Abstract: An adhesive comprising: (a) 80 to 100% of a melt blend of 40 to 98% polyalphaolelin which has been grafted with 0 to 5% of at least 1 ethylenically unsaturated carboxylic acid or derivative thereof, (b) 2 to 60% of at least one copolymer of ethylene and vinyl acetate; (c) 0 to 20% of an opacifier; (d) optional further ingredients; wherein the total amount of components (a) and (b) is 80-100% of the composition and wherein the percentages of the components are selected to total 100%.

Abstract: A metal film, particularly, a stainless steel film having been not subjected to roughing treatment, and an aromatic polyimide substrate film having a thermoplastic surface can be combined with a high bonding strength to form a metal film/aromatic polyimide film laminate, utilizing an amorphous aromatic polyimide film of 0.05 to 3 &mgr;m thick which has a glass transition temperature in the range of 200 to 300° C.

Abstract: A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.

Abstract: A method of forming a laminated composite printed wiring structure of a plurality of at least three superimposed subcomposites having organic substrates is provided. Via openings in the subcomposite structures having conductive paste therein are positioned to align with openings in at least one adjacent subcomposite structure also filled with conductive paste that is to be joined thereto. Printed wiring is provided on at least one face of one subcomposite structure. A fixture with pins which extends through index openings in the composites are provided to mount masks for screening paste and stacking of the composites is provided. After screening of paste, and partially curing of the paste, in each composite, a group of composites is placed on the fixture and the pastes are fully cured to form a unitary structure.

Abstract: A method for producing a fibre-reinforced plastic component includes (1) prefabricating an unwindable part of the plastic component as a prepreg semi-finished material; (2) prefabricating a non-unwindable part of the plastic component as a textile semi-finished material; (3) applying a resin film to said textile semi-finished material; (4) joining said textile semi-finished material and said prepreg semi-finished material in a curing device; (5) evacuating said curing device; and (6) subjecting said curing device to temperature and pressure treatment in an autoclave.

Abstract: A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.

Abstract: A layered composite material comprises a backing made from a thermoplastic polymer, an intermediate layer arranged thereupon, and a heat-cured layer applied to the intermediate layer, where the bonding material of the intermediate layer is a thermoplastic. The intermediate layer and the backing may be composed of the same thermoplastic. The intermediate layer and the heat-cured layer may also be applied to both sides of the backing. The layered composite material may furthermore comprise a decorative layer between the intermediate layer and the heat-cured layer.

Abstract: A process for manufacturing pre-cured parts of composite material with green-applied stiffeners, comprising the lamination of superimposed pre-impregnated composite material sheets to obtain a base part (1) and a second part (2) intended to be bonded with it; curing the base part (1); hot forming the laminate destined to form the second part (2); removing the second part (2) from the forming tool thereof and deposit it over the base part (1), intercalating a structural adhesive sheet between both of them; closing the assembly of both parts inside a vacuum bag and loading said bag in an autoclave, carrying out a curing cycle of the second part (2) under pressure and temperature, so that it is strongly adhered to the base part (1). The invention is applicable to the field of aeronautics.

Abstract: A method for making a metal-clad laminate product including: providing a carrier film; depositing directly onto the carrier film a release agent layer, the release agent layer comprising an aqueous soluble polymer; forming a conductive metal layer on the release agent layer, the metal layer having a thickness of less than about 10,000 Angstroms; bonding the metal layer to a circuit board laminate layer; and removing the carrier film from the metal layer by peeling the carrier layer from the release agent layer.

Abstract: A compressible and melt-flowable thermally conductive interface may be either tacky and pressure sensitive or be non-tacky and dry, and may include one of more thermally conductive fillers in one or more forms. The interface either melt flows or cures at low temperature, such as about 40-50° C. Certain embodiments provide a bond strength between a heat generating component, such as an integrated circuit, power transistor and the like, and a heat dissipating element, such as a heat sink or cold plate, sufficient to permit elimination of the need for mechanical fasteners.

Abstract: A process for producing a composite material with an intermediate layer made from a thermoplastic polymer, an intermediate layer arranged thereupon, and a heat-cured layer applied to the intermediate layer, where the bonding material of the intermediate layer is a thermoplastic, the process comprising providing the materials for the intermediate layer, an optional decorative layer, and the heat-cured layer each in the form of a sheet, then bonding the sheets to the backing material at temperatures from 150 to 300° C. The intermediate layer and the backing may be composed of the same thermoplastic. The intermediate layer and the heat-cured layer may also be applied to both sides of the backing. The layered composite material may furthermore comprise a decorative layer between the intermediate layer and the heat-cured layer.

Abstract: A method for manufacturing a laminated board having high quality with high productivity is disclosed. In this manufacturing method, a prepreg 2 that has been supplied from a prepreg supply section 1 is fed vertically using feed rolls. Further, metal foils 4 are supplied from a metal foil supply section 3 using feed rolls. The prepreg 2 and the metal foil 4 are heated at a heating section 7, and then they pass through between the rolls 5 so that the metal foils are bonded to the prepreg. Thus obtained laminated board is fed to a rolling section 6 using feed rolls, and the laminated is continuously rolled up at the rolling section 6, thereby continuously manufacturing the laminated board.

Abstract: A method of manufacturing an orifice member used in a nozzle for ink-jet printing includes a first step of applying an adhesive onto one surface of a synthetic resin member; a second step of forming at least one through-opening in a metallic member such that the through-opening extends in a direction perpendicular to the direction of penetration of the through-opening; a third step of bonding together the metallic member having the through-opening and the synthetic resin member via the adhesive; and after the bonding step, a fourth step of forming a plurality of through-holes having substantially the same diameter in a portion of the synthetic resin member corresponding to the through-opening of the metallic member such that the through-holes are aligned at a substantially constant pitch along the through-opening of the metallic member and such that the through-holes do not deviate from an area corresponding to the through-opening.

Abstract: A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip.

Abstract: A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip.

Abstract: This invention deals with an improved adhesive additive, adhesion compositions, articles, and structures manufactured utilizing such adhesive compositions. More specifically, this invention deals with an adhesive additive which is a combination of cement, water, calcium chloride and a curable polyvinylacetate latex which when used to bond cementitous substrates, gives bonds with enhanced tensile strengths.

Abstract: To provide a method for bonding a second member with a fixed shape (e.g. crystal glass) to a first member with a flexible and flat configuration (e.g. cloth, leather, and the like) with a hot-melt adhesive in a short process so as to have a high peel resistance and a beautiful appearance, a bonding apparatus and a composition bonded thereby. The bonding method of the present invention comprises the steps of placing a second member with a fixed shape on a first member with a flexible and flat configuration with a hot-melt adhesive being sandwiched therebetween, heating at least the second member up to a temperature equal to or greater than a melting point of the hot-melt adhesive, and cooling the first member and the second member while pressing the second member so as to contact the first member closely.

Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: A method of fabricating devices incorporating microelectromechanical systems (MEMS) using UV curable tapes includes providing a silicon substrate 12 with a MEMS layer 14 arranged on one side of the substrate 12. A first UV curable tape 22 is applied to the MEMS layer 14. At least one operation is performed on the substrate 14 via an opposed side of the substrate 14. A second UV curable tape 32 is applied to the opposed side of the substrate 14 and the first tape 22 is removed by exposing it to UV light. At least one operation is performed on the MEMS layer to form individual MEMS chips which are able to be removed individually from the second UV tape 32 by localized exposure of the tape 32 to UV light.

Abstract: Affixing together two articles includes placing a frit preform with an adhesive material on the surface of either article. The preform and the articles are heated to cause the frit material to liquify and then cooled to affix together the two articles at the junction of the two articles.

Abstract: The method of forming a cushion assembly (10) includes placing a pre-contoured trim layer (16) on a complimentary contoured mold (22), placing an air impervious adhesive film (18) thereover, drawing the trim layer (16) and film (18) against the mold (22), spraying a solvent activator (28) thereover, placing a contoured foam pad (14) over the adhesive film (18) and solvent activator (28), and compressing the foam pad (14) against the trim layer (16) by an upper platen (34) to bond the foam pad (14) and trim layer (16).

Abstract: The present invention provides a front plate for plasma display panels with the transparent substrate, electroconductive member and optical film fast adhered to each other, easily produced by a simple process, and excellent in productivity. The present invention further provides a method of producing the same. The present invention provides a front plate for plasma display panels comprising a transparent substrate laminated, at least on one side, with an electroconductive member and at least one type of optical film to form a monolithic structure, wherein (a) two types of adhesive layers of tackifier layer and heat-bond film are orderly placed between the optical film as the outermost layer and the adjacent member, and (b) the transparent substrate, electroconductive member and at least one type of optical film are pressed under heating.

Abstract: The invention provides a process, and product thereof, for forming a chemically resistant fusion bonded seal between chemically dissimilar materials by use of a chlorinated polyolefin film for protective garments. The process involves placing the chlorinated polyolefin film between two dissimilar films such as a facepiece and the fabric film of the garment and applying heat and pressure. The resulting fusion bonded film composite is strong, flexible and upon the application of sufficient stress exhibits total cohesive rupture failure.

Abstract: A wood decorative material coated with resin composite film, comprising a laminate of, arranged in the following order, a wood substrate; a heat bonding layer (A) formed from a heat bonding resin composition comprising 100 parts by weight of a thermoplastic resin (a-1) and 0.001 to 80 parts by weight of a tackifier resin (a-2), the above heat bonding resin composition having a melting point or softening temperature of 170° C. or below and exhibiting a melt flow rate (MFR) at 190° C. of 1 to 500 g/10 min; and a mar-proof surface layer (B). Not only can beautiful appearance be obtained while retaining natural texture without the application of lacquer but also surface protection and bending working properties are improved.

Abstract: An improved direct liquid-feed fuel cell having a solid membrane electrolyte for electrochemical reactions of an organic fuel. Catalyst utilization and catalyst/membrane interface improvements are disclosed. Specifically, the catalyst layer is applied directly onto the membrane electrolyte.

Abstract: A method for making a unitary composite headliner adapted to be installed in a motor vehicle includes providing an inner layer and two reinforcing layers, each of which comprises polymeric material, the inner layer being configured to absorb sound and vibrations, and the reinforcing layers being configured to provide sufficient flexibility to the headliner to facilitate installation in the vehicle, while also providing sufficient rigidity to the headliner to enable the headliner to be self-supporting once installed in the vehicle; differentially heating the layers such that each reinforcing layer is heated to a respective predetermined reinforcing layer temperature, and the inner layer is heated to a predetermined inner layer temperature less than either respective reinforcing layer temperature; inserting the layers into a mold such that the inner layer is disposed between the reinforcing layers; and compressing the layers together to bond the layers and form the headliner.

Abstract: In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet type adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising conductive high polymer material, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet adhesive coating device.

Abstract: The invention provides a method for fastening a polymeric label to a glass, plastic or metal container or surface by means of a water based adhesive composition by the following steps: (a) applying a layer of a hydrophilic solid material to a polymeric label to form a hydrophilic layer; (b) applying water or a water based adhesive to the hydrophilic layer to form a fastenable polymeric label; (c) fastening the fastenable polymeric label to a glass, plastic or metal container or surface; and (d) allowing said the polymeric label to dry on the glass, plastic or metal container or surface.

Abstract: The invention provides a process, and product thereof, for forming a chemically resistant fusion bonded between chemically dissimilar materials by use of an acid-based terpolymer for protective garments. The olefin terpolymers are preferably copolymers of an olefin, an acid and an ester. The process involves placing the olefin terpolymer film between two dissimilar films such as a facepiece and the fabric material of the garments and applying heat and pressure. The resulting fusion bonded film composite is strong, flexible and upon the application of sufficient stress exhibits total cohesive rupture failure.

Abstract: The invention provides a process for bonding a pressure-sensitive adhesive to a rubber article. The process includes the steps of heat laminating a heat-activatable adhesive bearing a primer layer to the rubber article at a temperature of at least 100° C. and bonding the pressure-sensitive adhesive to the primer layer. The invention also provides an assembly comprised of a shaped rubber article heat laminated to an adhesive bearing a primer. The invention also provides article of manufacture for bonding a rubber article to a surface.

Abstract: Two electroluminescent substrates, each emitting light having different color, are laminated and bonded together with adhesive layer interposed therebetween. An insulation film such as an epoxy film is placed between two substrates and deformed into an adhesive layer under pressure and heat. The adhesive layer serves as a bonding material and a humidity-protection layer as well. Electrical connection between electrodes of the electroluminescent substrates and outside driving circuits is made at the same time two substrates are bonded by the adhesive layer by bonding wiring sheets together. To further improve the humidity-protection ability of the adhesive layer, the surface of the electroluminescent substrates may be covered by resin which is hardened by radiating ultraviolet light at the same time the insulation film is deformed into the adhesive layer. Thus, the electroluminescent display panel having two substrates can be manufactured in a simple and inexpensive manufacturing process.

Abstract: A method for mass producing thin IC cards having beautiful surfaces using a non-polluting polyethylene telephthalate material in which a hot-melt type adhesive is applied and formed on a joint surface of a cover sheet formed from polyethylene telephthalate, and in which a hot-melt adhesive is used as a sealing adhesive at an opening of a core sheet that is held by the cover sheets. To improve the heat-resisting bonding strength of this hot-melt adhesive, a thermosetting resin may be mixed with the hot-melt adhesive.